Abstract: This disclosure discloses a method comprising: positioning a stencil having an opening onto an aerospace part such that the aerospace part is accessible through the opening; positioning a masking medium onto the aerospace part through the opening; removing the stencil from the aerospace part such that the masking medium remains on the aerospace part and treating the aerospace part with the masking medium thereon.

Abstract: There is presented a method for geometrically modifying high-index dielectric structures on a support structure which includes steps of providing a support structure and a first plurality of high-index dielectric structures supported by the support structure. The method includes changing a geometry of the high-index dielectric structures within a second plurality of high-index dielectric structures, being a sub-set of the first plurality of high-index dielectric structures. The geometry is changed by photothermally melting some of the high-index dielectric structures within the second plurality of high-index dielectric structures by irradiating them with incident electromagnetic radiation, and thereby exciting resonances associated with each of the high-index dielectric structures within the second plurality of high-index dielectric structures.

Abstract: A method for creating an iridescent effect on a surface through formation of wavelets on the source can include using a pulse of laser beams sent to the surface in juxtaposed optical fields of a focusing system. A scanner scans the surface using laser beams along a series of lines that follow each other in a relative direction of travel of the part and of the scanner and a series of lines that lie in continuation of each other in a direction perpendicular to the relative direction of travel. The optical fields overlap in an overlapping area having a width that is twice the diameter of the pulse laser beam up to 2 cm. Two lines lying in continuation of each other overlap at a junction and between the two series of lines follow each other in a relative direction of travel of the part and the scanner.

Abstract: A semiconductor device has a shielding layer over a semiconductor package. A plurality of slot lines define a location to form a slot in the shielding layer. The slot is formed in the shielding layer by cutting along the slot lines with a laser controlled by a scanner to read the slot lines. The slot lines include a left boundary slot line and right boundary slot line. The slot can be cut in the shielding layer by performing an edge cut along the slot lines, and performing a peel back to form the slot in the shielding layer. Alternatively, the slot can be cut in the shielding layer by performing a first cut in a first direction along the slot lines, and performing a second cut in a second direction opposite the first direction along the slot lines to form the slot in the shielding layer.

Abstract: An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.

Abstract: A method for fabricating an active cooling structure, comprising forming an array of Superconductor-Insulator-Normal Metal (NIS) tunnel structures between a non-conducting layer and a superconducting layer. The non-superconducting layer may comprise a plurality of non-superconducting traces running in a first direction. The superconductor layer may comprise a plurality of superconducting traces running in a second direction.

Abstract: Photonic devices are disclosed including a first cladding layer, a first electrical contact comprising a first lead coupled to a first dielectric portion, a second electrical contact comprising a second lead coupled to a second dielectric portion, a waveguide structure comprising a slab layer comprising a first material, and a second cladding layer. The slab layer may be coupled to the first dielectric portion of the first electrical contact and the second dielectric portion of the second electrical contact. The first dielectric portion and the second dielectric portion may have a dielectric constant greater than a dielectric constant of the first material.

Abstract: The present disclosure relates to a process of machining a metal middle frame, which includes the following steps of: obtaining a sheet material and cutting the sheet material into a linear profile; performing a finish machining to the linear profile; bending the linear profile after the finish machining, obtaining a metal border frame with an R angle; welding the metal border frame; and placing the metal border frame after the welding in a die-casting mold, providing a die-casting metal liquid, thereby obtaining a die-cast middle plate connected to the metal border frame, so as to form the metal middle frame.

Abstract: A method for forming an electrode catalyst layer by putting catalyst ink within an insulative container having a conductive nozzle in communication with the interior of the container and applying an electrospray voltage to the nozzle to cause electrospray of the catalyst ink through the tip end of the nozzle and thereby to form an electrode catalyst layer, the method includes preparing catalyst ink containing a mixture of at least electrode catalyst, polymer electrolyte binder and volatile organic compound and/or water, putting the catalyst ink within the container with a space remaining inside thereof and air-tightly sealing the container, and electrospraying with the space inside of the air-tightly sealed container being conditioned to have a negative pressure of a level at which the catalyst ink cannot drip off from the nozzle.

Abstract: A product includes a substrate, at least one of a conductive layer or a coating layer, and an ablated surface on the substrate. The substrate is at least partially transparent to visible light. The at least one of the conductive layer or the coating layer are disposed over at least a portion of the substrate. The ablated surface includes an interleaved surface profile having a plurality of non-overlapped laser spots and a plurality of overlapped laser spots formed by subjecting the substrate to an interleaving laser ablation process.

Abstract: Disclosed herein are embodiments of methods, devices, and assemblies for processing feedstock materials using microwave plasma processing. Specifically, the feedstock materials disclosed herein pertains to scrap materials, dehydrogenated or non-hydrogenated feed material, and recycled used powder. Microwave plasma processing can be used to spheroidize and remove contaminants. Advantageously, microwave plasma processed feedstock can be used in various applications such as additive manufacturing or powdered metallurgy (PM) applications that require high powder flowability.

Abstract: A vapor deposition mask used for forming a thin film pattern on a substrate enables to form much higher-definition thin film pattern and to closely attract and hold the vapor deposition mask to and on a surface of a transparent substrate by a magnetic force in a state that the substrate held on a substrate holder is intermediated therebetween, while preventing occurrence of shadow portions (vapor deposition shadows) to which no deposition material is adhered due to a holding member. A vapor deposition mask 1 is composed of a single resin film layer 2 or a resin film layer 2 and a holding member 7 of a substantially rectangular thin plate frame body, and a metal powder 4 is contained in the resin film layer 2 in which a plurality of through openings 3 are formed. When having the holding member 7, a single rectangular opening 8 including a portion of the resin film layer 2 where a plurality of the through openings 3 are formed is formed on the holding member 7.

Abstract: In a transparent electrode based on a metal material having reduced light reflectance, a light absorbing layer having black characteristic is formed on a lower surface, a partition wall, and/or an upper surface of a metal wire, and thus, light reflectance of transparent electrode is minimized. In a method of manufacturing a transparent electrode, the light absorbing layer can be selectively formed on the upper and lower surfaces and the partition wall of the metal wire having a fine line width by using self-aligning and a spontaneous pattern effect. A conductive wire is implemented by using an imprinting process using an elastic body-based stamp, and thus, conductive wires having a fine line width and an excellent aspect ratio can be formed, so that it is possible to improve electric conductivity and transmittance.

Abstract: There is provided a substrate processing apparatus including a rotary holding part configured to hold and rotate a substrate with a film formed on an upper surface of the substrate; a first supply part configured to supply a first chemical solution for etching the film to a peripheral edge portion of the upper surface of the substrate held by the rotary holding part; a second supply part configured to supply the first chemical solution to a peripheral edge portion of a lower surface of the substrate; and a third supply part configured to supply a second chemical solution, which exothermically reacts with the first chemical solution, to the peripheral edge portion of the lower surface of the substrate.

Abstract: An solar cell of an embodiment includes a first electrode, an electron transport layer containing a metal oxide, a self-assembled monolayer, a photoelectric conversion layer including a p-type semiconductor and an n-type semiconductor, and a second electrode. The self-assembled monolayer includes a fullerene-containing compound having a fullerene portion including a fullerene or a fullerene derivative, an absorption group to the metal oxide, and a bond group bonding the fullerene portion and the absorption group. The bond group contains a bivalent aromatic hydrocarbon group and a bivalent organic group which includes a carbon atom chain having 1 to 18 single-bonded carbon(s) or an atom chain in which a part of the carbon atom chain is substituted by at least one element selected from oxygen, nitrogen, and sulfur, as a main chain.

Abstract: In a transparent electrode based on a metal material having reduced light reflectance, a light absorbing layer having black characteristic is formed on a lower surface, a partition wall, and/or an upper surface of a metal wire, and thus, light reflectance of transparent electrode is minimized. In a method of manufacturing a transparent electrode, the light absorbing layer can be selectively formed on the upper and lower surfaces and the partition wall of the metal wire having a fine line width by using self-aligning and a spontaneous pattern effect. A conductive wire is implemented by using an imprinting process using an elastic body-based stamp, and thus, conductive wires having a fine line width and an excellent aspect ratio can be formed, so that it is possible to improve electric conductivity and transmittance.

Abstract: A graphene-containing coating film includes at least one hydrate represented by Chemical Formula 1 as described herein, a graphene positioned in a shape on the surface of the hydrate represented by Chemical Formula 1, and a silica particle positioned on the surface of the hydrate of Chemical Formula 1 and positioned on the surface of the graphene in a shape of discontinuous island. Particularly, the silica particle includes agglomeration of a plurality of silica nanoparticles. A method of preparing the graphene-containing coating film and a vehicle part such as a head lamp including the same are also provided.

Abstract: Processes for shaping one- and two-dimensional nanomaterials, and thereby inducing local strains therein preferably to control one or more of their material properties. The processes include providing a substrate comprising a three-dimensional surface feature thereon, locating a nanomaterial on the substrate and over the surface feature, and directing a laser beam toward the nanomaterial such that the nanomaterial experiences laser shock pressure sufficient to deform the nanomaterial to conform at least partially to the shape of the surface feature and adhere to the surface feature either directly or via an intermediate layer therebetween.

Abstract: The present invention relates to a method of producing a (shaped) ceramic or glass-ceramic article, involving the steps of: (a) providing a powder or a powder mixture comprising ceramic or glass-ceramic material, (b) depositing a layer of said powder or powder mixture on a surface, (d) heating at least one region of said layer by means of an energy beam or a plurality of energy beams to a maximum temperature such that at least a part of said ceramic or glass-ceramic material in said at least one region is melted and (e) cooling said at least one region of said layer so that at least part of the material melted in step (d) is solidified, such that the layer is joined with said surface in said at least one region. The invention also relates to ceramic or glass-ceramic articles and their use.

Abstract: A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm2. The laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.

Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.

Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate.

Abstract: An electronic device may have components such as button members, display cover glass layers, structures associated with connector ports, and other components. The components may have transparent and opaque structures. The transparent structures may be formed on top of the opaque structures. The transparent structures may have peripheral edges through which light may pass. To help prevent the appearance of the components from becoming degraded by the presence of dirt, at least some of the edge portions of the transparent structures may be covered with an opaque covering material. The opaque covering material may be formed from paint or sidewall structures that are formed as an integral part of the opaque structures.

Abstract: In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.

Abstract: A substrate for a display device including a base substrate; a thin film transistor on the base substrate; a passivation layer of a photosensitive organic material on the thin film transistor, the passivation layer having a contact hole exposing the thin film transistor, the photosensitive organic material including an ultraviolet absorber; and a pixel electrode on the passivation layer, the pixel electrode connected to the thin film transistor through the contact hole.

Abstract: The present invention relates to a composition comprising a stable aqueous dispersion of polymer particles and a dispersant adsorbed onto the surfaces of TiO2 particles, wherein the dispersant is a water-soluble polymer functionalized with structural units of a carboxylic acid ester and tris(hydroxymethyl)aminomethane. The composition of the present invention is particularly useful for achieving high hiding for paints containing associative thickeners.

Abstract: Formation of a feedthrough in a substrate for use in an implantable medical device is presented. A substrate includes a first surface and a second surface, and a via that extends through the first and the second surfaces. A dielectric layer is formed over one of a first surface of the substrate. Conductive material is introduced into the via to form a feedthrough.

Abstract: In a method for manufacturing a fine metal electrode, the method includes coating an organometallic ink on a first base substrate to form a solution layer. The first base substrate on which the solution layer is formed is pre-baked, to self-produce a nanoparticle in the solution layer. The first base substrate on which the solution layer is formed is aligned with a photomask. A laser is irradiated on the photomask. The photomask is detached from the base substrate on which the solution layer is formed. The solution layer is cleaned.

Abstract: A manufacturing method includes providing a substrate having one or more grooves formed therein. One or more coatings having one or more grooves formed therein are disposed on the substrate and in fluid communication with the one or more grooves in the substrate. A cover coating is disposed on a portion of an outermost surface of the one or more coatings, having one or more cooling outlets formed therein and in fluid communication with the one or more grooves in the one or more coatings. The substrate, the one or more coatings and the cover coating define therein a cooling network for cooling a component. A component having a cooling network defined therein a substrate, one or more coatings disposed on at least a portion of the substrate, and a cover coating disposed over at least a portion of an outermost coating of the one or more coatings.

Abstract: A method of forming a superconductor includes exposing a layer disposed on a substrate to an oxygen ambient, and selectively annealing a portion of the layer to form a superconducting region within the layer.

Abstract: A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall.

Abstract: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

Abstract: A three-dimensional article having spray-applied ink and a spray application process for three-dimensional articles are disclosed. The article includes a substrate and conductive ink spray-applied to a non-planar region of the substrate. The conductive ink on the non-planar region is at least a portion of a power trace, an antenna, a resistive heater, a conductive lead, a sensor, a functional electrical device, or a combination thereof. The process includes spray-applying conductive ink, ablating the conductive ink, photo-sintering the conductive ink, or a combination thereof.

Abstract: Improved/efficient fiber laser systems are provided for medical/cosmetic applications, comprising at least one pump source, optically coupled with at least one fiber laser. The fiber laser comprises an irregularly-shaped single-, double- or multiple-clad fiber of unconventional structure and geometry, and means for partially/completely reflecting the pump radiation, such as Bragg gratings. The fiber laser system further comprises at least one fiber optic delivery device optically coupled with the pump source, with the irregularly-shaped single-, double- or multiple-clad fiber laser, or with both, to convey laser radiation to a treatment site. The fiber optic delivery device comprises one or more waveguides, preferably optical fibers. The irregularly-shaped fiber laser and waveguides of the fiber optic delivery device have the same or different tip configurations to perform the treatment according to therapeutic needs.

Abstract: There is provided with a method of manufacturing an electrostatic adsorptive belt. A portion for forming an electrode pattern on a first resin layer is irradiated with an ultraviolet laser beam. A region including the portion for forming the electrode pattern on the first resin layer is oxidated. The electrode pattern if formed on the first region layer by plating. A second resin layer is formed on a surface of the first resin layer on which the electrode pattern is formed.

Abstract: Various laser marking compositions and related methods are described. The laser marking compositions utilize one or more populations of particles having certain average particle sizes or a range of sizes. Marks or other indicia formed using the compositions and methods exhibit increased contrast, improved substrates bonding, and greater dispersability.

Abstract: Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source.

Abstract: A method of forming an article includes forming a silicon-containing layer on a silicon-containing region of a surface of a substrate of the article; forming a plurality of channels and ridges in the silicon-containing layer; and forming at least one outer layer overlying the surface of the silicon-containing region. The plurality of channels and ridges may be formed by adding silicon-containing material to the silicon-containing layer. The channels and ridges may be formed by subtracting material from the silicon-containing layer. The channels and ridges may be formed by forming channels or grooves in the silicon-containing region of the surface of the substrate prior to formation of the silicon-containing layer.

Abstract: The invention relates to a process for the treatment of parts for creating a surface with areas with shiny and matte appearances, in which on the surface previously coated with a first layer of copper and a second layer of metal a selective etching of the second layer is performed, wherein the selective etching of the second layer is performed according to the area or areas to be glazed with respect to the rest of the part. The process allows a finish with areas of a different shine (from mirror shine to matte), the differences in thickness of which cannot be observed by the human eye without optical aids.

Abstract: A method of forming graphene comprises supplying energy to at least a portion of an organic material monolayer disposed on a substrate. The energy is sufficient to carbonize the at least a portion of the monolayer exposed thereto to form a layer of graphene on the substrate.

Abstract: An illuminated glass keycap having a glyph diffuser layer that may diffuse light through a glyph window opened in a background layer. The background layer may be opaque and the glyph window may be transparent. The keycap is adhered to a scissor mechanism positioned above electrical switch circuitry. Included within, below, or adjacent to the scissor mechanism may be one or more light sources positioned to emit light through the keycap, around the perimeter of the keycap, and/or through the background layer.

Abstract: A method of making a sensor includes depositing a layer of hydrogel over a substrate, the hydrogel configured to change thickness or volume in response to a selected condition and including a plurality of magnetic particles disposed in the hydrogel so that a magnetic property of the hydrogel changes with changes of thickness or volume of the hydrogel. The hydrogel is sacrificed in selected region(s) of the layer so that the hydrogel outside the selected region(s) forms a plurality of spaced-apart islands of the hydrogel. The islands of the hydrogel are enclosed in an enclosure at least partly permeable to a selected fluid. A sensor for detecting a condition includes the substrate, islands, and a device coil arranged with respect to the hydrogel so that changes in the magnetic property modulate an electrical property of the sensor. A system includes the substrate, islands, and a magnetic-field detector.

Abstract: When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.

Abstract: Methods, apparatus, and systems for mitigating pinhole defects in optical devices such as electrochromic windows. One method mitigates a pinhole defect in an electrochromic device by identifying the site of the pinhole defect and obscuring the pinhole to make it less visually discernible. In some cases, the pinhole defect may be the result of mitigating a short-related defect.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section.

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract: A method for producing a nickel-containing surface coating that is metallic and conductive is provided. The method includes contacting a surface of a substrate with a liquid composition that includes nickel oxide nanoparticles, and modifying the nickel oxide nanoparticles to produce a nickel-containing metallic and conductive surface coating on the surface of the substrate. Also provided are nickel-containing (e.g., NiO and Ni containing) surface coatings and methods for making a liquid composition that includes nickel oxide nanoparticles. The methods and compositions find use in a variety of different applications.

Abstract: The invention relates to an interface device including an array of pixels and an insulating, transparent substrate, the pixels being connected to the substrate by linking elements, the contact surface between the linking elements and the pixels being strictly smaller than the surface of the pixels facing the substrate.