W-base Component Patents (Class 428/665)
  • Patent number: 8993121
    Abstract: There is provided a metal laminated structure in which a first metal layer containing tungsten is provided on a first surface of a second metal layer containing copper and a third metal layer containing tungsten is provided on a second surface of the second metal layer opposite to the first surface, and the first metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the first surface of the second metal layer and the third metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the second surface of the second metal layer, and a method for producing the metal laminated structure.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: March 31, 2015
    Assignees: Sumitomo Electric Industries, Ltd., A.L.M.T. Corp.
    Inventors: Koji Nitta, Shinji Inazawa, Akihisa Hosoe, Masatoshi Majima, Osamu Suwata, Hiroshi Yokoyama, Shinichi Yamagata, Yugaku Abe
  • Publication number: 20140315392
    Abstract: A cold spray barrier coated component of a semiconductor plasma processing chamber comprises a substrate having at least one metal surface wherein a portion of the metal surface is configured to form an electrical contact. A cold spray barrier coating is formed from a thermally and electrically conductive material on at least the metal surface configured to form the electrical contact of the substrate. Further, the cold spray barrier coating may also be located on a plasma exposed and/or process gas exposed surface of the component.
    Type: Application
    Filed: April 22, 2013
    Publication date: October 23, 2014
    Applicant: Lam Research Corporation
    Inventors: Lin Xu, Hong Shih, Anthony Amadio, Rajinder Dhindsa, John Michael Kerns, John Daugherty
  • Patent number: 8753755
    Abstract: A body, such as a pick tool for cutting coal, includes a steel substrate and a hard face structure fused to the steel substrate. The hard face structure includes at least 1 weight percent Si, at least 5 weight percent Cr and at least 40 weight percent W. Substantially the balance of the hard face structure includes carbon and an iron group metal M selected from Fe, Co, Ni and alloy combinations of these elements. The hard face structure includes a plurality of elongate or platelike micro-structures having a mean length of at least 1 micron, a plurality of nano-particles having a mean size of less than 200 nanometers, and a binder material.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: June 17, 2014
    Assignee: Element Six GmbH
    Inventors: Igor Yuri Konyashin, Bernd Heinrich Ries, Frank Friedrich Lachmann, Kersten Heinrich Schafer
  • Publication number: 20140141277
    Abstract: The present invention relates generally to jewelry articles comprising a substrate and a metallic, external coating.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: Frederick Goldman, Inc.
    Inventor: Andrew Derrig
  • Publication number: 20140141278
    Abstract: The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: Frederick Goldman, Inc.
    Inventor: Andrew Derrig
  • Patent number: 8652649
    Abstract: Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: February 18, 2014
    Assignee: Xtalic Corporation
    Inventors: John Cahalen, Alan C. Lund, Christopher A. Schuh
  • Publication number: 20140017509
    Abstract: Provided in the present invention is a bonded tungsten carbide-based super hard alloy assembly equipped with a first metal member having a first bonding surface and comprised of a steel material containing a martensite structure and a second metal member having a second bonding surface directly bonded to the first bonding surface of the first metal member and comprised of a tungsten carbide-based super hard alloy. The martensite structure-containing steel material which constitutes the first metal member is a stainless steel having an average carbon concentration of from 0.10 to 0.40 mass %. The first metal member has a high carbon concentration region at a depth ranging from 0.70 to 3.00 mm from the first bonding surface. The high carbon concentration region has a maximum carbon concentration of from 0.3 to 1.2 mass %. The bonded tungsten carbide-based super hard alloy assembly has both high bonding strength and excellent mechanical strength.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 16, 2014
    Applicant: NGK INSULATORS, LTD.
    Inventors: Hironori TAKAHASHI, Hiroyuki TANAKA
  • Patent number: 8486541
    Abstract: A composite is produced by the steps of (a) blending a first mixture of metallic powders; (b) compacting the blended first mixture of metallic powders to a plurality of discretely shaped articles; (c) blending a second mixture of metallic powders; (d) mixing the plurality of discretely shaped articles with the blended second mixture of metallic powders to form a precursor blend; (e) compacting the precursor blend; and (f) sintering the precursor blend. The composite has a metallic matrix with embedded shapes dispersed throughout the matrix where the embedded shapes have an incipient liquid phase sintering temperature less than an incipient liquid phase sintering temperature of the matrix.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: July 16, 2013
    Assignee: Aerojet-General Corporation
    Inventors: Timothy J. Brent, Michael T. Stawovy
  • Publication number: 20130065082
    Abstract: A cargo container fire suppression system may prevent fires from spreading within a cargo area into other portions of a craft. A fire resistant liner may be disposed within a cargo container to prevent a fire from penetrating through the liner and burning other elements within the craft beyond the wall(s) of the liner. The suppression system may include a fire sensor and an automatic fire extinguishing device. A transceiver may be coupled to the fire sensor which may remotely alert personnel to a fire occurring in the cargo area.
    Type: Application
    Filed: September 10, 2012
    Publication date: March 14, 2013
    Inventor: KEVIN SOTO
  • Patent number: 8394508
    Abstract: A plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 ??·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: March 12, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
  • Publication number: 20120315502
    Abstract: There is provided a metal laminated structure in which a first metal layer containing tungsten is provided on a first surface of a second metal layer containing copper and a third metal layer containing tungsten is provided on a second surface of the second metal layer opposite to the first surface, and the first metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the first surface of the second metal layer and the third metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the second surface of the second metal layer, and a method for producing the metal laminated structure.
    Type: Application
    Filed: December 27, 2010
    Publication date: December 13, 2012
    Applicants: A.L.M.T. Corp., Sumitomo Electric Industries, Ltd.
    Inventors: Koji Nitta, Shinji Inazawa, Akihisa Hosoe, Masatoshi Majima, Osamu Suwata, Hiroshi Yokoyama, Shinichi Yamagata, Yugaku Abe
  • Publication number: 20120276411
    Abstract: A coating composition for coating a substrate, the coating composition comprising: Carbon in an amount of between about 1.5 and 3 wt %; Chromium in an amount of between about 10 and 15 wt %; Iron in an amount of between about 1 and 3 wt %; Nickel in an amount of less than about 15 wt %; 10 Silicon in an amount of between about 1 to 3 wt % Tungsten in an amount of between about 10 to 55 wt % with the balance of wt % being Cobalt.
    Type: Application
    Filed: June 2, 2010
    Publication date: November 1, 2012
    Applicant: HUNPRENCO PRECISION ENGINEERS LIMITED
    Inventor: Eddie Neesom
  • Patent number: 8283051
    Abstract: A plated product made of a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion contains metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at a pH of 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at a pH of 10 or higher.
    Type: Grant
    Filed: July 13, 2009
    Date of Patent: October 9, 2012
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori, Yasuhiro Yamakoshi, Shinichiro Senda
  • Publication number: 20120127629
    Abstract: A composite dielectric material including an early transition metal or metal oxide base material and a dopant, co-deposited, alloying or layering secondary material, selected from among Nb, Ge, Ta, La, Y, Ce, Pr, Nd, Gd, Dy, Sr, Ba, Ca, and Mg, and oxides of such metals, and alumina as a dopant or alloying secondary material. Such composite dielectric material can be formed by vapor deposition processes, e.g., ALD, using suitable precursors, to form microelectronic devices such as ferroelectric high k capacitors, gate structures, DRAMs, and the like.
    Type: Application
    Filed: April 14, 2010
    Publication date: May 24, 2012
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: Jeffrey F. Roeder, Bryan C. Hendrix, Steven M. Bilodeau, Gregory T. Stauf, Tianniu Chen, Thomas M. Cameron, Chongying Xu
  • Patent number: 8128063
    Abstract: A power generation system valve stem comprising a nickel-based substrate and a WC-based coating thereon, wherein the WC based coating comprises WC particles in a matrix of Ni and/or Co wherein the average interfacial spacing between the WC particles is between 5 microns and about 20 microns on average.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: March 6, 2012
    Assignee: Ameren Corporation
    Inventor: Dennis Sullivan
  • Patent number: 7985488
    Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10?a/(a+b)*100?70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: July 26, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yuuji Suzuki, Takami Moteki, Kazuhiro Hoshino, Satoshi Fujisawa, Akira Kawakami
  • Patent number: 7955715
    Abstract: In a known method for coating a crucible for use at a high working temperature in a crucible drawing method for quartz glass, a base body wall of tungsten has applied thereto a protective layer containing a coating metal consisting of the group selected from iridium, rhenium, osmium and ruthenium. Starting therefrom, to provide a method for producing such a component exhibiting high corrosion resistance to the quartz glass melt at low material costs, it is suggested according to the invention that the protective layer should be produced from a layer material which contains tungsten and the coating metal, and in which the amount of the coating metal should be dimensioned such that it exceeds the limit amount of a coating metal-rich phase boundary of a solid mixture phase of tungsten and the coating metal, with the solid mixture phase being thermodynamically stable at the working temperature, by not more than 25 at. % (based on the total amount of tungsten and the coating metal in the layer material).
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: June 7, 2011
    Assignee: Heraeus Quarzglas GmbH & Co. KG
    Inventors: Martin Trommer, Rainer Berg, Nigel Whippey, Helmut Leber, Joerg Becker
  • Patent number: 7914904
    Abstract: Disclosed herein is a component in a combustion system comprising a composite, the composite comprising silicon carbide; and a refractory metal silicide comprising a phase selected from Rm5Si3, Rm5Si3C, RmSi2, and a combination thereof; wherein Rm is a refractory metal selected from molybdenum, tungsten, and a combination thereof. Also disclosed is a process for preventing slag, ash, and char buildup on a surface, comprising disposing a first surface of the composite on the surface; replacing a component comprising the surface with a component consisting of the composite; or a combination thereof.
    Type: Grant
    Filed: March 25, 2008
    Date of Patent: March 29, 2011
    Assignee: General Electric Company
    Inventors: Martin Mathew Morra, Aaron John Avagliano, Wei Chen, Monty L. Harned, Shashishekara S. Talya
  • Patent number: 7851070
    Abstract: A diffusion barrier alloy film has a diffusion barrier layer which has more excellent diffusion barrier properties than an Re—Cr alloy film, and can stand usage at higher temperatures (e.g., 1150° C. or higher). The diffusion barrier layer is made of an Re—W alloy ? phase containing 12.5 to 56.5% of W in terms of atomic composition and the remainder of Re excluding unavoidable impurities. A metal base has a surface coated with a diffusion barrier layer. If required, the diffusion barrier layer has a surface coated with a diffusion alloy layer containing 10% or greater and less than 50% of Al, Cr, or Si in terms of atomic composition, providing a high-temperature apparatus member.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: December 14, 2010
    Assignee: National University Corporation Hokkaido University
    Inventors: Toshio Narita, Hiroshi Yakuwa
  • Patent number: 7648775
    Abstract: A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: January 19, 2010
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Hisashi Wakako, Makoto Nagai, Atsushi Uchida, Masahito Morita, Kazuo Kimura
  • Publication number: 20090239095
    Abstract: A composite rod includes an outer sleeve formed over an inner core, wherein the outer sleeve and the inner core are joined with a non-metallurgical bond that provides a tight fit therebetween. A process for forming a composite rod includes positioning a rod inside a tube to form an intermediate assembly, wherein the tube has an inside diameter that is greater than the outside diameter of the rod. The tube is then compressed around the rod to produce a non-metallurgical bond between the tube and the rod.
    Type: Application
    Filed: March 23, 2009
    Publication date: September 24, 2009
    Applicant: Elmet Technologies, Inc.
    Inventors: Vinay M. Desai, David W. Littlefield, James A. Granese
  • Publication number: 20090226715
    Abstract: A coated article includes a substrate and a substantially pure metal layer coated thereon. The substantially pure metal layer is configured to enhance the strength of the underlying substrate. A method is also disclosed for making a coated article by providing a substrate and coating a substantially pure metal layer thereon.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 10, 2009
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Leonid C. Lev, Erkan Konca, Michael J. Lukitsch
  • Publication number: 20090042057
    Abstract: A composite metal article includes a higher melting point metal, a lower melting point alloy and at least one other metal with an intermediate melting point between that of the higher melting point metal and the lower melting point alloy. The at least one other metal is selected to aid in sinter-densification of the higher melting point metal in a temperature range above the liquidus temperature of the lower melting point alloy and below the melting point of the at least one other metal.
    Type: Application
    Filed: August 11, 2008
    Publication date: February 12, 2009
    Applicant: Springfield Munitions Company, LLC
    Inventors: Julian Alex Thomas, Timothy George Smith
  • Publication number: 20080274369
    Abstract: An alloy for use in vapor deposition or atomic layer deposition is described herein that includes ruthenium and at least one element from group IV, V or VI of the Periodic Chart of the Elements or a combination thereof. In addition, a layered material is described herein that comprises at least one layer that includes a ruthenium-based material or ruthenium-based alloy and at least one layer that includes at least one element from group IV, V or VI of the Periodic Chart of the Elements or a combination thereof.
    Type: Application
    Filed: April 21, 2005
    Publication date: November 6, 2008
    Inventors: Eal H. Lee, Nicola Truong, Robert Prater, Morales Diana
  • Publication number: 20080081214
    Abstract: A diffusion barrier alloy film has a diffusion barrier layer which has more excellent diffusion barrier properties than an Re—Cr alloy film, and can stand usage at higher temperatures (e.g., 1150° C. or higher). The diffusion barrier layer 18 is made of an Re—W alloy ? phase containing 12.5 to 56.5% of. W in terms of atomic composition and the remainder of Re excluding unavoidable impurities. A metal base 10 has a surface coated with a diffusion barrier layer 18. If required, the diffusion barrier layer 18 has a surface coated with a diffusion alloy layer 20 containing 10% or greater and less than 50% of Al, Cr, or Si in terms of atomic composition, providing a high-temperature apparatus member.
    Type: Application
    Filed: January 14, 2005
    Publication date: April 3, 2008
    Inventors: Toshio Narita, Hiroshi Yakuwa
  • Patent number: 7128980
    Abstract: A highly heat-resistant laminated component for a fusion reactor has at least of a plasma-facing area made of tungsten or a tungsten alloy, a heat-dissipating area of copper or a copper alloy with a mean grain size of more than 100 ?m, and an interlayer of a refractory metal-copper-composite. The refractory metal-copper-composite has a macroscopically uniform copper and refractory-metal concentration progression and a refractory metal concentration of between 10 vol. % and 40 vol. % over its entire thickness.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: October 31, 2006
    Assignee: Plansee SE
    Inventors: Bertram Schedler, Thomas Granzer, Thomas Huber, Karlheinz Scheiber, Dietmar Schedle, Hans-Dieter Friedle, Thomas Friedrich, Anton Zabernig
  • Patent number: 7001670
    Abstract: The invention relates to a wear protection layer for piston rings in internal combustion engines consisting essentially of chromium carbides, wolfram carbide, chromium and nickel. The wear protection layer is formed from a mixture of powders in which the first powder consists of at least the alloy components chromium carbide, chromium and nickel, in the form of an agglomerated and sintered powder, and which has not been subjected to any secondary heat treatment that would make the powder brittle, such as plasma refinement, the carbides in the powder having an average diameter of essentially not more than 3 ?m. A second powder, also in the form of an agglomerated and sintered powder, contains wolfram carbide and is applied to at least one peripheral surface of the piston rings by thermal injection, so that two distinctive coating areas are produced in the wear protection layer. A first area, predominantly rich in chromium, and a second area, mainly rich in wolfram carbide are formed.
    Type: Grant
    Filed: November 17, 2001
    Date of Patent: February 21, 2006
    Assignee: Federal-Mogul Burscheid GmbH
    Inventor: Christian Herbst-Dederichs
  • Patent number: 6984358
    Abstract: A method for producing diffusion bonds between components formed of tungsten heavy alloy (WHA) uses aid material to accelerate diffusion across the joint surfaces. The aid material consists of an alloy of palladium (Pd) with one or more of the secondary elements of nickel (Ni), iron (Fe), or cobalt (Co). The secondary elements are selected to correspond to the secondary elements present in the components. The diffusion bonding is carried out by placing diffusion aid material between the joint surfaces of adjacent components, applying a pressure across the joint surfaces, and processing the assembly through a thermal profile. Structures of WHA with complex shapes, interior volumes and/or large sizes can be formed. The joint properties are equal to or superior to those of the parent material of the components.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: January 10, 2006
    Assignee: Lockheed Martin Corporation
    Inventor: William R. Spencer
  • Patent number: 6866943
    Abstract: A bond pad structure formed over a predetermined area of an IC substrate comprising quickly and easily removable redundancy and passivation layers upon lithography and plasma etching in a plasma containing Cl2, the bond structure comprises: a liner or lower metal layer formed on a predetermined area of the IC substrate; an aluminum-based metal layer formed on the liner layer as the last metal layer for bond purposes; a tungsten based redundancy layer formed on top of the aluminum-based last metal layer; and a passivation layer formed over the IC substrate and on the tungsten based redundancy layer.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: March 15, 2005
    Assignee: Infineon Technologies AG
    Inventors: Gerald Friese, Werner K. Robl, Hans-Joachim Barth, Axel Brintzinger
  • Patent number: 6803117
    Abstract: A magnetic recording medium for high areal recording density that has excellent thermal fluctuation resistance and recording/reproduction characteristics, and a method of producing the same. The magnetic recording medium includes a glass substrate, an NiP layer having an oxide film on its surface provided on the glass substrate, a ground layer provided on the NiP layer, and a nonmagnetic intermediate layer provided on the ground layer. The magnetic recording medium further includes an exchange layer structure composed of a ferromagnetic layer and a nonmagnetic coupling layer provided on the nonmagnetic intermediate layer, and a magnetic recording layer provided on the exchange layer structure. The oxide film on the NiP layer is formed by introducing a small quantity of oxygen into a vacuum chamber of a sputter device. The formation and oxidation of the NiP layer are conducted at a temperature of not less than 140° C.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: October 12, 2004
    Assignee: Fujitsu Limited
    Inventors: Hideyuki Akimoto, Kenji Sato, Yuki Yoshida, Masaya Suzuki, Akira Kikuchi, Tohru Horie, Naoya Saito, Akiko Honda
  • Publication number: 20040195296
    Abstract: A highly heat-resistant laminated component for a fusion reactor has at least of a plasma-facing area made of tungsten or a tungsten alloy, a heat-dissipating area of copper or a copper alloy with a mean grain size of more than 100 &mgr;m, and an interlayer of a refractory metal-copper-composite. The refractory metal-copper-composite has a macroscopically uniform copper and refractory-metal concentration progression and a refractory metal concentration of between 10 vol. % and 40 vol. % over its entire thickness.
    Type: Application
    Filed: March 30, 2004
    Publication date: October 7, 2004
    Inventors: Bertram Schedler, Thomas Granzer, Thomas Huber, Karlheinz Scheiber, Dietmar Schedle, Hans-Dieter Friedle, Thomas Friedrich, Anton Zabernig
  • Publication number: 20040067385
    Abstract: A tungsten disulfide metal surface treatment in which the substrate material is prepared through impingement of small blast media particle sizes to create formed pockets in the substrate material approximately matched to the size of the tungsten disulfide particles. A sand blast apparatus having a vibratory bowl with a throttled intake pipe enables small blast media particles to be used to prepare the substrate surface with the formed pockets. A method for forming the tungsten disulfide surface treatment through roughening the substrate surface in a controlled manner is disclosed.
    Type: Application
    Filed: October 3, 2002
    Publication date: April 8, 2004
    Applicant: Material Technologies, Inc.
    Inventor: Craig T. LeClaire
  • Patent number: 6692833
    Abstract: The present invention is directed to a process for depositing at least one layer (3) based on tungsten and/or on molybdenum by chemical vapor deposition on a non-conductive substrate (1), such as glass, ceramic, glass-ceramic, or polymer, which includes providing at least one tungsten- and/or molybdenum-containing precursor in the form of a metal halide and/or of an organometallic compound, and at least one reducing agent, such as hydrogen or silane, to form the at least one metal layer. The present invention also relates to the substrate obtained by the preceding process and its applications, especially for producing a glazing, mirrors, or emissive screens.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: February 17, 2004
    Assignee: Saint-Gobain Vitrage
    Inventor: Georges Zagdoun
  • Patent number: 6660413
    Abstract: A component of a recording device comprising a magnetic layer, means for improving corrosion resistance of the magnetic layer and a carbon overcoat, and a method of making and using the same are disclosed. The means for improving corrosion resistance of the magnetic layer comprises a sealing layer comprising a refractory metal or a refractory metal-containing alloy.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: December 9, 2003
    Assignee: Seagate Technology LLC
    Inventors: Raj Thangaraj, Kueir-Weei Chour, Xiaoding Ma, Huan Tang, Jing Gui
  • Publication number: 20030186074
    Abstract: This specification discloses a metal electrode that uses MoW (molybdenum-tungsten) alloy as its barrier layers and the method for making the same. Using MoW alloy as the barrier layer of a metal electrode can effectively solve the spiking and hillock problems occurred in aluminum electrodes. The MoW alloy barrier layer is thermally stable, preventing the resistance from rising due to the high-temperature manufacturing process. The metal electrode using the MoW alloy as the barrier layer can be prepared using the dry etching process. The resulting resistance is lower than other kinds of barrier layers. The MoW alloy barrier layer can be used in TFT metal electrodes for high-resolution and large-area displays.
    Type: Application
    Filed: April 2, 2002
    Publication date: October 2, 2003
    Inventors: Chi-Lin Chen, Chich-Shang Chang
  • Patent number: 6565988
    Abstract: The invention provides a component or composite part, such as a divertor plate for the “first wall” of a fusion reactor, adapted to endure a high thermal load, which is made, at least in some sections, of tungsten or a tungsten alloy. In accordance with the invention, the sections are not constructed massively from tungsten or a tungsten alloy, but rather are made as a laminated packet, in order to improve the susceptibility to fissures.
    Type: Grant
    Filed: May 9, 2000
    Date of Patent: May 20, 2003
    Assignee: Plansee Aktiengesellschaft
    Inventors: Laurenz Plöchl, Florian Rainer
  • Patent number: 6544667
    Abstract: In a magnetic recording medium having Co-based alloy magnetic layer containing Pt formed on a substrate through an underlayer, by forming said underlayer with plural underlayers including double layer structure which is formed by piling up 1st underlayer of Cr-based alloy containing Ti and 2nd underlayer of Cr-based alloy containing at least one element selected from a group comprising Mo and W in this sequence, crystal grain diameter is decreased and then medium noise can be decreased, and c axis is oriented to in-plane direction and then high coercivity can be obtained, consequently the magnetic recording medium having high signal to noise ratio at high recording density region is obtained. Further a small size large capacity magnetic recording system can be provided by combination of said magnetic recording media with a MR (magnetoresistive) head.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: April 8, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Yuzuru Hosoe, Yoshibumi Matsuda, Yotsuo Yahisa, Kiwamu Tanahashi, Hiroyuki Suzuki, Koji Sakamoto, Akira Kato
  • Publication number: 20030064243
    Abstract: A Zn—Co—W alloy electropated steel sheet with excellent corrosion resistance and weldability, and an electrolyte for manufacturing the same arc provided. Accordingly, the present invention relates to a Zn—Co—W alloy electroplated steel sheet, wherein a plating layer consisting of Co: 0.1-3.0 W %, and zinc: balance, is formed on the steel sheet and all tungsten plating is carried out with metallic tungsten; an electrolyte for manufacturing a Zn—Co—W alloy electroplated steel sheet, comprising zinc chloride: 60-200 g/l, cobalt chloride: 0.1-6.0 g/l, tungsten: 0.1-4.0 g/l, citric acid: 0.5-10.0 g/l, polyethylene glycol: 0.1-2.0 m/l and electric conductive aid: 30-400 g/l, wherein almost all ions of the tungsten form a complex compound with citric acid, thereby preventing formation of sludge; and a Zn—Co—W alloy electroplated steel sheet, on which a plating layer is formed by electroplating the steel in the electrolyte.
    Type: Application
    Filed: August 21, 2002
    Publication date: April 3, 2003
    Inventor: Myung-Su Kim
  • Patent number: 6531226
    Abstract: A multilayer brazeable metallization structure for diamond components is described. The brazeable metallization finds particular application for the attachment of diamond components such as heat spreaders in electronic packages that incorporate high power semiconductor devices. In the present invention, a diamond component is provided with a multilayer coating of metals including a first layer of chromium for adhesion, a second barrier layer of a refractory metal for a barrier that may be alloyed with chromium, and a top layer of copper, silver or gold for wetting. The refractory metals for the second layer include tungsten, molybdenum, tantalum and niobium. Tungsten or tungsten-chromium alloy is preferred as the second layer. This multilayer metallization structure provides a robust interface between diamond and standard brazing alloys which are used to join the diamond to electrical leads or a flange made of metals such as copper-tungsten.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: March 11, 2003
    Assignee: Morgan Chemical Products, Inc.
    Inventor: Ronald R. Petkie
  • Patent number: 6503641
    Abstract: An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf; and a liner abutting the conductor body which is formed of an alloy that includes Ta, W, Ti, Nb and V. The invention further discloses a liner for use in a semiconductor interconnect that is formed of a material selected from the group consisting of Ti, Hf, In, Sn, Zr and alloys thereof, TiCu3, Ta1−XTix, Ta1−X, Hfx, Ta1−X, Inxy, Ta1−XSnx, Ta1−XZrx.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: January 7, 2003
    Assignee: International Business Machines Corporation
    Inventors: Cyril Cabral, Jr., Roy Arthur Carruthers, James McKell Edwin Harper, Chao-Kun Hu, Kim Yang Lee, Ismail Cevdet Noyan, Robert Rosenberg, Thomas McCarroll Shaw
  • Patent number: 6492037
    Abstract: A friction welded joint structure includes friction welded dissimilar first and second metallic materials. The first metallic material has a rigidity greater than the second metallic material. The angle of the first metallic material to a free edge of the first metallic material, at an end portion of a joined surface between the first and second metallic materials, is greater than or equal to 120 degrees or in the range of from 55 degrees to 85 degrees. A reaction layer between the first and second metallic materials is more than zero and less than or equal to 20 &mgr;m. The first metallic material is copper. The second, which has the smaller rigidity, is aluminum.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: December 10, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takahiko Shindo, Yoshiyasu Itoh, Katsumi Suzuki
  • Patent number: 6451185
    Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: September 17, 2002
    Assignee: Honeywell International Inc.
    Inventors: Anthony F. Beier, Janine K. Kardokus, Susan D. Strothers
  • Patent number: 6436550
    Abstract: A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink 1 which comprises a heat sink main body 2. The heat sink main body 2 comprises a substrate 3, a plurality of projections 4 integrally formed with the substrate 3 on its heat dissipation surface, and a molded frame 5 integrally formed with the substrate 3 to surround the projections 4. On each corner of the substrate 3 is formed a circular molded hole 6. The opposite surface of the substrate 3 is formed into a contacting surface which is adapted to be in contact with the heat generating semiconductor chip, and this contacting surface is surface treated, for example, by plating. The sintered compact is produced from metal powders, and it comprises at least one metal selected from tungsten and molybdenum and 2 to 50% by weight of silver.
    Type: Grant
    Filed: August 25, 1997
    Date of Patent: August 20, 2002
    Assignee: Injex Corporation
    Inventors: Masaaki Sakata, Shoji Takahashi, Kenichi Shimodaira
  • Publication number: 20020061417
    Abstract: The present invention relates generally to a joined structure of dissimilar metallic materials having different characteristics. More specifically, the invention relates to a joined structure of a current-carrying contact or arching contact which are used for, e.g., a power breaker, or a coating end structure of a metal base and a coating material for improving conductivity and heat resistance.
    Type: Application
    Filed: November 18, 1998
    Publication date: May 23, 2002
    Inventors: TAKAHIKO SHINDO, YOSHIYASU ITOH, KATSUMI SUZUKI
  • Patent number: 6391473
    Abstract: A Cu plated ceramic substrate is used in a semiconductor. On a ceramic substrate layer, a thin-film Cr layer is put, and a thin-firm Au layer is put on the Cr layer. The Au layer is plated with Cu. By providing the Au and Cr layers between the ceramic plate and Cu layer, adhesibility is increased. A Pertier element which includes the Cu plated ceramic layer is employed in a semiconductor to absorb and generate heat efficiently.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: May 21, 2002
    Assignee: Yamatoya & Co., Ltd.
    Inventors: Iwao Numakura, Noriaki Tsukada
  • Patent number: 6376097
    Abstract: Sputter-deposited TiW film interposed between a magnetic layer and a nitrogen-containing overcoat of a magnetic recording medium significantly reduces the migration of nitrogen from the overcoat to the magnetic layer, thereby improving the magnetic recording performances of the magnetic recording medium.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: April 23, 2002
    Assignee: Seagate Technology LLC.
    Inventors: Charles Leu, Lin Huang, Qixu David Chen, Rajiv Yadav Ranjan
  • Patent number: 6372364
    Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: April 16, 2002
    Assignee: MicroCoating Technologies, Inc.
    Inventors: Andrew T. Hunt, Henry A. Luten, III
  • Patent number: 6368729
    Abstract: The invention provides a thin-film heater having a high heat-resisting property and a high resistivity and suitable for low power consumption and for a compact and fine structure, and a method of manufacturing this thin-film heater. A thin-film heater contains a tungsten film formed on a substrate, and this tungsten film generates heat when a current is supplied to this tungsten film. The tungsten film is formed by an RF sputtering method, and is constructed of tungsten having peaks at approximately 36 degrees, 40 degrees and 44 degrees in Bragg angle 2&thgr; of X-ray diffraction.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: April 9, 2002
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Tomoo Ikeda, Etsuo Yamamoto, Yoshimasa Shirai, Hiroshi Ikeda
  • Publication number: 20010052573
    Abstract: A target mark member having a mark pattern with a plurality of marks and a controlled width of the marks provides accuracy and efficiency in electron beam shape measurement and focus of the electron beam. The target mark member for adjusting a focus of an electron beam and measuring a shape of said electron beam in an electron beam processing apparatus includes a metal mark portion having a predetermined mark pattern, said metal mark portion comprising an epitaxial metal material; and a substrate that supports said metal mark portion.
    Type: Application
    Filed: June 14, 2001
    Publication date: December 20, 2001
    Applicant: ADVANTEST CORPORATION
    Inventor: Masaki Takakuwa
  • Publication number: 20010019737
    Abstract: A method of treating structures (and the structure formed thereby), so as to prevent or retard the oxidation of a metal film, and/or prevent its delamination a substrate, includes providing a structure including a refractory metal film formed on a substrate, placing the structure into a vessel having a base pressure below approximately 10−7 torr, exposing the structure to a silane gas at a sufficiently high predetermined temperature and predetermined pressure to cause formation of a metal silicide layer on the refractory metal film, and exposing the structure to a second gas at a sufficiently high temperature and pressure to nitride the metal silicide layer into a nitrided layer.
    Type: Application
    Filed: March 23, 2001
    Publication date: September 6, 2001
    Inventors: Kevin K. Chan, Erin C. Jones, Fenton R. McFeely, Paul M. Solomon, John J. Yurkas