Diverse Refractory Group Metal-base Components: Alternative To Or Next To Each Other Patents (Class 428/661)
  • Patent number: 10133055
    Abstract: The present invention relates to an optical element for use in a camera system for the inspection of passageways, a camera system for the inspection of passageways and a method of illuminating a passageway during inspection with a camera. An optical element for use in a camera system for the inspection of passageways comprises a first optical portion arranged to transmit light into a camera, a second optical portion arranged to transmit light emitted from a light source, the second optical portion located adjacent the first optical portion, and barrier means arranged to prevent light being transmitted from the second optical portion into the first optical portion.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: November 20, 2018
    Assignee: E.V. OFFSHORE LIMITED
    Inventors: Jonathan Thursby, Shaun Peck, Matthew Gibson-Ford
  • Patent number: 9527777
    Abstract: An apparatus includes a ceramic matrix composite (CMC) component and an interface coating on the CMC component, wherein the interface coating includes a layer of at least one of the following compositions: 100 wt % Ir; 90-95 wt % Ir, 5-10 wt % Co, 1-2 wt % Al, 1-2 wt % Si; 40-50 wt % Nb, 28-42 wt % Al, 4-15 wt % Cr, 1-2 wt % Si; 90-92 wt % Mo, 4-5 wt % Si, 4-5 wt % B; or 60-80 wt % V, 20-30 wt % Cr, 2-15 wt % Ti.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: December 27, 2016
    Assignee: ROLLS-ROYCE CORPORATION
    Inventors: Adam Lee Chamberlain, Kang N. Lee, Andrew Joseph Lazur
  • Patent number: 9194039
    Abstract: Depositing pure aluminum and aluminum alloy coatings onto substrates using directed vapor deposition (DVD) method is presented herein. The aluminum alloys have decreased environmental impact both due to their composition and due to the use of DVD process with no hazardous precursors or waste. Corrosion resistance of DVD deposited aluminum and aluminum alloys is effective for protection of steel substrates. The invention includes the use of the DVD technique to apply aluminum and/or aluminum alloy coatings effective for corrosion protection; the use of plasma-activated DVD to enhance the density of aluminum and aluminum alloy coatings deposited at low substrate temperatures; the use of multi-source evaporation to control composition of aluminum alloys during DVD deposition; the application of aluminum and/or aluminum alloy coatings onto NLOS substrates can be used for corrosion protection.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: November 24, 2015
    Assignee: Directed Vapor Technologies International
    Inventors: Derek D. Hass, Susie Eustis
  • Patent number: 8795845
    Abstract: Methods for the low-temperature synthesis of an integrated, corrosion-resistant coating structure for metal substrates by means of multi-component pack cementation are provided. The synthesis of the integrated coating structures at low temperatures can avoid or minimize degradation of the mechanical properties of the substrates. The integrated coating structures can increase the lifetime of high temperature steels under severe steam environments and, therefore, provide a technological enabler for the high-temperature operation of steam power generation plants.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: August 5, 2014
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: John Harry Perepezko, Ridwan Sakidja
  • Publication number: 20140044990
    Abstract: A decorative article comprises a substrate being primarily composed of at least any of Ti and stainless steel in at least part of a surface vicinity thereof; a first coat being formed on the substrate and being primarily composed of TiCN; a second coat being formed on a side of the first coat opposite a side facing the substrate and being composed of stainless steel; wherein a combined C content ratio and N content ratio in the first coat is equal to or more than 2.0 wt % and less than or equal to 19 wt %.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 13, 2014
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yuzuru TSUKAMOTO, Atsushi KAWAKAMI
  • Publication number: 20140004379
    Abstract: In order to obtain a ferroelectric thin film having good crystallinity and realizing high piezoelectric properties, and a production method therefor, provided is a ferroelectric thin film constituting a dielectric material having a perovskite structure that comprises Zr and Ti formed on a substrate, wherein a layer having a Zr ratio that is smaller than a predetermined ratio and having good crystallinity and a layer that realizes good piezoelectric properties and has a Zr ratio that is about as great as the predetermined ratio are combined. A production method is also provided.
    Type: Application
    Filed: February 8, 2012
    Publication date: January 2, 2014
    Inventor: Hideyuki Eguchi
  • Publication number: 20130302639
    Abstract: A zirconium alloy for use in nuclear fuel assemblies is provided, which provides increased resistance against oxidation and corrosion and also improved bonding with parent material, because pure metallic material such as silicon (Si) or chromium (Cr) is evenly coated on the surface of the parent material by plasma spraying. Because the plasma spray coating used to coat the pure metallic material on the zirconium alloy does not require vacuum equipment and also is not limited due to the shape of the coated product, this is particularly useful when evenly treating the surface of the component such as 4 m-long tube or spacer grip arrangement which is very complicated in shape. Furthermore, because the coated zirconium alloy confers excellent resistance to oxidation and corrosion under emergency such as accident as well as normal service condition, both the economic and safety aspects of nuclear fuel are improved.
    Type: Application
    Filed: November 7, 2012
    Publication date: November 14, 2013
    Applicants: KOREA HYDRO AND NUCLEAR POWER CO., LTD., KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Korea Atomic Energy Research Institute, Korea Hydro and Nuclear Power Co., Ltd.
  • Publication number: 20130260166
    Abstract: In one aspect, composite articles are described herein comprising a lightweight, high strength metal substrate and an abrasion resistant coating adhered to the substrate. In some embodiments, a composite article described herein comprises a titanium or titanium alloy substrate and a coating adhered to the substrate, the coating comprising particles disposed in a metal or alloy matrix.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 3, 2013
    Applicant: Kennametal Inc.
    Inventors: Paul Dehnhardt Prichard, Joel Thomas Dawson, Mark Rowe
  • Patent number: 8535441
    Abstract: A lid for a crystal growth chamber crucible is constructed by forming arcuate sector-shaped portions and coupling them in abutting relationship, for example by welding, to form an annular profile fabricated lid. The arcuate sector-shaped portions may be formed and removed from a lid fabrication blank with less waste than when unitary annular lids are formed and removed from a similarly sized fabrication blank. For example, the sector-shaped portions may be arrayed in an undulating pattern on the fabrication sheet.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: September 17, 2013
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Mark S. Andreaco, Troy Marlar, Brant Quinton
  • Patent number: 8383248
    Abstract: A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of titanium dioxide layers and a plurality of copper-zinc alloy layers formed on the combining layer. The combining layer is a titanium layer. Each titanium dioxide layer interleaves with one copper-zinc alloy layer. A method for making the coated article is also described.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: February 26, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZehen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Cong Li
  • Publication number: 20130022837
    Abstract: A film is coated on a substrate made of stainless steel, and includes a first buffer layer, a second buffer layer, and a third buffer layer which are positioned on the substrate from a near end to a far end. The first buffer layer is made of Cr. The second buffer layer is made of Ti and Cr. The color layer is made of Ti and Cr.
    Type: Application
    Filed: September 27, 2011
    Publication date: January 24, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHUNG-PEI WANG
  • Patent number: 8354158
    Abstract: A microfibrous article includes a substrate and a plurality of magnetic fibers disposed on the substrate. Each of the plurality of magnetic fibers is individually sheathed with a polymer and includes a plurality of magnetic particles. Further, each of the plurality of magnetic fibers is aligned along a magnetic field and not connected by the polymer to any adjacent magnetic fiber. A method of forming the microfibrous article is also disclosed.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: January 15, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: Tao Xie, Hamid G. Kia, Man Zhang, John C. Ulicny
  • Patent number: 8329314
    Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: December 11, 2012
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Tom Xiaohai, Michael S Colvin
  • Publication number: 20120280217
    Abstract: There are provided an electrode foil which has both the functions of a supporting base material and a reflective electrode and also has a superior thermal conductivity and heat resistance; and an organic device using the same. The electrode foil comprises a metal foil; a diffusion prevention layer for preventing diffusion of metal derived from the metal foil, the diffusion prevention layer being provided directly on the metal foil; and a reflective layer provided directly on the diffusion prevention layer.
    Type: Application
    Filed: September 8, 2011
    Publication date: November 8, 2012
    Applicant: MITSUI MINING &SMELTING CO. LTD
    Inventors: Yoshinori Matsuura, Nozomu Kitajima
  • Publication number: 20120270067
    Abstract: Gold can be attached to titanium or niobium using a laser having a wavelength that is reflected by gold but absorbed by titanium or niobium. The exemplified laser wavelengths are 1064 nm or 1080 nm.
    Type: Application
    Filed: April 25, 2011
    Publication date: October 25, 2012
    Inventors: Steven K. Boyd, Per A. Klype
  • Publication number: 20120141821
    Abstract: A bathroom appliance is provided having a substrate made of metal or plastic and a coating, it is provided to consecutively electroplate metal layers made of copper, an alloy of copper and tin, and chromium and to subsequently apply a cover layer which is made of at least one of the elements of chromium, titanium, zirconium, gold, silver or platinum or is made of a chemical combination of the elements of titanium or chromium and nitrogen and, optionally, carbon, the cover layer being produced on the electroplated chromium layer by means of a PVD method.
    Type: Application
    Filed: November 28, 2011
    Publication date: June 7, 2012
    Inventors: Axel ROST, Rene Musielik, Ingrid Ueckert
  • Patent number: 8133594
    Abstract: Steel sheet for container use able to realize superior corrosion resistance and canmaking ability, wherein at least one side of the steel sheet is provided with a chemical conversion coating film including a mixture of a zirconium oxide compound and a zirconium phosphate compound, the zirconium oxide compound is segregated at part or all of a region of 40 to 100% from the surface with respect to the total thickness of the chemical conversion coating film, and the zirconium phosphate compound is segregated at part or all of a region of 0 to 40% from the surface with respect to the total thickness of the chemical conversion coating film.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: March 13, 2012
    Assignee: Nippon Steel Corporation
    Inventors: Akira Tachiki, Shigeru Hirano, Hiroshi Nishida, Hirokazu Yokoya, Hironobu Miyazaki, Masakazu Noda
  • Patent number: 8129036
    Abstract: A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: March 6, 2012
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: Durwood M. Beringer, Kenneth J. Zacharias, Jesse J. Stieber, Edmund P. Taddey, Stephen A. Yaworski, Gregory K. Schwalm
  • Publication number: 20110234091
    Abstract: The present invention provides a non-evaporable getter for an FED which can remove a plurality of types of gases. The non-evaporable getter for the FED has a first layer containing titanium, and a second layer containing crystalline zirconium layered on the first layer. The average value of crystalline grain sizes of the crystalline zirconium is 3 nm or more but 20 nm or less.
    Type: Application
    Filed: March 14, 2011
    Publication date: September 29, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Tadayuki Yoshitake, Takuto Moriguchi, Yoichi Ando
  • Patent number: 8025983
    Abstract: A joining method between Fe-based steel and Ti/Ti-based alloys having a joint strength higher than those of base metals by using interlayers. The production of intermetallic compounds at a joint portion between Fe-based steel and Ti/Ti-based alloys can be prevented using interlayers, and strong interface diffusion bonding can be formed at interfaces between interlayers, thereby producing a high-strength joint. Accordingly, the present disclosure can be used to develop high-strength, high-functional advanced composite materials.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: September 27, 2011
    Inventors: Min Ku Lee, Jung Gu Lee, Jin-Ju Park, Chang-Kyu Rhee
  • Patent number: 7998594
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: August 16, 2011
    Assignee: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Patent number: 7985488
    Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: July 26, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yuuji Suzuki, Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami
  • Patent number: 7923127
    Abstract: A process for producing sheets of ?-TiAl includes the steps of forming a melt of a ?-TiAl alloy; casting the ?-TiAl alloy to form an as-cast ?-TiAl alloy; encapsulating the as-cast ?-TiAl alloy to form an as-cast ?-TiAl alloy preform; and rolling the as-cast ?-TiAl alloy preform to form a sheet comprising ?-TiAl.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: April 12, 2011
    Assignee: United Technologies Corporation
    Inventor: Gopal Das
  • Patent number: 7892655
    Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: February 22, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yuuji Suzuki, Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami
  • Patent number: 7892653
    Abstract: A titanium alloy composite material including dispersed carbon fibers coated with a layer containing an element which forms a carbide in reaction with carbon, and the carbide formed thereby, in crystal grains of the titanium alloy. The element which forms a carbide in reaction with carbon is preferably at least one of silicon (Si), chromium (Cr), titanium (Ti), vanadium (V), tantalum (Ta), molybdenum (Mo), zirconium (Zr), boron (B), and calcium (Ca). The carbon fibers are preferably carbon nanotubes, vapor-grown carbon fibers, or a mixture thereof. The titanium alloy composite material has excellent mechanical strength, such as tensile strength, Young's modulus, toughness, and hardness.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: February 22, 2011
    Assignees: E & F Corporation, Nagano Prefecture
    Inventors: Toshio Tanimoto, Hidekazu Takizawa
  • Patent number: 7771838
    Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part; and a titanium palladium (Ti—Pd) interface layer for bonding said ceramic part to the metal part. In one embodiment, the interface layer may be formed from a single titanium layer in contact with a single palladium layer, or in other embodiments, may be at least a three layer laminate (Pd—Ti—Pd). A microstimulator housing comprising a ceramic part, a titanium or titanium alloy part sandwiching the Ti—Pd interlayer may be employed to create a eutectic bond that is strong and hermetic.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: August 10, 2010
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Tom Xiaohai He, Michael S. Colvin
  • Patent number: 7771841
    Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: August 10, 2010
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yuuji Suzuki, Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami
  • Publication number: 20100119866
    Abstract: Methods for the low-temperature synthesis of an integrated, corrosion-resistant coating structure for metal substrates by means of multi-component pack cementation are provided. The synthesis of the integrated coating structures at low temperatures can avoid or minimize degradation of the mechanical properties of the substrates. The integrated coating structures can increase the lifetime of high temperature steels under severe steam environments and, therefore, provide a technological enabler for the high-temperature operation of steam power generation plants.
    Type: Application
    Filed: November 10, 2008
    Publication date: May 13, 2010
    Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION
    Inventors: John Harry Perepezko, Ridwan Sakidja
  • Patent number: 7695823
    Abstract: A reinforced powder metal component is disclosed, the powder metal component having reinforcing preforms disposed in selected locations to provide a local reinforcement for the powder metal component.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: April 13, 2010
    Assignee: GM Global Technology Operations, Inc.
    Inventor: Shekhar G. Wakade
  • Patent number: 7691442
    Abstract: Embodiments of the invention provide a method for depositing materials on substrates. In one embodiment, the method includes depositing a barrier layer containing tantalum or titanium on a substrate, depositing a ruthenium layer or a cobalt layer on the barrier layer, and depositing a tungsten bulk layer thereover. In some examples, the barrier layer may contain tantalum nitride deposited by an atomic layer deposition (ALD) process, the tungsten bulk layer may be deposited by a chemical vapor deposition (CVD) process, and the ruthenium or cobalt layer may be deposited by an ALD process. The ruthenium or cobalt layer may be exposed to a soak compound, such as hydrogen, diborane, silane, or disilane, during a soak process prior to depositing the tungsten bulk layer. In some examples, a tungsten nucleation layer may be deposited on the ruthenium or cobalt layer, such as by ALD, prior to depositing the tungsten bulk layer.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: April 6, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Avgerinos V. Gelatos, Mei Chang, Kavita Shah, Seshadri Ganguli
  • Patent number: 7666522
    Abstract: A method is provided for depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The wear resistant surface of the medical implant device may be formed by a Laser Based Metal Deposition (LBMD) method such as Laser Engineered Net Shaping (LENS). The wear resistant surface may include a blend of multiple different biocompatible materials. Further, functionally graded layers of biocompatible materials may be used to form the wear resistant surface. Usage of a porous material for the base may promote bone ingrowth to allow the implant to fuse strongly with the bone of a host patient. The hard wear resistant surface provides device longevity, particularly when applied to bearing surfaces such as artificial joint bearing surfaces or a dental implant bearing surfaces.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: February 23, 2010
    Assignee: IMDS, Inc.
    Inventors: Daniel F. Justin, Brent E. Stucker, T. Wade Fallin, Durga Janaki Ram Gabbita
  • Patent number: 7632575
    Abstract: A method of depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The medical implant device formed by a Laser Based Metal Deposition (LBMD) method. The porous material of the base promotes bone ingrowth allowing the implant to fuse strongly with the bone of a host patient. The hard wear resistant surface provides device longevity when applied to bearing surfaces such as artificial joint bearing surface or a dental implant bearing surface.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: December 15, 2009
    Assignee: IMDS, Inc.
    Inventors: Daniel F. Justin, Brent E. Stucker
  • Publication number: 20090123778
    Abstract: A friction stir method comprises causing a rotating probe (1) of a friction stir tool to enter a workpiece or a joint between a pair of workpieces (89), the or each workpiece being a low conductivity, high melting point metal or metal alloy. The probe (1) extends from a shoulder (4), or between shoulders, in contact with the workpiece(s) and rotates relative to the or each shoulder.
    Type: Application
    Filed: May 15, 2007
    Publication date: May 14, 2009
    Applicant: THE WELDING INSTITUTE
    Inventors: Michael Jonathan Russell, Nathan Leonard Horrex, Adrian Charles Addison
  • Publication number: 20080226936
    Abstract: A method for producing an outer layer for a roll having a structure having MC carbide dispersed at an area ratio of 20-60%, comprising the steps of (1) centrifugally casting a melt having a composition comprising, by mass, 2.2-6.0% of C, 0.1-3.5% of Si, 0.1-3.5% of Mn, and 8-22% of V, the balance being Fe and inevitable impurity elements, to produce a cylindrical body comprising an inner layer having concentration MC carbide, an MC-carbide-poor outer layer, and a concentration gradient layer between the inner layer and the outer layer, in which the area ratio of MC carbide changes, and (2) cutting the cylindrical body to a depth at which the area ratio of MC carbide is 20% or more.
    Type: Application
    Filed: September 13, 2002
    Publication date: September 18, 2008
    Applicant: Hitachi Metals, Ltd.
    Inventors: Kiyoshi Furushima, Shunji Matsumoto, Ryota Honda, Kiyoshi Hayashi, Takashi Honda, Masatsugu Uchida
  • Patent number: 7338717
    Abstract: A method 10 and a laminated tool 31 which is created by the method 10 and which is formed by the selective coupling or attachment of sectional members, such as members 14, 16. The formed tool 31 includes a finished surface 36 which is formed by the selective deposition of material 30 onto surface 22.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: March 4, 2008
    Assignee: FloodCooling Technologies, LLC
    Inventors: Mark Manuel, Thomas N. Greaves
  • Patent number: 7247396
    Abstract: A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a magnetically soft underlayer: (1) a first crystalline layer of a material having a first lattice parameter and a strong preferred growth orientation; (2) a second crystalline layer of a material having a second lattice parameter and the same strong preferred growth orientation as the first crystalline layer; and (3) a third crystalline layer of an hcp material, having a [0002] lattice parameter similar to or different from that of the second lattice parameter of the second crystalline layer and a strong <0002> preferred growth orientation, wherein: the second crystalline layer has a lower interfacial energy with the first crystalline layer and a higher interfacial energy with the third crystalline layer, owing to a lower surface energy of th
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: July 24, 2007
    Assignee: Seagate Technology LLC
    Inventors: Thomas Patrick Nolan, Erol Girt, Chunghee Chang, Qixu Chen, Li-Lien Lee
  • Patent number: 7241515
    Abstract: An electrode layer for thin-film magnetic heads includes a Ta base sub-layer, an Au sub-layer functioning as a main conductive sub-layer, and a protective sub-layer, those sub-layers being disposed in that order. An Au electrode seed sub-layer containing any one of NiFeCr, NiCr, and NiFe is placed between the Ta base sub-layer and the Au sub-layer. The Au electrode seed sub-layer has a thickness of 40 to 100 ?.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: July 10, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventors: Masahiro Oshima, Naoya Hasegawa
  • Patent number: 7201973
    Abstract: A heat exchanger of the plate-fin type has fins of one metal brazed to a plate made of a different metal for use in oil coolers, condensers, evaporators, and the like. The distortion-prone titanium fins of conventional heat exchangers may be replaced with another metal, such as a stainless steel or a nickel based alloy to provide a structure that is resistant to crushing at the brazing temperature. Fluid or air flow resistance (pressure drop) through the heat exchanger may also be improved if the selected fin metal forms better fin shapes and has fewer burrs than conventional titanium fins. The replacement material may also improve the heat transfer performance of the heat exchanger if the selected fin metal has higher thermal conductivity than titanium.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: April 10, 2007
    Assignee: Honeywell International, Inc.
    Inventors: Matthew J. Pohlman, Salvador L. Hernandez, Nikolay Lewucky, Edward S. Tai
  • Patent number: 7157150
    Abstract: A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The compact filler material is made of particles, preferably spheres, of discrete layers of nickel and titanium metal that react with each other and with the stainless and titanium parts to form a strong assembly when thermally processed. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: January 2, 2007
    Assignee: Alfred E. Mann Foundation for Scientific Research
    Inventors: Guangqiang Jiang, Attila Antalfy, Gary D. Schnittgrund
  • Patent number: 7129194
    Abstract: An improved catalyst system that includes a metal support structure and an anti-corrosive layer on the metal support structure, and has improved resistance to corrosion and other degradation under corrosive environments. Typically, a catalyst supporting layer is applied over the anti-corrosive layer.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: October 31, 2006
    Assignee: Corning Incorporated
    Inventors: Adra S. Baca, Lin He, Youchun Shi, Charles M. Sorensen, Jr.
  • Patent number: 7022415
    Abstract: The invention is a method of bonding a ceramic part (6) to a metal part (4) by heating a component assembly (2) comprised of the metal part (4), the ceramic part (6), and a thin laminated interlayer material (8) placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed within the laminated interlayer material (8) or between the metal part (4) and the laminated interlayer material (8), but that is less than the melting point of the ceramic part (6) or of the metal part (4). The component assembly (2) is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a strong bond between the ceramic part (6) and the metal part (4). The compact interlayer material (8?) may be further comprised of two or more sets of metal alloy spheres (16, 16?) each having distinct compositions.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: April 4, 2006
    Assignee: Alfred E. Mann Foundation for Scientific Research
    Inventor: Gary D. Schnittgrund
  • Patent number: 7001672
    Abstract: A method of depositing a hard wear resistant surface onto a porous or non-porous base material of a medical implant. The medical implant device formed by a Laser Based Metal Deposition (LBMD) method. The porous material of the base promotes bone ingrowth allowing the implant to fuse strongly with the bone of a host patient. The hard wear resistant surface provides device longevity when applied to bearing surfaces such as artificial joint bearing surface or a dental implant bearing surface.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: February 21, 2006
    Assignee: Medicine Lodge, Inc.
    Inventors: Daniel F. Justin, Brent E. Stucker
  • Patent number: 6989200
    Abstract: The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a compatible interlayer material such as titanium-nickel alloy placed between the two parts and heated at a temperature that is greater than the eutectic temperature of the interlayer material, where alloys, intermetallics or solid solution formed between the metal part and the metal interlayer material, but that is less than the melting point of either the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove unwanted materials, to assure a biocompatible component assembly for implantation in living tissue.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: January 24, 2006
    Assignee: Alfred E. Mann Foundation for Scientific Research
    Inventors: Charles L. Byers, Guangqiang Jiang, Gary D. Schnittgrund
  • Patent number: 6896974
    Abstract: A magnetic field sensor has a pair of magnetic shields serving as a negative electrode and a positive electrode, respectively, a magnetoresistive element arranged between the pair of magnetic shields, a nonmagnetic conductive layer for the negative electrode arranged between the magnetic shield for the negative electrode and the magnetoresistive element and including a first metal layer formed in contact with the magnetoresistive element and a second metal layer formed in contact with the first metal layer, and a nonmagnetic conductive layer for the positive electrode arranged between the magnetic shield for the positive electrode and the magnetoresistive element and formed of a first metal layer, the first metal layer containing at least one metal selected from the group consisting of Ta, Ti, Cr, V, Mo and W.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: May 24, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazuhiro Saito
  • Patent number: 6896976
    Abstract: A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: May 24, 2005
    Assignee: International Rectifier Corporation
    Inventor: Chuan Cheah
  • Patent number: 6838188
    Abstract: A magnetic recording medium such as a magnetic disk includes a NiP or ceramic glass substrate on which a seedlayer is sputtered in a low pressure inert gas atmosphere, the seedlayer comprising a ternary or quaternary alloy formed from a B2 lattice type alloy such as NiAl, CoTi, CoAl, NiTi, FeTi, CoFe, CoHf, CuZn, CoZr, and MnAl. For quaternary alloys in which elements X and Y are added to the B2 type alloy, X can be chosen from one or more elements selected from the group consisting of Co, Ni, Fe, Cu, V, Mn, and Zn, and Y can be chosen from one or more elements selected from the group consisting of Al, Nb, Ta, Hf, Zr, Zn, Ag, Au, Pt and Pd. The resulting seedlayer preferably has an A2 lattice structure.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: January 4, 2005
    Assignee: Maxtor Corporation
    Inventor: Bunsen Y. Wong
  • Publication number: 20040253476
    Abstract: Getter multilayer structures are disclosed, embodiments of which include at least a layer of a non-evaporable getter alloy having a low activation temperature over a layer of a different non-evaporable getter material having high specific surface area, both preferably obtained by cathodic deposition. The multilayer NEG structures exhibit better gas sorbing characteristics and lower activation temperature lower than those of deposits made up of a single material. A process for manufacturing such structures includes depositing a first, high surface area NEG film on a support, and then depositing a thin over layer of low activation NEG film.
    Type: Application
    Filed: June 10, 2004
    Publication date: December 16, 2004
    Inventors: Andrea Conte, Marco Moraja
  • Patent number: 6830827
    Abstract: Disclosed is an alloy coating which can be advantageously applied to members for high temperature apparatuses so as to prolong the service life of the members. The alloy coating comprises an alloy. This alloy comprises: at least one member, as a base, selected from the group consisting of Re, Ir, Nb, Ta, Mo, and W; and at least one alloying element for imparting corrosion resistance. A method for forming the alloy coating, and a member for high temperature apparatuses, to which the alloy coating has been applied, are also disclosed.
    Type: Grant
    Filed: March 6, 2001
    Date of Patent: December 14, 2004
    Assignees: Ebara Corporation
    Inventors: Toshio Narita, Shigenari Hayashi, Hiroshi Yakuwa, Manabu Noguchi, Matsuho Miyasaka
  • Publication number: 20040202888
    Abstract: A self-healing tribological surface comprises a shape memory material. The self-healing tribological surface can be used for recovering a scratches and/or indentations in the surface. Processes for recovering scratches or indentations generally comprises forming a shape memory material onto the surface; scratching or indenting the surface; and heating an area about the scratch or indentation, wherein a depth of the scratch or the indentation decreases after heating as compared to the depth prior to heating.
    Type: Application
    Filed: April 8, 2003
    Publication date: October 14, 2004
    Inventors: Yang-Tse Cheng, Wangyang Ni, Michael J. Lukitsch, Anita M. Weiner, David S. Grummon
  • Patent number: 6783867
    Abstract: A highly reliable member for a semiconductor device, in which a high melting point metallizing layer, which consists mainly of a high melting point metal such as W and/or Mo, and an intervening metal layer, which has a melting point of not greater than 1,000° C. and consists mainly of at least one selected from among Ni, Cu and Fe, are provided on an AlN substrate material in this order on the AlN substrate material, and a conductor layer consisting mainly of copper is directly bonded to the intervening metal layer without intervention of a solder material layer. A semiconductor element or the like is mounted on the member for a semiconductor device, thereby fabricating a semiconductor device. The high melting point metallizing layer is formed on an aluminum nitride substrate by post-fire or co-fire metallization.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: August 31, 2004
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kazutaka Sasaki, Hirohiko Nakata, Akira Sasame, Mitsunori Kobayashi