Abstract: A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.

Abstract: When hard-substance parts are soldered onto steel bases, thermal stresses are produced between the hard substance and the steel. These stresses can be reduced by means of using a multilayer solder in which the middle layer consists of a precipitation-hardenable copper alloy or nickel alloy provided on both sides with a layer of a hard-solder alloy whose working temperature is at least 50.degree. C. below the melting point of the precipitation-hardenable copper alloy or nickel alloy. A tempering treatment at 250.degree. to 550.degree. C. is carried out after the soldering in order to achieve a precipitation hardening of the middle layer.

Abstract: Dielectric ceramics a microwave device made of (Bi.sub.2 O.sub.3).sub..times. (Nb.sub.2 O.sub.5).sub.1-x includes at least one of subcomponents of CuO and V.sub.2 O.sub.5, wherein the composition ratio x is fallen into a range of 0.48.ltoreq..times..ltoreq.0.51, an atomic ratio AR1 defined by the following equation:AR1=(the number of Cu atoms of the CuO)/ARO,whereARO=(the number of Bi atoms of the (Bi.sub.2 O.sub.3).sub.x (Nb.sub.2 O.sub.5).sub.1-x)+(the number of Nb atoms of the (Bi.sub.2 O.sub.3).sub.x (Nb.sub.2 O.sub.5).sub.1-x)is fallen into a range of 0<AR1< 0.01, and another atomic ratio AR2 defined by the following equation:AR2=(the number of V atoms of the V.sub.2 O.sub.5)/AROis fallen into a range of 0<AR2.ltoreq. 0.02.

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract: An electric contact material comprising 0.01 to 2.0 weight % of Li, 0.01 weight % or more to less than 0.2 weight % of at least one rare earth metal and the remainder being Ag. The electric contact material may further comprise 0.1 to 1.0 weight % of at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi, however, for Zn and Mn, the amount is less than 0.5 % by weight; and/or 0.03 to 0.6 weight % of at least one element selected from a group consisting of Fe, Ni and Co. The electric contact material is excellent in arc resistance, wear resistance and lubricity in a small current region and is suitable as a material for a slide contact and a rotary slide contact.

Abstract: A solder coating is applied to a metallized ceramic part in that at least two layers, in each case composed of nickel, copper, silver, zinc or tin, are applied chemically or galvanically. Under the soldering conditions molten solder metal forms on these layers. Useful layers for hard solders are those which are in each case composed of Ni, Cu or Ag. For example, a layer of nickel, copper or silver, with a layer thickness of at least 0.5 .mu.m, can be first applied to the metallized ceramic part, followed by at least one further layer of nickel, copper or silver with a layer thickness of 10-105 .mu.m, until a total layer thickness of 15-300 .mu.m is obtained.

Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.

Abstract: Disclosed herein is a process for the electrodepositing multiple layers of fine gold and bright nickel upon a substrate layer. Fine gold is defined as being 99.99% pure. By insulating bright nickel between layers of fine gold, the galvanic effect is substantially reduced. This process is uniquely suited to jewelry products, where the substrate layers are ordinarily composed of brass.

Abstract: A composite consists of a ceramic brazed to another ceramic by means of a joint layer therebetween. The joint layer comprises a porous metal interlayer and an active brazing filler metal penetrating through the porous metal interlayer.

Abstract: An article comprising a non-conductive substrate having a sub-micron thickness of an oxidizable conductive first metal coating thereon, and a second (promoter) metal which is galvanically effective to promote the corrosion of the first metal, discontinuously coated on the first metal coating. Optionally, the second metal-doped, first metal-coated substrate may be further coated with a salt, to accelerate the galvanic corrosion reaction by which the conductive first metal coating is oxidized. Also disclosed is a related method of forming such articles, comprising chemical vapor depositing the first metal on the substrate and chemical vapor depositing the second metal on the applied first metal coating, and of optionally applying a salt by salt solution contacting of the second metal-doped, first metal-coated substrate. When utilized in a form comprising fine-diameter substrate elements such as glass or ceramic filaments, the resulting product may be usefully employed as an evanescent chaff.

Abstract: An electrically conductive composite material is formed by dispersing in a matrix metal the other metal which is not solid soluble with the matrix metal. The other metal is finely divided to an extent of not excessively lowering the conductivity and is mixed in the matrix metal in a particle amount with which respective particles keep a mutual distance effective to strengthen the composite material, whereby the material is sufficiently improved in the mechanical strength and wear resistance and remarkably reduced in the high temperature deformation. Such conductive composite material can be obtained through a melt atomization.

Abstract: A ceramic or glass having a thin layer of silver, gold or alloys thereof at the surface thereof. A first metal is bonded to the thin layer and a second metal is bonded to the first metal. The first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Tl and alloys thereof, and the second metal is selected from the class consisting of Cu, Al, Pb, An and alloys thereof.

Abstract: A metallized article (10) having a non-conductive surface (11) and a plurality of depressions (12) in the surface (11). A first layer of metal (13) being mechanically bonded to the non-conductive surface (11), such that the mechanical bond is enhanced by the interaction of the first layer of metal (13) and the depressions (12). An intermediate layer of metal (14) bonded to the first layer (13). A finish layer of metal (15) being bonded to the intermediate layer (14). The finish layer (15) being a metal which readily accepts a high polish or shine. A process for metallizing such an article having a non-conductive surface including the steps of etching the surface of the article with fluoride containing salts and the depositing of a first layer of metal onto the etched surface. The process further including depositing an intermediate layer of metal in an electroless manner, and then depositing a finish layer of metal by electrolysis.

Abstract: A ceramic and metal bonded composite comprising an intermediate metal plate interposed between a ceramic member and a metal member and brazed thereto, the intermediate metal plates carries on its juncture surface a central square projection having substantial area, pins arranged near the four corners and fins between the corners, the central square projection mechanically and thermally couples the ceramic member and the metal member together with the brazing layer and the pins and fins also mechanically and thermally couple the both members together with the brazing layer, while permitting relative displacement between the both members through their plastic deformation, thereby preventing crack generation in the ceramic member.

Abstract: A metallic composite alloy composition useful in electrical components comprises at least one base metal alloy constituent metallurgically bonded to at least one noble metal alloy constituent. A process for producing the metallic composite alloy comprises metallurgically bonding of the base metal alloy to the noble metal alloy. The metallic composite alloy is particularly useful in fabricating an electrical contact and spring member assembly in which the contact portion comprises at least one noble metal alloy and the spring member comprises at least one base metal alloy.

Abstract: An aqueous coating composition is provided for thermoplastic films comprising(i) from 1 to 10 weight percent based upon the total weight of the coating composition, of a sulfonated copolyester consisting essentially of the polyester condensation product of the following monomers or their polyester-forming equivalents:(A) about 65 to 95 mole percent of isophthalic acid;(B) about 0 to 30 mole percent of at least one aliphatic dicarboxylic acid of the formula HOOC(CH.sub.2)--.sub.n COOH, wherein n ranges from about 1-11;(C) about 5 to about 15 mole percent of at least one sulfomonomer containing an alkali metal sulfonate group attached to a dicarboxylic aromatic nucleus; and(D) stoichiometric quantities of about 100 mole percent of at least one copolymerizable aliphatic or cycloaliphatic alkylene glycol having about from 2 to 11 carbon atoms,(ii) from 0.

Abstract: A member for a semiconductor apparatus for carrying or holding a semiconductor device, obtained by joining an aluminum nitride substrate and a radiating substrate, comprises an insulating member formed by an aluminum nitride sintered body to be provided thereon with the semiconductor device, a radiating member to be joined to the insulating member, which radiating member is mainly formed of a copper-tungsten alloy or a copper-molybdenum alloy, a stress relieving member interposed between the insulating member and the radiating member and a silver solder member for joining the insulating member, the stress relieving member and the radiating member with each other.

Abstract: A filler metal for brazing parts made of superalloys has a brazing temperature of 1025.degree.-1080.degree. C., a solidus temperature above 1000.degree. C., a liquidus temperature above 1018.degree. C. and a composition of, in weight percent, 5-30 gold, 15-35 palladium, 10-30 nickel, 20-48 copper, 5-25 manganese.

Abstract: A method for processing a copper alloy wherein the alloy comprises from 0.2-1.0% beryllium, 1.4-2.2% nickel or cobalt and remainder copper. Said method comprising one or more processing steps and characterized in that said steps conclude with cold working the alloy to an area reduction of at least 99% followed by a batch annealing at a temperature of 750.degree.-950.degree. F. for a period of 1-4 hours.

Abstract: It is disclosed that a metal cored board which comprises an electrically conductive layer whose one surface at least composed of a hardly oxidizable metal, an insulating organic polymer layer baked on the surface of the hardly oxidizable metal, and a metal core adhered on the insulating organic polymer layer, and a method for manufacturing a metal cored board, which comprises a step to coat the surface of a hardly oxidizable metal layer of an electrically conductive metal foil with an insulating varnish, a step to bake a layer of the varnish, and a step to adhere a metal core on the baked varnish layer.

Abstract: A process for producing silver-coated potassium titanate fibers comprises admixing the potassium titanate fibers with a silver ion solution containing a reducing agent. The resulting silver-coated potassium titanate fibers can, if desired, be provided with one or more additional metal coatings superimposed on the silver coat wherein the additional metal is other than silver.

Abstract: Nickel material comprising controlled amounts of hydrogen has low electrical contact resistance even after prolonged exposure to an oxidizing ambient. When used as a surface layer on an electrically conducting member, such material is suitable as a contact material and represents an inexpensive alternative to gold. And, when prepared in the form of microscopic flakes, such material is suitable for use in electrically conductive inks and adhesives.

Abstract: A wire having a tensile strength of at least 95 psi and conductivity of at least 60 percent IACS is provided. The wire is manufactured from a precipitation hardenable alloy, the alloy consisting essentially of about 0.38 percent beryllium, 1.66 percent nickel or cobalt and the remainder copper. The manufacture comprises one or more processing steps concluding with cold working the alloy to a wire and an area reduction of at least 99 percent.

Abstract: One or both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.

Abstract: A heterogeneous wire is disclosed which has a cladding comprising fibers of tungsten and fibers of copper and a core of the eutectic mixture of copper and silver. This eutectic mixture also connects the fibers of the cladding to each other. The wire has a high tensile strength, a low resistivity and a high ratio between these specific properties. As a result, the wire, which has a diameter of less than 50 .mu.m, is particularly suitable to be embedded in a pane.

Abstract: It is disclosed that a metal cored board which comprises a base metal core, an easily solderable metal plating layer formed on one surface of the base metal core, an electrically insulating layer formed on the another surface of the base metal core, and an electrically conductive metal layer formed on the electrically insulating layer, a method for manufacturing a metal cored board, which comprises a step to plate both surface of a base metal core with an easily solderable metal, a step to form an electrically insulating layer on one surface of the easily solderable metal plating layer, and a step to form an electrically conductive metal layer on the electrically insulating layer.

Abstract: The bond strength between a silicon carbide substrate and a metal layer comprised of a series of metal films is improved without detrimentally affecting other properties of such a device by interposing a layer of silicon, Si.sub.2 Mo or mixtures thereof between the substrate and the first metal film in the layer which is preferably Ti, Zr or Hf.

Abstract: Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of copper to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. A copper preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing material to add Ni and copper to the melt.

Abstract: A clad brazing filler for use in bonding a ceramic to a metal, glass or another ceramic having a substantially different thermal expansion coefficient, and composites using such a filler. According to one aspect of the invention, a brazing filler of a clad type is provided which is composed of a titanium layer adjacent a silver, copper or silver-copper alloy layer, or a combination of silver and copper layers, with the titanium content being in a range of 3 to 80% of the total weight of the layers of the assembly. In accordance with another aspect of the invention, a brazing filler of the clad type is provided which combines the layer arrangement of the first aspect with either a layer of a metal having a low thermal expansion coefficient, a layer of a metal having a low Young's modulus, for a combination layer of both, arranged in any order.

Abstract: An electrical contact comprises a base metal and an electroplated nickel layer thereover wherein said nickel layer is preferentially oriented in a <111> crystallographic plane along the surface of the nickel.

Abstract: Paired metal force-transmitting machine elements are protected against fretting corrosion under dynamic or oscillating load or stress conditions by a protection layer between pairing surfaces, whereby a direct contact between these pairing or junction surfaces is avoided. The protection layer is a material having a different composition than that of the machine elements. The protection layer is applied between the paired surfaces and to at least one of the paired surfaces. The protection layer has a different crystal structure and a lower hardness than titanium material of which the machine elements are made. The protection layer is galvanically applied and is advantageously of copper, aluminum or silver, whereby the thickness is 5-50 .mu.m. In this way the fretting fatigue durability of machine elements made completely or partially of titanium materials is greatly improved in a simple manner.

Abstract: Solar insulating window film comprising a sheet of substantially transparent flexible polymer thin film plastic material having first and second surfaces. First, second and third layers are adherent to the first surface of the film. The second layer is formed of copper. The first layer is formed of a material which possesses substantially the same nobility as copper or is inert to copper. The first layer counting from the first surface is formed of a material selected from nickel and palladium and oxides and sulfides thereof. The third layer counting from the first surface is formed of a material selected from nickel, palladium and chromium and oxides and sulfides thereof.

Abstract: A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.

Abstract: In the manufacture of a formed contact part of a metal alloy, wherein the formed part is shaped in one or more manufacturing operations without the removal of metal to produce a contact element, the improvement which comprises forming from the alloying constituents a composite material in which the alloying constituents are heterogeneously embedded, the composite material being formed into the contact part without the removal of metal and, after forming, heating the contact part so as to convert the composite material into a homogeneous alloy. The process is particularly applicable to silver-palladium alloys where the alloy would not itself be suitable for the forming operation.

Abstract: A soldering foil having a multi-layer structure for the stress-free joining of ceramic bodies to metal is described along with a process for making the foil. The soldering foil contains two layers of an active solder, particularly a Cu/Ti solder, provided with an intermediate cushion layer, preferably of copper, which absorbs the stresses. Between the copper cushion layer and the active solder layers barrier layers of silver are arranged which are very thin in relation to the copper and solder layers. The soldering foil permits a low-stress and extremely durable connection to be established between metal and ceramic, simultaneously permitting relatively large deviations in the temperature and time parameters of the soldering process.

Abstract: To prevent interference from secondary electron emission, a base member, as of a waveguide, which in operation is exposed to high frequency electric fields is provided with a coating comprising a rough surface layer having a thickness less than its skin depth, and a further layer of high electrical conductivity between said rough layer and said base member, the thickness of said further layer being substantially larger than its skin depth. The rough layer preferably has a ratio of mean depth to mean pitch of its random corrugations substantially larger than 1:2.

Abstract: This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

Abstract: An ornamental composite material has a covering of an Ni-, Au-, Ag- or Cu-base alloy, and a core of a mineral powder aggregate. A layer of a metal different from the metals of the alloy of the covering can be clad on the inner surface of the covering as needed. The ornamental composite material is preferably used for various parts of a spectacle frame.

Abstract: A metal-ceramics composite material is produced by forming a metal film comprised of three layers on a ceramic substrate, and laminating a metal member thereon, the metal film comprising first layer of Group IV a metal, second layer of Group VIa metal and third layer of Group Ib metal, wherein the first and second layers are formed by gas deposition technique and the Group Ib layer may be formed by gas deposition technique or electrochemical plating. An additional Group VIII metal layer may be interposed between Group VIa layer and Group Ib layer by gas deposition technique.

Abstract: A silver-coated electric material wherein a partial or total surface of an electroconductive or non-electroconductive substrate is provided with a coating of silver or silver alloy, having the first intermediate coating layer made of Ni, Co, Cr, Pd or their alloys and the second intermediate coating layer made of Sn, Cd, Pd, Ru or their alloys between the silver coating and the surface of the substrate, and the method of preparing the same.

Abstract: Shielding means comprising a non-conductive base material having thereon a combined electrolessly-deposited metal layer of copper over lain with a second layer.

Abstract: This invention relates to brazing alloys for use primarily in jewellery manufacture having compositions consisting of 30 to 80 weight % gold, 0 to 20 weight % silver, 20 to 60 weight % copper, 5 to 20 weight % zinc, 0 to 5.0.% of a group VIII metal as a grain refiner for gold, and 0.5 to 3.0 weight % indium. These alloys have desirable properties, particularly in the 14 karat gold range, without the health hazards associated with the use of cadmium.

Abstract: Flexible selective energy control sheet construction formed of a sheet of substantially transparent polymer thin film plastic material having first and second surfaces. A substantially transparent continuous adhesion promoting layer is adherent to the second surface of the sheet. A substantially transparent metal layer is adherent to the adhesion promoting layer and a protective layer is adherent to the metal layer. The metal layer is selected from the materials of copper and silver.

Abstract: The top surface metallurgy of LSI chip carriers is improved by multiple and phased interface of metal layers which enable such metallurgies to be suitable for joining by solder reflow and wire bonding techniques. The modifications result in separating the solder bonding metallurgy from the fan-out conductor metallurgy with an intermediate layer of a metal such as Cr or Ti which prevents the formation of intermetallic alloys which are mechanically weak or brittle and tend to fracture because of thermal fatigue stresses caused by thermal cycling during either multiple (up to 50) solder bonding reflow operations or operation of the circuit. The fan-out metallurgy conductors are preferably composed of Cr-Cu-Cr layers covered by at least one upper metal layer which is separated from the Cu of the conductor by means of a metal such as phased layers of Cr or Ti deposited before the other upper metal layer or layers. Solder ball bonding surfaces are composed of additional metal in the form of Au, Cu and Ni.

Abstract: A permanently solderable palladium-nickel electroplated coating is formed on electrically conductive surfaces. The coating has a first alloy layer of 46 to 82 atomic percent palladium and 18 to 54 atomic percent nickel. This first layer is covered by a continuous second layer of 96 to 100 atomic percent metallic palladium and 0-4 atomic percent nickel. The second layer has a thickness of up to twenty angstroms. The second layer is formed by dipping the first layer in a solution of sulfuric or hydrochloric acid.

Abstract: There is described an electrical contact piece made of a silver-metal oxide material as contact coating, a carrier made of copper, or iron and an intermediate layer which furnishes a high adhesive strength of the contact coating to the contact carrier even at a high number of switchings. The intermediate layer consist essentially of a silver alloy having 2 to 12 weight % of tin, indium, and/or germanium.

Abstract: A stainless steel thermos bottle comprising inner and outer bottles made of stainless steel, the inner and outer bottles being joined together at tip portions of their bottlenecks to form a double-walled construction, the space created between the two bottles being a vacuum. The surfaces of the inner and outer bottles that surround the space are provided with at least one metal deposit at least on an outer surface of the inner bottle, except for a part or all of the bottleneck surfaces in the space. The part or all of the bottleneck surfaces in the space includes the surface of the joint between the two bottles.

Abstract: A multifiber electrical brush formed of an electrically conductive matrix material having plural electrically conducting fiber wires embedded therein and extending therefrom, wherein the fiber wires have a diameter varying from 1 to 120.mu.m, a length on the order of 100 times greater than the diameter thereof, and a packing density between 1-25%. Suitable materials for the fiber wires are platinum, gold, silver, copper, palladium, or niobium which may be embedded in a copper, silver, or other suitable matrix material, or copper embedded in an aluminum matrix. The fiber wires may be provided with a coating of a suitable barrier material on the lateral surfaces thereof as may be required to protect the fiber wires from etching during removal of the matrix material, or to prevent and/or retard interdiffusion between the matrix material and the fiber wire material during annealing or hot-forming of brush stock, and/or to impart improved electrical performance to the resultant electrical brush.

Abstract: An electrical connector arrangement comprises a first element adapted to be in contact for substantial periods of time with a second element. The first element comprises a first metal substrate having an outer layer of a copper base alloy comprising from about 2 to about 12% aluminum, about 0.001 to about 3% silicon, and the balance essentially copper. The second element comprises a second metal substrate having a gold or gold base alloy contact surface.

Abstract: This invention is a method for depositing on an article a coating containing at least one member of the group metals and metal alloys plus particulate dispersed diamond comprising contacting the surface of the article with a stable electroless plating bath consisting essentially of an aqueous solution of soluble constituents of the group, electroless reducing agent therefor, a suspension of diamond particles therein and a stabilizer, and maintaining the diamond particles in suspension throughout the bath during the coating of the article for a time sufficient to produce a preselected depth of coating on the article, and the coated article pe se.This is a reissue of a patent which was the subject of a reexamination certificate No. B1 Re. 29,285, dated July 5, 1983, Request No. 90/000,120, Dec. 3, 1981.