Abstract: To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.

Abstract: A sanitary article, particularly a sanitary fitting or plumbing fitting, having a coated surface, in which on a coating face and/or below a coating face is provided at least one print image which color-contrasts with the coating.

Abstract: Durable electrolytic cell electrodes having low hydrogen overpotential and performance stability. A highly porous electrocatalytic primary phase and an outer, secondary phase reinforcement coating are provided on an electrically conducting transition metal substrate to make the electrodes. Durability is achieved by the application of the outer secondary phase to protect the primary phase electrocatalytically active coating. A process is also disclosed for catalizing a substrate surface to promote electroless deposition of a metal.

Abstract: A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, permanently glossy, bright palladium layer with few pores. The metal surface may be pretreated in a cementation palladium bath. The metal surface contains at least one of copper, nickel, and cobalt, as well as their alloys with one another and/or with phosphorus or boron.

Abstract: There is provided a method of forming a conductive film having a predetermined pattern in hybrid ICs, high frequency dielectric filters and the like which makes it possible to safely and efficiently perform a series of the steps of preparing an activating catalytic solution for forming a photoreactive film on a base, forming the photoreactive film through the application of the activating catalytic solution, producing an activating catalyst by exposing particular regions of the photoreactive film, developing by flushing away the photoreactive film in unexposed regions, and immersing the base in an electroless plating bath without using an organic solvent and which allows the formation of a plating film having high electrical conductivity and high strength of adherence. A hydrophilic activating catalytic solution is used which is obtained by dissolving copper oxalate, a palladium salt such as palladium chloride into an alkaline solution such as ammonia.

Abstract: A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal salt, an electroless reducing agent, a complexing agent, an electroless plating stabilizer, a quantity of particulate matter which is essentially insoluble or sparingly soluble in the metallizing bath, and a particulate matter stabilizer (PMS), and maintaining said particulate matter in suspension in said metallizing bath during the metallizing of said body for a time sufficient to produce a metallic coating with said particulate matter dispersed therein.

Abstract: A plating jig for plating a corrugated tube includes a linear center rod, a circular rod helically formed with the center rod as its center axis, support rods each having a base fixed to the center rod and an end extended in the radial direction of the circular rod, and suspensions provided at the ends of the support rods respectively, extended in the same direction as the center rod and connected to the one-end side outer circumferential surface of the circular rod.

Abstract: The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity.

Abstract: A process for depositing catalytically active platinum metal layers from an ionogenic, acidic, platinum metal ions-containing solution which further contains sulfonic acid. This activation leads to more uniform catalyst layers with greater surfaces which are catalytically more efficient. The process according to the invention can be implemented in any chemical process utilizing platinum metal catalysts, e.g. chemical synthesis, environment applications or metallization of surfaces.

Abstract: In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, corrosion protection is provided by plating those features by electroless deposition of a nickel-phosphorus alloy forming a layer having a thickness in a range from about 200 .ANG. to about 3000 .ANG., at a rate of about 100 .ANG. per minute, in an aqueous plating bath comprising nickel sulfate hexahydrate in an amount of about 5.5 grams per liter, sodium hypophosphite in an amount of about six grams per liter, boric acid in an amount of about 30 grams per liter, sodium citrate in an amount of about 45 grams per liter, lead acetate in an amount of about one part per million by weight of lead, and a surfactant in an amount of about 0.1 grams per liter. The bath has a temperature of about 72.degree. C. and a pH of about 8.1.

Abstract: The present invention relates to a method for plating nickel onto metal substrates. The method broadly comprises the steps of passing the metal substrate to be plated through a dilute organic acid bath solution to remove contaminants and other deleterious materials, agitating the bath solution as the metal substrate passes therethrough, and thereafter electrolessly plating nickel on the surfaces of the metal substrate. The method of the present invention may be used to nickel plate substrates formed from steel, copper and aluminum.

Abstract: This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.

Abstract: A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and copper is deposited without a mask by electroless plating on the unetched seed layer to form well-adhering high density copper lines without exposing the photoresist to the electroless bath.

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.

Abstract: A method producing a coating on a substrate by aluminizing, chromizing or siliconizing the substrate, and depositing on the coated substrate by electrolytic or electroless deposition a metal matrix M.sub.1 from a bath containing particles of CrAlM.sub.2 to co-deposit the particles with the matrix as M.sub.1 CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. Preferably, the method includes platinum aluminizing of the substrate. Heat treatments may be incorporated before and after deposition of the M.sub.1 CrAlM.sub.2. The deposition of the M.sub.1 CrAlM.sub.2 is carried out at a current density of less than 5 mA per square centimeter. Preferably, the deposition forms a M.sub.1 CrAlM.sub.2 layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles.

Abstract: A zincate-treated article of an Al-Mg-Si base alloy has a zincate coating film having a Zn crystal grain size of 1.0 .mu.m or smaller on an Al-Mg-Si base alloy body having a Cu content of 0.1 to 1.5 weight %. The Zn crystal grain size is preferably equal to or smaller than 0.95 .mu.m. This zincate-treated article can be manufactured by treating an Al-Mg-Si base alloy body having a Cu content of 0.1 to 1.5 weight % in a zincating treatment bath containing 100 to 300 g/l of sodium hydroxide, 5 to 20 g/l of zinc oxide, 2 to 10 g/l of iron chloride, 5 to 20 g/l of Rochelle salt and 50 to 200 ml/l of water glass at a temperature of 20.degree. to 80.degree. C. for 5 to 60 seconds. By adjusting the Zn crystal grain size in the zincating treatment in this manner, a zincate-treated article of an Al-Mg-Si base alloy having an excellent adhesion can be acquired even in a single stage zincating treatment.

Abstract: A wobble plate in a wobble plate compressor has a bevel gear positioned at a central portion thereof. The bevel gear is provided with a centered ball seat. A second bevel gear is supported on the cylinder block and also has a centered ball seat. A bearing ball is seated in both of the ball seats so that the wobble plate nutates about the ball. At least one of the bevel gears is coated with electroless composite plating layer having a self-lubricative material, such as polytetrafluoroethylene (PTFE), dispersed therein. Consequently, the bevel gears have low frictional resistance, high hardness and improved anti-seizure characteristics.

Abstract: An oxygen concentration detector element 2 includes a cup-shaped solid electrolyte 20 with an inside chamber 25 opened at one end and closed at the other end. An external electrode 21 is formed on an outer surface of solid electrolyte 20 by dipping solid electrolyte 20 in first chemical plating liquid 81, while an internal electrode 22 is formed on an inner surface of solid electrolyte 20 by introducing second chemical plating liquid 82 into inside chamber 25. First, in an injecting step, an injection needle 11 is inserted into inside chamber 25 and second chemical plating liquid 82 is introduced into inside chamber 25 via injection needle 11, and then injection needle 11 is pulled out of inside chamber 25. Next, in a plating step, internal electrode 22 is formed on the inner surface of inside chamber 25 using second chemical plating liquid 82. Then, in a discharging step, residual second chemical plating liquid 82 is discharged from inside chamber 25.

Abstract: Metal hydrides are activated by an electrochemical procedure. In this procedure, a bulk sample of the corresponding metal is immersed in an aqueous electrolyte and contacted by a cathode. Current passed through the aqueous electrolyte causes electrolysis of the water and a concomitant reaction with the formation of metal hydride. As a result, the metal hydride is fractured and smaller particles result. Additionally, the resulting metal hydride has a substantial amount of absorbed hydrogen. A novel plating method, taking advantage of the reducing power of hydrogen absorbed in a metal hydride, is useful to encapsulate such metal hydride with a variety of metals. Therefore, such hydrides are uniformly coated by using plating solutions without the standard reducing agent and stabilizer.

Abstract: A process for electrolessly depositing cobalt-tin alloys with adjustable tin contents from 1 to over 25 atomic percent tin is disclosed. The deposited alloy is useful in the electronics and computer industries for device, chip interconnection and packaging applications. When used for chip interconnection applications, for example, the invention replaces the currently used complicated ball-limiting-metallurgy. The invention may also be used to inhibit hillock formation and electromigration in copper wire structures found in computers and micron dimension electronic devices.

Abstract: Polyamino disuccinic acids are effective chelants for use in photography and gas conditioning (both applications preferably involving the polyamino disuccinic acid in the form of a metal, preferably an iron complex). The copper chelates are also useful in electroless copper plating. In photography, the invention includes a method of bleaching or bleach-fixing a photographic material which comprises contacting said material with a bleaching solution containing a bleaching agent comprising a ferric complex of a polyamino disuccinic acid and the solution so used. In electroless deposition, the invention includes a method of electroless deposition of copper upon a non-metallic surface receptive to the deposited copper including a step of contacting the non-metallic surface with an aqueous solution comprising a soluble copper salt and a polyamino disuccinic acid and plating baths appropriate for such use.

Abstract: An electroless metal plating solution comprising metal ions to be reduced for plating onto a substrate and a chelate for the metal to prevent or reduce metal hydroxide precipitates forming and to buffer the amount of metal ions available for reduction, wherein the chelate is at least ethylene diamine disuccinic acid (EDDS).

Abstract: A chemical reducing solution obtained by using an alkali boron hydride as a reductant and adding thereto a water-soluble, polyoxyethylene chain-containing organic compound having a molecular weight of 200 or above molecule as an additive has merits in that it can reduce copper oxide to metallic copper while maintaining the needle-like form of copper oxide as completely as possible and the reduction can be completed in a short period of time by a simple procedure, so that the chemical reducing solution is successfully usable in a process for producing a multi-layer printed circuit board.

Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.

Abstract: A method for replenishing an electroless gold plating bath in which metallic gold is dissolved into the bath.

Abstract: A process for the selective variation in density of particulate matter codeposited within metallic matrices deposited onto articles utilizing increased levels of rotation of said articles during plating cycle to attain said selective codeposition density. The attainment of varying densities of codeposited particulate matter in the plated layer along the surface of the substrate is particularly useful in cost reduction and improved product performance.

Abstract: Disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below-listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step:(a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double

Abstract: A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.

Abstract: A substrate metal such as aluminum or titanium, usually in the form of a web, is anodized to form a porous unsealed oxide coating. An inexpensive core metal such as copper or chromium is then electrodeposited in the pores of the oxide coating to form metal nodules extending above the oxide coating in a bulbous, undercut configuration. A second metal, usually an expensive catalytic metal, is deposited onto the surface of the core metal nodules by electro or chemical deposition. A large surface area of catalyst is formed with the use of a minimum amount of catalyst metal. The nodules may be liberated from the substrate metal surface by dissolving the oxide layer and releasing discrete particles to form a fine catalyst powder.

Abstract: A plating method by means of an electroless gold solution under air supply in the form of air bubbles from air dispersing bodies placed on the bottom of a plating tan, whereby more uniform plating can be achieved and the life of the plating solution can be prolonged. Air bubbles are uniformly supplied over the entire region in the plating tank which corresponds to a plating region of a substance to be plated and placed in the plating tank, and the air supply is adjusted depending on the liquid temperature of the plating solution.

Abstract: There is disclosed a novel process for catalyzation for trapping of a catalyst metal involved with the adhesion of an electroless plating to a substrate. The process is carried out by employing neither the sensitizing-activating method nor the catalyst-accelerator method. Specifically, in forming an electroless plating on the surface of a non-conductive substance as a substrate, the surface of the non-conductive substance is coated with a treatment liquid containing at least chitosan or a chitosan derivative before the steps of catalyzation and electroless plating to form a hydrophilic coating film on the surface of the non-conductive substance.

Abstract: The invention provides a method and structure in which a nucleating species [54] is implanted through apertures [52] of a metal-phobic layer [40] into a support layer [17] and copper or a like metal is selectively grown at the implant site or sites. The implant support layer [17] is preferably composed of a material which inhibits diffusion therethrough of the copper or other like grown metal.

Abstract: A process for efficient modification and metallization of substrates includes the steps of providing a substrate with highly photoefficient chemical functional groups on at least a portion of this substrate, exposing the substrate to actinic radiation to transform, deactivate, or remove these chemical functional groups, to modify their chemical reactivity, and carrying out further chemical reaction steps on these modified chemical functional groups.

Abstract: A replenishing solution for a cyanide-based electroless gold plating bath. The solution includes a gold(III) halide such as gold chloride, gold bromide, tetrachloroaurate (and its sodium, potassium, and ammonium salts), and tetrabromoaurate (and its sodium, potassium, and ammonium salts). The replenishing solution also may include an alkali (such as potassium hydroxide, sodium hydroxide, and ammonium hydroxide) to maintain the pH of the solution between 8 and 14. Also provided is a method of replenishing a cyanide-based electroless gold plating bath with the solution of the present invention.

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

Abstract: A phosphate bath control system and method is provided that tracks the set points of one or more of the major process variables of the phosphate bath independently of variations in the production conditions. A detector determines the current values of Zinc, Manganese and Total Acid provides data to a controller which exponentially filters the data and processes the filtered data in accordance with fuzzy logic rules. The controller periodically updates the flow rate of one or more pumps that control the flow of liquid concentrates to the bath in order to maintain a desired concentration of the various constituents of the bath. Control of an accelerator is provided by incorporating in the controller an additional algorithm for indirect estimation of the accelerator concentration based on a math model which represents the material balance of the accelerator in the bath.

Abstract: The invention relates to a process for production of a copper clad, electrically insulated base for printed circuit boards, wherein a foil, of copper, copper alloy, aluminum or aluminum alloy by electroplating on preferably both sides furnished with a 1-35 .mu.m thick unpatterned layer of copper or copper alloy, is under heat and pressure laminated with the copper surfaces facing an electrically insulating, resin containing base. The copper layers are electroplated onto the foil in such a way that the layers after lamination strongly adhere to the insulating base and at the same time exhibit a very poor adhesion to the foil, which easily can be stripped from the copper layers without splitting these. The foil works during the lamination as a mold plate, whereby conventional mold plates can be excluded. The invention also comprises the use of such a copper clad foil as a combined mold plate and base for the copper layers during the lamination.

Abstract: Disclosed herein are processes for the metallizing of an article to provide on the surface thereof a metallic coating free of codeposited particulate matter comprising the contacting of said article with a metallizing composition having dispersed therein finely insoluble particulate matter which are not codeposited within said metallic coating during the plating process. Said process provides an improved surface morphology in comparison to the metallic coating derived from said metallizing composition in the absence of said insoluble particulate matter.

Abstract: A photoelectrochemical method and apparatus are disclosed for fabricating electronic circuits. An electroplating solution is applied to the surface of a reverse biased p-type semiconductor material, such as NiO. The solution-covered NiO surface is illuminated with a light beam directed by computer aided design data to photoelectrochemically deposit a seed layer of metal in an electronic circuit pattern. The seed layer may be thickened by further deposition in a plating bath to form metallic circuit traces on the NiO. If desired, the metallic circuitry may be transferred from the NiO to an alternate substrate having a low dielectric constant. The porosity of the NiO surface can be adjusted to optimize the metallic circuit adhesion for image retention or ease of transfer. The metallic traces may also be treated to reduce adhesion of subsequently deposited metal that can be transferred readily.

Abstract: A method for forming a conductor circuit is provided which comprises depositing and filling a conductor metal in recessions of insulator in the form of grooves or holes using an electroless plating solution, the conductor metal being deposited and filled in the recession to the same level as the surface of the insulator, wherein said electroless plating solution contains an inhibitor which inhibits the cathodic partial reaction which is a metal deposition reaction and the electroless plating is carried out with stirring the plating solution. Since the plating reaction automatically stops when the metal conductor 1 is formed up to the level of the surface of the insulator 2, a conductor circuit in which the surface of the metal conductor 1 and that of the insulator 2 are even and at the same level can be easily obtained.

Abstract: A chemical metallization process is used for electrically non-conducting porous substrates, in needle felts, nonwovens or open-pored foams which possesses a porosity of from 40 to 97%. The metallization follows activation of the fiber surfaces or of the surfaces of the pore walls with a noble metal-containing solution. The volume of the chemical metallizing solution used is reduced to produce a considerable reduction in the operating costs, not only in respect of the solution itself but also in respect of the disposal of the waste water from the chemical metallization. Since less waste water is produced from the start in the chemical metallization process, a considerable contribution to the protection of the environment results.

Abstract: Ceramic fibers may be produced by the electrophoretic deposition of metal oxide upon a conductive fiber core, which core may be subsequently removed.

Abstract: Described is an aqueous electroless alkaline pH tin coating composition comprised of a source of tin ions and an effective amount of a sludge control agent that is an organic chelating composition.

Abstract: An electrodeposited composite coating comprises, as deposited, a matrix of cobalt and particles of chromium carbide, at least 50% and preferably at least 80% or 90% by weight of the particles lying within the size range of 4 .mu.m to 8 .mu.m.

Abstract: A method and an apparatus for coating tanks and pipe systems internally in that, first, a tank (1) is filled with a liquid (3) consisting of water to which is admixed an acid (10). Oxide coating on the internal surface is removed through heating and circulating the liquid (3) through a filter (4). The liquid (3) is neutralized through the admixture of a base (12). Approximately one fifth of the neutralized liquid (3) is drawn off, the tank (1) being refilled with a concentrated metal solution (15). The temperature, acidity and metal concentration of the liquid (3) are maintained close to constant through supplying heat, acid (10) or base or base (12), and concentrated metal solution (15), respectively. Air or vapor is supplied through a blowing pipe (5) and creates stirring, surplus liquid and gas being drained through a pipe (16). When the internal surface of the tank (1) has received a coating having the desired thickness, the process is interrupted in that the liquid (3) is cooled and drained.

Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Abstract: A method for metallizing selected areas of a two dielectric layered sequentially processed circuit board (100) involves exposing the resin A (204) by photo-definition. The resin A (204) contains 10% or less, by weight Cu.sub.2 O particles (300) mixed uniformly throughout the resin. The circuit board (100) is sprayed with a reduction solution to form catalytic islands (301) predominately of Cu.sup.0 or CuH. The circuit board (100) is then electrolessly plated to form conductors, pads or vias, where the resin A (204) has been exposed. The reduction solution includes a primary reducing agent, a secondary reducing agent and a capturing agent. The reduction solution preferably has a pH of 10 or greater. The primary reducing agent is preferably a borohydride. The secondary reducing agent is preferably an iodide and the capturing agent is a chelating agent preferably EDTA.

Abstract: Printed circuit board having excellent peel strength and conductance resistance is provided with a substrate, a resin insulating layer formed thereon and roughened at its surface, and a conductor formed thereon, in which at least a portion of the conductor is composed of an eutectic metal layer.

Abstract: The adhesion of metal coatings deposited by electroless deposition on polycarbonate-addition polymer substrates, especially polycarbonate-ABS substrates, is improved by first contacting the substrate with an alkali metal hydroxide solution followed by concentrated nitric acid.

Abstract: Workpieces of non-corrosion-resistant metals are provided with a wear-resistant, non-metallic layer of a nitride, carbide, boride, oxide or silicide of an element of the fourth to the sixth subgroup applied by PVD (physical vapor deposition) after a corrosion-resistant intermediate layer had been previously applied. An intermediate layer consisting of a copper-tin alloy with 45 to 80% copper, 10 to 55% tin and 0 to 15% zinc proved to be corrosion-resistant and noble and in addition does not cause any skin allergy.