Abstract: A tin-coated aluminum material includes a base material including aluminum or aluminum alloy, and an anti-corrosion layer and an electrical contact layer formed on an outer layer of the base material, the electrical contact layer including tin or tin alloy. The anti-corrosion layer includes a metal selected from titanium, chromium and niobium or an alloy including the selected metal as a main component. The tin-coated aluminum material may further include a bonding layer including aluminum or aluminum alloy formed between the base material and the anti-corrosion layer. The tin-coated aluminum material may further include aluminum oxide formed at an interfacial region between the base material and the anti-corrosion layer or between the base material and the bonding layer. The aluminum oxide at the interfacial region has a peak value of not less than 0.18 and not more than 0.

Abstract: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.

Abstract: According to the present invention, in order to suppress whisker formation on a plated member having a plated layer comprising a lead-free material, the orientation index of the plane (321) in a plated layer for a plated member 3 having a plated layer 2 comprising a lead-free material on the surface of a base material 1 is 2.5 to 4.0. In another embodiment, the value (220)/(321) derived from the ratio of the orientation index of the plane (220) to that of the plane (321) for the plated layer is 0.5 to 1.5. An undercoat layer 4 having the orientation plane (220) may be formed between the base material 1 and the plated layer 2.

Abstract: A material composite has at least one region of copper or a copper alloy, at least one region of a predominantly graphitic material, and at least one boundary region between them. The boundary region has one or more carbides from the group of the IVb, Vb, VIb transition metals and one or more elements of the group consisting of Si, B, Al, Ge, Mn, Sn. In a preferred implementation of the invention, the composite is produced with a back-casting process.

Abstract: There is provided a tin-plated product which has a small deterioration of contact resistance with age, an excellent wear resistance and a low coefficient of friction. A coating of a composite material, which contains 0.1 to 1.0 wt % of carbon particles dispersed in a tin layer and which has a thickness of 0.5 to 10.0 ?m, preferably 1.0 to 5.0 ?m, is formed as the outermost layer of a substrate. Thus, the coefficient of dynamic friction between the tin-plated products of the same kind is 0.20 or less, and the coefficient of dynamic friction between the tin-plated product and a reflow tin-plated product is 0.20 or less, while the contact resistance is 1 m? or less.

Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

Abstract: A coated article, which contains (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a tin-containing layer, wherein the layer (ii) is positioned between the layer (i) and the layer (iii). The article is characterized in that the tin-containing layer (iii) contains at least one other metal.

Abstract: The invention provides an anode capable of inhibiting collapse of a shape of an anode active material layer and a side reaction with an electrolyte in accordance with the collapse, and inhibiting reduction in a battery capacity, and a battery using it. The anode comprises an anode current collector and the anode active material layer. The anode active material layer has a first layer containing Sn and a second layer containing an element other than Sn capable of electrochemically inserting and extracting Li. A component element of the anode current collector is preferably diffused in both the first layer and the second layer.

Abstract: An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board.

Abstract: Systems and methods for forming conductive traces on plastic substrates. In one embodiment, conductive traces are formed by forming a polyelectrolyte layer on a polymeric substrate and growing conductive traces on the polyelectrolyte layer using an electroless plating process.

Abstract: It is possible to prevent deterioration of a soldering portion and improve strength of thermal fatigue resistance by providing barrier metal layers on at least one of lead and land to cover parent materials comprising Cu-containing materials, feeding a soldering material between the lead and the land and allowing to contact in a fused condition with barrier metal layers and solidify, and thus soldering together the lead and the land.

Abstract: A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 per cent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0 % by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

Abstract: An electronic component according to the present invention includes a land 112 having a flat reference surface p1 and having a solder joint p3 to be solder bonded, wherein the solder joint p3 as a concave 113 recessed from the reference surface, and a nickel plate layer 114 is laminated on a surface of the land 112, and a position of an interface between (a) a tin-containing alloy layer 116 formed on the solder joint p3 of the nickel plate layer 114 in solder bonding the nickel plate layer 114 and (b) the nickel plate layer 114 deviates from a plane including the reference surface p1. This makes it possible to provide an electronic component including a solder joint which hardly cracks.

Abstract: A plated substrate comprises a plating layer disposed outwardly from a substrate. The substrate comprises a substrate material, where the substrate material comprises a metal. The plating layer comprises a plating material and blocking particles. The plating material comprises grains, and the blocking particles are disposed within interstices between the grains. The blocking particles are scattered substantially uniformly throughout at least a portion of the plating layer, and contribute to formation of boundaries.

Abstract: An electric contact, in particular an electric contact of a plug-in connector, has a metallic substrate to which a contact layer is applied. The contact layer is arranged as a structured layer.

Abstract: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Abstract: A plated automotive part and method of plating are provided. One or more semi-bright finish layers of nickel are plated onto an automotive part. One or more bright finish layers of nickel are plated onto the outermost, semi-bright finish layer of nickel. One or more layers of an alloy are plated onto the outermost, bright-finish layer of nickel. The alloy has a Vickers hardness of 400 VHN or greater.

Abstract: A resin sealed IC has a plurality of external terminals. A metal thin film made of a Sn—Bi alloy is formed in direct contact with the surface of a base member of each external terminal. A Bi content in the Sn—Bi alloy layer is within a range of 0.5 to 6.0 wt %. Further, the Sn—Bi alloy layer has a single-layer plating structure, and the film thickness is within a range of 10 to 25 MIC.

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.

Abstract: The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.

Abstract: The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5–2 to 0.1–5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.

Abstract: Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multi-layered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, CO2 laser device, or other energy source.

Abstract: An electrically conductive composite material for use in the manufacture of electrical contact components, consisting of a metal strip and a contact layer made of a silver or tin contact material, which contact layer is applied at least to one side of the metal strip, whereby the contact material contains as a first additive 0.5 to 60 weight percentage of carbon powder in the form of fine particles having a diameter of ø1=5 to 200 nm and 0.5 to 60 weight percentage of a second powdery additive in the form of fine particles having a diameter of ø2=5 to 200 nm. Moreover a device for the gas atomization of a jet of a flowable or liquid material and a method for the manufacture of an electrically conductive composite material and its use are disclosed.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains at least indium and at least one material containing at least a component capable of reducing the melting point of indium and is provided between the first and second members to provide a laminate. The laminate is heated at a temperature in a solid-liquid coexisting range of an alloy comprising indium and the indium melting point reducing component to join the first and second members.

Abstract: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Abstract: A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a, 21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.

Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: Electrical connectors incorporate a composite coating of molybdenum disulfide and a metal, preferably tin, for one or both of the contact surfaces of the electrical connector. The coating provides for a low coefficient of friction, low contact resistance, and good electrical conductivity, as well as good mechanical properties. The coating also reduces the insertion force of the electrical connectors, thereby increasing the number of possible terminal pairs and/or reducing terminal bending and breakage for a manually mated connector. The coating can be deposited on copper, tin-plated copper, tin alloy-plated copper or other metallic substrates, using any of several physical vapor deposition methods.

Abstract: The present invention is directed to a coated substrate, comprising: an antitarnish layer deposited on a substrate in an amount effective to prevent tarnishing of said coated substrate; and an outer layer deposited onto said antitarnish layer, said outer layer comprising tin or tin alloys having at least 50% by weight tin. The present invention is also directed to coated substrates having a concentration gradient of antitarnish agent diffused into the coating, as well as methods of forming such coated substrates.

Abstract: A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Abstract: Ceramic-containing bodies can be bonded to other ceramic-containing bodies, or to metals or metal-containing bodies, by way of an aluminum-silicon brazing alloy. Such alloys feature high thermal conductivity and a melting range intermediate to Cu—Sil and Au—Si. By depositing a layer of silicon or aluminum, e.g., by vapor deposition, onto a surface of the ceramic-containing body, the formation of deleterious intermetallic phases at the brazing interface is avoided. This technique is particularly useful for joining reaction-bonded silicon carbide (RBSC) composite bodies, and particularly such composite bodies that contain appreciable amounts of aluminum as a metallurgical modification of the residual silicon phase. When the RBSC body contains minor amounts of the aluminum alloying constituent, or none, the metallization layer is not required. The resulting bonded structures have utility as mirrors, as packaging for electronics, and in semiconductor lithography equipment, e.g.

Abstract: A process is provided for coating metallic workpieces with a bearing material, wherein the workpiece first receives a hard chromium plating having a pearl or columnar structure type surface. A predominantly silver layer is then galvanically deposited, which fills in and smooths the pearl or columnar structure type surface of the hard chromium plating. Optionally, additional hard chromium platings and predominantly silver-containing layers may be applied, preferably galvanically. The predominantly silver layer may advantageously contain a graphite component.

Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract: An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

Abstract: The invention is a formable, bright metallized laminate that has superior optical and deformation properties. The metallized laminate is made from a plurality of discontinuous metal island layers deposited on a formable clear coat film. The invention is also a method that includes depositing a first discontinuous layer of metal islands upon a formable clear coat film and then depositing a second discontinuous layer of metal islands onto the first discontinuous layer of metal islands.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A phase-change optical recording medium capable of implementing record and readout operations of information data through reversible phase transition between amorphous and crystalline states induced by light beam irradiation in a recording layer included in the recording medium, including at least a transparent substrate and contiguous layers formed on the substrate in order as follows, a lower dielectric protective layer, the recording layer, an upper dielectric protective layer, and a reflective/heat dissipating layer, in which the upper dielectric protective layer essentially consists of a mixture of ZrO2 and SiO2, having a composition of (ZrO2)100-x (SiO2)x, where 0<x<60 (mole %).

Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Abstract: The present invention provides a surface treated steel sheet for electronic components which does not include lead, which is a hazardous substance with environmental impact, and, in particular, satisfies the solder wettability after retort treatment, a rust-proof property and a whisker-proof property simultaneously. More specifically, the present invention is a surface treated steel sheet with less environmental impact for electronic components excellent in solder wettability, a rust-proof property and a whisker-proof property and having an Sn—Zn alloy layer which is formed by plating Sn and Zn on a steel sheet or a Ni plated steel sheet and then applying thermal diffusion treatment, or by plating Sn—Zn alloy on a steel sheet or a Ni plated steel sheet, characterized in that the amount of said Sn—Zn alloy layer is not less than 3 g/m2, the Zn/Sn ratio (in weight ratio) is 0.01 to 10, more preferably 0.01 to 0.

Abstract: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin or tin and zinc metal alloy.

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

Abstract: An electrodeposition process for producing a layered composite material and the layered composite material produced by the process. The layered composite material includes at least one layer of a first alloy species of an alloy and at least one layer of a second alloy species of the alloy. The first alloy species and the second alloy species have distinguishable properties. The process includes the steps of first energizing an electroplating circuit to provide a first electroplating current to deposit a layer of the first alloy species and second energizing the electroplating circuit to provide a second electroplating current to deposit a layer of the second alloy species. The alloy is preferably a gold-tin alloy, the first alloy species is preferably the Au5Sn alloy phase and the second alloy species is preferably the AuSn alloy phase.

Abstract: A corrosion-resistant coated brass metal coated with a corrosion resistant alloy. The corrosion resistant alloy is a tin metal alloy or a tin and zinc metal alloy. The corrosion resistant metal alloy may also include one or more metal additives to improve the coating process and/or to alter the properties of the tin and zinc metal alloy.