Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: The stack of laminations consists of punched laminations (5), which are bonded together by an adhesive agent. The adhesive agent is composed of an adhesive (4) and an initiator (15), which consists of methacrylates, derivative imines and methacrylic esters. The completely cured adhesive bond has long-term resistance when exposed to a temperature of at least over 80° C. The adhesive (4) is applied over the full surface area and in a contacting manner to one side of the lamination (5) and the initiator (15) is applied to the same side and/or to the other side of the lamination (5). The initiator (15) reacts with the adhesive (4) when contact is made and establishes the adhesive connection between laminations (5) lying against one another. The adhesive agent may, however, also be an adhesive (4) that cures by itself when heat is applied.

Abstract: Disclosed herein is an adhesive composition for polarizing plates having increased adhesion by preventing curing inhibition due to moisture. The present invention provides an adhesive composition for polarizing plates, comprising: (A) a radical polymerizable monomer; (B) a cationic polymerizable monomer; (C) an unsaturated dicarboxylic acid anhydride; and (D) an initiator.

Abstract: One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate. One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate during building or reconfiguring a product.

Abstract: Provided is e.g., an epoxy resin curing agent, epoxy resin composition and a gas-barrier adhesive containing the epoxy resin composition which can express high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester, and a gas-barrier laminate having high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester. The epoxy resin curing agent of the present invention is a reaction product of the following (A) and (B). Furthermore, the epoxy resin curing agent contains at least an epoxy resin and the epoxy resin curing agent of the present invention. (A) metaxylylenediamine or paraxylylenediamine; (B) an unsaturated carboxylic acid represented by the following formula (1) and/or derivatives thereof: wherein R1 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer.

Abstract: An optical device includes a support structure configured to retain an optical element using a cured adhesive composition that is disposed between a surface of the support structure and a surface of the optical element, wherein a structured optical particulate material is dispersed throughout the cured adhesive. The structured optical particulate material redirects curing radiation via a scattering mechanism to facilitate curing of portions of the adhesive compositions that cannot be directly exposed to the radiation, thereby facilitating rapid and more thorough curing than could otherwise be achieved without the structured optical particulate material.

Abstract: An epoxy resin curing agent includes at least the following component (I) and component (II) in a mass ratio of 50/50 to 92/8: Component (I): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B1) acrylic acid and acrylic acid derivatives; Component (II): a reaction product obtained by reacting at least (A) metaxylylenediamine or paraxylylenediamine and at least one selected from (B2) unsaturated carboxylic acids represented by the following formula (1) and derivatives thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group; so that at least one of R1 and R2 is an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.

Abstract: Disclosed herein are an insulating film for a printed circuit board and products having the same. In detail, in the insulating film according to a representative embodiment of the present invention, an insulating material in which a content of an inorganic filler in an insulating layer has a concentration gradient and a printed circuit board using the same may increase fillability of an inner layer circuit and a through hole of the inner layer circuit.

Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).

Abstract: A process for the preparation of a printed wiring board that can prevent generation of crack and warpage is provided. A process for the preparation of a printed wiring board, comprising a step of forming a curable resin layer and a non-curable resin layer sequentially on a surface of a substrate; a step of forming depressions in the non-curable resin layer and the curable resin layer from the non-curable resin layer side; a step of applying a catalyst for plating to a surface of the non-curable resin layer and surfaces of the depressions; a step of removing the non-curable resin layer and the catalyst for plating provided on the surface of the non-curable resin layer; and a step of electroless plating the surfaces of the depressions.

Abstract: An article having a fluid permeation prevention layer, such as a pneumatic tire or hose. A tire for example includes an outer tread layer, intermediate sidewall and carcass layers and an innermost air permeation prevention layer: (i) the air permeation prevention (APP) layer having an upper and a lower surface, the layer having a polymer composition exhibiting an air permeation coefficient (APC) of about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.) or less and a Young's modulus of about 1 MPa to about 500 MPa, the polymer composition comprising: (A) at least 10 wt % of at least one thermoplastic resin component having an APC of about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.) or less and a Young's modulus of more than 500 MPa, which is preferably a polyamide resin or mixture, and (B) at least 10 wt % of at least one elastomer component having an APC of more than about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.

Abstract: Kits and assemblies for causing, enhancing, and/or expediting consumption of an article by at least one biodegradative living organism are disclosed. The kits and assemblies include at least one additional living organism that enhances and/or expedites consumption of the article by the at least one biodegradative living organism. Methods of producing and using same are also provided.

Abstract: The invention relates to a radiation curable adhesive system for use in bonding a high thermal deformation temperature layer to a UV opaque, pigmented or non-pigmented fluoropolymer film The radiation curable adhesive system uses an adhesive composition optimized for cure using long wavelength UV energy. The adhesive system may also be optimized for curing by LED or e-beam radiation. The system is designed for curing through a UV opaque fluoropolymer film—and especially where titanium dioxide is used as the pigment. A preferred multilayer film structure is a polyvinylidene fluoride (PVDF)/curable adhesive/polyester terephthalate (PET) structure. This film structure is especially useful as a backsheet for a photovoltaic module.

Abstract: It is an object of the present invention to provide a water-based composite resin composition which has an excellent long-term storage stability and which enables formation of a coating film having an excellent water resistance and solvent resistance. The present invention relates to a water-based composite resin composition and a coating agent; the water-based composite resin composition containing composite resin particles (A) and an aqueous medium (B), the composite resin particles (A) containing polyester resin (a1) particles having a sulfonate group and an epoxy resin (a2) of which some or all parts are encapsulated in the polyester resin (a1) particles, wherein a mass ratio [(a1)/(a2)] of the polyester resin (a1) to the epoxy resin (a2) in the composite resin particles (A) is in the range of 95/5 to 30/70.

Abstract: An adhesive composition for a polarizing plate has good initial curing and an adhesive property. The adhesive composition includes (A) a polymerizable functional group-containing monomer capable of providing an anchor effect; (B) an epoxy group-containing compound; (D) a photoacid generator; and (E) at least one of a photopolymerization initiator and a photosensitizer.

Abstract: The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer (L1) and the carrier film.

Abstract: A fiber-reinforced composite material can achieve dynamical properties at high levels, and can simultaneously improve Mode I interlaminar fracture toughness GIC and Mode II interlaminar fracture toughness GIIC. The fiber-reinforced composite material has a plurality of reinforcing-fiber-containing layers and an interposing resin layer between adjacent reinforcing-fiber-containing layers. The resin layer is composed of a cured product of a resin composition containing a compound having a benzoxazine ring of formula (1), epoxy resin, a curing agent, a toughness improver, and polyamide 12 powder. The composite material has a GIC of not lower than 300 J/m2, and a GIIC of not lower than 1000 J/m2: (R1: C1-C12 chain alkyl group; H is bonded to at least one of the carbon atoms of the aromatic ring at ortho- or para-position with respect to C to which the oxygen atom is bonded).

Abstract: A biodegradable biomass article for use in construction includes a cellulose biomass. The cellulose biomass includes an alkaline crystalline substance. An adhesive layer covers an outer surface of the biomass, and a sealing layer covers the adhesive layer. A method for manufacturing the biodegradable biomass article includes drying a cellulose biomass, and mixing the biomass with water into a slurry. The slurry is heated, and strained after the step of heating, resulting in a residual paste. The residual paste is compressed to form a biomass mat. The biomass mat is heated, and an adhesive layer is applied which covers the biomass mat. A sealing layer is applied over the adhesive layer.

Abstract: Curable adhesive compositions comprising i. a curable epoxy resin ii. an amine curing agent, iii. a polymeric toughening agent, iv. a filler and v. a phosphoric acid ester according to the formula as an adhesion promoter, wherein R represents an aliphatic or aromatic residue that contains one or more carboxylic acid ester units and/or one or more urethane units and that further contains at least one ether group and n represents an integer of 1 or 2, methods of making them, bonded articles and methods for bonding.

Abstract: The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.

Abstract: Epoxy compounds that are bisanhydrohexitol derivatives (i.e., isosorbide derivatives, isomannide derivatives, isoidide derivatives, or mixtures thereof) having two terminal oxirane groups are provided. Additionally, curable compositions that include these epoxy compounds, cured compositions prepared from the curable compositions, and articles containing the cured compositions are described. The cured compositions can be used, for example, as a structural adhesive or as a coating.

Abstract: The present invention relates to laminates comprising at least one structural layer and a heat sealable layer, wherein the heat sealable layer comprises or is produced from polytrimethylene succinate, poly(trimethylene terephthalate-co-succinate), or blends thereof. This invention also relates to packages comprising the laminates, said package is heat sealable at a heat sealing temperature below 100° C. to provide a heat sealing strength of 10 N/15 mm or higher.

Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

Abstract: A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.

Abstract: To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.

Abstract: A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.

Abstract: Provided are an adhesive for a polarizing plate and a polarizing plate comprising the same, and more particularly, an adhesive composition for a polarizing plate comprising one or more acrylic monomers having a hydrophilic group, a radical polymerization initiator, an epoxy resin, and a cationic photopolymerization initiator, as well as a polarizing plate comprising a polarizer, a polymer film adhered to one side or both sides of the polarizer, and an adhesive layer for bonding the polarizer and the polymer film, in which the adhesive layer is formed of an adhesive composition comprising one or more acrylic monomers having a hydrophilic group, a radical polymerization initiator, an epoxy resin, and a cationic photopolymerization initiator.

Abstract: In one aspect, the present invention relates to a method of forming a reworkable, thermally conductive and electrically resistive material as a bonding structure in a module and application of the same. In certain embodiments, a homogeneous solution is prepared with an anisotropic structure, such as single-wall carbon nanotubes (SWCNTs), and an epoxy resin. The homogeneous solution is applied between a carrier and a chip of the module, and cured at a curing temperature for a curing time period to form a reworkable epoxy bonding layer, which has an anisotropic structure loading factor of about 0.1%-1.0% such that the reworkable epoxy bonding layer is thermally conductive and electrically resistive. When the chip is identified as a faulty chip, the module may be heated at a debonding temperature for a debonding time period such that the reworkable epoxy bonding layer debonds, and the chip becomes detachable from the carrier.

Abstract: The present invention relates to multi-phase self-stratifying coating systems, and in particular, to multi-phase self-stratifying coating systems having a substantially homogeneous composition of polymeric binder components that upon application and cure generates a multi-phase stratified coating wherein each phase is rich in a different polymeric binder component and wherein individual phases are separated by a diffuse interface, such that the stratified coating exhibits a gradient behavior wherein a given interface exhibits the attributes of the polymeric binder component that is rich at that interface, and wherein at least one phase is rich in a polymeric binder having a telechelic resin with reactive internal groups, reactive end groups, and an alkoxide oligomer, and at least one other phase is rich in a polymeric binder having a fluorinated polymer derived from fluorinated vinyl-based monomers.

Abstract: The present invention is to provide an epoxy resin composition uniformly containing a large amount of inorganic fillers, excellent in heat resistance and flame resistance, and having good impregnation into a base material, and a prepreg using the epoxy resin composition, having good tackiness, and being easy in handling. Furthermore, it is to provide a printed wiring board using a metal-clad laminate formed using the prepreg and/or the prepreg or the epoxy resin composition, capable of easily conducting an ENEPIG process, and a semiconductor device using the printed wiring board, excellent in performances. An epoxy resin composition comprises a solid epoxy resin, a silica nanoparticle having an average particle diameter of 1 nm or more and 100 nm or less, and a silica particle having an average particle diameter larger than that of the silica nanoparticle, in the range of 0.1 ?m or more and 5.0 ?m or less.

Abstract: A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the carrier foil (1), and several soldering surfaces (2) arranged on a bonding side (12) of the carrier foil (1) opposite the solder side. The soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) is inseparably connected to the carrier foil (1) on the solder side thereof.

Abstract: There are provided an antifogging article having a water absorbing layer which excels in antifogging property, in durability and appearance, a method for manufacturing the same, an article for transportation apparatus having the antifogging article, and a water absorbing layer forming composition. The antifogging article has a substrate and an antifogging film on a surface of the substrate, in which the antifogging film has a water absorbing layer constituted of a water absorbing material with a saturated water absorption amount of 50 mg/cm3 or more, the water absorbing material is containing a first cured epoxy resin obtained by reacting the composition containing a polyepoxide component, a polyaddition type curing agent, and a catalyst type curing agent, and the polyepoxide component is constituted only of at least two polyepoxides selected from aliphatic polyepoxides with molecular weights of 800 to 3000. The article for transportation apparatus has the antifogging article.

Abstract: An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material comprising at least one adhesive polymeric resin, and one of either; a) low aspect ratio metal-coated additives present in the range 0.2 wt. % to 30 wt. % of the adhesive material; or b) discrete high aspect ratio metal-coated additives present in the range 0.2 wt. % to 25 wt. % of the adhesive material.

Abstract: The disclosure relates to curable polyepoxysilane compounds and compositions, methods related to curing of such compounds via hydrolysis and/or condensation to form coatings on a substrate, and coated articles formed from the curable polyepoxysilane compounds. The polyepoxysilane compounds are silane-functional precursors and can be used as coatings (or pretreatments) on various substrates (e.g., metals such as aluminum) and provide a substantial improvement in corrosion resistance relative to other anti-corrosion coatings. The silane-functional precursors can be prepared by reaction of functional silanes (e.g., amino-functional silanes or other epoxide-reactive functionalized silanes) with epoxide-containing organic or hydrocarbon compounds and oligomers/polymers thereof (e.g., glycidyl-type ethers or other epoxide-/oxirane-functionalized hydrocarbon compounds), for example including hydrocarbons with one or more aromatic hydrocarbon groups (e.g., in an aromatic polyether).

Abstract: A composition for a resist underlayer film is provided. The composition has excellent storage stability and can form a resist underlayer film which has excellent adhesion to a resist film, can improve reproducibility of a resist pattern and is resistant to an alkaline liquid used in development and to oxygen ashing during the removal of a resist. The composition comprises a hydrolyzate and/or a condensate of a silane compound of the following formula (A), R1bR2cSi(OR3)4-a??(A) wherein R1 is a monovalent organic group having at least one unsaturated bond, R2 individually represents a hydrogen atom, a halogen atom or a monovalent organic group, R3 individually represents a monovalent organic group, R1 is a group other than OR3, a is an integer of 1 to 3, b is an integer of 1 to 3, and c is an integer of 0 to 2, provided that a=b+c.

Abstract: An object having a coating produced using an adhesion promoter, wherein the adhesion promoter comprises at least one, optionally oligomeric, addition product having no terminal C?C double bonds and having hydrolyzable silane groups.

Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a second type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a first type having a surface area to mass ratio of 0.05 to 0.15 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

Abstract: The present invention relates to composite coating systems and methods for the manufacture and reconstruction of condensate pans, floors or other internal structures of a heating ventilation and air conditioning (HVAC) or heating ventilation air conditioning and refrigeration (HVACR) unit. The composite coating system comprises a base epoxy coating and a top surface coating. The base epoxy coating is substantially free of volatile organic compounds (VOC's) and adheres to the condensate pans, floors or other internal structures of the HVAC or HVACR unit to fill pinholes and to provide corrosion and water resistance, and the top surface coating provides a barrier to high thermal exposure of the base coating.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

Abstract: A non-transparent paper is described for non-transparent art or graphic design sketches, which prevents seepage of the inks, it accepts any type of gel, water-based, solvent-based, oil-based or mixed inks and solid materials for sketching and drawing, as well as fixatives for the solid materials. This paper consists of a lamination of at least two sheets of uncoated bond paper, inserting at least one intermediate layer of pigmented opacifying emulsion between both sheets, applied between the layers of paper to prevent transparency and the seepage of inks from one face of the lamination to the other. This layer of emulsion contains at least one opacifying pigment, at least one adhesive, agents to control viscosity and surface tension and other components.

Abstract: An adhesive film, an adhesive composition, and a semiconductor device wherein, in the adhesive film, a difference between a storage modulus (A) of the adhesive film after 4 cycles and a storage modulus (B) of the adhesive film after 1 cycle is about 3×106 dyne/cm2 or less, the storage modulus (A) of the adhesive film after 4 cycles is about 7×106 dyne/cm2 or less, and the storage modulus (B) of the adhesive film after 1 cycle is about 2×106 dyne/cm2 or more, when curing at 125° C. for 1 hour and then at 150° C. for 10 minutes is defined as 1 cycle.

Abstract: This invention provides emulsions and adhesives comprising proteins that can be isolated from a variety of sources including renewable plant biomass, and methods of making and using such emulsions and adhesives.

Abstract: Disclosed herein is a build-up film structure including: a core layer containing a resin and an inorganic filler; a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer; and a second adhesive layer covering the other surface of the core layer and having a smaller content of the inorganic filler than that of the core layer.

Abstract: A method for coating a building panel (1, 1?), including applying a first coating fluid including an organic binder on a surface (11) of the building panel (1, 1?) to obtain at least one coating layer (13), and applying barrier components and photocatalytic particles, preferably TiO2, on said at least one coating layer (13). Also, such a building panel (1, 1?).

Abstract: An adhesive film for polarizing plates includes core-shell particles, each including a core and a shell surrounding the core. An adhesive composition for the adhesive film includes an epoxy compound, a (meth)acrylic compound, core-shell particles, each core-shell particle including a core and a shell surrounding the core, and a photo-initiator. A polarizing plate includes a polarizer, an optical film on one or both sides of the polarizer, and the adhesive film between the polarizer and the optical film. An optical display apparatus includes the polarizing plate.

Abstract: The invention is directed to adhesives derived from animal or plant proteins, particularly canola and spent hen proteins. The adhesives are prepared by extracting the proteins by pH shifting; and either treating the extracted proteins with urea or sodium dodecyl sulfate, or polymerizing the proteins to form a protein-polymer conjugate. The invention is also directed to a wood based product comprising pieces of wood based material joined or consolidated with the adhesives.

Abstract: An engineering or constructional member comprising at least two strips bonded with an adhesive; each of the strips comprises bamboo impregnated or treated with a polymer derived from one or more furfuryl alcohol resin precursors.

Abstract: The invention relates to a multi-layer polymer structure having a polyolefin-based layer, an acrylic-based or other polar polymer layer, and a tie-layer between and adjacent to the polyolefin and acrylic-based layers. Each layer could contain multiple sub-layers. The invention specifically relates to the composition of the tie-layer used to bond the polyolefin- and the polar polymer layers together. The multilayer structure can contain more than three layers, with polar polymer layers on each side of the polyolefin-based layer, and can be made by any method known to the art. The multilayer structure exhibits excellent structural integrity, excellent surface appearance, high impact strength, high scratch resistance, and excellent resistance to UV rays.