Abstract: Negative-working imageable element can be used to prepared lithographic printing plates. These elements include a water-soluble contrast dye having a ?max in the range of from about 450 to about 750 nm and having an absorption that is lower than 10% with respect to the absorption of the radiation sensitive compound in the element at the wavelength used for exposure. The contrast dye is present in sufficient H-aggregation such that less than 40% of the entire absorption spectrum from the contrast dye is contributed by it in non-H-aggregated form.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: A radiation-sensitive composition includes a polymer (A) which includes a repeating unit (1) shown by the following formula (1) and a repeating unit (2) shown by the following formula (2), and a radiation-sensitive acid generator (B). wherein R1 is a methyl group, R2 is a linear or branched alkyl group having 1 to 12 carbon atoms, and R3 is a linear or branched alkyl group having 1 to 4 carbon atoms, and n is an integer from 1 to 5. The composition is useful as a chemically-amplified resist having excellent resolution performance and exhibiting low LWR, low PEB temperature dependency, excellent pattern collapse resistance, and low defect-incurring properties.

Abstract: A photoresist composition comprises a polymer capable of radiation induced main chain scission and acid-catalyzed deprotection, wherein the polymer is derived by free radical polymerization of two or more monomers, each having an alpha-substituent on a polymerizable vinyl group; and a photochemical acid generator.

Abstract: Provided is a novel fluorene-based polymer having urethane bonds and a method for preparing the fluorene-based polymer. According to the method, a diol compound is condensed with a diisocyanate instead of an acid dianhydride, and then an acid anhydride is reacted with the reaction mixture to introduce desired acid groups into the final polymer. Further provided is a negative-type photosensitive resin composition comprising of the fluorene-based polymer as a binder resin. The composition exhibits improved chemical resistance, good development margin and high sensitivity due to presence of the acid groups despite the low molecular weight of the fluorene-based polymer.

Abstract: An alkali-soluble resin is provided. The alkali-soluble resin is prepared using a polyfunctional thiol compound as a chain transfer agent. The alkali-soluble resin has a lower viscosity than a resin having the same molecular weight. Further provided is a negative-type photosensitive resin composition comprising the alkali-soluble resin as a binder resin. The use of the alkali-soluble resin lowers the overall viscosity of the photosensitive resin composition to effectively reduce the height of a stepped portion of a photoresist pattern using a small amount of the photosensitive resin composition.

Abstract: Photopolymerisable systems for coatings or photolithography comprising radically photopolimerisable oligomers and/or monomers having ethylenically unsaturated groups and, as photoinitiator, at least one compound of formula (I).

Abstract: Compositions characterized by the presence of an aqueous base-soluble polymer having aromatic moieties and aliphatic alcohol moieties have been found which are especially useful as developable bottom antireflective coatings in 193 nm lithographic processes. The compositions enable improved lithographic processes which are especially useful in the context of subsequent ion implantation or other similar processes where avoidance of aggressive antireflective coating removal techniques is desired.

Abstract: A method of making a lithographic printing plate comprising the steps of: a) providing a lithographic printing plate precursor comprising (i) a support having a hydrophilic surface or which is provided with a hydrophilic layer, (ii) a photopolymerizable coating on said support, b) image-wise exposing said coating in a plate setter, c) developing the precursor, thereby removing the non-exposed areas of the coating from the support, whereby the developing step is carried out off-press in a gumming unit by treating the coating of the precursor with a gum solution.

Abstract: Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.

Abstract: An imaged and developed element, such as a lithographic printing plate, is provided by infrared radiation imaging of a negative-working imagable element having an outermost imagable layer that includes a free radically polymerizable component, a free radical initiator composition comprising a diaryliodonium borate, and an infrared radiation absorbing compound. The imagable layer also includes a polymeric binder that is represented by the following Structure (I): -(A)w-(A?)w?-??(I) wherein A represents recurring units comprising a pendant reactive vinyl group, A? represents recurring units other than those represented by A, w is from about 1 to about 70 mol %, and w? is from about 30 to about 99 mol %. The imagewise exposed element is developed with a gum to remove only the non-exposed regions. The gum has a pH greater than 7 and up to about 11 and at least 1 weight % of an anionic surfactant.

Abstract: There are provided: a curable resin composition having a high exposure sensitivity and a good developing property, and thereby capable of forming an accurate and precise pattern; a liquid crystal panel substrate on which a protective film for covering a color layer or spacers for a liquid crystal layer, by using the curable resin composition, hardly causing a color irregularity and contrast irregularity; and a liquid crystal panel using the liquid crystal panel substrate and having a superior display quality. The curable resin composition of the present invention comprises: a copolymer (a) having a molecular structure in which a constitutional unit including an acidic functional unit and a constitutional unit including a photocurable functional group are linked at least; a photopolymerization initiator (h) having a tertiary amine structure; and a photocurable compound (c) having at least one acidic functional group and at least three photocurable functional groups.

Abstract: A photosensitive resin composition for forming a laser engravable printing element, comprising: (a) 100 parts by weight of a resin which is in a solid state at 20° C., wherein the resin has a number average molecular weight of from 5,000 to 300,000, (b) 5 to 200 parts by weight of an organic compound having a number average molecular weight of less than 5,000 and having at least one polymerizable unsaturated group per molecule, and (c) 1 to 100 parts by weight of an inorganic porous material having an average pore diameter of from 1 to 1,000 nm, a pore volume of from 0.1 to 10 ml/g and a number average particle diameter of not more than 10 ?m. A laser engravable printing element formed from the above-mentioned resin composition. A method for producing a laser engraved printing element by using the above-mentioned photosensitive resin composition.

Abstract: A method of polymerizing poly(cyclic)olefin monomers encompassing (a) combining a monomer composition containing the poly(cyclic)olefin monomers, a non-olefinic chain transfer agent and an activator compound to faun a mixture; (b) heating the mixture; and (c) adding a polymerization catalyst containing Ni and/or Pd. The non-olefinic chain transfer agent includes one or more compounds selected from H2, alkylsilanes, alkylalkoxysilanes, alkylgermanes, alkylalkoxygermanes, alkylstannanes, and alkylalkoxystannanes. The activator is characterized as having an active hydrogen with a pKa of at least 5. The resulting poly(cyclic)olefin polymers can be used in photoresist compositions.

Abstract: An alkali-developable black photosensitive resin composition for forming a light-shielding barrier wall which comprises, as indispensable components, (A) a carboxyl group-containing photosensitive prepolymer, (B) a photopolymerization initiator, (C) a black pigment, and (D) light-transmitting fine particles. By the use of this composition, light-shielding barrier walls (11) having sufficient light-shielding properties and a height of not less than 20 ?m can be formed by photolithography, without causing undercutting during development. In a preferred embodiment, the black pigment (C) is a metal oxide, preferably iron oxide, and the fine particles (D) are inorganic fine particles having a refractive index of 1.40-1.90, preferably silica.

Abstract: There is disclosed a chemically amplified positive resist composition to form a chemically amplified resist film to be used in a lithography, wherein the chemically amplified positive resist composition comprises at least, (A) a base resin, insoluble or poorly soluble in an alkaline solution, having a repeating unit whose phenolic ydroxyl group is protected by a tertiary alkyl group, while soluble in an alkaline solution when the tertiary alkyl group is removed; (B) an acid generator; (C) a basic component; and (D) an organic solvent, and a solid component concentration is controlled so that the chemically amplified resist film having the film thickness of 10 to 100 nm is obtained by a spin coating method.

Abstract: A negative-tone radiation-sensitive composition includes a polymer, a photoacid generator, and a solvent. The polymer has a polystyrene-reduced weight average molecular weight of 4000 to 200,000, and is obtained by hydrolysis and condensation of at least one hydrolyzable silane compound among compounds shown by RaSi(OR1)4-a, Si(OR2)4 and R3x(R4O)3-xSi—(R7)z—Si(OR5)3-yR6y. “R” represents a fluorine atom, an alkylcarbonyloxy group, or a linear or branched alkyl group having 1 to 5 carbon atoms. “R1” represents a monovalent organic group. “R2” represents a monovalent organic group. “R3” and “R6” individually represent a fluorine atom, an alkylcarbonyloxy group, or a linear or branched alkyl group having 1 to 5 carbon atoms “R4” and “R5” individually represent a monovalent organic group. “R7” represents an oxygen atom, a phenylene group, or a group —(CH2)m—. The content of units derived from the compound RaSi(OR1)4-a is 50 to 100 mol % of the total units forming the polymer.

Abstract: A pattern is formed by coating a first positive resist composition comprising a copolymer comprising lactone-containing recurring units and acid labile group-containing recurring units onto a substrate to form a first resist film, patternwise exposure, PEB, and development to form a first resist pattern, applying an amine or oxazoline compound to the first resist pattern for inactivation, coating a second positive resist composition comprising a C3-C8 alcohol and an optional C6-C12 ether onto the first resist pattern-bearing substrate to form a second resist film, patternwise exposure, PEB, and development to form a second resist pattern.

Abstract: Disclosed is a photosensitive resin composition showing excellent contrast performance after exposure to light. Also disclosed is a photosensitive resin laminate using the composition. The photosensitive resin composition comprises (a) 20 to 90% by mass of a binder having a carboxyl group, (b) 5 to 75% by mass of an addition-polymerizable monomer having at least one ethylenically unsaturated terminal group, (c) 0.01 to 30% by mass of a photopolymerization initiator, and (d) 0.01 to 10% by mass of a leuco dye, wherein a specific binder is contained as the binder (a) and a specific monomer is contained as the addition-polymerizable monomer (b).

Abstract: Disclosed is a photosensitive resin composition suitable for forming barrier ribs for LCD pixels during a process for fabricating an LCD using an ink jet printing step. Also disclosed is a method of forming barrier ribs for LCD pixels using such photosensitive resin composition.

Abstract: The photosensitive resin composition of the invention comprises (A) a photopolymerizing compound with two or more ethylenic unsaturated bonds in the molecule and (B) a photopolymerization initiator which initiates photopolymerization reaction of the (A) photopolymerizing compound, the photosensitive resin composition being characterized in that the molecule of the (A) photopolymerizing compound further contains a characteristic group with a bond which breaks when the (A) photopolymerizing compound is heated under temperature conditions of 130-250° C.

Abstract: Disclosed is a photosensitive paste including glass frit; organic binder; polymerizable monomer; photopolymerization initiator; and organic solvent, wherein at least a part of the polymerizable monomer contains phosphorus atom within the structure.

Abstract: Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.

Abstract: An alkali developable photosensitive resin composition contains (J) a photopolymerizable unsaturated compound having a structure resulting from the addition reaction of (B) a compound having a ?-diketone moiety or a compound having a ?-ketoester group to the (meth)acryloyl group of (A) a compound having at least two (meth)acryloyl groups and a hydroxyl group and subsequent esterification of the hydroxyl group of the resulting addition product with (C) a polybasic acid anhydride. The compound having a ?-diketone moiety is preferably a novel ?-diketone compound represented by general formula (I): wherein R1 is a C1-C20 alkyl group; R2 represents R11, OR11, COR11, SR11, CONR12R13, or CN; R11, R12, and R13 are each hydrogen, a C1-C20 alkyl group, etc.; a is 0 to 3; and b is 0 to 4.

Abstract: An infrared radiation-sensitive positive-working imageable element has a substrate and single imageable layer that includes a first polymeric binder having urethane or urea moieties in its backbone. The first polymeric binder is also insoluble in water and soluble in a weakly alkaline solution. This imageable element can be imaged and processed using weakly alkaline processing solutions that are free of silicates and metasilicates, which processing solutions may also be used to “gum” the imaged and developed printing surface.

Abstract: An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring.

Abstract: The present invention provides a fine pattern-forming composition and a fine pattern-forming method. This fine pattern-forming composition enables a pattern of high aspect ratio to be made finer than a limit of resolution determined by the wavelength of light for exposure. The composition contains a water-soluble resin and a water-containing solvent, and has a kinetic viscosity ? at 25° C. in the range of 10 to 35 mm2/s and a solid content C satisfying the condition that the ratio ?/C of the kinetic viscosity ? to the solid content C is in the range of 0.5 to 1.5 mm2/s/wt %. By use of this composition, a resist pattern having an aspect ratio of 4 to 15 or having a thickness of 2 ?m or more can be further miniaturized.

Abstract: A composition for radical polymerization includes a photosensitive material, a photoinitiator, a solvent, and a material for adjusting a size of a pattern. A method of forming a pattern using the composition is also disclosed.

Abstract: An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin.

Abstract: A photosensitive element 1 comprising a support film 10 and a layer (photosensitive layer) 20 composed of a photosensitive resin composition formed on the support film 10, wherein the haze of the support film 10 is 0.01-2.0%, the total number of particles and aggregates with diameters of 5 ?m or larger in the support film 10 is no greater than 5/mm2, the photosensitive layer 20 contains (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated bond and (C) a photopolymerization initiator, and the thickness of the photosensitive layer 20 is 3-30 ?m.

Abstract: A fluorinated monomer of cyclic acetal structure has formula (1) wherein R is a C1-C20 alkyl group which may be substituted with halogen or separated by oxygen or carbonyl, and Z is a divalent organic group which forms a ring with alkylenoxy and contains a polymerizable unsaturated group. A polymer derived from the fluorinated monomer may be endowed with appropriate water repellency, water sliding property, lipophilicity, acid lability and hydrolyzability and is useful in formulating a protective coating composition and a resist composition.

Abstract: There is described a photopolymerisable composition comprising (a) 75 to 99% by weight of an ethylenically unsaturated monomer or a monomer mixture of different ethylenically unsaturated monomers, (b) 0.5 to 25% by weight of a triglyceride or a mixture of different triglycerides and (c) 0.1 to 10% by weight of a photoinitiator system which activates the polymerisation of the ethylenically unsaturated monomer(s) upon exposure to actinic radiation, wherein the composition is a homogeneous, clear and, at 20° C., liquid mixture. Furthermore, there are described elements manufactured from such photopolymerisable compositions and methods for the formation of light-resistant holograms therefrom. The photopolymerisable compositions are useful, in particular, as recording material for optical elements having refractive index modulation, in particular, holograms.

Abstract: A photosensitive resin composition is used that comprises a photosensitive silicone having a styryl group as a photosensitive group, and a photopolymerization initiator having a specific structure. As a result, a photosensitive resin composition capable of being cured in air by photopolymerization that is preferable for use as a buffer coat material or rewiring layer of an LSI chip, a method for forming a cured relief pattern using this photosensitive resin composition, and a semiconductor device comprising the cured relief pattern are provided.

Abstract: A colored dispersion according to the present invention comprises a resin including monomers of Formulas 1 to 4, as a binder resin. Accordingly, a photoresist composition for a black matrix of a high light shielding property, which has the dispersion stability of the colored dispersion according to the present invention, could be provided, and a black matrix of high sensibility having an uniform process characteristic while maintaining a high light-shielding property could be produced.

Abstract: A process for producing a radiation-sensitive resin composition includes the steps of providing a filter apparatus equipped with a filter composed of a polyamide resin filter and a polyethylene resin filter connected in series, circulating a precursor composition for the radiation-sensitive resin composition in the filter apparatus so that the precursor composition is passed through the filter two or more times to thereby effect filtration with the result that foreign matter is removed from the precursor composition.

Abstract: A top coat material for applying on top of a photoresist material is disclosed. The top coat material includes a polymer, which includes at least one fluorosulfonamide monomer unit having one of the following two structures: wherein: M is a polymerizable backbone moiety; Z is a linking moiety selected from the group consisting of —C(O)O—, —C(O)—, —OC(O)—, and —O—C(O)—C(O)—O—; R1 is selected from the group consisting of an alkylene, an arylene, a semi- or perfluorinated alkylene, and a semi- or perfluorinated arylene; p and q are 0 or 1; R2 is selected from the group consisting of hydrogen, fluorine, an alkyl group of 1 to 6 carbons, and a semi- or perfluorinated alkyl group of 1 to 6 carbons; n is an integer from 1 to 6; and R3 is selected from the group consisting of hydrogen, an alkyl, an aryl, a semi- or perfluorinated alkyl, and a semi- or perfluorinated aryl. The top coat material may be used in lithography processes, wherein the top coat material is applied on a photoresist layer.

Abstract: Disclosed is a polymer having excellent solvent resistance which can be produced by using a polycarbonate diol having a repeating unit represented by the formula (1) and/or (2), having a hydroxyl group at both termini, and having a number average molecular weight of from 300 to 50,000: wherein R1 represents a linear or branched hydrocarbon group having 2 to 50 carbon atoms; and n represents an integer of 2 to 50, wherein R2 represents a linear or branched hydrocarbon group having 10 to 50 carbon atoms.

Abstract: The present invention relates to a photosensitive resin composition for a black matrix, a black matrix produced by the composition and a liquid crystal display including the black matrix. The resin composition for a black matrix comprising a fluorene-based resin polymer as a resin binder has high sensitivity and optical density, and excellent development adherence.

Abstract: A composition for photosensitive dielectric material is provided. The composition includes 4 to 10 percent by weight of a polymer material, 1.5 to 10 percent by weight of a crosslinking agent, 0.32 to 2 percent by weight of a photoacid generator (PAG) and 78 to 94.18 percent by weight of solvent, based on a total weight of the composition.

Abstract: The present invention relates to a photosensitive resin composition that includes a polymer prepared by using a macromonomer as an alkali soluble resin. The photosensitive resin composition is used for various types of purposes such as a photoresist for preparing a color filter, an overcoat photoresist, a column spacer, and an insulating material having a light blocking property, and improves physical properties such as residue or not, chemical resistance, and heat resistance of the photoresist.

Abstract: The present invention provides a resin composition for laser engraving, including at least a complex between a layered inorganic compound and a cationic organic compound, and a binder polymer that is insoluble in water and soluble in an alcohol having 1 to 4 carbon atoms; a relief printing plate precursor for laser engraving using the same, a relief printing plate; and a method of producing the relief printing plate.

Abstract: A resin comprising a structural unit represented by the formula (I): wherein Q1 and Q2 represent a fluorine atom etc., U represents a C1-C20 divalent hydrocarbon group in which one or more —CH2— may be replaced by —O— etc., X1 represents —O—CO— etc., and A+ represents an organic counter ion.

Abstract: A compound represented by the following formula (1) is provided: wherein R1 represents a hydrogen atom, a trifluoromethyl group, an alkyl group, or an alkoxy group; and A represents a group represented by the following formula (2) or formula (3): wherein R2, R3, R4, R5 and R6 each independently represent a substituted or unsubstituted alkyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted perfluoroalkyl group, a substituted or unsubstituted benzyl group, or a substituted or unsubstituted aryl group; and two or more of R2, R3 and R4 may be linked to each other to form a saturated or unsaturated carbon ring or a saturated or unsaturated heterocyclic ring. The chemically amplified resist composition comprising a polymer compound which is produced from the compound of formula 1 according to the present invention provides a chemically amplified resist sensitive to far-ultraviolet radiation, which is represented by KrF excimer laser or ArF excimer laser.

Abstract: The present invention provides a resin composition for laser engraving, containing at least an inorganic porous material, a binder polymer, a thermopolymerization initiator and a polymerizable compound; a relief printing plate precursor for laser engraving using the same; a relief printing plate; and a method of producing the relief printing plate.

Abstract: A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by at least one of formulae (1-1) to (1-3) wherein R1 is H, methyl or trifluoromethyl, X is a single bond or methylene, Y is hydroxyl or hydroxymethyl, and m is 0, 1 or 2. The composition is improved in resolution when processed by lithography.

Abstract: A photosensitive lithographic printing plate precursor for infrared laser includes in the following order: a support having a hydrophilic surface; a lower layer containing a polymer compound having at least a unit derived from a polymerizable monomer represented by the following formula (I); and an upper layer containing a polymer compound having a group represented by the following formula (II) in a side chain, wherein R1 represents a hydrogen atom or a methyl group, R2 represents a methylene group or an ethylene group, R3 represents a methyl group, and X represents O or NH, wherein Z1, Z2 and Z3 each independently represents a hydrogen atom or a monovalent substituent composed of at least one nonmetallic atom.

Abstract: A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R1 is H, methyl or trifluoromethyl, X is a single bond or methylene, m is 1 or 2, and the hydroxyl group attaches to a secondary carbon atom. The composition is improved in resolution when processed by lithography.

Abstract: [Task to be Achieved] To provide a chemically amplified type positive copolymer for semiconductor lithography, which has eliminated the problems of prior art, has a high development contrast, and has excellent resolution in fine-pattern formation; a composition for semiconductor lithography which contains the copolymer; and a process for producing the copolymer. [Means for Achievement] The copolymer for semiconductor lithography according to the present invention is a copolymer which has at least (A) a repeating unit having a structure which has an alkali-soluble group protected by an acid-labile, dissolution-suppressing group, (B) a repeating group having a lactone structure and (C) a repeating group having an alcoholic hydroxyl group and which is characterized by having an acid value of 0.01 mmol/g or less as determined by dissolving the copolymer in a solvent and subjecting the solution to neutralization titration with a solution of an alkali metal hydroxide using Bromothymol Blue as an indicator.

Abstract: A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R1 is H, methyl or trifluoromethyl, Y is H or OH, at least one Y being OH, and the wavy line indicates an indefinite direction of the bond. The composition is improved in resolution when processed by lithography.

Abstract: Disclosed are a positive photosensitive resin composition, a method of forming a pattern using the same, and a semiconductor device having a photoresist pattern obtained by the method. The composition for positive photosensitive resin comprises a polyamide derivative, a photosensitive compound, and at least one additive having a low molecular weight.