Abstract: The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical characteristics, when the Co—Cu system layer is used in IC chips. The composition of the electroless solution contains more than one reducing agents, one of which can catalyze the initial electroless deposition layer of cobalt on copper (called initiator), while the other maintains deposition of cobalt on the aforementioned initial layer as the process is continued. Small amount (100-5000 ppm) of elements from the initiator also builds into the electroless film, which is expected to further improve the barrier properties of the resultant film compared to the deposition bath without initiator.

Abstract: The surfaces of apparatuses and apparatus parts for chemical plant construction, including, for example, apparatus, container and reactor walls, discharge apparatuses, fittings, pumps, filters, compressors, centrifuges, columns, heat exchangers, dryers, comminuting machines, internals, packings and mixing elements, are coated by a process wherein protuberances having a mean height of from 100 nm to 50 &mgr;m with a mean spacing of from 100 nm to 100 &mgr;m are produced on the surface to be coated and the coating is applied thereon by currentless deposition of a metal layer or of a metal-polymer dispersion layer with the aid of a plating bath which contains a metal electrolyte, a reducing agent and optionally a polymer or polymer blend to be deposited, in dispersed form.

Abstract: A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.

Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.

Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.

Abstract: A method for metallizing a surface of substrates is disclosed. Particularly, nonhomogeneous heating deposition occurs by setting the surface and the heater in an electroless plating reactor at different temperatures. Moreover, an adjustable gap is defined between the substrate being metalized and heating source board. The deposit can securely adhere to the surface of the substrate for gap creates and activates metallic nanoparticles, which possess higher activity and bonding strength to the surface. Accordingly, metallization of the surface of the substrate can be easily achieved without using precious metals and carcinogenic materials.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.

Abstract: Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.

Abstract: A method is provided for the preparation of metal/porous substrate composite membranes by flowing a solution of metal to be plated over a first surface of a porous substrate and concurrently applying a pressure of gas on a second surface of the porous substrate, such that the porous substrate separates the solution of metal from the gas, and the use of the resulting membrane for the production of highly purified hydrogen gas.

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electroless process to deposit a silicate containing coating or film upon a metallic or conductive surface.

Abstract: A process for depositing copper-indium-gallium-selenide thin films on substrates, including foreign substrates, occurs in a chemical bath that includes a buffer solution and does not require external current as a catalyst. Formation of the chemical bath includes compounds of each of the constituent elements dissolved in deionized water and the addition of pHydrion buffers likewise dissolved. Deposition occurs as a result of the introduction of both a working electrode and a counter electrode. The deposited thin film is further processed through physical vapor deposition of additional indium, gallium, and selenium in order to fine-tune the stoichiometry of the resultant thin film.

Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.

Abstract: A process for metallizing a substrate part includes the following three steps: coating the part with a precursor composite material layer consisting of a polymer matrix doped with photoreducer material dielectric particles, irradiating the surface to be metallized of the substrate part with a light beam emitted by a laser, and immersing the irradiated part in an autocatalytic bath containing metal ions, with deposition of the latter in a layer on the irradiated surface. The dimension of the dielectric particles is less than or equal to 0.5 microns. The method is intended in particular for producing a metallized part including a substrate part consisting of a flexible film.

Abstract: Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

Abstract: An electroless brass plating method for applying an uniform and thick metallic layer on metallic, ceramic or plastic pieces, which does not depend on the piece geometry nor on its electric characteristics and by which global costs are reduced approximately 50% thanks to the use of a zinc compound as source of zinc atoms, which is less expensive than zinc cyanide.

Abstract: A whetstone pellet 1 is composed of a columnar base body 2 to be fixed on a pedestal 9, and an abrasive grain part 5 containing numerous abrasive grains formed by electroless plating on an end surface 3 of the base body 2.

Abstract: The present invention provides a continuous wire drawings process, wherein ferrous metal is drawn through multiple dies, in which the wire is coated in-line in an electroless coppering step between two wire drawing stages by being passed through a bath using transport means comprising ferrous metal components which contact solution in the bath, the bath containing an aqueous solution containing copper ions, bromide ions, a water soluble lubricant and an inhibitor compound such that a coating of copper is deposited on to the ferrous metal surface. A treatment composition as well as dry and liquid concentrate compositions are also described.

Abstract: There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexing agent for nickel ions, a reducing agent for nickel ions, and ammonums (NH4+). The electroless Ni—B plating liquid can lower the boron content of the resulting plated film without increasing the plating rate and form a Ni—B alloy film having an FCC crystalline structure.

Abstract: A method for locally nickel-plating an aluminum alloy fin structure including placing the aluminum alloy fin structure on a sponge that is located at the bottom of a “zinc” tank containing a volume of zinc chemical solution for zinc plating; and thereafter rotating the aluminum alloy fin structure and immersing the rotated aluminum alloy fin structure in a volume of nickel chemical solution of a “nickel” tank to plate nickel onto the aluminum alloy fin structure.

Abstract: The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate. More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article formed therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers and powders.

Abstract: The specification discloses a mechanical deposition process for depositing a metal powder on a metal substrate to form a sacrificial coating therefor, wherein the metal powder is produced from a molecular alloy of zinc and aluminum, for instance by the atomization of a molten alloy of zinc and aluminum. The mechanical deposition process described herein is carried out in the presence of a ductile metal more noble than zinc, an activating anion containing a fluoride moiety, and either a fluoride-engendering acidic compound or a weak organic acid.

Abstract: Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.

Abstract: The invention relates to the production of composite cathodes, which comprise, for example, at least one lithium-containing spinel, composite anodes for lithium batteries, and the cathodes and anodes thereby produced. The active mass in the form of a thin film is incorporated into a material, or the active mass together with a matrix metal or a matrix alloy is deposited on a substrate. The invention also relates to a metallised, textile material made of insulating fibres which have been made conductive and which have been completely galvanically or electrolessly plated. The fibres lying on crossovers are not baked with other fibres, but can move freely. The surface of the material is thereby optimally used. Said material is preferably used as an anode or a cathode for batteries, especially a lithium battery, and fuel cells.

Abstract: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.

Abstract: A process for coating an object formed of magnesium or a magnesium alloy comprising the steps of: immersion coating the object in a sonicated bath to form an undercoat and topcoating the object to form a topcoat. When desirable to protect against topcoat failure, the undercoat may be equally noble or more noble than the topcoat. If topcoat failure is not a concern, the nobility of the topcoat relative to the undercoat need not be considered. The process promotes uniform coating of a magnesium and its alloys.

Abstract: Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten.

Abstract: A sequence of temperature control in electroless plating for microelectronic processing is disclosed in this invention. This sequence improves the uniformity of the deposit, increases the lifetime of the plating bath and is cost effective. The plating bath is heated to a temperature, which is lower than the minimum deposition temperature, in an apparatus outside the plating chamber. Then the solution is introduced into the plating chamber without the occurrence of the deposition. After the chamber is filled, the solution is heated up to the desired deposition temperature. The deposition is initialized. After the deposition, the solution is returned back to the original tank.

Abstract: The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate (2) and an activator (1) are immersed in a copper plating bath in order to contact each other for a predetermined period.

Abstract: An electroless copper plating bath containing a cupric compound, a cupric ion complexing agent, a reducing agent, and a pH adjusting agent is provided, in which a carboxylic acid is added as a reaction accelerator to accelerate the oxidation reaction of the reducing agent. It does not need to use formaldehyde as the reducing agent yet it has a plating reaction velocity which is equivalent to that of a bath in which formaldehyde is contained as the reducing agent.

Abstract: A cutting tool comprising a metal plate having a central aperture, a forwardly extending blade and a rearwardly extending tang having a second aperture offset from the central aperture, wherein the plate is coated with an electroless nickel layer. Also included is a first elongated member comprising a first handle terminating at a distal end by a jaw and a second elongated member comprising a second handle. The first and second members are pivotally connected to the plate at the central and second apertures by couplers respectively, so that the blade and jaw pivotably move in response to pivotable movement of the first and second members about the coupler in the central aperture.

Abstract: A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.

Abstract: A method of electroless plating for processing a plating surface to form a barrier layer being capable of uniformly forming a barrier layer and reducing the consumption of a processing solution, comprising a step of feeding a processing solution used in at least one of the pre-processing steps of the electroless plating and the electroless plating step to the plating surface for puddling treatment, or, using a processing solution at least containing, with respect to one mole of a first metallic material supplying a main ingredient of the barrier layer, three or more moles of a completing agent and three or more moles of reducing agent and having a pH value adjusted to 9 or more and stored in an atmosphere of an inert gas or ammonia gas, and a corresponding electroless plating apparatus.

Abstract: ABSTRACT OF THE DISCLOSURE A method for forming the soldering layer of fiber array substrate surface has been disclosed herein. A plurality of fiber array bases having V-shape grooves are formed on a substrate, and a solder layer is formed on the whole substrate via chemical plating method of following steps: forming a layer of nickel/chromium (Ni/Cr) alloy or aluminum (Al) metal on said substrate through evaporation or sputtering; treating said surface of said substrate having V-shape grooves with a sensitizing solution for plating said surface with Sn2+, wherein said sensitizing solution comprises deionized water and SnCl2; treating said sensitized surface of said substrate with an activating solution for precipitating catalytic element Pd0 on said surface, wherein said sensitizing solution comprises 2 to 10 g/l of PdCl2 and 0.01 to 0.1 M HCl; and (E) immersing said treated surface into an electroless nickel plating solution to form a nickel metal layer on said treated surface.

Abstract: Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (—SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one —S—, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.

Abstract: Methods and apparatus are provided for forming a metal or metal suicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.

Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.

Abstract: A method of patterning a layer of copper on a material surface includes providing a stamp having a base and a stamping surface and providing a copper plating catalyst on the stamping surface. The method can also include applying the stamping surface to the material surface, wherein a pattern of copper plating catalyst is applied to the material surface. The method can further include providing a copper solution over the copper plating catalyst, whereby a layer of copper is patterned on the material surface.

Abstract: An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.

Abstract: The present invention relates to a process for coating apparatuses and apparatus parts for chemical plant construction—which are taken to mean, for example, apparatus, tank and reactor walls, discharge devices, valves, pumps, filters, compressors, centrifuges, columns, dryers, comminution machines, internals, packing elements and mixing elements—wherein a metal layer or a metal/polymer dispersion layer is deposited in an electroless manner on the apparatus(es) or apparatus part(s) to be coated by bringing the parts into contact with a metal electrolyte solution which, in addition to the metal electrolyte, comprises a reducing agent and optionally the polymer or polymer mixture to be deposited in dispersed form, where at least one polymer is halogenated.

Abstract: Embodiments of the invention generally provide a method and plating solution for reducing the degradation of additives in electroplating solutions. The method generally includes adding an anti-oxidant to the electroplating solution in an amount effective to reduce the degradation of additives in the plating solution. The plating solution generally includes copper ions, at least one organic plating additive, and at least one anti-oxidant in an amount sufficient to reduce the degradation of the organic plating additives in the plating solution.

Abstract: A nickel base single crystal compliant layer on a ceramic blade has the capability to sustain high stresses and high operating temperature. Layers of nickel and platinum bonded on a single crystal superalloy over a sputtered gold-chromium layer support the high stress levels at elevated temperature without extrusion of the soft platinum or nickel layer and without destruction of an NiO compliant surface. The compliant layers have survived stress and temperature conditions without failure to the ceramic blade and the system can be stressed/heated and unloaded/cooled repeatedly without damage to the ceramic blades. A single crystal nickel base superalloy (i.e., SC180) has high strength properties at elevated temperature. Thin layers of chromium followed by gold are e-beam evaporated on one side of a polished surface of the alloy. Pure nickel is electroplated over this e-beam gold-chromium layer. Platinum is either electroplated or plated electrolessly over the nickel layer.

Abstract: A method and apparatus for improving interfacial chemical reactions in electroless depositions of metals, in which the substrate to be plated is pre-heated prior to its immersion in the various processing solutions that require elevated temperatures, and especially before immersion in the electroless plating solution. The pre-heating is carried out to a temperature that is needed to bring about the desired chemical reaction at the substrate-solution interface, allowing the bath of that process step to operate significantly below the temperature that would have been needed if the panel had not been pre-heated, and below the solution temperature of current practice. According to another aspect of the present invention, the electroless plating apparatus for plating a workpiece operates in a vertical mode and it comprises a heating station, with the panel to be plated returning to the heating station as dictated by the temperature required for a given process step.

Abstract: The invention relates to a method for coating particles thus obtained. According to the inventive method, the particles that are to be coated and at least one organo-metallic complex precursor of the coating material are brought into contact with each other in a liquid containing one or several solvents, whereby said particles are maintained in a dispersion in the liquid which is subjected to temperature conditions and supercritical pressure or slightly sub-critical pressure conditions; the precursor of the coating material is transformed in such a way that it is deposited onto the particles, whereupon the liquid is placed in temperature and pressure conditions so that it can eliminate the solvent in a gaseous state. The invention can be used to coat nanometric particles in paticular.

Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.

Abstract: The present invention is related to the fabrication of at least a part of a Cu-containing layers or a Cu-containing pattern used for the electrical connection of active or passive devices as well as integrated circuits. Such Cu-containing patterns and/or layers are formed on an activated surface of a substrate by means of immersion of said substrate in an electro less Cu plating solution. Such a solution typically comprises: a source of copper Cu (II) ions; a reducing agent; an additive to adjust the pH of said aqueous solution to a predetermined value; and a chemical compound for complexing said Cu ions, said chemical compound having at least one part with chemical structure COOR1—COHR2, R1 being a first organic group covalently bound to the carboxylate group (COO), R2 being either hydrogen or a second organic group. Further disclosed is a method for depositing Cu on an activated surface and particularly on an activated surface of a Cu diffusion barrier layer.

Abstract: A gold complex prepared through allowing a gold hydroxide salt to react with a hydantoin-based compound in an aqueous solution at a temperature between 30° C. to 80° C. in order to coordinate the hydantoin-based compound to gold ions. It is preferable that the reaction ratio of the gold hydroxide salt to the hydantoin-based compound is 1:2 to 1:4 in mole ratio.

Abstract: A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.

Abstract: Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.

Abstract: There is a method and apparatus for plating in which electroless copper plating is performed in a contact hole and an interconnect trench on a minute scale of a semiconductor integrated circuit device, and a plating structure. Organic material originated from an organic gas carried over from the preceding step is removed from the inner surface of a blind hole, thereafter the surface of the barrier layer is subjected to predetermined pretreatments comprising a hydroxylation treatment, a coupling treatment, a Pd colloidal solution treatment and the like, and following the pretreatments, electroless plating with copper is effected desirably under influence of ultrasonic waves. Hence, a uniform, good quality plating layer is formed inside and outside the hole and a CMP processing following the plating is performed with ease.