Abstract: Provided is a laminated structure having excellent self-repairing performance, which can be prepared by an inexpensive and simple method; also provided are a self-bonding insulated wire and electrical machine using the same. A self-repairing laminated structure in which a self-repairing resin layer is formed on a base material and a thermosetting resin topcoat is formed on an outer layer thereof is characterized in that the self-repairing resin layer includes an uncured cross-linkable or curable thermoplastic resin, and the thermosetting resin topcoat includes a cross-linking agent, curing agent, or curing catalyst of the cross-linkable thermoplastic resin.

Abstract: There is provided an intermediate layer material including a curing type resin composition and a fiber base material, to be used to form an intermediate layer of a composite laminate, wherein a cured material obtained by curing the intermediate layer material at a temperature of 180° C. has such properties as (i) a planar linear expansion coefficient (?1) equal to or lower than 20 ppm/° C., in a range equal to or higher than 25° C. and equal to or lower than a glass transition temperature (Tg); and (ii) a Barcol hardness equal to or more than 40 and equal to or less than 65, at 25° C.

Abstract: The invention pertains to a composition (C1) comprising: at least one (meth)acrylic modified VDF polymer [polymer (A)] comprising recurring units derived from comprising recurring units derived from vinylidene fluoride (VDF) monomer and at least one hydrophilic (meth)acrylic monomer (MA) of formula (I), wherein each of R1, R2, R3, equal or different from each other, is independently a hydrogen atom or a C1-C3 hydrocarbon group, and ROH is a hydrogen or a C1-C5 hydrocarbon moiety comprising at least one hydroxyl group; at least one inorganic UV blocker compound in an amount not exceeding 5% wt, with respect to the weight of polymer (A), to multilayer assemblies comprising one layer made from said composition (C1), to a method for manufacturing said multilayer assemblies and to the use of the same in different field of use, including protection of PV modules.

Abstract: Processes for coating substrates and the related substrates are disclosed herein. A one-component base coating composition is applied onto a substrate and a one-component top coating composition is applied wet-on-wet onto the applied base coating composition. The coating compositions are based on aqueous acrylate/polyurethane dispersions. The top coating composition is applied after the applied base coating composition develops a pendulum hardness of at least 50% of the pendulum hardness that would be exhibited by the base coating composition after UV cure. The applied coatings exposed to UV radiation to simultaneously cure both the base coating composition and the top coating composition.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A coextruded multilayer structure which can be oriented and a process therefor are disclosed in which the structure comprises a poly(hydroxyalkanoic acid) polymer (PHA) composition layer, a tie layer, and a sealant layer and the process comprises, consists essentially of, or consists of coextruding a PHA composition, a tie layer composition, and a sealant layer composition to produce a tubular multiplayer structure; cooling the multilayer film structure in a first bubble to produce a tubular multilayer structure; orienting the tubular multilayer structure under heating in a second bubble to produce an oriented tubular multilayer structure; and relaxing the oriented tubular multilayer structure under heating in a third bubble. The structure can be used to produce an article such as a packaging article.

Abstract: A plastic articles is provided. The plastic article includes a base formed by injecting molted resin into a cavity of a female mold, and a film attached to the base. The base includes a first edge, the film comprises a second edge level to the first edge of the base.

Abstract: Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The TMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

Abstract: A barrier suitable for use in building construction materials. The barrier is formed from a plurality of members. Each member has a heat-resistant core or shell, a heat-reactive intumescent or flame retardant layer formed on an outer surface of the heat-resistant core, an antistatic and oil-phobic layer formed on an outer surface of the heat-reactive intumescent layer.

Abstract: An object of the invention is to prevent staining of processing equipment by a resin originated from a resin sheet during pressing. The present invention achieves the object by a laminate having a support, a resin sheet that is laminated on a part of the support, and a release sheet that is laminated on the resin sheet, in which a peel force F1 between the support and the resin sheet is larger than a peel force F2 between the resin sheet and the release sheet.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: One aspect of the invention is a laminate article including a first substrate layer comprising a fluorine-containing surface, a second substrate layer and an adhesive layer in contact with both the fluorine-containing surface of the first substrate layer and the second substrate layer. The adhesive layer includes a cross-linkable, pressure-sensitive acrylic adhesive and a cross-linker selected from the group consisting of epoxies, polyisocyanates, and melamines.

Abstract: The present invention relates to an adhesive composition including 100 parts by weight of a first epoxy compound having a glass transition temperature of a homopolymer of not less than 120° C., 30 parts by weight to 100 parts by weight of a second epoxy compound having a glass transition temperature of a homopolymer of not more than 60° C., and 0.5 parts by weight to 20 parts by weight of a cationic photopolymerization initiator, and a polarizing plate using the same.

Abstract: Polymeric compositions and processes of forming the same are discussed herein. The processes generally include contacting a polylactic acid with a reactive modifier selected from epoxy-functionalized polybutadiene, ionic monomer, and combinations thereof.

Abstract: The present invention relates to aromatic aldimines, which are based on primary aromatic polyamines, which are solid at room temperature and liquid at room temperature and which have the lowest possible viscosity, hydrolyze with little odor, and can be used as blocked amines in curable compositions, in particular in compositions having one-component and two-component isocyanate groups. Said compositions have a relatively long open time, but cure surprisingly rapidly, said curing occurring without strong odor formation and without bubbling. In addition, the compositions have outstanding mechanical properties after curing, in particular high strength with high ductility, and good resistance to heat and moisture.

Abstract: The present invention provides an adhesive composition that may improve both adhesiveness to a film layer and adhesiveness to a rubber layer, and an adhesion method using the same, as well as a laminate and a tire. The adhesive composition according to the present invention includes a rubber component, at least 80 mass % of which rubber component is an epoxidized natural rubber.

Abstract: Provided are a resin composition with high adhesion to substrates under hot and humid conditions, a two-part laminate adhesive containing the resin composition, and a laminated film and backsheet for solar cells including a layer of the adhesive. The resin composition contains, as essential components, a polyester polyurethane polyol (A) having a branched structure in a molecule thereof and having a weight average molecular weight (Mw) of 25,000 to 200,000 and a molecular weight distribution (Mw/Mn) of 2.5 to 25; a hydroxyl-containing epoxy resin (B) having a number average molecular weight (Mn) of 300 to 5,000; a hydroxyl-containing polycarbonate resin (C) having a number average molecular weight (Mn) of 300 to 3,000; and a polyisocyanate (D).

Abstract: A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K.

Abstract: Fixtureless self-alignment and orientation of components during an assembly process, and self-aligning/self-orienting components for assembly. Self-alignment and self-orientation are provided by integrating complementary spatially-modulated magnetic arrays into components requiring alignment and/or orientation during an assembly process. In addition to providing self-alignment/self-orientation, the spatially-modulated magnetic arrays also provide selective component placement and/or assembly order. Final assembly can involve permanent mechanical or adhesive fasteners.

Abstract: An adhesively bonded article includes a metallic substrate that has an oxide layer thereon, a phosphonate bond promoter coating on the oxide layer, an adhesive material on the bond promoter coating, and a component bonded to the metallic substrate by way of the adhesive material.

Abstract: A film which can be industrially coated easily and exhibits excellent gas barrier performance without being subjected to a high-temperature heat treatment, good gas barrier performance immediately after the production, and maintains the excellent gas barrier performance while exhibiting excellent hot water resistance and printing resistance; a gas barrier laminated film including a resin layer on an inorganic thin film formed on at least one surface of a support film, the resin layer being formed by applying: (1) an aqueous dispersion containing polyvinyl alcohol (a), an ethylene-unsaturated carboxylic acid copolymer (b), and inorganic particles (c); (2) an aqueous dispersion containing an ethylene-unsaturated carboxylic acid copolymer (b), inorganic particles (c), and/or a cross-linking agent (d); or (3) an aqueous dispersion containing polyvinyl alcohol (a), an ethylene-unsaturated carboxylic acid copolymer (b), inorganic particles (c), and cross-linking agent (d), to the inorganic thin film surface; and a

Abstract: A laminated polyester film provided on at least one side with layer (X) made from acrylic urethane copolymer resin (A), isocyanate compound (B), epoxy compound (C), compound (d-1) having a polythiophene structure and compound (d-2) having an anion structure, wherein the layer (X) has a continuous phase structure.

Abstract: The present invention provides an aqueous resin composition that can form a cured resin layer that exhibits high adhesion to a base member and high moisture-heat resistance. The present invention relates to a heat-sealing material including an aqueous urethane resin (A), an aqueous polyolefin resin (B), a cross-linking agent (C), and an aqueous medium (D), wherein the cross-linking agent (C) contains an alkylated methylolmelamine resin (c1) and an epoxy compound (c2), the content of the alkylated methylolmelamine resin (c1) is in the range of 5% to 50% by mass, one or both of the aqueous urethane resin (A) and the aqueous polyolefin resin (B) have a functional group [X] that is capable of reacting with an epoxy group, and the molar ratio of the amount of substance having an epoxy group to the total amount of substance having the functional group [X] is 5/1 to 1/5.

Abstract: This disclosure concerns a thermoforming cover of portable electronic apparatus, comprising: a first transparent layer, being made by plastic material; a color layer, being printed on the first transparent layer; an adhesive layer, being covered on the color layer; and a second transparent layer, being made by plastic material, and disposed on the adhesive layer; wherein the first transparent layer can be set as substrate, and the color layer, the adhesive layer and the second transparent layer are disposed on the first transparent layer by step, then a thermoforming cover can be manufactured in a mold through thermoforming process.

Abstract: A method for forming an electrical-conductor-free vapor barrier suitable for protecting long-term implanted electronic systems is disclosed. The method comprises forming a nascent layer of a partially cured layer and repeatedly compressing the layer via a roller-based process. Once the layer has been suitably compressed, the layer is fully cured. In some embodiments, a multi-layer protective layer is formed by repeating the roller-based formation process for each of a plurality of layers. In some embodiments, a multi-layer protective layer comprising layers of different materials is formed.

Abstract: A method for adhesively bonding a metallic substrate and a component together includes treating the metallic substrate to form an oxide layer thereon, treating the oxide layer with a conversion coating solution to form a bond promoter coating on the oxide layer, and depositing an adhesive material on the bond promoter coating to bond the component and the metallic substrate together.

Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Abstract: The invention relates to heat-curing sealing compound compositions comprising at least epoxy resin, a heat-activatable hardening agent or accelerators (B) for epoxy resins, isocyanate group-containing polyurethane polymer (PUP) and a special polyaldimine. Said single-component sealing compound compositions are characterized by a good skin formation time and extraordinarily good storage stability and low blistering. Due to these properties, said sealing compound compositions are optimally suitable for use as sealants in autobody work because they can be excellently coated with a KTL paint.

Abstract: An anti-fogging article having a substrate and an anti-fogging film on at least part of the surface of the substrate, wherein the anti-fogging film comprises a resin underlayer and a water-absorptive resin layer laminated in order on the substrate surface, the water-absorptive resin layer is composed mainly of a first cured epoxy resin obtained by reacting a water-absorptive resin layer-forming composition containing a first polyepoxide component consisting of a low molecular weight polyepoxide having molecular weight of from 200 to 800 and a high molecular weight polyepoxide having molecular weight of from 900 to 2,000 combined in mass ratio of from 30:70 to 70:30, and a first curing agent, and the resin underlayer is composed mainly of a second cured epoxy resin obtained by reacting a resin underlayer-forming composition containing a second polyepoxide component and a second curing agent, and has water absorption property lower than the water-absorptive resin layer.

Abstract: The invention makes it possible to use a coating liquid of a fine cellulose fiber (a natural material) and to form a coated layer which can be used as a various-functions layer such as a gas barrier layer and water vapor barrier layer etc. by achieving good adhesiveness and coatability of the coating liquid, and as a result, provides a laminated material in which temporal degradation of a substrate and the fine cellulose fiber layer is prevented. The laminated body includes a substrate, an anchor layer arranged on a surface the substrate, and a fine cellulose fiber layer containing a fine cellulose fiber having a carboxy group, wherein the anchor layer contains at least one resin having a carboxy group, sulfonate group, amino group or hydroxyl group.

Abstract: Provided are an adhesive for a polarizing plate and a polarizing plate comprising the same, and more particularly, an adhesive composition for a polarizing plate comprising one or more acrylic monomers having a hydrophilic group, a radical polymerization initiator, an epoxy resin, and a cationic photopolymerization initiator, as well as a polarizing plate comprising a polarizer, a polymer film adhered to one side or both sides of the polarizer, and an adhesive layer for bonding the polarizer and the polymer film, in which the adhesive layer is formed of an adhesive composition comprising one or more acrylic monomers having a hydrophilic group, a radical polymerization initiator, an epoxy resin, and a cationic photopolymerization initiator.

Abstract: The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained.

Abstract: A novel vacuum forming technique is disclosed whereby unique leather-plastic sandwich materials may be formed into arbitrary shapes using a molding technique having similarities to the vacuum thermoforming and leather molding processes. The leather itself may be softened before applying a vacuum forming step by means of soaking in warm water. The vacuum step removes the water thus hardening the material.

Abstract: This invention provides emulsions and adhesives comprising proteins that can be isolated from a variety of sources including renewable plant biomass, and methods of making and using such emulsions and adhesives.

Abstract: Embodiments relate to use of a particle accelerator beam to form thin layers of material from a bulk substrate. In particular embodiments, a bulk substrate (e.g. donor substrate) having a top surface is exposed to a beam of accelerated particles. In certain embodiments, this bulk substrate may comprise a core of crystalline sapphire (Al2O3) material. Then, a thin layer of the material is separated from the bulk substrate by performing a controlled cleaving process along a cleave region formed by particles implanted from the beam. Embodiments may find particular use as hard, scratch-resistant covers for personal electric device displays, or as optical surfaces for fingerprint, eye, or other biometric scanning.

Abstract: The present invention provides a sheet for sealing a rear surface of a solar cell in which degradation due to hydrolysis of the material constituting the solar cell is prevented, and the weather resistance is excellent such that electric output properties of the solar cell can be maintained not only under conditions of actual usage of the solar cell module but also conditions for evaluation under high temperatures and high moistures, and provides a sheet for sealing a rear surface of a solar cell comprising a laminate in which at least two substrates are laminated by an polyurethane-based adhesive, wherein the polyurethane-based adhesive comprises an adhesive having hydrolysis resistance which satisfies the following conditions: condition 1: the lamination strength of the adhesive is 1 N/15 mm or more after keeping the laminate in a chamber which acts as a highly accelerated stress test system under pressurized steam conditions of 105° C. and 1.

Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.

Abstract: A laminate useful for electrical insulation having: (a) at least one layer of a mica-aramid paper comprising 55 to 95 weight percent mica and 5 to 45 weight percent aramid and (b) at least one layer of a polymeric electrical insulating film bonded to the mica-aramid paper with an adhesive.

Abstract: The present invention relates to adhesives that are suitable for use in a broad variety of bonding applications. In particular, the present invention relates to adhesives that are suitable for use in polymer-to-metal, for example elastomer-to-metal, such as rubber-to-metal bonding applications, wherein the adhesives comprise at least one halogenated polyolefin, at least one epoxysilane having at least one terminal alkoxy silane group, at least one bis-silane, and optionally at lease one organic solvent.

Abstract: A method for the formation of a paint film in which an aluminum or aluminum alloy part is subjected to an anodic oxidation treatment and an anodic oxide film is formed on the surface of the aluminum or aluminum alloy part, an anti-rust primer is coated on said anodic oxide film and an anti-rust primer paint film is formed and, as required, a top-coat paint is coated on said anti-rust primer paint film and a top-coat paint film is formed in which said anti-rust primer includes a base resin comprising hydroxyl group containing epoxy resin and a hardening agent, selected from among melamine resin and polyisocyanate, and barium sulfate, and the proportion of said barium sulfate included is a proportion within the range from 20 to 70 parts by mass per 100 parts by mass in total of the solid fractions of the base resin and the hardening agent.

Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: A coating is a mixture of polybenzimidazole polymer and an epoxy. The coating may further include a primer underlying the coating. The coating may further include an adhesion promoter. A solution includes a polybenzimidazole polymer, an epoxy resin, an initiator, and a carrier solvent. The solution may further include a stabilizer and/or an adhesion promoter.

Abstract: An easy open end comprising a resin-coated metal plate obtained by coating a metal substrate with a polyester film via a primer, wherein the primer comprises an epoxy resin or a polyester resin and a resole-type phenol resin, and the resole-type phenol resin has 0.2 to 2.0 methylol groups per a benzene ring. The end can be lightly opened without causing defect at the time of opening the end by pushing in the end of a tab and cutting the score and, particularly, can be excellently opened at high temperatures without arousing the problem even in a state of being heated at high temperatures featuring excellent corrosion resistance, resistance against the content and retort resistance.

Abstract: A reinforcing method and structure for a steel structure and an elastic layer forming material for reinforcing a steel structure are provided that can prevent a reinforcing effect from being lowered by direct sunlight, can obtain a sufficient reinforcing effect, and can prevent a fiber sheet from being peeled away from a steel structure surface before the fiber sheet is torn. The reinforcing method for a steel structure, in which a fiber sheet including reinforcing fibers is bonded to a surface of the steel structure to integrate the fiber sheet with the steel structure, includes (a) a step of applying and hardening a polyurea resin putty to the surface of the steel structure to form an elastic layer, and (b) a step of bonding the fiber sheet to the surface of the steel structure having the elastic layer formed thereon with an adhesive agent.

Abstract: Provided is a low water-vapor permeable composite film, which includes a 3-layered co-extruded biaxial-oriented film formed of polyester films or polypropylene films including a first layer, a second layer and a third layer stacked in sequence. The first layer further includes an anti-block agent. An alternate structure including a plurality of organic protection layers and a plurality of inorganic layers are formed on the 3-layered co-extruded biaxial-oriented film. The plurality of organic protection layers and the plurality of inorganic layers are stacked alternately.

Abstract: The invention relates to a sealing membrane comprising a thermoplastic barrier layer and a tack-free solid epoxy resin layer which is suitable for sealing substrates in the construction industry. The invention further relates to a method for sealing said substrates. Said method allows rapid and efficient sealing of structures in civil engineering and good adhesion of the sealing membrane on the substrate.

Abstract: An adhesion method capable of strongly adhering two members without using an adhesive and without impairing a fine structure or optical properties of a joining surface, and a biochemical chip and optical component made by the same are provided. The adhesion method includes step A of forming a coating film 13 of a first film compound having a first functional group on a first joining surface 11 of a first member 21, step B of forming a coating film 14 of a second film compound having a second functional group on a second joining surface 12 of a second member 22, and step C of bringing the first joining surface 11 into contact by pressure with the second joining surface 12 while bringing a coupling agent having at least one coupling reactive group that forms a bond by a coupling reaction with the first functional group and the second functional group into contact with the first and second functional groups to form bonds by the coupling reaction.

Abstract: A surface treatment for polymeric part adhesion and a treated part is provided. In one aspect, a method for adhesively securing a part to a polymeric substrate is provided comprising providing an adhesive layer having a bonding surface having a first oxygen composition, a part having a bondable surface, and a polymeric substrate having a mating surface. Spray from an air plasma device is directed onto at least a portion of the bonding surface of the adhesive to provide a second oxygen composition on the bonding surface of the adhesive layer, with the second oxygen composition being greater than the first oxygen composition. The adhesive layer is secured between the bondable surface of the part and the mating surface of the polymeric substrate.