Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.

Abstract: A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent.

Abstract: Provided are a resin composition whose storability is not reduced, a prepreg which uses the resin composition and which is uniformly colored, a laminated board, a multilayer printed wiring board having excellent results in reliability tests such as a thermal shock test and the like, and a semiconductor device. The resin composition is a resin composition for a multilayer printed wiring board, comprising (A) a novolac type epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a colorant, wherein the exothermic peak temperature of the resin composition, as measured by DSC, is within ±5° C. of the exothermic peak temperature of a resin composition composed of (A) a novolac type epoxy resin, (B) a curing agent, and (C) an inorganic filler.

Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

Abstract: The invention describes novel coating agents that include a polymer, one or more latent reactive groups and one or more noncovalent linking groups, the noncovalent linking groups selected to interact with a substrate to which the coating agent is applied. The coating agents are useful for providing a coating that can be further functionalized (for example, by application of additional coating layers), or for providing desirable properties to a surface.

Abstract: The invention provides a vulcanized rubber laminate obtained by firmly bonding an unvulcanized epichlorohydrin rubber layer and an organic peroxide-containing fluororubber layer. The laminate is obtained by thermal adhesion a layer of an unvulcanized epichlorohydrin rubber composition to a layer of an unvulcanized fluororubber composition. The epichlorohydrin rubber composition comprises 1) an unvulcanized epichlorohydrin rubber containing 3 to 15 mol % of allyl glycidyl ether unit, 2) quinoxaline-based vulcanizing agents, mercaptotriazine-based vulcanizing agents or bisphenol-based vulcanizing agents, and 3) 1,8-diazabicyclo(5,4,0)undecene-7 salts, 1,5-diazabicyclo(4,3,0)nonene-5 salts, quaternary ammonium salts, quaternary phosphonium salts, basic white carbons or an alkaline metal salt of higher fatty acid the fluororubber composition comprises an fluororubber and an organic peroxide-based vulcanizing agent.

Abstract: An electret in disclosed including a laminate. A layer (A) containing a resin (a) and a layer (B) containing a resin (b) other than the resin (a) or an inorganic substance (c) are directly laminated. The resin (a) is a fluororesin (a1), or a resin (a2) having an alicyclic structure and containing no fluorine atom. The layer (B) is disposed on the outermost surface on a side opposite to the side where electric charge is injected at the time of injecting electric charge into the laminate to form the electret.

Abstract: The disclosure provides in one embodiment a method of promoting adhesion on a composite surface. The method comprises providing a composite structure having at least one composite surface to be bonded. The method further comprises preparing the at least one composite surface. The method further comprises providing a chemical derivatization compound containing active functional groups that promote adhesion. The method further comprises depositing the chemical derivatization compound on the prepared composite surface to form a functional group-adhesive promoter derivatized layer. The method further comprises applying an adhesive layer to the derivatized layer. The method further comprises heat curing the adhesive layer to result in a bond with another structure made of a composite, a metal, or a combination thereof.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: The present disclosure provides polyamides and amidoamine curing agents including the reaction product of (1) a modified amine component comprising at least one multifunctional amine of structure 1: wherein R1 is selected from C1-C16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; R2 and R4 are hydrogen, R3 is R1 or hydrogen, X, Y, and Z are independently selected from C2-C10 alkylene, hexylene and cycloalkylene groups, n=0, 1, 2, 3, 4, 5, 6, or 7; and (2) a fatty acid component. Exemplary fatty acid components include at least one of monomer fatty acids, dimer fatty acids, trimer fatty acids, polymer fatty acids, esters of monomer, dimer, trimer, and polymer fatty acids and combinations thereof. The method for making the curing agents and articles formed therefrom are also disclosed.

Abstract: A metal-clad polymer article includes a polymeric material with or without particulate addition. The polymeric material defines a permanent substrate. A metallic material covers at least part of a surface of the polymeric material. The metallic material has a microstructure which, at least in part, is at least one of fine-grained with an average grain size between 2 and 5,000 nm and amorphous. The metallic material has an elastic limit between 0.2% and 15%. At least one intermediate layer can be provided between the polymeric material and the metallic material. A stress on the polymeric material, at a selected operating temperature, reaches at least 60% of its ultimate tensile strength at a strain equivalent to the elastic limit of said metallic material.

Abstract: A film-like wafer mold material for molding a wafer in a lump, the material including a multilayer structure constituted of at least a first film layer and a second film layer provided on the first film layer, wherein the first film layer contains a silicone-backbone-containing polymer, a cross-linking agent, and a filler, and the second film layer, contains a silicone-backbone-containing polymer and a cross-linking agent, and further contains a filler in such a manner that a content rate of the filler becomes 0 or above and less than 100 when a content rate of the filler contained in the first film layer is assumed to be 100. The film-like wafer mold material has excellent transference performance with respect to a thin-film wafer with a large diameter, also has low-warp properties and excellent wafer protection performance after form shaping (after molding), and is preferably used for a wafer level package.

Abstract: The present invention relates generally to electrolyte materials. According to an embodiment, the present invention provides for a solid polymer electrolyte material that is ionically conductive, mechanically robust, and can be formed into desirable shapes using conventional polymer processing methods. An exemplary polymer electrolyte material has an elastic modulus in excess of 1×106 Pa at 90 degrees C. and is characterized by an ionic conductivity of at least 1×10?5 Scm-1 at 90 degrees C. An exemplary material can be characterized by a two domain or three domain material system. An exemplary material can include material components made of diblock polymers or triblock polymers. Many uses are contemplated for the solid polymer electrolyte materials.

Abstract: This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy.

Abstract: Copper clad laminates having reduced laminate curl include copper foil with a tensile strength of less than 47 ksi.

Abstract: Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri- or more-functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.

Abstract: Methods and compositions for forming a transparent clear coat characterized by a desired property, such as a color effect, resistance to UV light-induced degradation and/or scratch resistance, on a substrate are detailed according to embodiments of the present invention. Particular compositions and methods for producing a transparent clear coat layer include nanoparticles formed in-situ during curing of a transparent clear coat. Curable clear coat compositions are described according to embodiments of the present invention which include one or more substantially dissolved nanoparticle precursors.

Abstract: This invention provides a method capable of fabricating, by simple manufacturing processes, a color conversion layer which realizes high-efficiency color conversion characteristics without greatly increasing the film thickness of the color conversion layer. Further, this invention provides a color conversion layer manufactured by this method, and an organic EL element which includes this color conversion layer. By means of a method in which a polymer material having a weight-average molecular weight in a specific range is brought into contact with a color conversion material layer, and the polymer material is caused to intrude into the color conversion layer by a diffusion phenomenon, concentration quenching in the color conversion layer can be suppressed, and the fluorescence quantum yield can be increased.

Abstract: A layered body (1) is provided in which a first layer (3) is deposited at one side on at least one surface of a resin substrate (2), a second layer (4) is deposited on the other side of the first layer (3) opposite to the one side thereof at which the first layer (3) is deposited on the resin substrate (2), the first layer (3) is a first organic-inorganic hybrid layer containing a (meth)acrylic resin and a silane compound, and the second layer (4) is a second organic-inorganic hybrid layer obtained by curing a composition made of a solution obtained by hydrolysis and condensation using a composition which contains a silane compound (A) containing at least one epoxy group and represented by the following Formula (1), an aluminum alkoxide (B) represented by the following Formula (2) and a tetrafunctional silane compound (C) represented by the following Formula (3): Si(R1)p(OR2)4-p??Formula (1); Al(OR3)3??Formula (2); and Si(OR4)4??Formula (3).

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract: An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.

Abstract: The invention relates to an adhesive composition comprising, relative to its total weight: from 1 to 40% of a polyethylene (A) grafted with a functional monomer or a blend of a polyethylene (A1) with a second polymer (A2) different from (A1), said blend of (A1) and (A2) being co-grafted with an unsaturated functional monomer, the content by weight of unsaturated functional monomer relative to (A) being in the range from 30 to 100000 ppm; from 25 to 98% of a non-grafted polyethylene (B) having a density in the range from 0.900 to 0.965; from 1 to 35% of an elastomeric product (C). The invention also relates to a multilayer structure comprising this composition, said structure being able to serve as protection of metal tubes used for the fabrication of oil pipelines and gas pipelines.

Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.

Abstract: The present disclosure is directed to coalescing agent for waterborne coatings. The coalescing agent comprises low molecular weight polytrimethylene ether glycol having a Mn (number average molecular weight) in a range of from 100 to 490. This disclosure is further directed to a waterborne coating composition comprising the coalescing agent. The waterborne coating compositions can be used as interior and exterior top coats, basecoats, primers, primer surfacers and primer fillers. The waterborne coating compositions can be used as architecture coatings, automotive original equipment manufacturer (OEM) coatings, automotive refinish coatings, sports equipment coatings or any other coatings. The disclosure is particularly directed to a coating composition comprising components derived from renewable resources.

Abstract: In various embodiments, the present invention provides electrically conductive and radio frequency (RF) transparent films that include a graphene layer and a substrate associated with the graphene layer. In some embodiments, the graphene layer has a thickness of less than about 100 nm. In some embodiments, the graphene layer of the film is adhesively associated with the substrate. In more specific embodiments, the graphene layer includes graphene nanoribbons that are in a disordered network. Further embodiments of the present invention pertain to methods of making the aforementioned electrically conductive and RF transparent films. Such methods generally include associating a graphene composition with a substrate to form a graphene layer on a surface of the substrate.

Abstract: Organosilane condensates are described as well as their use in coating compositions, processes for making them and process for applying the coating compositions. The organosilane condensates can be formed from the hydrolysis of at least one medium to long chain trialkoxy silane compound, an amino silane and optionally one or more additional reactants. Coating compositions containing the organosilane condensates can provide coatings having improved scratch and mar resistance and can have excellent recoat adhesion.

Abstract: The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×102 Pa·S or more and 2×104 Pa·S or less, and the shear modulus of the adhesive layer is 1×103 Pa or more and 2×106 Pa or less, when the thermosetting resin layer has a temperature in a range of 50 to 120° C.

Abstract: Disclosed is a barrier laminate comprising at least one organic layer and at least one inorganic layer on a surface of the organic layer, wherein the organic layer is formed by curing a polymerizable composition comprising a compound having a triphenylene skeleton and a polymerizable group.

Abstract: The object of the invention is a new Sheet Molding Compound (SMC), Thick Molding Compound (TMC), or Bulk Molding Compound (BMC) comprising at thermosetting resin on the basis of renewable resources with which molded parts can be produced in a molding process at elevated temperature and pressure said process being suitable to produce molded parts in an industrial process.

Abstract: Provided is a sheet for processing a wafer. The sheet can exhibit excellent heat resistance and dimensional stability, prevent breakage of a wafer in response to residual stress due to excellent stress relaxation properties, inhibit damage to or dispersion of the wafer due to application of a non-uniform pressure, and also exhibit excellent cuttability. The sheet can effectively prevent a blocking phenomenon from occurring during wafer processing. For these reasons, the sheet can be useful for processing a wafer in various wafer preparation processes such as dicing, back-grinding and picking-up.

Abstract: A prepreg comprising an epoxy resin (A), a boron chloride-amine complex (B) and a fiber base material (C) is used. Preferably, the molar ratio of boron in the boron chloride-amine complex (B) is 4-7 mol % with respect to the number of moles of epoxy groups in the epoxy resin (A), and the epoxy resin (A) includes a bifunctional epoxy resin with an oxazolidone ring structure, a bisphenol-type epoxy resin and a phenol-novolac-type epoxy resin.

Abstract: A vibration-damping sheet includes a resin layer having a glass transition temperature of more than 100° C. and 140° C. or less, and a constraining layer laminated on the resin layer.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.0% with respect to the reaction mass either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs, pouring the resin mix in a mold having an in-situ glass fiber scaffold at a mold temperature in the range of 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C.

Abstract: The present invention provides a laminated polyester film which can be suitably used in the applications in which it is required to exhibit a good adhesion property to various adhesives and has a good bonding property to various surface functional layers, for example, as a member for protecting a polarizing plate of liquid crystal displays, in particularly, as a protective film disposed on a front surface of a front side polarizing plate. The laminated polyester film according to the present invention comprises a polyester film; a first coating layer formed by applying a coating solution which comprises polyvinyl alcohol, an oxazoline compound and at least one resin selected from the group consisting of a polyester resin, an acrylic resin and a urethane resin, on one surface of the polyester film; and a second coating layer formed on the other surface of the polyester film which comprises at least one resin selected from the group consisting of a polyester resin, an acrylic resin and a urethane resin.

Abstract: This invention concerns a thermosetting resin system that is useful in the manufacture of high performance prepreg, laminate and composite materials as well as, prepregs, laminates and composites made from the thermosetting resin composition.

Abstract: To provide an anti-fogging article having excellent anti-fogging performance and further having excellent durability, and an anti-fogging agent composition. An anti-fogging article comprising a substrate and a water-absorptive crosslinked resin layer formed on the surface of the substrate, wherein the water-absorptive crosslinked resin is a crosslinked resin with a saturated water absorption of at least 45 mg/cm3, or a water-absorptive crosslinked resin with a glass transition point of at least 50° C. as measured by a differential scanning calorimeter and further with a saturated water absorption of at least 45 mg/cm3.

Abstract: An optical component for an LED lighting arrangement comprises a transparent material having a surface and one or more photoluminescent (phosphor) materials deposited as a layer on the surface of the transparent material. The phosphor material layer can be deposited using a deposition approach including spraying, dropping, printing, painting, spin coating or tape casting. The phosphor material layer has a thickness in a range of 20 to 500 ?m. The component can further comprising a light diffusing material which can be provided in a separate layer from the phosphor material layer or provided in the phosphor material layer. The light diffusing material can be deposited using a deposition approach including spraying, dropping, printing, painting, spin coating or tape casting.

Abstract: An easy-open end comprising a resin-coated metal plate obtained by coating a metal substrate with a anti-blocking agent-containing biaxially drawn film via a primer, wherein an important feature resides in that the anti-blocking agent in the biaxially drawn film is of a spherical shape having an average particle size of 0.5 to 2.5 ?m and an average particle size ratio (long diameter/short diameter) in a range of 1.0 to 1.2, and is contained at a ratio of 0.05 to 0.5% by weight in the biaxially drawn film. Even without forming a top-coat layer, therefore, the film is not scratched or the forming-tool is not damaged by the anti-blocking agent that adheres and deposits on the forming tool. Besides, the resin coating favorably adheres to the metal plate offering excellent advantage in production and in economy.

Abstract: A varnish includes an epoxy resin, a curing agent, an accelerator agent and fillers. The fillers include sericite powders. The sericite powders have composition of SiO2 in weight ratio of 55±3%. Furthermore, the Mohs' scale of hardness of the sericite powder is between 2 to 3. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better machined-work capability.

Abstract: A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.

Abstract: Hydrophilic and self cleaning UV nano-epoxy/acrylate cationic hybrid coating composition, methods for coating transparent polymeric materials, and coated transparent polymeric materials are provided herein. In one example, a coating composition for a transparent polymeric material comprises a cationically polymerizable compound, a radically polymerizable compound, a surfactant with both hydrophilic and hydrophobic segments, and a nano-particular filler. The cationically polymerizable compound comprises at least one epoxy group. The radically polymerizable compound comprises at least one (meth)acrylate group and the nano-sized particulate filler comprises TiO2, and SiO2 and/or Al2O3.

Abstract: The bonding method of the present invention is a method of bonding a member (a) having a layer (a1) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a).

Abstract: The invention relates to a composition comprising mica and glass, said glass comprising: 10 to 30 mol % of SiO2 5 to 40 mol % of BaO 15 to 30 mol % of B2O3, the sum of the concentrations of zinc oxide, alkali metal oxide and alkaline earth oxide in the glass extending from 15 to 65 mol %. This composition is intended to be molded at a temperature above the Tg of the glass so as to form composite parts that can serve as an electrical insulator.

Abstract: The solar cell sealant sheet of the present invention includes a coating film of a water-soluble thermosetting resin-dispersed paint obtained by emulsion-polymerizing a monomer mixture containing an ?,?-ethylenically unsaturated monomer having an alkoxysilyl group in a presence of a resin serving as a dispersant, the resin having a quaternized ammonium group that has been obtained by addition of a tertiary amine compound and an organic acid to having an epoxy group, wherein a hardness (B) in terms of a pencil hardness of the coating film after being thermally cured is 4B or higher, and a hardness ratio (B/A) of the hardness (B) after being thermally cured relative to a hardness (A) before being heated is 1.1 or higher. The sealant-integrated substrate of the present invention includes, as a sealant, the coating film of the water-soluble thermosetting resin-dispersed paint that is integrally layered on a surface on a solar cell element side of a substrate of a solar cell module.

Abstract: The present invention discloses a resin composition and a prepreg produced using the resin composition. The resin composition comprises, as essential components: 100 parts by mass of a component (A) which is an epoxy resin; 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles; and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent. The thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B1) having an average particle diameter of 1 to 50 ?m and thermoplastic resin particles (B2) having an average particle diameter of 2 to 100 ?m at a mass ratio of 3:1 to 1:3. The average particle diameter ratio D2/D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more.

Abstract: An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.

Abstract: Resin compositions comprise an epoxy thermosetting resin; and at least two types of interlaminar toughening particles; wherein a first type of interlaminar toughening particles are insoluble in said epoxy thermosetting resin; wherein a second type of interlaminar toughening particles are partially soluble or swellable in said epoxy thermosetting resin. Prepregs and structural compounds contain these resin compositions, which are useful in the aerospace industry.

Abstract: Disclosed herein are a substrate for a semiconductor package and a method for manufacturing the same. The substrate for the semiconductor package includes: a semiconductor chip forming region; and a hydrophobic film for controlling the flow of an adhesive for bonding a semiconductor chip in a portion of a solder resist layer. According to the present invention, a molecular film type of chemically treated hydrophobic film is formed to effectively control the flow of epoxy resin as an adhesive for bonding a semiconductor chip at a location where the epoxy resin meets the hydrophobic film. Also, a part to be controlled is bonded to a substrate through chemical bonding, thereby maintaining a very stable form.

Abstract: There is provided a photosensitive thermosetting resin composition of an alkali development type from which it is possible to form a coating film that is halogen-free yet has high-level flame retardancy, has a superior low warpage property after it is cured, is excellent in plasticity, resolution, soldering heat resistance, chemical resistance, and the like, and a flexible printed circuit board using the same.