Abstract: A temperature sensing device and a method of forming it is disclosed. A first film or coating of an adherent electro-conductive metallic oxide is applied over the exterior surface of a dielectric substrate. The metal oxide coating is thereafter thoroughly cleansed and a second coating or layer of a metal having a relatively high temperature coefficient of resistance is applied over the metallic oxide film so as to form a strong physical bond as well as a chemical bond therebetween. The composite so formed is fired at a temperature up to about 750.degree.C. If desired, the metal layer is thereafter suitably spiralled to provide the desired resistance and terminal leads are attached to the element. Also, if desired, the element is then coated with a dielectric protective coating.

Abstract: A cross-linkable positive resist formed from mixtures of a copolymer of an olefinically unsaturated carboxylic acid and an olefinically unsaturated compound having no free acid group and a copolymer of olefinically unsaturated acid chloride and an olefinically unsaturated compound having no acid chloride group.

Abstract: A protective layer containing polytetrafluoroethylene (PTFE) is provided over the riser of an anode having a porous film-forming metal anode body to render the riser non-wetting to a solution of manganese nitrate and thereby help prevent the formation of MnO.sub.2 on the riser during the subsequent pyrolysis step in the process of making a capacitor. The protective layer also helps to prevent mechanical damage to the anode during assembly of the capacitor. The protective layer over the anode riser may be applied by means such as dipping a wetted anode in a suspension containing particulate PTFE or by masking the anode body with a liquid and then spraying the riser with binderless material containing PTFE. The preferred embodiment employs high pressure spraying of the material containing PTFE over the anode riser.

Abstract: There is provided a process for producing resin rich surfaces of desired and specified thickness and physical, chemical, electrical and/or optical properties involving the use of a transfer base material to move a viscous, liquid, hardenable composition after partial hardening into a non-tacky state into contact with the surface of a second, permanent base, completing the hardening of the composition into a resin-rich surface layer adhering to the second base and subsequently removing the transfer base therefrom. In specific embodiments, the permanent base itself can be hardenable and complete hardening is effected simultaneously; the surface layer can be an adhesive layer; and the surface layer can be catalytic throughout to electroless metal deposition.

Abstract: A high sensitivity resist layer structure for high energy radiation exposure is formed by coating plural layers of radiation degradable polymers on a substrate which layers are successively slower dissolving in the resist developer. Upon exposure and solvent development, a resist edge profile is obtained which is particularly useful for metal lift-off.

Abstract: A process for the stabilization of an aluminum part, such as a semiconductor lead frame, which includes the step of coating said aluminum part with an alcohol solution containing boron, phosphorous and a metal selected from the group consisting of gold, palladium, rhodium and platinum. The solution is prepared by mixing phosphorous pentoxide in an alcohol solvent. The dissolution of the phosphorous pentoxide is exothermic and the temperature of the solution will rise during the reaction. Then, boric anhydride and a salt of gold, palladium, rhodium or platinum is added. The solution strips any aluminum oxide from the surface of the part while also removing any organic contamination and while depositing a layer of the gold, platinum, rhodium or palladium onto the surface of the aluminum part. The process is particularly advantageous for preparing aluminum lead frames for wire bonding during semiconductor device assembly.