Abstract: A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate.

Abstract: Technologies are generally described for an optical waveguide, methods and systems effective to form an optical waveguide, and an optical system including an optical waveguide. In some examples, the optical waveguide may include a silicon oxynitride region in a wall of the silicon substrate. The silicon oxynitride region may define an inner region of the optical waveguide. The wall may define a via. The optical waveguide may include a silicon oxide region in the substrate. The silicon oxide region may define an outer region of the optical waveguide adjacent to the inner region.

Abstract: The method for fabrication of the electrochemical energy converter characterised in that, cermet composition (2A)1 (2B) is applied on both sides of the central ceramic plate (1), wherein on both sides of the plate in the cermet composition (2A), (2B), channels (3A), (3B) are made, then the channels (3A), (3B) on both sides of the plate are covered with cermet composition layers (4A), (4B). Afterwards, both sides of the ceramic structure made in such a way are overlaid with conductive structures (5A), (5B) and then with subsequent layers of the cermet composition (6A). (6B) containing nickel, then both sides of the ceramic structure prepared in a such way are subsequently overlaid with: layers constituting the solid electrolyte (7A), (7B), layers constituting electrodes (8A), (8B) and contact layers (9A), (9B). The electrochemical energy converter has a flat layered ceramic base whose core is constituted by the central ceramic plate (D, permanently bonded with porous cermet layers (AN1).

Abstract: A through wiring substrate includes a substrate having a first face and a second face; and a through-wire formed by filling, or forming a film of, an electrically-conductive substance into a through-hole, which penetrates between the first face and the second face. The through-hole has a bend part comprising an inner peripheral part that is curved in a recessed shape and an outer peripheral part that is curved in a protruding shape, in a longitudinal cross-section of the through-hole, and at least the inner peripheral part is formed in a circular arc shape in the longitudinal cross-section.

Abstract: This invention contemplates the use of laser patterning/scribing in electrochromic device manufacture, anywhere during the manufacturing process as deemed appropriate and necessary for electrochromic device manufacturability, yield and functionality, while integrating the laser scribing so as to ensure the active layers of the device are protected to ensure long term reliability. It is envisaged that the laser is used to pattern the component layers of electrochromic devices by directly removing (ablating) the material of the component layers. The invention includes a manufacturing method for an electrochromic device comprising one or more focused laser patterning steps.

Abstract: A method for direct-write patterning comprises providing a cantilever having a cantilever end, wherein the cantilever is a tipless cantilever; providing an ink disposed at the cantilever end; providing a substrate surface; and moving the cantilever end or moving the substrate surface so that ink is delivered from the cantilever end to the substrate surface. A method for direct writing of conductive metal or metal precursor comprises providing a tipless cantilever having a cantilever end; providing an ink disposed at the cantilever end, wherein the ink comprises one or more metals, one or more metallic nanoparticles, or one or more metal salts; providing a substrate surface; and contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface.

Abstract: A method for fabricating a part with relief, wherein portions in relief are at least partially coated with a decorative layer. The method a) forms the body of the part; b) selectively alters the surface state of the body of the part to change the adherence thereof locally relative to the decorative layer; c) directly deposits the decorative layer over the entire body; d) removes the portions of the deposited layer which have not adhered to the body of the part. The method can be utilized in decorating timepieces.

Abstract: The present invention provides several manufacturing processes for surface treatment in order to improve conventional electroplating, coating, sputtering processes. Through the surface treatment of the present invention, a brilliant modern pattern/mark can be achieved. Pearl luster lacquer coating, non-pearl luster lacquer coating and laser-marking are the characteristics of the present invention.

Abstract: A patterned retarder includes at least one retardation plate comprising a substrate substantially transparent in visible spectral range and having front and rear surfaces and a set of parallel stripes located on front surface of the substrate and possessing in-plane retardation.

Abstract: A resin composition is provided that includes (Component A) a filler having an ethylenically unsaturated group, (Component B) a polymerizable compound having an ethylenically unsaturated group, and (Component C) a polymerization initiator. There are also provided a relief printing plate precursor, a process for producing a relief printing plate precursor that includes a layer formation step of forming a relief-forming layer and a crosslinking step of thermally crosslinking the relief-forming layer, and a process for making a relief printing plate that includes an engraving step of laser-engraving the crosslinked relief-forming layer so as to form a relief layer.

Abstract: A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

Abstract: Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source.

Abstract: The invention relates to a recognizable carrier for determining physical, chemical or biochemical interactions by means of optical measurement methods. The carrier comprises a surface that defines a substrate surface and that has a base layer coated with reactive elements, which are bonded to receptor molecules, wherein the base layer and/or the reactive elements are provided with a pattern of holes which forms a code and/or the reactive elements are provided with linker molecules or markers which form a code. The substrate surface may additionally have a macroscopically planar pattern which is applied using laser light or chemical etching and forms a code. The invention likewise relates to a method for producing a recognizable carrier for spectroscopic processes and/or intensiometric tests to determine said interactions. The code to recognize the carrier can be controlled via a read-out unit coupled to the photometric analysis unit.

Abstract: The invention relates to a process for securing an identification document and to a secure identification document. More particularly, the process uses UV sensitive ink(s) to define a pattern only visible under UV radiations. The process is characterized in that it comprises the following steps: printing a first layer of a transparent ablation varnish (13), printing a layer (14) of UV sensitive ink(s) over said first layer of transparent ablation varnish, removing parts of the layer (14) of UV sensitive ink(s), by means of a laser beam, some remaining areas of said UV sensitive ink(s) defining said pattern to be revealed in color under UV radiations, and some areas, where the UV sensitive ink(s) has been removed and the laser beam has interacted with the ablation varnish (13), absorbing the UV radiations with effect of creating black color.

Abstract: According to the present invention, a porous material for a fuel cell electrolyte membrane, wherein at least one strength auxiliary layer is provided inside and/or on the surface of a high porosity layer, the high porosity layer and the strength auxiliary layer constitute a multilayer structure, and the average diameter of pores of the high porosity layer is different from the average diameter of pores of the strength auxiliary layer, is provided. Also, a porous material having high porosity and high strength, which is suitable as a base material for an electrolyte membrane of a solid polymer fuel cell, is provided and a high-performance fuel cell using such material is realized.

Abstract: A pattern formation method includes discharging a functional liquid substance having a functional material to an object, and irradiating the functional liquid substance with light emitted from a light source thereby to form a pattern of a functional film on the object. In this method, when the thickness of the functional liquid substance on an optical axis of the light is L and the absorption coefficient of the functional liquid substance for the light is ?, the thickness and the absorption coefficient are set so as to satisfy an equation (1): 0.1??·L?0.7 ??(1).

Abstract: A method of forming a layer (12) of getter particles (11) on a glass part (10) includes contacting the getter particles with the glass part and irradiating the particles through the glass by a laser, thus heating the particles at a temperature greater than the softening temperature of the glass but lower than the melting temperature of the particles.

Abstract: An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: Fabrication of a touch sensor panel using laser ablation is disclosed. The fabricated touch sensor panel can have its touch sensors formed from conductive layers disposed on a surface such as an undersurface of the panel's cover substrate. A fabrication method can include ablating a first conductive layer to define the first part of the touch sensors and then ablating a second conductive layer proximate to the first conductive layer to define the second part of the touch sensors. The touch sensor panel can be incorporated into a mobile telephone, a digital media player, or a personal computer.

Abstract: Disclosed is a method of fabricating a pattern, and more particularly is a method of fabricating a pattern by using laser. The method includes: a first step of forming an organometallic ink layer 20 on a substrate; a second step of curing the organometallic ink layer 20 into a semi-solid state; a third step of forming a pattern by irradiating laser onto the semi-solid organometallic ink layer 20, so that the irradiated portion of the organometallic ink layer 20 is changed into a solid state; and a fourth step of leaving only the pattern by removing the semi-solid organometallic ink layer 20.

Abstract: A coated material includes a support covered with at least one layer of polymer resin, characterized in that the resin includes heat-expandable microspheres. A process for manufacturing the novel material, and also the use thereof in the binding and packaging fields and an article including the coated material are also described.

Abstract: There is disclosed a microchannel reactor module for the immediate catalytic release of hydrogen from hydrogenated organic molecules along with the recovery of hydrogen gas and the recovery of dehydrogenated organic molecules as a liquid. More specifically, the disclosure provides a polyimide-based microchannel plate that is particularly useful for a process of immediate catalytic release of hydrogen from a hydrogenated organic molecule or formulation of molecules.

Abstract: A method for making a field emission cathode includes the steps of: (a) providing a substrate having a first substrate surface and a second substrate surface opposite to the first substrate surface; (b) forming a conductive film on the first substrate surface; (c) forming a light absorption layer on the conductive film; (d) forming a catalyst film on the light absorption layer; (e) flowing a mixture of a carrier gas and a carbon source gas over the catalyst film; (f) focusing a laser beam on the catalyst film and/or on the second substrate surface to locally heat the catalyst to a predetermined reaction temperature; and (g) growing an array of the carbon nanotubes via the catalyst film to form a field emission cathode.

Abstract: A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.

Abstract: A method of making a drug eluting stent comprises forming a porous stent body surface layer by ion implantation, applying a layer of ceramic particles on the porous layer and compressing the layer of ceramic particles. The layer of ceramic particles can be compressed to successively higher densities. Drugs can be loaded into the layer of ceramic materials at a relatively low density before the layer of ceramic materials is compressed to a higher density to achieve a desired low drug release rate.

Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane generally has the formula H—[(AHR)n(c—AmHpm?2)q]—H, where each instance of A is independently Si or Ge; R is H, —AaHa+1Ra, Halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. In one aspect, the method generally includes the steps of combining a silane compound of the formula AHaR14?a, the formula AkHgR1?h and/or the formula c—AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. In another aspect, the method includes the steps of halogenating a polyarylsilane to form a halopolysilane; and reducing the halopolysilane with a metal hydride to form the polysilane.

Abstract: A keyboard for use with a computing device. In some embodiments, the keyboard comprises a plurality of keys having upper surfaces to which a durable protective coating has been applied and legend symbols that have been etched into the upper surfaces through the durable protective coating.

Abstract: One aspect of the present invention resides in a method of producing a circuit board, including a film-forming step of forming a resin film on a surface of an insulative substrate; a circuit pattern-forming step of forming a circuit pattern portion by forming a recessed portion having a depth equal to or greater than a thickness of the resin film, with an outer surface of the resin film serving as a reference; a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on a surface of the circuit pattern portion and a surface of the resin film; a film-separating step of removing the resin film from the insulative substrate; and a plating step of forming an electroless plating film only in a region where the plating catalyst or the precursor thereof remains after the resin film is separated.

Abstract: The present invention provides efficient methods for producing a superhydrophobic carbon nanotube (CNT) array. The methods comprise providing a vertically aligned CNT array and performing vacuum pyrolysis on the CNT array to produce a superhydrophobic CNT array. These methods have several advantages over the prior art, such as operational simplicity and efficiency. The invention also relates to superhydrophobic CNT arrays.

Abstract: A method for patterning a one or more biomolecules on a substrate that includes coating the substrate with a coating of the one or more biomolecules, applying a laser to the coating, and ablating a portion of the one or more biomolecules with the laser in a predetermined pattern.

Abstract: A method for patterning a substrate is presented, which includes the following steps. A conductive material is jet-printed onto a part of at least one side of the substrate. A surface of the at least one side of the substrate is imprinted with a laser to pattern a first conductive pattern. By using the method, the process can be simplified and substrates of a touch panel can be integrated, so as to achieve an objective of decreasing the overall thickness of an electronic device.

Abstract: The invention relates to an indicator comprising a substrate and an optical grating structure fabricated on the substrate, the grating structure being formed from an indicator material comprising a binder and deliquescent salt and varying in volume by the effect of moisture. Further, the invention relates to a method for fabricating an indicator wherein a substrate is coated by an indicator material forming an optical grating structure, and the optical grating structure is fabricated onto the substrate, and use of an indicator for detecting quality and/or authenticity. Furthermore, the invention relates to a package and a method for detecting a change induced by moisture without breaking the package.

Abstract: A device for the production of silicon blocks comprising a vessel for receiving a silicon melt with at least one vessel wall, with the at least one vessel wall comprising a nucleation-inhibiting coating on at least part of an inside or with the at least one vessel wall consisting of a nucleation-inhibiting material.

Abstract: An optical filter provided in front of a display panel of a display device includes a background layer and a color shift-reducing pattern formed to a predetermined thickness at the background layer. The color shift-reducing pattern includes a plurality of pattern elements spaced apart from each other. At least two pattern elements of the plurality of pattern elements have different light absorptivities and/or light diffusivities. The at least two pattern elements may contain different amounts of a light-absorbing material that cause the different light-absorptivities and/or different amounts of a light-diffusing material that cause the different light diffusivities. The plurality of pattern elements may form a group of first pattern elements and a group of second pattern elements. Only the group of first pattern elements may contain the light-absorbing material, and only the group of second pattern elements may contain the light-diffusing material.

Abstract: The present invention relates to a structure with luminous and visual effects, a light transmissive sheet thereof, and a method for making the same. The light transmissive sheet includes a first layer, a light transmissive intermediate layer and a second layer. The material of the first layer, the light transmissive intermediate layer and the second layer is polyurethane resin. The light transmissive intermediate layer is disposed on the first layer, and the second layer is disposed on the light transmissive intermediate layer. At least one pattern is formed on the first layer or the second layer, and the pattern penetrates the first layer or the second layer. When light irradiates the light transmissive sheet, the pattern is shown, so the light transmissive sheet has luminous and visual effects.

Abstract: The invention provides a method for forming a patterned material layer on a structure, by condensing a vapor to a solid condensate layer on a surface of the structure and then localized removal of selected regions of the condensate layer by directing a beam of energy at the selected regions. The structure can then be processed, with at least a portion of the patterned solid condensate layer on the structure surface, and then the solid condensate layer removed. Further there can be stimulated localized reaction between the solid condensate layer and the structure by directing a beam of energy at at least one selected region of the condensate layer.

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract: A method of forming a circuit interconnection on a circuit board includes: forming a trench that corresponds to a shape of the circuit interconnection on an interconnection base material that forms the circuit interconnection; distributing a catalyst for forming a conductive layer on the trench; and forming a conductive circuit interconnection film that forms the circuit interconnection by distributing a plating solution in a range that includes the trench and depositing a conductive material from the plating solution through the catalyst for forming the conductive layer.

Abstract: A surface antenna formation method to form an antenna on the surface of an antenna carrier economically by means of spraying a conducting paint into a patterned opening of a shield being covered on the antenna carrier and then employing a laser etching technique to remove burrs from the border of the antenna thus formed on the surface of the antenna carrier after removal of the shield.

Abstract: A method of forming a pattern on a turbomachine component includes adding material to selected surface regions of the turbomachine component, the material is arranged in a predetermined pattern.

Abstract: A process for fabricating a circuit board is provided. A circuit substrate having a first surface and a first circuit layer is provided. A first dielectric layer having a second surface is formed on the circuit substrate and covers the first surface and the first circuit layer. An antagonistic activation layer is formed on the second surface. The antagonistic activation layer is irradiated by a laser beam to form at least a blind via extended from the antagonistic activation layer to the first circuit layer and an intaglio pattern. A first conductive layer is formed inside the blind via. A second conductive layer is formed in the intaglio pattern and the blind via. The second conductive layer covers the first conductive layer and is electrically connected with the first circuit layer through the first conductive layer. The antagonistic activation layer is removed to expose the second surface.

Abstract: A method for producing a build-up substrate containing two layers of wiring patterns that are separated from each other with an insulating film intervening therebetween and are electrically connected to each other at a contact part penetrating through the insulating film, includes: ejecting a liquid repelling agent having repellency to an ink for forming the insulating film from a liquid droplet ejecting head onto one of the wiring patterns, thereby forming a liquid repelling part; then ejecting the ink for forming the insulating film from a liquid droplet ejecting head onto portions on the wiring pattern except for the liquid repelling part provided, thereby forming the insulating film; then removing the liquid repelling part; and then forming the contact part and the other of the wiring patterns by electroless plating.

Abstract: A circuit board includes a circuit substrate, a dielectric layer, and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit, a first intaglio pattern, and a second intaglio pattern. The patterned circuit structure includes at least a second circuit and a plurality of third circuits. The second circuit is disposed in the first intaglio pattern. The third circuits are disposed in the second intaglio pattern and the blind via. Each third circuit has a first conductive layer, a second conductive layer, and a barrier layer. The first conductive layer is located between the barrier layer and the second intaglio pattern and between the barrier layer and the blind via. The second conductive layer covers the barrier layer.

Abstract: A circuit board including a circuit substrate, a dielectric layer, a first conductive layer and a second conductive layer is provided. The circuit substrate has a first surface and a first circuit layer. The dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The dielectric layer has a second surface, at least a blind via extended from the second surface to the first circuit layer and an intaglio pattern. The first conductive layer is disposed inside the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer through the first conductive layer.

Abstract: A method for fabricating a wiring structure of a wiring board is provided. First, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next, an intaglio pattern exposing the insulation layer is formed on an outer surface of the film. The intaglio pattern is formed by removing a portion of the insulation layer and a portion of the film. Next, an activated layer is formed on the outer surface and in the intaglio pattern. The activated layer completely covers the outer surface and all surfaces of the intaglio pattern. Then, the film and the activated layer on the outer surface are removed, and the activated layer in the intaglio pattern is remained. After the film and the activated layer on the outer surface are removed, a conductive material is formed in the intaglio pattern by chemical deposition method.

Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.

Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Abstract: A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.

Abstract: A golf club shaft, includes a flexible, elongate, tapered, fiber-reinforced generally cylindrical body formed from a fiber/resin matrix having carbon fibers embedded therein, an interior coating layer applied substantially continuously over the surface of the cylindrical body along the length and circumference of the cylindrical body, a plurality of secondary coating layers formed over the interior coating layer including an exterior coating layer, each secondary coating layer having a different color and surrounding at least one etched area wherein one or more secondary coating layers has been removed to expose one or more coating layers between the exterior coating layer and the interior coating layer, each coating layer having a different color; and wherein the difference in the thickness of the secondary coatings in the etched area is discernable from the remainder of the surface of the cylindrical body via tactile sensation when the golf shaft is gripped by a user.