Abstract: In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has a an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Abstract: A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (3) a molecular layer comprising at least one molecule having a hydrophilic region and a hydrophobic region, wherein the hydrophilic region at least partially extends into the partially-filled aperture. Also, provided are coated metallic meshes having bilayers and a method of providing a molecular layer to a coated mesh.

Abstract: A method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the cleansed surface of the copper alloy, depositing a NiAl top coat on the bond coat and consolidating the bond coat and the NiAl top coat to form the thermal barrier coating. The bond coat may be a nickel layer or a layer composed of at least one of copper and chromium-copper alloy and either the bond coat or the NiAl top coat or both may be deposited using a low pressure or vacuum plasma spray.

Abstract: The conductive fabric is fabricated by preparing a base fibrous fabric substrate having the form of a woven, non-woven, or mesh sheet, forming a first layer formed on the fibrous fabric substrate in accordance with an electroless plating process, the first layer being made of copper, and forming a second layer as an externally exposed layer, on the first layer continuously, the second layer being made of gold or platinum.

Abstract: An anti-ferromagnetically coupled (“AFC”), high areal density magnetic recording medium of simplified thin film layer structure and having improved thermal stability and signal-to-medium noise ratio (“SMNR”) comprises a stack of thin film layers including, in overlying sequence from a surface of a non-magnetic substrate: (a) a non-magnetic seed layer (“SDL”); (b) at least one non-magnetic underlayer (“UL”); (c) a first ferromagnetic layer (“M1”); (d) a non-magnetic spacer layer (“SPL”); and (e) a second ferromagnetic layer serving as a magnetic recording layer (“M2”); wherein: the first ferromagnetic layer (c) serves as a combined interlayer (“IL”) and “bottom” magnetic layer (“BML”) and the non-magnetic spacer layer (d) provides RKKY-type coupling between the first ferromagnetic layer (c) and the second ferromagnetic layer (e) for stabilizing the medium via anti-ferromagnetic coupling

Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.

Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.

Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.

Abstract: A method for forming a tool 10 and a tool 10 which is comprised of several selectively coupled sectional members, such as members 12, 16, which are placed upon a heat resistant surface 20. A sealing material 24, such as copper in a solid molecular state, is placed around the periphery of the tool 10. The copper in a solid molecular state 24, the heat resistant surface 20, and the tool 10 are placed within a heat source which transforms the copper in a solid molecular state 24 into liquid which flows within the gaps, such as gap 41 and within knife edges 26, 28 which exists within the tool 10. After the copper 24 cools, the cooper 24 reinforces and strengthens the tool 10.

Abstract: A metal transfer sheet which is so low in peel-strength as to be transferred to an object to be transferred with ease and reliability; a producing method thereof; and a ceramic condenser producing method for producing a reliable, compact, thin-layer ceramic condenser with improved production efficiency by transferring a metal layer to the ceramic condenser by using the metal transfer sheet. After a first metal layer is formed on a carrier film in a sputtering or an electrolytic plating method, the member thus formed is dipped in plating solution and voltage is applied in such a way that the first metal layer side is anode, to form a passive film. Sequentially, with the polarity reversed, voltage is applied in such a way that the passive film side is cathode, to form the second metal layer. After this manner, a metal transfer sheet in which the first metal layer and the second metal layer are laminated through the passive film interposed therebetween is obtained.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.

Abstract: A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The film is heated in a temperature range of 70-100° C. for at least five minutes, wherein the fine-grained microstructure is converted into a stable large-grained microstructure. In another embodiment, the plated film is stored, after the step of depositing, at a temperature not greater than −20° C., wherein the fine-grained microstructure is stabilized without grain growth for the entire storage period.

Abstract: A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in terms of weight percentage which, when plotted on a diagram as shown in FIG. 1, falls within a range defined by: the point A (37% Mn, 63% Ni, 0% Cu), the point B (18% Mn, 27% Ni, 55% Cu); the point C (42% Mn, 3% Ni, 55% Cu); the point D (50% Mn, 3% Ni, 47% Cu); and the point E (50% Mn, 50% Ni, 0% Cu), wherein Mn=50% is exclusive.

Abstract: For a two-layer printed wiring board including a polyimide substrate produced with varnish containing polyamic acid as the raw material for the polyimide and a copper alloy foil laminated with the polyimide substrate, there is provided, for the copper alloy foil, a copper alloy containing, in addition to copper and unavoidable impurities, either (1) 0.02 to 1.0 weight percent Ag and/or 0.01 to 0.5 weight percent In or (2) alloy composition (1) plus a total of 0.005 to 2.5 weight percent of at least one of the additional elements Al, Be, Co, Fe, Mg, Mn, Ni, P, Pb, Si, Ti and Zn, or (3) 0.001 to 0.5 weight percent Sn or (4) alloy composition (3) plus a total of 0.005 to 2.5 weight percent of at least one of the additional elements of alloy composition (2) and each of (1), (2), (3) and (4) preferably having a heat resistance of at least 300° C.

Abstract: High-frequency ceramics containing SiO2, Al2O3, MgO, ZnO and B2O3 as constituent components, said ceramics comprising: 30 to 50% by weight of a crystal phase containing ZnO and Al2O3; 5 to 15% by weight of a crystal phase containing SiO2 and MgO; and 40 to 60% by weight of an amorphous phase comprising substantially SiO2 or SiO2 and B2O3; wherein the content of the SiO2 crystal phase is suppressed to be not larger than 6% by weight. The ceramics has a dielectric loss at 60 GHz of not larger than 15×10−4, exhibiting excellent high-frequency characteristics, and is very useful as an insulating substrate for the wiring boards that deal with high-frequency signals.

Abstract: A method is described for producing composite multilayer materials which exhibit optimum properties throughout their entire service life. The composite multilayer material comprises a backing layer, a bearing metal layer, an intermediate layer and an electrodeposited overlay, which exhibits a hardness which increases continuously from its surface in the direction of the bearing metal layer. The method provides for the electrodeposition as overlay of a lead-free alloy with at least one hard and one soft component, the current density being modified within the range of from 0.3 to 20 A/dm2 during the deposition process and/or the temperature of the electroplating bath being modified within the range of from 15° C. to 80° C.

Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Abstract: A component for a gauge comprising a bourdon tube having a first end and a second end. A socket is joined to the first end of the bourdon tube and a closure member is joined to the second end of the bourdon tube. At least one of the bourdon tube and the closure member comprises a copper nickel alloy and/or the socket comprises a nickel silver alloy. In addition, a low temperature soldering material, such as a tin-bismuth soldering material, was used to affix the socket to the bourdon tube and the closure member to the bourdon tube. Preferably, the components contain substantially no free copper. Such a component resists corrosion, especially corrosion formed when certain fluids are used with such components.

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.

Abstract: A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

Abstract: A reduced CTE composite structure is made by providing a matrix material whose CTE is to be reduced, adding negative CTE bodies to the matrix material and mechanically coupling the matrix material to the negative CTE bodies as by deforming the composite structure. A preferred application is to make an improved composite material for use as a heat sink for semiconductor substrates with a minimum of thermal expansion mismatch.

Abstract: A three-layer clad material in which stainless steel is used as the substrate, Ni or an Ni alloy is monolithically pressure-welded to either principal plane of the substrate, and Cu is monolithically pressure-welded to the other principal plane, wherein this high-strength, high-drawability clad material allows the thickness ratio of the stainless steel to be further increased, mechanical strength (tensile strength) to be raised above that of a conventional two- or three-layer clad material, and the thickness of the entire clad material to be reduced. Uniform tension can be created across the entire thin sheet, folding or creasing can be prevented from occurring during pressure welding, the thickness of the thin Ni and Cu sheets prior to pressure welding can be reduced to about 5 &mgr;m, and the thickness ratio of each of the thin sheets in the three-layer clad material for cell cases can be reduced to about 0.

Abstract: The present invention, which is aimed at providing a method for manufacturing a clad material that can be used for the anode cases and cathode cases of button-type microbatteries and other miniature electronic devices requiring the use of comparatively thin, drawable sheets, allows the difference between r values, or Lankford values (which characterize the plastic anisotropy between the rolling/bonding direction of a clad material and a direction at a prescribed angle to the rolling/bonding direction) to be reduced by preforming cold rolling at a reduction of 30% or lower in addition to performing a conventional method for manufacturing a clad material, making it possible to substantially enhance the mechanical strength of the clad material and to mass-produce clad materials that have low reduction anisotropy.

Abstract: An abrasion resistant coating is created by adding a ductile phase to a brittle matrix phase during spray coating where an Al—Cu—Fe quasicrystalline phase (brittle matrix) and an FeAl intermetallic (ductile phase) are combined. This composite coating produces a coating mostly of quasicrystal phase and an inter-splat layer of the FeAl phase to help reduce porosity and cracking within the coating. Coatings are prepared by plasma spraying unblended and blended quasicrystal and intermetallic powders. The blended powders contain 1, 5, 10 and 20 volume percent of the intermetallic powders. The unblended powders are either 100 volume percent quasicrystalline or 100 volume percent intermetallic; these unblended powders were studied for comparison to the others.

Abstract: A corrosion resistant, multi-layer structure on a substrate including an adhesion metallic layer on the substrate, a cushion metallic layer on the adhesion layer, a diffusion barrier layer on the cushion layer, and an impermeable gold layer that encapsulates all the layers, is substantially even on all sides of the layers, and contacts a region on the substrate adjacent the layers to prevent oxidation and corrosion.

Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.

Abstract: A method of coating a metal part that is to be soldered, in particular a part of an electrical connector for high frequency signals, in which method a layer of white bronze is applied to said part. The layer of white bronze is initially covered in a fine layer of palladium, and then in a fine layer of gold.

Abstract: A glass circuit substrate wherein nuclei of Pd (palladium) are placed on a glass substrate and a plating layer of Pd--P (palladium--phosphorus) is placed on the nuclei. A fabrication method of the glass circuit substrate comprises steps of forming nuclei of Pd on a glass substrate; and therefore forming a plating layer of Pd--P on the nuclei.

Abstract: A magnetic device uses laminated ferromagnetic layers containing antiferromagnetically coupled ferromagnetic films coupled together with improved antiferromagnetically coupling (AFC) films. The AFC films are formed of the binary and ternary alloys comprising combinations of Ru, Os and Re. The ferromagnetic film thicknesses, the AFC film thicknesses and the compositions of the films in the laminated layer can be varied to engineer the magnetic properties of the device. The magnetic devices whose properties are improved with the improved laminated layers include spin valve magnetoresistive read heads and magnetic tunnel junction (MTJ) devices for use as magnetic memory cells and magnetoresistive read heads.

Abstract: Clad material comprises a metal substrate which is provided with a multiplicity of perforated openings therein and a metal foil which is laminated on the metal substrate to close the perforated openings. To produce such a clad material, at least one surface of the metal substrate and corresponding one surface of the metal foil are respectively subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surfaces face each other. Alternately, only one surface of the metal substrate is subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surface of the metal substrate defines a laminating surface. It may be possible to provide a nickel plating on the metal substrate or the metal foil. The clad material can be effectively used for producing safety valve chips which rupture accurately at low pressures which fall in a stable pressure range on a mass production basis.

Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN.sub.50) while at least one material layer has a hardness that is less than about 250 (KHN.sub.50).

Abstract: The present invention discloses an exhaust gas catalyst for reducing the pollutant release containing in the exhaust gas. The catalyst includes a primary-core support carrier composed of gamma-phase aluminum oxide. The core-carrier is coated with Y.sub.2 O.sub.3 and ZrO.sub.2 such that the heat resistance is greatly improved. A two-layer active catalytic structure is formed over the core-carrier. An inner catalytic layer is formed with composition active catalytic elements with approximate weight ratios of La:Ce:Mn:Co:Pd:=10-15:10-15:6-10:6-10:0.1-0.3. An outer catalytic layer is then coated over the inner catalytic layer. The outer catalytic layer comprises catalytic active elements. The weight ratio of the active catalytic elements are Y:La:Zr:Cu:Cr:V:Pd:=1-3:2-6:2-6:6-10:10-15:2-6:0.1-0.3.

Abstract: An Mg based article excellent in plating adhesion which is produced with an Mg alloy base material regardless of its kind by forming a Zn layer of an average thickness of 0.60 .mu.m or more, or a Zn deposition of 0.43 mg/cm.sup.2 or more formed on the Mg alloy base material and a method of producing the article with good efficiency are provided.

Abstract: A component of aluminum nitride metallized with a metallizing paste containing: (i) a pulverulent glass of the MnO--Al.sub.2 O.sub.3 --SiO.sub.2 system as an adhesion promotor having a mean particle size of 2-15 .mu.m; (ii) a refractory metal powder having a mean particle size of 1-4 .mu.m; and (iii) an organic resin dissolved in a suitable solvent and/or a screen printing oil is disclosed. The metallizing paste preferably has a viscosity of 50-100 Pa.multidot.s when applied by screen printing, and a viscosity of <5 Pa.multidot.s when applied by dipping. The component of aluminum nitride metallized with the metallizing paste has at least one metal layer deposited on the metallizing paste, and the at least one metal layer applied has a bonding strength given by mean pull-off values of .gtoreq.3.5 kN/cm.sup.2.

Abstract: A method for forming a patterned layer within an integrated circuit. There is first provided a substrate having formed thereupon a blanket target layer. Formed upon the blanket target layer is a blanket focusing layer, where the blanket focusing layer is formed from an organic material and where the blanket focusing layer is susceptible to a reproducible negative etch bias within a first etch method employed in etching the blanket focusing layer to form a patterned focusing layer. There is then formed upon the blanket focusing layer a blanket photoresist layer which is photoexposed and developed to form a patterned photoresist layer. There is then etched through the first etch method the blanket focusing layer to form the patterned focusing layer while employing the patterned photoresist layer as a first etch mask layer. The patterned focusing layer so formed has the reproducible negative etch bias with respect to the patterned photoresist layer.

Abstract: A ceramic circuit board is characterized by being constituted by bonding a ceramic substrate 2 and a metal circuit plate 3 to each other through a silver-copper-based brazing material layer 5 containing at least one active metal selected from Ti, Zr, Hf, V, Nb and Ta, and wherein the Vickers hardness of a reaction product layer 6 generated by causing the silver-copper-based brazing material layer 5 and the ceramic substrate 2 to react with each other is 1,100 or more. At least one element selected from In, Zn, Cd, and Sn is preferably contained in the silver-copper-based brazing material layer 5. Further, 0.1 to 10.0 wt % of carbon powder is preferably contained in the brazing material layer 5. According to the above arrangement, there can be provided a ceramic circuit board in which cracks are effectively suppressed from being formed even after a thermal cycle is repeatedly applied for a long period of time, i.e.

Abstract: A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.

Abstract: It is an object of the present invention to provide a magnetoresistance effect element which has a film with a spin valve structure or an artificial lattice film having good soft magnetic characteristics, and which can be applied to a high-sensitivity magnetic head. The present invention provides a magneto-resistance effect element including a stacked film formed on a substrate by sequentially stacking a ferromagnetic film containing as its main constituents at least one elements selected from the group consisting of Co, Fe, and Ni, a nonmagnetic film, and the ferromagnetic film, wherein the two ferromagnetic films are not coupled with each other, and the closest packed plane of each ferromagnetic film is oriented in a direction perpendicular to the film surface.

Abstract: A heat insulating film comprises a plastic film, a surface metal layer coating the plastic film, a thin metal layer coating the surface metal layer and a protective membrane layer coating the thin metal layer. The surface metal layer has crystal grains having flat upper surfaces and the thin metal layer has flat crystal grains disposed in a single grain layer and formed and overlying respective flat upper surfaces of the crystal grains of the surface metal layer. Heat rays which irradiate on the heat insulating film pass freely through the protective membrane layer but are reflected by the crystal grains of the thin metal layer. Absorption of heat rays by the heat insulating film is remarkably suppressed.

Abstract: Disclosed is a magneto-resistance effect element indicating a larger magneto-resistance effect at room temperature under impression of low magnetic field is obtained with the construction wherein the characteristics of artificial metallic lattice membrane are exploited.

Abstract: In the present invention, electrons flow through a free or excitable magnet, or reflect from it, to make its magnetization respond. To accomplish this, the spin vectors of the flowing electrons are preferentially polarized by an auxiliary ferromagnet, whose moment orientation is fixed. The electrons flow between the fixed and free ferromagnets through a non-magnetic metallic spacer which is thick enough to make the static inter-magnetic exchange coupling negligible. While transmitting thru or reflecting from the free ferromagnet, the spins of the moving electrons interact by quantum-mechanical exchange with the local, permanently present, spontaneously-polarized electron spins of the free magnet. This interaction causes a transfer of vectorial angular momentum between the several metallic layers in the device which causes the magnetization vector of the free magnet to change its direction continually with time. Thus excited, the magnetization vector will precess about its original axis.

Abstract: It is an object of the present invention to provide a magnetoresistance effect element which has a film with a spin valve structure or an artificial lattice film having good soft magnetic characteristics, and which can be applied to a high-sensitivity magnetic head. The present invention provides a magnetoresistance effect element including a stacked film formed on a substrate by sequentially stacking a ferromagnetic film containing as its main constituents at least one elements selected from the group consisting of Co, Fe, and Ni, a nonmagnetic film, and the ferromagnetic film, wherein the two ferromagnetic films are not coupled with each other, and the closest packed plane of each ferromagnetic film is oriented in a direction perpendicular to the film surface.

Abstract: In an artificial superlattice magnetoresistance effect element in which two or more of magnetic thin film layers having different coercive forces are stacked with intervening of a non-magnetic film layer and resistance changes depending on directions of magnetization in adjacent magnetic thin film layers by utilizing differences in the coercive forces, an anisotropy magnetic field Hk is increased by reducing a thickness of a soft magnetic layer, anisotropy in the magnetic thin film layer is obtained by forming the magnetic thin film layer in a magnetic field to thus increase the Hk, a material having large Hk is used as a soft magnetic material for the soft magnetic layer, and further the anisotropy is obtained by reducing a pattern width into 1-30 .mu.m to thus increase the Hk, whereby the resistance change is achieved in the neighborhood of a zero magnetic field and thus no bias mechanism is required.

Abstract: Disclosed is a magneto-resistance effect element indicating a larger magneto-resistance effect at room temperature under impression of low magnetic field is obtained with the construction wherein the characteristics of artificial metallic lattice membrane are exploited.

Abstract: A ceramic substrate has a five-layered thin metallic film thereon. The first layer is Ti, Zr, Cr and/or W; the second layer is Ni and/or Mo; the third layer is one or more metals of group Ib in the periodic table; the fourth layer contains the same metals as the second layer and the fifth layer contains the same metals as the third layer.

Abstract: There is disclosed a magnetoresistance effect element including a multilayer constituted by a magnetic layers in which fine magnetic metal particles of crystalline or amorphous containing at least one element of Fe, Co, and Ni are dispersed in a matrix containing at least one element selected from the group consisting of noble metals and Cu, and non-magnetic layers containing a noble metal.

Abstract: Printed circuit board having excellent peel strength and conductance resistance is provided with a substrate, a resin insulating layer formed thereon and roughened at its surface, and a conductor formed thereon, in which at least a portion of the conductor is composed of an eutectic metal layer.

Abstract: A rotary seal member, such as a gas turbine engine blade, is provided with an improved surface layer which has an elastic modulus matched with the elastic modulus of a substrate of the member. Also, the surface layer does not form a brittle intermetallic with the substrate at an intended operating temperature. In one form, the surface layer includes abrasive particles adapted to inhibit chemical reaction with the layer material. One specific example is a Ti-alloy substrate having a metallurgically bonded layer based on Nb, and including cubic boron nitride abrasive particles coated with cobalt entrapped in the layer.