Abstract: The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C).

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract: The present invention relates to multicoat paint systems comprising basecoats and clearcoats with high solids fractions that each comprise at least one sulfonic acid compound of formula (I) or formula (II). The invention further relates to a method of producing these multicoat paint systems and to their use, and also to substrates coated with the multicoat paint system. The invention relates, furthermore, to the use of the sulfonic acid compounds of formula (I) and formula (II) in basecoats and clearcoats with high solids fractions.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×103 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.

Abstract: The present technology provides compositions that may be coated on bisphenol A-containing polymers to provide a coating or film that prevents bisphenol A from leaching from the polymer. Coatings using the present compositions also protect the bisphenol A-containing polymer from degradation by UV rays and other sources. The compositions include one or more matrix polymers having a solubility parameter of about 20 or less; and a plurality of UV-blocking nanoparticles dispersed in the one or more matrix polymers; wherein the composition is substantially free of bisphenol A. Methods of making the compositions and coatings are also provided. The coatings may be used on food and beverage containers made from bisphenol A-containing polymers.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: Organometallic coatings or films, substrates coated with such films and methods for applying the films to the substrates are disclosed. The organometallic film or coating is derived from a transition metal compound containing both halide ligands and alkoxide ligands. Coated articles comprising polymer substrates and adhered to the substrate surface an organometallic film in which the metal comprises halide and alkoxide ligands are also disclosed.

Abstract: A composite structural system comprising first and second outer plates and an inner core of elastomer wherein the outer plates are formed with a plurality of nails pre-punched from the plates to provide coherent integration between the outer plates and the inner elastomer core and are fabricated either by a Post-Sandwich method or a Pre-Sandwich method

Abstract: A decoration device including a housing, an anti-fingerprint layer, an easy-cleaning layer, and an adhesion layer is provided. The anti-fingerprint layer is disposed on the housing and exposed. The easy-cleaning layer is disposed between the housing and the anti-finger print layer, and a material of the easy-cleaning layer includes a polymer containing fluorine. The adhesion layer is disposed between the housing and the easy-cleaning layer.

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: A roll member includes: a core; and an elastic layer that is formed on the core and constituted with a vulcanized substance of a rubber composition containing a polysulfide polymer (A) and an elastic material (B); wherein the polysulfide polymer (A) includes at least one structural unit selected from —(C2H4OCH2OC2H4—Sx)— and —(CH2CH(OH)CH2—Sx)—, wherein x represents an integer of from 1 to 5, and includes at least one thiol group selected from —C2H4OCH2OC2H4—SH and —CH2CH(OH)CH2—SH at an end thereof, and wherein the elastic material (B) is an elastic material other than the polysulfide polymer and includes at least a double bond in the chemical structure thereof.

Abstract: Coatings utilized in multilayer sheets such as laminated films used for photovoltaic backsheets can be prepared by adding epoxy and carbodiimide to a polyurethane mixture to be utilized as the adhesive, prior to application of the coating to a substrate. Such coatings can exhibit improved resistance to hydrolysis, and can maintain bond strength under prolonged conditions of high heat and humidity.

Abstract: Substrates, coated with a block copolymer comprising at least four blocks being at least two hard blocks, one soft block and one hydrophilic block, wherein a the soft block is sandwiched between the hard blocks.

Abstract: The invention relates to an adhesive composition comprising, relative to its total weight: from 1 to 40% of a polyethylene (A) grafted with a functional monomer or a blend of a polyethylene (A1) with a second polymer (A2) different from (A1), said blend of (A1) and (A2) being co-grafted with an unsaturated functional monomer, the content by weight of unsaturated functional monomer relative to (A) being in the range from 30 to 100000 ppm; from 25 to 98% of a non-grafted polyethylene (B) having a density in the range from 0.900 to 0.965; from 1 to 35% of an elastomeric product (C). The invention also relates to a multilayer structure comprising this composition, said structure being able to serve as protection of metal tubes used for the fabrication of oil pipelines and gas pipelines.

Abstract: Disclosed is an adamantane derivative which provides a cured product excellent in optical characteristics such as transparency and light resistance, long-term heat resistance, electrical characteristics such as and dielectric constant, and low water absorption. Also disclosed are a resin composition containing the adamantane derivative, a sealing agent for electronic circuits, optical electronic member, semiconductor device and copper-clad laminate all using the resin composition, and a radiation-sensitive resin composition which contains the above-mentioned adamantane derivative as a crosslinking agent.

Abstract: There is provided a transparent hybrid sheet having superior transparency and thermal resistance and having smaller linear expansion coefficient and optical anisotropy and higher degree of flatness. In a transparent hybrid sheet obtained by curing a hybrid composition including an epoxy resin composition containing alicyclic epoxy compound and a curing agent and curing a glass filler together, the alicyclic epoxy compound contains, as a principal component thereof, a diepoxybicyclohexyl compound represented by Formula (1) below, with amounts of isomers of the diepoxybicyclohexyl compound being 20% or less, of a sum of the diepoxybicyclohexyl compound and the isomers, in terms of a ratio of its peak area determined by a gas chromatography.

Abstract: An apparatus includes a substrate having a top surface, a substantially regular array of raised structures located over the top surface, and a layer located on the top surface between the structures. Distal surfaces of the structures are farther from the top surface than remaining portions of the structures. The layer is able to contract such that the distal surfaces of the structures protrude through the layer. The layer is able to swell such that the distal surfaces of the structures are closer to the top surface of the substrate than one surface of the layer.

Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

Abstract: The claimed invention relates to a flexible substrate having reduced shrinkage and curling, wherein said substrate is coated with a coating having a dual cure system, wherein said coating comprises a free radical curable component and a cationically curable component.

Abstract: Methods for preparing thermosetting or thermoplastic polymer or elastomer composites that are reinforced with natural fibers are disclosed. A thermosetting or thermoplastic polymer or elastomer composite that is reinforced with natural fibers obtainable by the disclosed method is also disclosed. Construction material that is obtainable by hardening a thermosetting or thermoplastic polymer or elastomer composite that is reinforced with natural fibers is described.

Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

Abstract: A composition is described that includes at least one polyolefin, at least one thermoplastic bio-resin derived from starch or soy or both, and at least one compatibilizer having at least one polyolefin and at least one polar group. Surface coverings and floor coverings, such as laminated floor coverings, having the composition, are also described.

Abstract: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Abstract: The invention is a building construction sheathing panel which employs a two component system, which is comprised of semi-flexible or rigid FRP laminate, adhered or otherwise affixed to a thicker and usually more rigid material such as fiber cement board, cement board, magnesium oxide board or calcium silicate board. The hybrid sheathing panel is then used to build structures in either the conventional “stick framing method” or used as a facer or “skin” in insulated or non insulated panels.

Abstract: The present invention provides a safety laminate or solar cell module comprising an acid terpolymer containing film or sheet, wherein the acid terpolymer comprises copolymerized units derived from an ?-olefin, about 15 to about 30 wt % of an ?,?-ethylenically unsaturated carboxylic acid having 3 to 8 carbons, and about 0.5 to about 40 wt % of an ?,?-ethylenically unsaturated carboxylic acid ester having 4 to 12 carbons, based on the total weight of the acid terpolymer.

Abstract: The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an ?-? unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relates to coating compositions comprising these curing agents.

Abstract: The present invention provides a multilayered plastic substrate that simultaneously satisfies improvement in high temperature thermal deformation according to low linear expansion coefficient and excellent dimensional stability and excellent gas barrier property, and is capable of being used instead of a glass substrate that has brittleness and heavy disadvantages without a problem caused by a difference in linear expansion coefficient between layers, and a method for manufacturing the same.

Abstract: An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract: The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours.

Abstract: Reinforced natural or conglomerate stone plate-like element comprising: a substrate (1) of natural or conglomerate stone material; a multi-layered coating providing protection of said substrate (1) against chemical and wearing mechanical agents acting on the element, said multi-layered coating comprising three single or multiple film forming composition layers.

Abstract: The invention relates to curable compositions substantially comprising A) at least one epoxy resin, and B) at least one curing agent comprising a hetero-poly-cyclic ring system comprising at least two amino groups.

Abstract: A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating.

Abstract: A photosensitive laminate film for forming a top plate portion, which is suitably used for efficiently and inexpensively forming various precision fine spaces, particularly the precision fine spaces formed in an electronic part such as inkjet head, and a method of forming the precision fine space using the photosensitive laminate film are provided. As the photosensitive laminate film for forming the top plate portion of the precision fine space, which constitutes the top plate portion of the precision fine space by being placed on the precision minute concave portion so as to cover an upper opening followed by being cured, a laminate film providing at least the photosensitive composition layer and the transparent support film is used. The transparent support film supports the photosensitive composition layer as well as prevents the photosensitive composition layer from being deformed upon curing.

Abstract: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to about 2.4 phenolic hydroxy groups per molecule, and it has a polydispersity index less than or equal to 2.2 and an intrinsic viscosity of about 0.03 to about 0.2 deciliter per gram. These characteristics substantially improve the solubility of the poly(arylene ether) in the curable composition and allow the curable composition to be formed and used at or near room temperature. Composites formed by the process and circuit boards including the composites are also described.

Abstract: The invention is a structural insulated panel that can be utilized as a building panel. The structural insulated panel has a two part skin system, comprising a semi-flexible or rigid FRP laminate that is adhered to a thicker and usually more rigid material such as cement board or magnesium oxide board. The double skin is adhered to one or both sides of a core material that can comprise one or more plastic foams, natural materials, honeycomb, paper, plastic and aluminum.

Abstract: The invention relates to a sliding element with a substrate and at least one layer of a sliding layer material applied onto the substrate. The sliding layer material can consist of an antifriction lacquer comprising at least one cross-linkable binder or at least one high-melting thermoplast material or of a material that contains a matrix of at last one high-melting thermoplast material or at least one duroplast material. Said sliding layer material contains Fe2O3 with a preferred fraction of 0.1 to 15 vol. %.

Abstract: The invention describes novel compositions that include a cross linking compound, a polymer and a 1 nm to about a 25 micron sized particle optionally with an oxide layer. In particular, the particle is a silica and one which has been pretreated with a silane.

Abstract: An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a phosphazene compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: The present invention relates to an organic/inorganic hybrid thin film passivation layer comprising an organic polymer passivation layer prepared by a UV/ozone curing process and an inorganic thin film passivation layer for blocking moisture and oxygen transmission of an organic electronic device fabricated on a substrate and improving gas barrier property of a plastic substrate; and a fabrication method thereof. Since the organic/inorganic hybrid thin film passivation layer of the present invention converts the surface polarity of an organic polymer passivation layer into hydrophilic by using the UV/ozone curing process, it can improve the adhesion strength between the passivation layer interfaces, increase the light transmission rate due to surface planarization of the organic polymer passivation layer, and enhance gas barrier property by effectively blocking moisture and oxygen transmission.

Abstract: There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.

Abstract: One embodiment of the invention includes product comprising an elastomeric epoxy dry adhesive with a pull-off strength of 1-200 N/cm2 from a substrate and reversibly detached with a peel-off force less than 1 N/cm.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A process for the preparation of coated polymer particles containing superparamagnetic crystals, said process comprising reacting porous, surface-functionalized, superparamagnetic crystal-containing polymer particles of diameter 0.5 to 1.8 ?m with at least one polyisocyanate and at least one diol or at least one epoxide.

Abstract: Epoxy resin compositions that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes from 15 to 35 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 5 to 25 weight percent of a curative agent.

Abstract: A method for preparing a tamperproof ID document comprising in order the steps of a) providing an ID document having at least one image on at least one outermost surface of said ID document; b) printing or coating a curable liquid on at least one of said outermost surfaces of said ID document thereby forming an outermost layer on said printed or coated outermost surface at least partially covering said at least one image; and c) curing said outermost layer; wherein said curable liquid comprises a polymerizable and/or a polymeric abherent agent and said printed or coated outermost surface is the surface of a layer or foil exclusive of porous pigment. Also disclosed is an ID document wherein the surface of an outermost layer at least partially covering an image on the ID document has a surface energy of less than 28 mN/m; and the use of an abherent agent-comprising curable composition to provide ID-documents with a substantially non-printable and substantially non-laminatable abhesive surface.

Abstract: [PROBLEMS TO BE SOLVED] There are provided an in-mold coating composition having an excellent adhesion to a thermosetting molding resin or a thermoplastic molding resin and an in-mold-coated molded product formed by coating effectively with a conductive coating film in a mold. [SOLUTION] This invention is an in-mold coating composition characterized by comprising components of (A) at least one selected from a urethane oligomer, an epoxy oligomer, a polyester oligomer and a polyether oligomer each having a (meth)acryloyl group, or an unsaturated polyester resin, (B) a monomer capable of copolymerizing with the (A) component, (C) a conductive particle formed by coating a surface of an inorganic particle with a conductive metal oxide particle, and (D) an organic peroxide polymerization initiator, wherein mass ratios of the (A) and (B) components satisfy (A)/(B)=20/80-80/20, a mass ratio of the (C) component satisfies (C)/{(A)+(B)}=5/100-50/100, and a mass ratio of the (D) component satisfies (D)/{(A)+(B)}=0.

Abstract: The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.