Abstract: Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

Abstract: The present invention refers to a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, the barrier film comprises at least one nanostructured layer comprising reactive nanoparticles capable of interacting with moisture and/or oxygen, the reactive nanoparticles being distributed within a polymeric binder, and at least one ultraviolet light neutralizing layer comprising a material capable of absorbing ultraviolet light, thereby limiting the transmission of ultraviolet light through the barrier film

Abstract: The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation comprising (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).

Abstract: A first resin, a curable precursor of a second resin that differs from the first resin, an inorganic material and a solvent are blended and a mixed solution is prepared. Next, by heating the mixed solution, the solvent is removed and the curable precursor is cured, and an organic-inorganic composite is obtained that comprises a composite resin having a co-continuous phase-separated structure formed from a three-dimensionally continuous first phase made of the first resin and a three-dimensionally continuous second phase made of the second resin, and an inorganic material that is localized at the interface between the first phase and the second phase.

Abstract: The invention describes a multi-layered film comprising a modified fluoropolymer and a silicone material. The laminate is useful to protect a photovoltaic cell, for example, as an encapsulant.

Abstract: Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.

Abstract: A graphene laminate including a substrate, a binder layer on the substrate, and graphene on the binder layer, wherein the graphene is bound to the substrate by the binder layer.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: A method of coating at least a portion of the exposed surface of a metal comprises: a) applying to said surface a curable coating composition comprising an aqueous solution of at least one partially or substantially completely hydrolyzed, and optionally partially condensed, silane possessing one or more hydroxyl groups and, optionally, one or more organonitrogen groups, said hydroxyl group(s) and optional organonitrogen group(s) being bonded to different carbon atoms of a bridging group linking such group(s) to the silicon atom of the partially or substantially completely hydrolyzed and optionally partially condensed silane; and, b) curing the curable coating composition on the surface of the metal to provide an anti-corrosion and/or adhesion promoting coating thereon.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: The invention relates to a liquid radiation curable resin capable of curing into a solid upon irradiation comprising: (A) from about 0 to about 12 wt % of a cycloaliphatic epoxide having a linking ester group; (B) from about 30 to about 65 wt % of one or more epoxy functional components other than A; (C) from about 10 to about 30 wt % of one or more oxetanes; (D) from, about 1 to about 10 wt % of one or more polyols; (E) from about 2 to about 20 wt % of one or more radically curable (meth) acrylate components; (F) from about 2 to about 12 wt % of one or more impact modifiers; (G) from about 0.1 to about 8 wt % of one or more free radical photoinitiators; and (H) from about 0.1 to about 8 wt % of one or more cationic photoinitiators; wherein the liquid radiation curable resin has a viscosity at 30° C. of from about 600 cps to about 1300 cps.

Abstract: A UV curable intermediate transfer media, such as a belt, that includes a first supporting substrate layer, such as a polyimide substrate layer, and a second surface layer of an epoxy acrylate, a conductive compound, and a photoinitiator.

Abstract: A shaped article including a modified ethylene-vinyl alcohol copolymer (C), wherein the modified ethylene-vinyl alcohol copolymer (C) is a product obtained by modifying an unmodified ethylene-vinyl alcohol copolymer (A) with an epoxy compound (B) having a double bond and has a degree of modification with the epoxy compound (B) of 0.1 to 10 mol % based on the monomer units of the ethylene-vinyl alcohol copolymer (A), and at least a part of the modified ethylene-vinyl alcohol copolymer (C) is crosslinked, and the gel fraction of the shaped article is 3% by weight or more. Thereby, a shaped article which contains almost no harmful crosslinking agent and which is excellent in hot water resistance, heat resistance and a gas barrier property is provided.

Abstract: Provided is an anisotropic conductive film, containing: an insulating layer formed of an insulating resin composition; and a conductive particle-contained layer containing a photo and thermal curing resin composition and conductive particles, the conductive particles being aligned into a monolayer in a portion adjacent to an interface with the insulating layer, in which the conductive particle-contained layer has a degree of cure which is gradually lowered in a thickness direction of the conductive particle-contained layer, from the side where the conductive particles are present to the side where the conductive particles are not present.

Abstract: A coated article comprising a substrate having a plastic surface and adhered thereto an organometallic film in which the metal has f electron orbitals or is niobium is disclosed. Also disclosed are methods for applying organometallic films to substrates and the organometallic films themselves.

Abstract: The method is for treating a marine object. A composition is provided that has an organic substance. The composition is applied to the marine object. The composition has a first layer and a second layer. A first organic substance on the first layer attracts bacteria. The bacteria consume the first organic substance and during this process use oxygen. The bacteria thus reduce an oxygen level in a boundary layer adjacent to a surface of the marine object. The first layer of the composition erodes to expose the second layer. The bacteria consume a second organic substance of the second layer.

Abstract: An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.

Abstract: Substantially environmentally inert materials that include substrates coated with a green-colored barrier layer containing at least a film forming polymer; organic pigment green 7; and yellow iron oxide pigment are disclosed. In the layer, the organic pigment green 7 and the yellow iron oxide pigment are present in the layer in a weight ratio of about 1:about 3 to about 1:about 5. Suitable substrates include crumb rubber, sand, chipped rubber and other particulate substrates. Related compositions, methods and recreation fields upon which such materials have been disposed are also described.

Abstract: An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino-, N-alkylamino- or N-arylamino- functional group on one of the aromatic rings, as a co- catalyst or co-curing agent. The use of the leuco dye co-catalyst provides improved curing speed of the epoxy composition comprising a latent curing agent/catalyst such as imidazole microcapsules while maintaining the shelf-life stability. The epoxy may also include a secondary co-catalyst that includes a urea, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino- or dicycloalkylamino- functional group. Secondary cocatalysts of low mobility at the storage conditions are particularly preferred.

Abstract: A surface composition for reducing degradation and fading of surfaces subjected to extended periods of submersion in an aqueous liquid includes at least one clear barrier layer and at least one under layer, wherein the clear barrier layer is in use, disposed atop the under layer and in contact with the aqueous liquid whereby the clear barrier layer protects the structure and appearance of the under layer. The clear barrier layer provides structural protection against degradation from chemical attack and from fading due to UV exposure.

Abstract: An initial surface is provided. An overlay of colored grout is provided. The colored grout is on the initial surface. In this manner an intermediate surface is created. An acid stain is provided. The acid stain is on the intermediate surface. A two part clear epoxy resin is provided. The epoxy resin is provided on the intermediate surface. In this manner an exterior surface is created.

Abstract: The present invention provides a method for the preparation of organic light-emitting devices comprising a bilayer structure made by forming a first film layer comprising an electroactive material and an INP precursor material, and exposing the first film layer to a radiation source under an inert atmosphere to generate an interpenetrating network polymer composition comprising the electroactive material. At least one additional layer is disposed on the reacted first film layer to complete the bilayer structure. The bilayer structure is comprised within an organic light-emitting device comprising standard features such as electrodes and optionally one or more additional layers serving as a bipolar emission layer, a hole injection layer, an electron injection layer, an electron transport layer, a hole transport layer, exciton-hole transporting layer, exciton-electron transporting layer, a hole transporting emission layer, or an electron transporting emission layer.

Abstract: Provided are plastic substrates and methods of forming the same. The method includes applying a protective layer composition including reactive monomers on a organic substrate, and polymerizing the reactive monomers to form a protective layer.

Abstract: An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A) a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B) an epoxy resin; (C) an epoxy resin curing agent; (D) a filler; and (E) a solvent.

Abstract: The invention relates to an optical article comprising a substrate coated with an abrasion- and scratch-resistant coating composed of a lower layer and an upper layer that do adhere to each other, the upper layer and the lower layer being layers of cured upper and lower layer compositions, said upper layer composition comprising at least one organosilane, or a hydrolyzate thereof, of formula RnYmSi(X)4-n-m and at least one compound, or a hydrolyzate thereof, of formula M(Z)x, the following ratio being lower than 2.

Abstract: The invention relates to electronic devices whose electronic properties can surprisingly be improved to a significant degree by inserting at least one crosslinkable polymeric buffer layer, preferably a cationically crosslinkable polymeric buffer layer, between the conductive doped polymer and the organic semiconductor layer. Particularly good properties are obtained with a buffer layer in which crosslinking is thermally induced, i.e. by raising the temperature to 50 to 250° C. Alternatively, crosslinking can be radiation-induced by adding a photoacid. Moreover, such a buffer layer can be advantageously applied by means of printing techniques, especially inkjet printing, as the ideal temperature for the thermal treatment is independent of the glass transition temperature of the material. This avoids having to rely on material that has a low molecular weight, making it possible to apply the layer by means of printing techniques.

Abstract: A coated article comprising a substrate having a plastic surface and adhered thereto an organometallic film in which the metal has f electron orbitals or is niobium is disclosed. Also disclosed are methods for applying organometallic films to substrates and the organometallic films themselves.

Abstract: An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.

Abstract: A composition useful as an impregnant for the making of laminates for printed wiring boards comprises a FR4 epoxy resin which is a bisphenol A epoxy resin advanced with tetrabromobisphenol A, a crosslinking agent of a strene-maleic anhydride copolymer and a co-crosslinking agent is an optionally brominated bisphenol A and/or an optionally brominated bisphenol A diglycidyl ether.

Abstract: The present invention relates to an optical article which has high surface hardness and absorbs an electromagnetic wave such as a visible light, ultraviolet radiation, infrared radiation, X-rays, ?-rays and ?-rays, in particular, a functional optical article represented by a prescription lens, sunglasses, a goggle lens, a shield and an optical filter. The present invention provides an optical article comprising a laminated substance in which a plastic sheet, a resin layer and a backup resin are laminated in this order, wherein the resin layer containing an electromagnetic wave absorbing agent.

Abstract: A component which comprises the following components: I. a top layer of a moulding compound which contains at least 50% by weight of PA613 and II. a substrate of a thermoplastic moulding compound has a surface with high scratch resistance and high chemical resistance.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: The invention pertains to a combination of a substrate (6) and a wafer (15), wherein the substrate (6) and the wafer (15) are arranged parallel to one another and bonded together with the aid of an adhesive layer (8) situated between the substrate (6) and the wafer (15), and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer (8) is only applied annularly between the substrate (6) and the wafer (15) in the edge region of the wafer (15).

Abstract: Film-forming coating compositions are disclosed. The composition comprises a) an epoxy-containing polymer system; and b) a polyacid curing agent comprising two acid functional groups per molecule; wherein the epoxy-containing polymer system comprises: (i) an epoxy resin comprising at least two epoxy functional groups per molecule and which is different from (ii); and (ii) an epoxy functional silsesquioxane. Also disclosed are processes for applying the film-forming composition to a basecoat, and substrates coated in part by a coating deposited from the film-forming compositions.

Abstract: Two-component composition for producing flexible polyurethane gelcoats The invention relates to the use of a two-component composition which comprises a polyol component, a polyisocyanate component and, as filler, a pyrogenically pre-pared silica which has been hydrophobicized with hexamethyldisilazane (HMDS) and then structurally modified by means of a ball mill, for producing flexible polyurethane gelcoats for epoxy resin and vinyl ester composites.

Abstract: Provided is a weather-resistant gas barrier film capable of keeping a high delamination strength and an excellent gas barrier property in a high-temperature high-humidity environment and in a UV radiation environment. The gas barrier film comprises a substrate film, a weather-resistant coating layer formed on at least one surface thereof, and an inorganic thin film layer formed on the surface of the coating layer, wherein the weather-resistant coating layer is selected from (1) a weather-resistant coating layer that contains an acrylic copolymer having at least one group selected from a UV-stabilizing group, a UV-absorbing group and a cycloalkyl group, (2) a weather-resistant coating layer formed by crosslinking a polycaprolactone-polyol and/or a polycarbonate-polyol as the essential ingredient, and (3) a weather-resistant coating layer formed by crosslinking a modified polyvinyl alcohol; and also provided is a method for producing the gas barrier film.

Abstract: The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents that selectively absorb infrared radiation. In various embodiments of the present invention, an interlayer includes lanthanum hexaboride, which effectively absorbs infrared radiation at about 1,000 nanometers, and an epoxy, which stabilizes the lanthanum hexaboride agent.

Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Abstract: An adhesive film comprising a cycloalkanediol modified copolymerized polyester resin film and a thermosetting vinyl ester resin composition layer which is hardened at room temperature on said polyester resin film.

Abstract: There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).

Abstract: The present invention relates to an afterglow coating comprising a clear varnish and a photoluminescent pigment, wherein the pigment comprises a white luminous colour in which the clear varnish is distributed. The present invention furthermore relates to methods for producing these coatings and to their use for coating surfaces in the cabin of aircraft.

Abstract: This invention relates to coating compositions that include water; a latex polymer and a silane coupling agent. The latex polymer preferably comprises acetoacetoxy functionality, or is a multistage latex, or is an acetoacetoxy functional multistage latex. The silane coupling agent is preferably a functionalized silane coupling agent (more preferably an epoxy-functional silane coupling agent). The compositions may be used to coat a variety of substrates, including wood, cement and fiber cement. Articles having the coating applied thereto are also provided.

Abstract: A prepreg is provided capable of being a composite material having suitable high heat resistance, impact resistance, and mechanical properties under high temperature and high humidity conditions. As the matrix resin, a composition including a specific epoxy resin component (A), a specific bifunctional epoxy resin (B), a specific tetrafunctional epoxy resin (C), and a specific aromatic amine compound (D) at specific proportions are used. Particularly, as the epoxy resin component (A), one obtained by mixing and heating a bifunctional epoxy resin (a1), a trifunctional epoxy resin (a2), a phenol compound (a3), and a specific polyamide resin (a4) is used so as to be able to solve the above-described problems.

Abstract: A coating for elastomers is provided comprising, a rubber modified epoxy resin, an epoxy reactive diluent, and an epoxy curative. The epoxy resin is modified with a carboxyl terminated butadiene acrylonitrile rubber, and the coating is capable of co-extrusion with an elastomeric substrate, such as a weatherstrip.

Abstract: Super-low fouling sulfobetaine and carboxybetaine materials, super-low fouling surfaces and methods of making the surfaces coated with sulfobetaine and carboxybetaine materials, and devices having the super-low fouling surfaces.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.

Abstract: Thermoplastic polyamide resin compositions include the essential components of polyamide resins, polyalcohol and epoxy resin, and, optionally, one or more additives selected from among thermoplastic impact modifiers, reinforcement agents, and polyoxides; such thermoplastic polyamide resin compositions provide superior impact resistance, heat resistance, low degree of deformation, low degree of contraction, and external appearance, but also superior paint adhesion properties without requiring a primer, and function as an adhesion medium that advantageously may be applied to the interior and exterior parts of an automobile requiring painting.