Nonuniform Or Patterned Coating Patents (Class 427/552)
  • Patent number: 5529812
    Abstract: The present invention concerns a method of manufacturing decorative board meeting exceptionally high standard concerning abrasion resistance, scratch resistance and impact resistance and which for this pruposes is varnished, electron-beam cured to 60-9.5%, is subjected to a pressing treatment and finally it is electron-beam cured to 100% to provide the disired abrasion resistance, gloss, and surface finish.
    Type: Grant
    Filed: February 21, 1995
    Date of Patent: June 25, 1996
    Inventor: Djorn Keding
  • Patent number: 5514425
    Abstract: A thin film-forming method according to the present invention is characterized by comprising the steps of introducing TiCl.sub.4, hydrogen, nitrogen and NF.sub.3 into a film-forming chamber containing a semiconductor substrate (1) having a groove made in its surface, after the chamber has been evacuated to 10.sup.-4 Torr or less; and converting these gases into plasma, thereby forming a thin TiN film on only that portion of the groove which is other than the wall surfaces of the groove.
    Type: Grant
    Filed: March 6, 1995
    Date of Patent: May 7, 1996
    Assignees: Kabushiki Kaisha Toshiba, Tokyo Electron Limited, Tokyo Electron Yamanashi Limited
    Inventors: Hitoshi Ito, Kyoichi Suguro, Nobuo Hayasaka, Haruo Okano, Shinji Himori, Kazuya Nagaseki, Syuji Mochizuki
  • Patent number: 5512328
    Abstract: In forming a thin film pattern, first a seed material film is formed on a substrate and then exposed using electron beam lithography, for example, in the shape of the pattern. The latent image is then removed and an oriented material is deposited on one of the seed material and the substrtate, which have different hydrophilicity properties, to form the pattern. The oriented film is formed by an LB film forming method, in one example, and in another example the LB film material is a cresol novolak resin having a proportion of p-cresol novolak to m-cresol novolak of at least 20%.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: April 30, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Toshiyuki Yoshimura, Naoko Miura, Shinji Okazaki, Minoru Toriumi, Hiroshi Shiraishi
  • Patent number: 5508065
    Abstract: A method in which a thin layer of semiconducting, insulating, or metallic material is transferred by ablation from a source substrate, coated uniformly with a thin layer of said material, to a target substrate, where said material is desired, with a pulsed, high intensity, patternable beam of energy. The use of a patternable beam allows area-selective ablation from the source substrate resulting in additive deposition of the material onto the target substrate which may require a very low percentage of the area to be covered. Since material is placed only where it is required, material waste can be minimized by reusing the source substrate for depositions on multiple target substrates. Due to the use of a pulsed, high intensity energy source the target substrate remains at low temperature during the process, and thus low-temperature, low cost transparent glass or plastic can be used as the target substrate.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: April 16, 1996
    Assignee: Regents of the University of California
    Inventor: Kurt H. Weiner
  • Patent number: 5485935
    Abstract: A method and apparatus are disclosed for capturing coating debris during laser ablation of a photoreceptor comprising: (a) enclosing a predetermined length of a coated substrate in a housing to result in an enclosed coated substrate portion, wherein there exists a gap between the enclosed substrate portion and the housing in communication with air outside the housing; (b) directing high energy radiation at the coating of the enclosed substrate portion; (c) directing a first fluid stream against the coating of the enclosed substrate portion to remove at least part of the coating in the form of coating debris during or subsequent to (b), whereby the first fluid stream may move a portion of the coating debris outside the housing in the absence of (d); (d) directing a second fluid stream against the first fluid stream in a direction effective for keeping the coating debris inside the housing, thereby minimizing movement of the coating debris into the air outside the housing; and (e) exhausting the coating debris.
    Type: Grant
    Filed: April 1, 1994
    Date of Patent: January 23, 1996
    Assignee: Xerox Corporation
    Inventors: Robert S. Foltz, Ronald A. Gaither
  • Patent number: 5462772
    Abstract: New and improved structures in tools subject to wear and attrition when engaging or engaged by work or material being worked on thereby. Synthetic diamond material is formed in situ on a select portion or portions of the surface of a hard substrate or tool support to define or cover the portion of the tool substrate adjacent the work operated on by the tool in a manner to provide a hard wear resistant work engaging surface or surfaces which offers substantially greater resistance to abrasion and frictional deterioration than the material of the substrate or tool base. In one form, the synthetic diamond material is formed on and welded to the surface of the substrate in a single operation involving the application of intense radiant energy beamed against particles of carbon which are converted to a solid synthetic diamond structure of defined shape directly against the solid substrate.
    Type: Grant
    Filed: May 13, 1993
    Date of Patent: October 31, 1995
    Inventor: Jerome H. Lemelson
  • Patent number: 5460284
    Abstract: A method and apparatus are disclosed for capturing coating debris during laser ablation of a photoreceptor comprising: (a) enclosing a predetermined length of a coated substrate in a housing to result in an enclosed coated substrate portion, wherein there exists a gap between the enclosed substrate portion and the housing in communication with air outside the housing; (b) directing high energy radiation at the coating of the enclosed substrate portion; (c) directing a first fluid stream against the coating of the enclosed substrate portion to remove at least part of the coating in the form of coating debris during or subsequent to (b), whereby the first fluid stream may move a portion of the coating debris outside the housing in the absence of (d); (d) directing an annularly-shaped second fluid stream against the first fluid stream in a direction effective for keeping the coating debris inside the housing, thereby minimizing movement of the coating debris into the air outside the housing; and (e) exhausting t
    Type: Grant
    Filed: April 1, 1994
    Date of Patent: October 24, 1995
    Assignee: Xerox Corporation
    Inventors: Robert S. Foltz, Ronald A. Gaither, Richard C. Petralia
  • Patent number: 5437893
    Abstract: Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.
    Type: Grant
    Filed: April 26, 1993
    Date of Patent: August 1, 1995
    Assignees: Hitachi, Ltd, Showa Denko K. K.
    Inventors: Fumio Murai, Yasunori Suzuki, Hideki Tomozawa, Ryuma Takashi, Yoshihiro Saida, Yoshiaki Ikenoue
  • Patent number: 5407708
    Abstract: A system and method for the printing of substrates for use in food packaging and, more particularly, a flexographic printing system and method for applying and curing radiation cured inks to a flexible, heat shrinking web employing a combination of UV radiation and EB radiation.
    Type: Grant
    Filed: January 27, 1994
    Date of Patent: April 18, 1995
    Assignee: W.R. Grace & Co.-Conn.
    Inventors: Joseph Lovin, Lee W. Keller
  • Patent number: 5407557
    Abstract: A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam.
    Type: Grant
    Filed: February 24, 1994
    Date of Patent: April 18, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Atsuko Iida, Hiroshi Odaira, Yoshizumi Sato, Yuichi Yamamoto
  • Patent number: 5352330
    Abstract: The process of using electron beam induced stimulated desorption chemistry to produce structures of nanometer order size on surfaces. By passivating a reconstructed surface and selectively removing such passivation with an electron beam through the electron stimulated desorption effect, the adsorption of other atoms and/or molecules is controlled at predetermined regions and/or lines on the surface.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: October 4, 1994
    Assignee: Texas Instruments Incorporated
    Inventor: Robert M. Wallace
  • Patent number: 5340619
    Abstract: Color filter arrays containing one or more colors for liquid crystal displays and other optoelectronic devices are made by using a laser to ablate portions of a coating on either a colored or transparent substrate. Color filter materials are placed into the ablated openings and cured. The number of laser ablated openings in the coated substrate varies, depending on the quantity and types of colors desired.
    Type: Grant
    Filed: October 18, 1993
    Date of Patent: August 23, 1994
    Assignee: Brewer Science, Inc.
    Inventors: Yih-Wen Chen, Terry Brewer, Jeffery Hunninghake, Dan Hawley
  • Patent number: 5336530
    Abstract: A coating composition which includes an ionizing radiation-polymerizable oligomer, an ionizing radiation-polymerizable monomer and a releasing agent. The composition has a viscosity regulated to 1000 cps or less, can be rapidly and continuously produced and has excellent surface characteristics. A process for forming a decorative material using the coating composition is also disclosed.
    Type: Grant
    Filed: September 2, 1993
    Date of Patent: August 9, 1994
    Assignees: Dai Nippon Printing Co., Ltd., The Inctec, Inc.
    Inventors: Seiji Ikemoto, Katsuhiko Taki, Takashi Matano, Ichiro Kawahata, Kiyoshi Oguchi, Shigeki Ito, Tatsuo Miyauchi
  • Patent number: 5334422
    Abstract: A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: August 2, 1994
    Assignee: Delco Electronics Corp.
    Inventors: Bruce A. Myers, John K. Isenberg, Christine R. Coapman, James A. Blanton
  • Patent number: 5314768
    Abstract: A thin film mask for use in an X-ray lithographic process is disclosed herein along with a method of making the mask which is comprised of a diamond thin film layer supported on one surface of an X-ray transparent non-diamond substrate, for example silicon. A predetermined pattern of ions of a substance opaque to X-rays, for example a heavy atomic number substance such as gold, tungsten or cesium, is introduced into the diamond thin film layer as opposed to being deposited thereon. In one embodiment disclosed herein, this is accomplished by means of ion implantation, and in a second embodiment by means of an ion beam direct write device.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: May 24, 1994
    Assignee: National Semiconductor Corporation
    Inventor: Rakesh B. Sethi
  • Patent number: 5302421
    Abstract: A process for the production of microstructure elements having structure depths of from several .mu.m into the mm range by imagewise irradiation of polymers with X-rays and removal of the areas of the polymers which have been irradiated imagewise, comprises applying the polymers, before the imagewise irradiation, to an electroconductive substrate in a layer thickness of from several .mu.m into the mm range by melting under pressure, thus firmly anchoring the polymers.The process according to the invention is particularly suitable for the production of microstructure elements having structure depths of from 3 to 2000 .mu.m and lateral dimensions of less than 10 .mu.m.
    Type: Grant
    Filed: July 9, 1993
    Date of Patent: April 12, 1994
    Assignee: BASF Aktiengesellschaft
    Inventors: Peter Hoessel, Gerhard Hoffmann
  • Patent number: 5262392
    Abstract: A method for patterning precursor film, a product thereof, a method for preparing a patterned ceramic film and a processing workpiece. The method for patterning precursor film includes the steps of depositing a blocking layer over the precursor film, patterning the overlaid blocking layer to uncover portions of the precursor film, irradiating the patterned blocking layer and uncovered portions of the precursor film with a beam sufficiently energetic to radiation modify the full thickness of unmasked portions of the precursor film and insufficiently energetic to radiation modify portions of the precursor film covered by the blocking layer, and developing the precursor film. The blocking layer has a lesser thickness than the precursor film, but is sufficiently thick to block an irradiating beam having the minimal energy necessary to radiation modify the full thickness of the precursor layer.
    Type: Grant
    Filed: July 15, 1991
    Date of Patent: November 16, 1993
    Assignee: Eastman Kodak Company
    Inventors: Liang-Sun Hung, Longru Zheng, Yann Hung
  • Patent number: 5256454
    Abstract: Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.
    Type: Grant
    Filed: May 30, 1991
    Date of Patent: October 26, 1993
    Assignees: Hitachi, Ltd., Showa Denko K.K. Corporations
    Inventors: Fumio Murai, Yasunori Suzuki, Hideki Tomozawa, Ryuma Takashi, Yoshihiro Saida, Yoshiaki Ikenoue
  • Patent number: 5254373
    Abstract: The second pole layer P2 of a thin film transducer structure is fabricated by using two levels of photoresist to define the pattern of the P2 pole layer. The first photoresist layer is deposited as a thin film and is used to focus an optical projection device that projects the mask pattern onto the photoresist. After etching and curing of the first photoresist, which is disposed above a portion of the first pole piece at the apex of the transducer, a second photoresist layer is deposited over the first photoresist layer and above the insulation deposited over the electrical coil structure. The second photoresist layer is relatively thick and serves to define the frame for printing the P2 pole piece pattern a second time. The data track width defined by the P2 pole piece is more uniform as a result of the improved definition of the frame used for registering the P2 pattern.
    Type: Grant
    Filed: April 19, 1993
    Date of Patent: October 19, 1993
    Assignee: Read-Rite Corp.
    Inventor: Ronald A. Barr
  • Patent number: 5246742
    Abstract: The invention relates to a method of producing an X-ray rotary anode having a focal track region composed of refractory metals. The focal track region is manufactured by means of powder-metallurgy methods or by means of CVD or PVD methods. According to the invention, the focal track region is posttreated using high-energy electrons or photons by means of local, superficial melting to a depth of less than 1.5 mm. This reduces, in particular, the residual porosity in the focal track region. That results in improved mechanical properties, higher X-ray yield and markedly improved service life of such rotary anodes.
    Type: Grant
    Filed: May 5, 1992
    Date of Patent: September 21, 1993
    Assignee: Schwarzkopf Technologies Corporation
    Inventor: Peter Rodhammer
  • Patent number: 5229361
    Abstract: A method for forming an insulating layer in an oxide high-temperature superconductor is described. The oxide high-temperature superconductor is exposed to radiation, whereby an interface showing superconducting characteristics and/or a weak link that is present at an interface in the said oxide high-temperature superconductor is transformed to a thin insulating layer.
    Type: Grant
    Filed: April 2, 1992
    Date of Patent: July 20, 1993
    Assignee: Japan Atomic Energy Research Institute
    Inventors: Kensuke Shiraishi, Yasuo Otoguro, Koichi Yano
  • Patent number: 5225251
    Abstract: A process for forming layers on a substrate including irradiating at least part of an aluminum nitride surface with a high power ultraviolet emitter resulting in the elimination of the nitride component to form an aluminum layer. The aluminum layer is then reinforced by a metal.
    Type: Grant
    Filed: September 11, 1992
    Date of Patent: July 6, 1993
    Assignee: Asea Brown Boveri Aktiengesellschaft
    Inventor: Hilmar Esrom
  • Patent number: 4237192
    Abstract: This invention relates to a zinc plated steel plate, at least one side surface of which is substantially free from oxides and coated with an anti-rust film, and a can produced from said zinc plated steel plate having an interlocking seam joint bonded by soldering techniques.
    Type: Grant
    Filed: January 30, 1979
    Date of Patent: December 2, 1980
    Assignee: Nisshin Steel Co., Ltd.
    Inventors: Takehiko Ito, Yusuke Hirose, Hideaki Ishida