Abstract: Organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that in a first aspect comprise a crosslinker component that comprises a structure of the following Formula (I):

Abstract: Provided is an anti-reflection coating composition. The anti-reflection coating composition includes an active component and a solvent B. The active component includes a matting resin A, a catalyst C, and a crosslinking agent D. The weight average molecular weight of the matting resin A is less than or equal to 20000. Also provided is use of the anti-reflection coating composition.

Abstract: A hard-mask forming composition including a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0), wherein Ar01 and Ar02 are aromatic hydrocarbon groups which may have a substituent, Ar02 has at least one nitrogen atom or oxygen atom, L01 and L02 are each independently a single-bonded or divalent linking group, and X is NH4 and the like

Abstract: A liquid supply device includes: a storage tank configured to store a processing liquid including a first processing liquid (sulfuric acid) and a second processing liquid (hydrogen peroxide solution); a circulation path having a first pipeline through which the processing liquid passes in a horizontal direction, and configured to circulate the processing liquid stored in the storage tank; a branch path configured to supply the processing liquid to a processing unit; and a branching part having an opening for allowing the processing liquid to flow out from the first pipeline to the branch path, wherein the opening is formed in the branching part and formed below a periphery of the first pipeline when the first pipeline is viewed in section.

Abstract: A method for forming reliefs on a face of a substrate is provided, successively including forming a protective screen for protecting at least a first zone of the face; an implanting to introduce at least one species comprising carbon into the substrate from the face of the substrate, the forming of the protective screen and the implanting being configured to form, in the substrate, at least one carbon modified layer having a concentration of implanted carbon greater than or equal to an etching threshold only from a second zone of the face of the substrate not protected by the protective screen; removing the protective screen; and etching the substrate from the first zone selectively with respect to the second zone.

Abstract: A photosensitive element, particularly a photopolymerizable printing form precursor; a method of preparing the photosensitive element to form a printing form for use in relief printing; and a process of making the photosensitive element are disclosed. The printing form precursor includes a layer of a photosensitive composition, a digital layer that is adjacent to a side of the photosensitive layer, and a cell pattern layer that is disposed between the photosensitive layer and the digital layer. The cell pattern layer includes a plurality of features, and is composed of an ink that is opaque to actinic radiation and transparent to infrared radiation. Since the cell pattern layer is integral with the printing form precursor, digital imaging can occur rapidly with relatively low resolution optics to form a mask without needing to also form a microcell pattern of the digital layer.

Abstract: A patterning stack and methods are provided for semiconductor processing. The method includes forming a graded hardmask, the graded hardmask including a first material and a second material with extreme ultraviolet (EUV) absorption cross sections for absorption of EUV wavelengths, the second material configured to provide adhesion to photoresist materials. The method also includes depositing a photoresist layer over the graded hardmask. The method additionally includes patterning the photoresist layer. The method further includes etching the graded hardmask. The method also includes removing the photoresist layer.

Abstract: The electro-optical device includes a first substrate including a plurality of pixel electrodes, a second substrate facing the first substrate, and an electro-optical layer disposed between the first substrate and the second substrate. The first substrate is provided with a spacer protruding from a position overlapping with a portion between adjacent pixel electrodes toward the second substrate, and an insulating protective film is provided between the spacer and the pixel electrode. The spacer is made of a metal material such as titanium nitride, and a surface of the spacer is covered with an insulating film. A first oriented film overlaps the spacer with the insulating film interposed therebetween. The first substrate is formed with a recessed portion that is recessed toward a substrate body, and a root portion of the spacer is embedded in the recessed portion.

Abstract: A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 ?m.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a liquid supplier configured to supply liquid to a film on a substrate and cause a substance to dissolve from the film in the liquid. The apparatus further includes a first channel configured to recover the liquid supplied to the film and feed the liquid again to the liquid supplier, and a second channel configured to drain the liquid supplied to the film. The apparatus further includes a first switching module configured to switch a discharge destination of the liquid supplied to the film between the first and second channels, and a second switching module configured to switch between supplementing and not supplementing the first channel with new liquid. The apparatus further includes a controller configured to control the first and second switching modules to adjust concentration of the substance in the liquid to be supplied to the film.

Abstract: A laser-engravable pad printing plate comprising at least (a) a metal support, (b) an adhesion layer, (c) a laser-engravable recording layer having a layer thickness of 20 ?m to 200 ?m, (d) a cover film, characterized in that the laser-engravable recording layer (c) comprises (c1) 40 to 95 wt % of a polyvinyl alcohol, (c2) 5 to 50 wt % of an IR absorber, (c3) 0 to 30 wt % of an inorganic filler, (c4) 0 to 20 wt % of a crosslinker, and (c5) 0 to 10 wt % of further additives.

Abstract: A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: (wherein A1 is a C2 or C3 alkenyl group or alkynyl group, and A2 is a C2 alkenylene group or alkynylene group).

Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.

Abstract: A method for determining hydration of a polymer includes mixing a water-soluble, powdered dye with a powdered polymer and introducing the mixed water-soluble, powdered dye and powdered polymer into a water-based fluid. Full hydration of the powdered polymer is determined when the mixed water-soluble, powdered dye, powdered polymer and water-based fluid comprises substantially no internal optical contrast.

Abstract: A method for fabricating an optical element is provided. The fabrication method includes the following steps. A substrate is provided. A plurality of metal grids are formed on the substrate. A first organic layer is formed on the substrate between the plurality of metal grids. A second organic layer is formed on the first organic layer and the plurality of metal grids. The second organic layer and the first organic layer are etched to leave the plurality of metal grids and a plurality of patterned second organic layers on the plurality of metal grids. An optical element fabricated by the method is also provided.

Abstract: Provided is a positive type lithographic printing plate precursor including at least: a support which has a hydrophilic surface or a hydrophilic layer; and an underlayer, an interlayer, and an upper layer on the support in this order, in which the underlayer contains a polymer compound 1 which has at least one structure selected from the group consisting of a urethane bond, an acetal structure, and a urea bond in a main chain, the interlayer contains a polymer compound 2 which has at least one structure selected from the group consisting of a sulfonamide group, an active imide group, and a urea bond in a side chain, the upper layer contains a polymer compound 3 which has a phenolic hydroxy group, and one or more layers among the underlayer, the interlayer, and the upper layer contain an infrared absorbent.

Abstract: Photoresist topcoat compositions, comprising: a first polymer comprising a first repeat unit of general formula (I) and a second repeat unit of general formula (II): wherein: R1 independently represents H, F or optionally fluorinated C1 to C4 alkyl; R2 represents optionally fluorinated linear, branched or cyclic C1 to C20 alkyl; L1 represents a single bond or a multivalent linking group; and n is an integer of from 1 to 5; a second polymer comprising a first repeat unit of general formula (III) and a second repeat unit of general formula (IV): wherein: R3 independently represents H, F or optionally fluorinated C1 to C4 alkyl; R4 represents linear, branched or cyclic C1 to C20 alkyl; R5 represents linear, branched or cyclic C1 to C20 fluoroalkyl; L2 represents a single bond or a multivalent linking group; and n is an integer of from 1 to 5; and a solvent. Coated substrates coated with the described topcoat compositions and methods of processing a photoresist composition are also provided.

Abstract: A film and method of forming a film provides an unmodified starting layer of a starting material, the starting layer having opposed first and second surfaces and an initial thickness, T1, and a modified surface layer of thickness T2 which is less than T1, formed in at least a portion of the second surface, wherein a portion of the modified surface layer is not supported by unmodified starting material removed from the first surface opposite the modified surface layer.

Abstract: Organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a diene/dienophile reaction product. Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer.

Abstract: A digitally imageable, photopolymerizable flexographic printing element that includes, disposed one above another in order, at least a dimensionally stable support, at least one photopolymerizable, relief-forming layer having a layer thickness of 300-6000 ?m, including at least one elastomeric binder, an ethylenically unsaturated monomer, and a photoinitiator or a photoinitiator system, an oxygen-blocking barrier layer which is transparent to UVA light and has a layer thickness of 0.3-5 ?m, a laser-ablatable mask layer having a layer thickness of 0.3-5 ?m, including at least one elastomeric binder and a material which absorbs UV/VIS light, and a removable outer film, wherein the at least one relief-forming layer, the barrier layer and the mask layer are soluble or dispersible in an organic solvent, and the barrier layer includes at least one oxygen-blocking binder and an oligomeric or polymeric basic adhesion component.

Abstract: Provided are topcoat compositions that include: a matrix polymer; a surface active polymer; an ionic thermal acid generator comprising an anion and a cation, wherein the anion, the cation, or the anion and the cation are fluorinated; and a solvent. Also provided are coated substrates and pattern-forming methods which make use of the topcoat compositions. The invention has particular applicability in photolithographic processes as a photoresist topcoat layer in the manufacture of semiconductor devices.

Abstract: A grating for line-narrowing a laser beam that is outputted from a laser apparatus at a wavelength in a vacuum ultraviolet region may include: a grating substrate; a first aluminum metal film formed above the grating substrate, the first aluminum metal film having grooves in a surface thereof; and a first protective film formed by an ALD method above the first aluminum metal film.

Abstract: Photopolymerizable, preferably digitally imageable photopolymerizable, flexographic printing elements having a PET support sheet of low thermal shrinkage, methods of preparing such flexographic printing elements and their use for making flexographic printing plates by imagewise exposure to light, washing out with organic solvents and drying, wherein said drying is carried out at temperatures of more than 60° C.

Abstract: A liquid can be delivered with a simple configuration. A liquid delivery method includes allowing a liquid to flow in a tube having elasticity depending on a pressure of a gas filled in an inner space between a tube housing covering an outside of the tube and an outer surface of the tube; obtaining a magnitude of a pressure of the liquid flowing in the tube as a first value; obtaining a magnitude of the pressure of the gas filled in the inner space as a second value; calculating a difference between the first value and the second value as a third value; and detecting a status of the tube on the basis of the third value.

Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.

Abstract: A process for printing multiple layers on a fabric or other material using UV-curable ink that includes a step of printing a first layer on the material and another step of partially curing the first layer. A next step includes printing a partially UV-transparent layer over the first layer and fully curing the UV-transparent layer while simultaneously fully curing the first layer.

Abstract: The present invention relates to a process for producing a surface-functionalized molding (oF) having a functionalized surface (fO). In this process a surface (O) of a molding (F) is brought into contact with a dienophile-containing solution (dL). The surface (O) comprises a polyamide (P) which comprises furan units. These furan units are able to react with the at least one dienophile present in the dienophile-containing solution (dL) to give the surface-functionalized molding (oF) having the functionalized surface (fO).

Abstract: The present invention relates to a novel multipurpose polymer and a composition containing the same. The polymer and the composition of the present invention are very useful for preparing a semiconductor device having very good mechanical and optical properties.

Abstract: There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Abstract: An anti-reflective hardmask composition is provided.

Abstract: The inventions are an optical film containing cellulose acylate and a compound having a structure denoted by General Formula (A) described below, and a polarizing plate and a liquid crystal display device employing the optical film. L represents n-valent connecting group, n represents an integer of greater than or equal to 2, and A represents a heterocyclic group denoted by General Formula (I). R1, R3, and R5 represent a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, or a heteroaryl group. Here, any one of R1, R3, and R5 is bonded to L.

Abstract: The present invention relates to a laminate including an alkali metal-doped layer. The laminate is processable at high temperatures of at least 550° C. and has excellent durability and barrier properties. Due to these advantages, the laminate can be used to fabricate a thin film solar cell with high flexibility and improved energy conversion efficiency. The present invention also relates to a thin film solar cell including the laminate.

Abstract: A radiation-sensitive composition includes particles including a metal oxide as a principal component, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %. A pattern-forming method includes applying the radiation-sensitive composition to form a film on a substrate, exposing the film, and developing the film exposed.

Abstract: The present invention provides a resist underlayer film that has a wide focus position range within which a good resist shape can be obtained. A resist underlayer film-forming composition for lithography comprising a linear polymer that is obtained by a reaction of a diepoxy group-containing compound (A) with a dicarboxyl group-containing compound (B). The linear polymer has structures of the following formulae (1), (2), and (3) derived from the diepoxy group-containing compound (A) or the dicarboxyl group-containing compound (B): The linear polymer preferably contains a polymer obtained by a reaction of two diepoxy group-containing compounds (A) each having structures of Formulae (1) and (2) with a dicarboxyl group-containing compound (B) having a structure of Formula (3), or a polymer obtained by a reaction of a diepoxy group-containing compound (A) having a structure of Formula (1) with two dicarboxyl group-containing compounds (B) each having structures of Formulae (2) and (3).

Abstract: A radiation-sensitive composition includes particles including a metal oxide as a principal component, a radiation-sensitive acid generator, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A van der Waals volume of an acid generated from the radiation-sensitive acid generator is no less than 2.0×10?28 m3. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %.

Abstract: A method of manufacturing a semiconductor device includes the step of positioning a patterned mask over a dielectric layer. The dielectric layer comprises a low-temperature cure polyimide. The method further includes the steps of exposing a first surface of the dielectric layer through the patterned mask to an I-line wavelength within an I-line stepper, and developing the dielectric layer to form an opening.

Abstract: A photosensitive composition, a method for producing a cured film using the photosensitive composition, a cured film prepared by curing the photosensitive composition, and a touch panel and a display device that use the cured film are provided. The photosensitive composition contains: a compound having two or more ethylenically unsaturated groups; a photopolymerization initiator; a polymer A1 containing a constitutional unit a1 represented by the following Formula 1 and a constitutional unit a2 having a carboxylic acid anhydride structure; particles; and a solvent. A molar content ratio of the constitutional unit a1 to the constitutional unit a2 in the polymer A1 is in a range of a1:a2=3:1 to 6:1. An acid anhydride value of the polymer A1 is from 1.30 to 3.00 mmol/g. A number average primary particle size of the particles is from 10 to 200 nm.

Abstract: A resin laminate having a structure in which a support, an intermediate layer and an image-forming resin layer are laminated in the order mentioned, the resin laminate including (A) a cationic polymer in the image-forming resin layer, and (B) an anionic polymer in the intermediate layer in contact with image-forming resin layer, wherein the (B) anionic polymer is a modified and partially saponified polyvinyl acetate in which a carboxyl group is introduced to a polymer side chain using a hydroxyl group of a partially saponified polyvinyl acetate as an origin of introduction.

Abstract: Aerogel compositions that include polyamic amides, methods for preparing the aerogel compositions, and articles of manufacture that include or manufactured from the aerogel compositions are described.

Abstract: An additive for a resist underlayer film-forming composition that modifies a surface state of a resist underlayer film into a hydrophobic state to enhance adhesion between the resist underlayer film and a resist pattern formed on the resist underlayer film, and a resist underlayer film-forming composition containing the additive. An additive for a resist underlayer film-forming composition including a polymer having a structural unit of Formula (1): (wherein R1 is a hydrogen atom or methyl group, L is a single bond or a divalent linking group, and X is an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, or a heterocyclic group having an oxygen atom as a heteroatom that does not have a hydroxy group). A resist underlayer film-forming composition for lithography including a resin binder, an organic solvent, and the additive.

Abstract: A charging member capable of inhibiting the effect of the contact mark on the electrophotographic image, even after in contact with another member for a long term, is provided. The charging member has a surface layer on a support, the surface layer containing a polymer compound having a structural unit represented by the following formula (1): In the formula (1), A represents an aromatic cyclic hydrocarbon group; R1 represents a specific hydrocarbon group. L represents a polysiloxane having at least one of an SiO3/2 unit (T) and an SiO2/2 unit (D). U represents an integer of 1 or more.

Abstract: A composition containing a novel vinyl-group-containing compound. This composition contains a vinyl-group-containing compound represented by general formula (1). In the formula: W1 and W2 represent a group represented by general formula (2) (where a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer equal to 0 or higher), a group represented by general formula (4) (where the ring (Z), X, R1, R2, and m are as previously stated), a hydroxyl group, or a (meth)acryloyloxy group; rings (Y1, Y2) are aromatic hydrocarbon rings; R represents a single bond or a specific divalent group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon group; and n1 and n2 are integers of 0-4.

Abstract: An organic layer composition, an organic layer, and a method of forming patterns, the composition including a polymer that includes a substituted or unsubstituted fluorene structure, an additive represented by Chemical Formula 1, and a solvent:

Abstract: Optically clear adhesive or coating layers can be prepared by preparing a curable mixture, coating the curable mixture to form a layer, partially curing the curable mixture, drying the coated layer, and fully curing the curable mixture. The curable mixture may also be partially cured and then coated, dried and fully cured. The curable mixture includes two free radically polymerizable monomer compositions that are relatively incompatible and a transient compatibilizer, such as a solvent. Polymers of the two monomer compositions, if polymerized separately and blended, form phase separated domains. The curable mixture provides for adhesive or coating layers that are optically clear.

Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

Abstract: A composition and a method of preparing the composition are provided herein. The composition comprises an active substance and a polymeric additive comprising at least one unit represented by the formula (I): wherein each R is independently selected from the group of a hydrogen atom, an alkyl group, an aryl group, and combinations thereof; and Z comprises at least 10 units represented by the formula (II): wherein each R1 is independently selected from the group of a hydrogen atom, an alkyl group, an aryl group, a carbonyl group, a hydroxyl group, an ether group, and combinations thereof and R2 is a C1-C10 hydrocarbon group. The polymeric additive further comprising at least one unit represented by the formula (III): A??(III) wherein A is an alkyleneoxy group having from 2 to 10 carbon atoms.

Abstract: A method of manufacturing a structure includes (1) positioning a first resin layer provided on a first supporting member on a substrate having a through hole, with the first resin layer facing toward the substrate, and releasing the first supporting member from the first resin layer; and (2) positioning a second resin layer provided on a second supporting member on the first resin layer from which the first supporting member has been released, with the second resin layer facing toward the first resin layer, and releasing the second supporting member from the second resin layer. A first resin layer portion that is above the through hole is removed before or simultaneously with the releasing of the first supporting member.

Abstract: A pattern forming method which uses a resist underlayer film having resistance to a basic aqueous hydrogen peroxide solution. A pattern forming method including: a first step of applying a resist underlayer film-forming composition containing a solvent and a polymer having a weight average molecular weight of 1,000 to 100,000 and an epoxy group on a semiconductor substrate that may have an inorganic film on the surface, followed by baking, to form a resist underlayer film; a second step of forming a resist pattern on the resist underlayer film; a third step of dry etching the resist underlayer film using the resist pattern as a mask to expose a surface of the inorganic film or the semiconductor substrate; and a fourth step of wet etching the inorganic film or the semiconductor substrate using the dry-etched resist underlayer film as a mask and a basic aqueous hydrogen peroxide solution.

Abstract: A method is used to provide an electrically-conductive polyaniline patterns on a substrate. A photocurable composition is applied as a pattern, comprising a water-soluble reactive polymer comprising (a) greater than 40 mol % of recurring units comprising sulfonic acid or sulfonate groups, (b) at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition. The pattern is exposed to radiation sufficient to cause crosslinking via [2+2] photocycloaddition of the (b) recurring units to form a pattern of crosslinked polymer. The crosslinked polymer is contacted with an aniline reactive composition comprising an aniline monomer and up to 0.5 molar of an aniline oxidizing agent, in a molar ratio of from 1:0.5 to 1:1.5 of the aniline monomer to the aniline oxidizing agent. A pattern of electrically-conductive polyaniline disposed within, on top of, or both within and on top of, the crosslinked polymer only.

Abstract: In one aspect, organic coating compositions, particularly antireflective coating compositions, are provided that comprise that comprise a diene/dienophile reaction product. In another aspect, organic coating compositions, particularly antireflective coating compositions, are provided that comprise a component comprising a hydroxyl-naphthoic group, such as a 6-hydroxy-2-naphthoic group Preferred compositions of the invention are useful to reduce reflection of exposing radiation from a substrate back into an overcoated photoresist layer and/or function as a planarizing, conformal or via-fill layer.