Abstract: A support structure (10) for forming a wreath includes an annular backing ring (14) having a plurality of straps (16) connected thereto. Each strap is spaced apart from one another along the circumference of the backing ring, and includes a first portion (18) having a first engaging material for releasably engaging with a second engaging material; and a second portion (20) having a second engaging material for releasably engaging the first engaging material. In the preferred embodiment, a plurality of openings (22) or (24) are defined in the backing ring at spaced apart locations along the circumference of the backing ring, wherein a strap is inserted in at least some of the openings.

Abstract: A cobalt-platinum (CoPt) magnetic film is deposited onto a chromium (Cr) or tungsten (W) underlayer on a substrate, or is deposited directly onto the substrate and has an appreciable component of its C-axis which is parallel go the [00.2] direction, lying in the plane of the film whereby the resultant magnetic films exhibit coercivities from 2100-3000 oersteds.

Abstract: The present invention pertains to a thin film media structure for low noise high density longitudinal magnetic recording. The thin film media structure is comprised of a substrate. The thin film media structure is also comprised of an underlayer in contact with the substrate. Additionally, the thin film media structure is comprised of a CoSm or a CoSmQ film in contact with the underlayer such that the underlayer is between the substrate and the CoSm or CoSmQ. In a preferred embodiment, the underlayer is made of Cr or W and there is additionally an overlayer in contact with the CoSm or CoSmQ film, an overcoat in contact with the overlayer and an organic lubricant disposed on the overcoat. The present invention also pertains to a low noise high coercivity media structure for longitudinal magnetic recording. The high coercivity media structure is comprised of a substrate.

Abstract: A roll used for continuous galvanization is provided at its surface with a spray-coated layer made from a cermet spraying material consisting essentially of WC-Co. The spray-coated layer consists of WC, at least one specified intermetallic compound and at least one of amorphous W-C-Co compound and free C, but contains no free W and free Co.

Abstract: A duplex coating for substrates that comprises an undercoat of tungsten carbide-cobalt having a strain-to-fracture of greater than 4.3.times.10.sup.-3 inch per inch and a top coat of a ceramic material such as alumina in which the ratio of the thickness of the top coat to the undercoat is from 6:1 to 1:3.

Abstract: A ceramic-metal composite substrate which comprises: a ceramic base member; metal members of a material selected from the group consisting of copper and copper alloys, which is bonded to said ceramic base member; and a constraining member bonded to said metal member, said constraining member being made up of a metal selected from the group consisting of molybdenum, tungsten and alloys thereof, and having a thickness in a range of from 1/20 to 1/3 of the thickness of said metal member.

Abstract: A metallized ceramic structure includes a ceramic substrate preferably aluminum nitride and a metallic layer preferably tungsten bonded to the ceramic substrate. First and second mixture layers are formed between the ceramic substrate and the metallic layer to bond the ceramic substrate and the metallic layer. The first mixture layer is in contact with the ceramic substrate and the second mixture layer is in contact with the metallic layer. Each of the mixture layers includes a mixture of ceramic of the ceramic substrate and the metal of the metallic layer. The second mixture layer has a lower percentage of the ceramic than the first mixture layer.

Abstract: A composite structure comprising a symmetric bimetallic laminate bonded to a separate substrate is provided by eutectic bonding the bimetallic laminate to the substrate. A variety of beneficial structures can be provided.

Abstract: A method is described for improving the erosion and abrasion wear resistance and hardness of the internal wear surfaces of structures such as nozzles, jets, ducts, chutes, powder handling tubes, valve housings, conveyors, drill bushings and the like. A substantially pure tungsten layer is chemical vapor deposited on the internal wear surface of the body of the structure followed by a chemical vapor deposited top coating comprising a mixture of tungsten and tungsten carbide. The tungsten carbide is selected from the group consisting of W.sub.2 C, W.sub.3 C, and mixtures thereof and is fine grained, non-columnar and has a substantially layered microstructure. Also described are structures formed by the method.

Abstract: A composite consists of a ceramic brazed to another ceramic by means of a joint layer therebetween. The joint layer comprises a porous metal interlayer and an active brazing filler metal penetrating through the porous metal interlayer.

Abstract: The method for producing the disclosed material comprises chemical vapor depositing on the substrate a substantially columnar, intermediate layer of tungsten and chemical vapor depositing on the intermediate layer a non-columnar, substantially lamellar outer layer of a mixture of tungsten and tungsten carbide. The tungsten carbide comprises W.sub.2 C, W.sub.3 C, or a mixture of both wherein the ratio of the thickness of the tungsten intermediate layer to the thickness of the outer layer is at least: (a) 0.35 in the case of tungsten plus W.sub.2 C in the outer layer, (b) 0.6 in the case of a mixture of tungsten and W.sub.3 C in the outer layer and (c) 0.35 in the case of mixtures of tungsten and W.sub.2 C and W.sub.3 C in the outer layer. The chemical vapor deposition steps are carried out at pressures within the range of 1 Torr to 1,000 Torr and temperatures within the range of about 300.degree. to about 650.degree. C.

Abstract: A ceramics-metal joined body which excels in high temperature characteristics and joint strength is formed by metallizing the surface of ceramics such as oxides, carbides, borides, nitrides, and composites thereof, and joining a metallic member through a solder to the metallized surface.

Abstract: A high temperture, bimetallic cylinder of either ASTM 193B-16 carbon steel or duplex stainless steel having a wear and corrosion resistant inlay or liner of a nickel-based alloy containing 1.5 to 4.5% carbon, 1.5 to 3.5% silicon, 1.0 to 3.0% boron, up to 7.0% chromium, up to 15% iron, 1.0 to 6.0% cobalt and 30 to 60% tungsten. The inlay is centrifugally cast within the cylinder which is thermally compatible with the inlay such that it retains a high yield strength after casting.

Abstract: The present invention relates to an electroless gold plating solution, a method of plating by using the same, and an electronic device plated with gold by using the same.According to the present electroless gold plating solution, the plating solution components contain no cyanide ions, the amount of a reducing agent used is small, and gold plating can be carried out without causing the gold plating on conducting paths having a fine interval between them to short-circuit the conducting paths.Therefore, according to the method of gold plating by using said electroless gold plating solution, a plating method that is safe in the plating work and in the treatment of its waste liquor can be accomplished. The method has a feature that the method can provide an electronic device on which parts can be mounted highly densely, and wherein the joint reliability to the parts is high.

Abstract: An improved highly erosive and abrasive wear resistant multi-layered coating system on a substrate which provides protection against impact of large particles is disclosed comprising a plurality of composite layers. In each of the composite layers, the first layer closest to the substrate comprises tungsten of sufficient thickness to confer substantial erosion and abrasion wear resistance characteristics to the coating system and a second layer deposited on the first layer comprises a mixture of tungsten and tungsten carbide and the tungsten carbide comprises W.sub.2 C, W.sub.3 C, or a mixture of both. Because the resulting coating system has enhanced high cycle fatigue strength over the substrate, the coating system is especially useful on such structures as turbine blades and similar articles of manufacture where such high stress cycles occur during normal operation. Also dislcosed is the method for preparing such improved composite coating systems.

Abstract: A getter wire is made by wrapping alternate layers of getter metal and refractory metal around an ingot of refractory metal. The composite ingot thus formed is reduced to wire, preferably by extrusion and drawing. The multi layers of refractory and getter metals can then be heated to form an alloy of the two metals from which the getter is evaporated during use. A preferred combination is tantalum as refractory and titanium as getter.

Abstract: Fine-grained and/or equiaxed tungsten and/or rhenium coatings, substantially free from columnar structure, are deposited on substrates (especially graphite) by chemical vapor deposition by directing the flow of reactant gases to the substrate with high velocity and in close proximity thereto, most often at a velocity gradient of at least about 1050 and preferably at least about 2000 cm./cm.-sec. The deposition process is preferably conducted while moving the substrate so as to coat large areas thereof. By this method, tungsten and/or rhenium-coated articles useful as X-ray targets having excellent properties under conditions of rapid temperature cycling may be produced.

Abstract: A primary plated film is formed on the surface of underlayer metal. Next, the heating process is performed and diffusion layers of the underlayer metal and primary plated film are formed. A mechanical abrasion is performed to the surface of the primary plated film, thereby exposing the diffusion layers. Thereafter, a secondary plated film is formed on the exposed diffusion layers. With this multilayer plating method, even in the case of the dissimilar metals, a uniform multilayer plated film of a good adhesive property is derived.

Abstract: Extremely hard, fine grained tungsten/carbon alloys are described which are produced by thermochemical deposition. The alloys consist primarily of a mixture of a substantially pure tungsten phase and at least one carbide phase wherein the carbide phase consists of W.sub.2 C or W.sub.3 C or a mixture of W.sub.2 C and W.sub.3 C. The disclosed tungsten/carbon alloys are free of columnar grains and consist essentially of extremely fine, equiaxial crystals. Also disclosed is a method of producing the disclosed material.

Abstract: A 3,000-10,000 angstrom thick cobalt-platinum (CoPt) magnetic film is deposited onto a chromium (Cr) or tungsten (W) overlayer on a substrate, or is deposited directly onto the substrate. The deposited film has an appreciable component of its C-axis, which is parallel to the [00.2] direction, lying in the plane of the film. The component of the C-axis lies in the plane of the film throughout the entire thickness of the CoPt film, and the resultant magnetic film has a coercivity from 1,300-2,000 oersteds, depending upon which, if any, overlayer is included.The method for producing the magnetic film of the invention teaches sputtering the overlayer onto a substrate maintained approximately at room temperature in an atmosphere of inert gas. After ajdusting the pressure of the gas and controlling the distance between the CoPt sputtering target and the substrate, CoPt is sputtered such that the depositing Co and Pt atoms are thermalized while traversing the distance between the target and the substrate.

Abstract: Disclosed is an aluminum nitride circuit substrate comprising an aluminum nitride plate and a conductive material bonded to the aluminum nitride plate through a metallized layer formed on the bonding surface of the aluminum nitride plate, the conductive material being of a metallic material which has a thermal expansion coefficient of 2.times.10.sup.-6 to 6.times.10.sup.-6 /.degree.C.The aluminum nitride circuit substrate according to this invention is free from the generation of crack caused by the difference of the thermal expansion coefficients of AlN plate and a conductive material bonded to the AlN plate to improve the reliability of the elements.

Abstract: "A coated substrate product is described wherein the outer coating on the substrate is comprised of a chemically vapor deposited and heat treated mixture of tungsten and tungsten carbide. The tungsten carbide phase consists of W.sub.2 C or W.sub.3 C or a mixture of W.sub.2 C and W.sub.3 C. During the heat treating, the coated substrate is heated to the deposition temperature or not substantially above the deposition temperature in a non-reactive atmosphere. The heat treating temperature is sufficient to confer a desired improvement in erosive and abrasive wear resistance in the outer coating but does not result in substantial degradation of the mechanical properties of the substrate or in formation of undesirable inter-metallic layers".

Abstract: A conductive member consisting of a first conductor of an alloy of titanium and tungsten and a second conductor of a refractory metal such as molybdenum is sintered to a conductive member of silicon of low resistivity to form a low resistance contact therewith.

Abstract: A highly erosive and abrasive wear resistant composite coating system is described in which an intermediate layer of substantially pure tungsten is deposited on a substrate. An outer layer is then deposited comprised of a mixture of tungsten and tungsten carbide, with the tungsten carbide consisting of W.sub.2 C, W.sub.3 C or a mixture of both. The thickness of the intermediate layer is sufficient to confer substantial erosive and abrasive wear resistance characteristics on the composite coating system. The ratio of the thickness of the intermediate layer to the thickness of the outer layer is controlled and is at least above 0.30 in the cases of W+W.sub.3 C, W+W.sub.2 C+W.sub.3 C and W+W.sub.2 C coatings.

Abstract: A composite film is provided which has a first layer of WSi.sub.x, where x is greater than 2, over which is disposed a second layer of a tungsten complex consisting substantially of tungsten with a small amount of silicon therein, typically less than 5%. Both layers are deposited in situ in a cold wall chemical vapor deposition chamber at a substrate temperature of between 500.degree. and 550.degree. C.. Before initiating the deposition process for these first and second layers, the substrate onto which they are to be deposited is first plasma etched with NF.sub.3 as the reactant gas, then with H.sub.2 as the reactant gas, both steps being performed at approximately 100 to 200 volts self-bias. WSi.sub.

Abstract: The present invention concerns a support of carbonaceous material for a rotary target of X-ray tubes. The support is formed of two parts which are fixed with respect to each other, one part being of a carbon/carbon composite which provides mechanical strength and the other part being of polycrystalline graphite for receiving a refractory metal, by virtue of its coefficient of expansion. A thermal contact is provided between the two parts. The invention is especially applicable to targets of X-ray tubes which rotate at a high speed, 20,000 RPM and above.

Abstract: Disclosed is a circuit substrate comprising an alumina plate and an aluminum nitride plate bonded to the alumina plate through metallized layers formed on the respective bonding surfaces of the alumina plate and the aluminum nitride plate and a buffering layer provided between the metallized layers, the buffering layer being of a metallic material(a) which undergoes plastic deformation by recrystallization at a temperature of not higher than 500.degree. C.,(b) which has a tensile strength of not higher than 35 kg.f/mm.sup.2 at a temperature of 500.degree. C., and(c) which has an elongation of not less than 10% at a temperature of 500.degree. C.The circuit substrate of this invention can provide a circuit substrate being excellent in heat dissipating characteristic and free from the generation of crack on an operation.

Abstract: A paste of a glazing composition is coated on the entire surface of a ceramic substrate having a metallized metal portion, and the paste-coated ceramic substrate is sintered in a reducing atmosphere, and a glazing layer is formed on the entire surface of the metallized metal portion by utilizing the repellency of the melt of the glazing composition to the metallized metal portion. A glazing composition comprising SiO.sub.2, B.sub.2 O.sub.3, BaO, Al.sub.2 O.sub.3 and an alkali metal oxide or a glazing composition comprising SiO.sub.2, BaO, Al.sub.2 O.sub.3, CaO and MgO or SrO is used. An acrylic resin syrup, especially an isobutyl methacrylate resin syrup, is used as a binder of a coating paste for forming a glazing layer.

Abstract: Disclosed is a magnetic recording medium of the magnetic metal thin-film type for longitudinal recording, in which the noise is reduced by selecting the value of maximum torque L (the product of magnetic anisotropy energy Ku and magnetic layer volume v; as measured by setting the axis of rotation in plane of the medium) and the value of magnetic flux .phi. (the product of saturation magnetization Ms and magnetic layer volume v) from a range defined by 0<L/(2.pi..multidot..phi..sup.2)<4.times.10.sup.5 (erg/emu.sup.2).

Abstract: Disclosed herein is a magnetic recording medium comprising a non-magnetic substrate, a magnetic layer for data recording formed on the substrate, and a protective layer of nickel (Ni)-tungsten (W)-boron (B) ternary alloy formed on the magnetic layer. The magnetic recording medium will find use as a the external storage such as magnetic disk for computers.

Abstract: The inability of conventional adhesion/diffusion barrier Ti-TiN laminates to secure a narrow linewidth electrodeposited gold layer to a silicon structure and prevent unwanted gold diffusion during anneal cycles at temperatures greater than 370.degree. C. for substantial periods of time is overcome by the addition of a medium thickness (.gtoreq.1,500.ANG.) layer of tungsten over the exposed silicon prior to formation of the titanium/titanium nitride laminate structure.

Abstract: A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.

Abstract: Erosion resistance is imparted to a metallic substrate without an attendant loss of fatigue life in the substrate by applying to the substrate a first layer comprising palladium, platinum or nickel in direct contact with the substrate and then applying a second layer which overcoats the first layer, the second layer being comprised of a tungsten-carbon alloy or a material formed of a tungsten matrix having dispersed tungsten-carbon compound phases therein. In another embodiment erosion resistance is imparted by employing a coating which comprises a first ductile layer on the substrate of palladium, platinum or nickel; a second layer comprising substantially pure tungsten; and a third layer comprising a material formed of a tungsten-carbon alloy or a material formed of a tungsten matrix having dispersed tungsten-carbon compound phases.

Abstract: Metal-ceramic joined articles having a splendid joint strength can be provided easily, even when the metallic member has a largely different thermal expansion coefficient from that of the ceramic member of the metal-ceramic article.

Abstract: A structure and method for fabricating the structure, which includes a layer containing a refractory metal and a substrate to which the refractory metal-containing layer does not strongly adhere, there being a thin bonding layer between the substrate and the refractory metal-containing layer for providing good adherence between the refractory metal-containing layer and the substrate. The bonding layer is an oxide, nitride or mixed oxy-nitride layer initially prepared to be Si-rich in a surface region thereof. Inclusions of the refractory metal are produced in the bonding layer by substituting the refractory metal for excess free silicon therein. These inclusions become nucleation and bonding sites for refractory metal deposition, ensuring good adhesion.

Abstract: A diamond-coated tungsten carbide-base sintered hard alloy material for inserts of cutting tools, which has greatly improved bond strength or degree of bonding of the diamond coating layer to the matrix and therefore is capable of exhibiting excellent cutting performance over a long period of time.The sintered hard alloy material comprises:(1) a matrix of a sintered hard alloy consisting essentially of 1-4 percent by weight cobalt, and the balance of tungsten carbide and inevitable impurities, the tungsten carbide having a coarse grain structure having an average grain size of 2-10 microns; and(2) a diamond coating layer formed over surfaces of the matrix by forming an etching layer over the matrix surfaces and then forming the diamond coating layer over the matrix surfaces via the etching layer by a low pressure vapor-phase synthesization method.If required, the matrix may further contain CO1-CO8 (ISO) free carbon.

Abstract: X-ray dispersive and reflective structures and materials are provided which exhibit at least one third of the theoretical integral reflection coefficient for the structures in the range of interest without fluorescence or absorption edges. The materials can be thermally activated to control the desired properties, during or post deposition. The structures can be deposited by ion beam absorption techniques to form the structures in a precise manner. The index of the refraction of the structures can be continuously varying throughout the structures.

Abstract: A source for vapor depositing manganese onto a substrate in a vacuum. The source is formed by a chain of metallic beads fused around a wire. The material of the wire has a high recrystallization temperature, the beads consist of an alloy of manganese and one or more other substances from the group of metals and metalloids having a saturated vapor pressure much lower than that of manganese, and the fusion temperature of the alloy is lower than that of pure manganese and lower than the recrystallization temperature of the material of the wire. The beads are formed by securing blocks of the alloy to the wire by means of electric welding, after which the blocks are fused around the wire and are cooled.

Abstract: A heterogeneous wire is disclosed which has a cladding comprising fibers of tungsten and fibers of copper and a core of the eutectic mixture of copper and silver. This eutectic mixture also connects the fibers of the cladding to each other. The wire has a high tensile strength, a low resistivity and a high ratio between these specific properties. As a result, the wire, which has a diameter of less than 50 .mu.m, is particularly suitable to be embedded in a pane.

Abstract: A ceramic package for semiconductor devices comprises a ceramic base, a gold-plated die-bonding area formed on the base for mounting thereon a semiconductor die, a gold-plated wire-bonding area, and a plurality of outerlead portions for electrically connecting the package to external printed circuits or the like. Cobalt or cobalt alloy, instead of nickel, is plated on the die-bonding and wire-bonding areas as underlayers of the gold-plated layers. Cobalt can also be plated on the outerlead portions, which may or may not have gold plated thereon.

Abstract: A surface metal layer composed mainly of gold is formed on the surface of a metallized metal layer on an insulating substrate through a first intermediate metal layer composed of a nickel/boron alloy and a second intermediate metal layer composed of a nickel/phosphorus alloy. In this surface layer, appearance of stains or occurrence of blistering is prevented, and this surface metal layer is excellent in appearance characteristics, electric characteristics and durability.

Abstract: A structure for an electrical interconnection suitable for a semiconductor integrated circuit is made by a process utilizing selective tungsten deposition at low pressure to form an intermediate conductive layer without significantly ablating nearby insulating material.

Abstract: A method of producing a high density tungsten alloy sheet product is disclosed which utilizes as a starting material a thin-gage sheet or foil substrate of a first alloy constituent, such as pure iron or an alloy thereof. A prescribed mixture of tungsten metal powder and a second metal alloy constitutent powder, such as nickel, is loaded on the substrate and partially consolidated in a protective atmosphere furnace to form a porous tungsten alloy skeleton which is also partially bonded to the substrate. The product is then preferably cooled in a protective atmosphere and sheared into desired lengths. The sized pieces are then further heated in a protective atmosphere at gradually increasing temperatures to a point above the melting point of the substrate, whereupon the substrate sheet or foil melts and infiltrates the porous tungsten alloy skeleton to complete the densification of the product.

Abstract: High-temperature joints formed from metallized ceramics are disclosed wherein the metal coatings on the ceramics are vacuum sputtered thereon.

Abstract: An electrodeposition process for depositing a boron-containing amorphous metallic layer onto a cathode from an electrodeposition bath having borophosphoric acid, dimethylamineborane or diethylamineborane; an ammonium salt of a hydroxycarboxylic acid or amino acid; and a source of the metallic ions. In one embodiment, tungsten-cobalt-boron amorphous alloys are deposited onto the cathode from a bath having borophosphoric acid, an ammonium salt of a hydroxycarboxylic acid or amino acid, a tungsten-containing salt and a cobalt-containing salt. In the preferred embodiment, the tungsten-containing salt is sodium tungstate, the cobalt-containing salt is cobalt sulphate, and the ammonium salt of a hydroxycarboxylic acid is ammonium citrate or ammonium tartrate.

Abstract: A ceramic body having a metallized layer which comprises a ceramic substrate and a metallized layer fired on the substrate to be integrated or further comprises a conductive layer consisting of a noble metal or noble metal alloy to be joined onto the metallized layer, the composition of the metallized layer being one or more of a silicide of transition metals belonging to Groups V and VI of periodic table; one or more of a boride of lanthanum and a boride of transition metals belonging to Groups IV, V and VI of periodic table; or a high melting point metal or alloy unmelted at a firing temperature of the ceramic substrate and containing, based on 100 parts by weight of the metal or alloy, 0.5-25 parts by weight of niobium, 0.5-10 parts by weight of yttrium, 0.5-10 parts by weight of tantalum, 0.5-25 parts by weight of mixture of niobium and yttrium, 0.5-25 parts by weight of mixture of yttrium and tantalum, 0.5-25 parts by weight of mixture of niobium and tantalum, 0.

Abstract: Window panes are provided with electrically conductive wires. At the desired small diameter of less than 50 micrometers the wires which have been used so far have too high a resistance per unit length.The invention provides a sufficiently strong, thin electrically conducting wire having an electric resistivity from 2.0-5.0 .mu..OMEGA.cm.

Abstract: Metal ceramics composites having high bonding strength wherein a metal body and a ceramics body are bonded through a bonding layer are produced bycoating on the ceramic body a metallizing layer-forming composition, which forms through heat treatment with the ceramic body a metallizing layer consisting essentially of70-90% by weight of at least one of molybdenum metal and tungsten metal, 0.5-15% by weight of manganese oxide, 0.1-10% by weight of yttrium oxide, 0.1-15% by weight of aluminum oxide and 0.1-15% by weight of silicon dioxide,heating the ceramic body and the coated metallizing layer-forming composition to form and adhere the metallizing layer on the ceramic body,applying metal plating on either or both of the metallizing layer surface to be bonded and the metal body surface to be bonded, andbonding the thus obtained ceramic body and metal body by using a brazing metal.

Abstract: A new material consisting of a multilayer crystalline structure which is coherent perpendicular to the layers and where each layer is composed of a single crystalline element. The individual layers may vary from 2.ANG. to 100.ANG. or more in thickness.

Abstract: Plated memory wire is provided with a nickel-phosphorous alloy protective coating through an electro-deposition process. The protective coating is electrically conductive, nonmagnetic and has a bright surface amenable to good solder bonding. The memory function is provided by a Saccharin-type nickel-iron-cobalt film and the protective overcoating is applied by submerging the wire in an electrolyte bath composed of 360 g/l of nickel sulfate (NiSO.sub.4.6H.sub.2 O), 80 g/l of sodium sulfate (Na.sub.2 SO.sub.4), 60 g/l of sodium hypophosphite (NaH.sub.2 PO.sub.2.H.sub.2 O) and 25 g/l of boric acid (H.sub.3 BO.sub.3). The static bath is maintained at room temperature and the wire is moved through it at approximately eighteen inches per minute. An electro-deposition current density of from 20 to 80 ma./cm..sup.2 of plating area is employed.