Abstract: A negative pattern is formed by coating a resist composition onto a substrate, the resist composition comprising a polymer comprising recurring units having an acid labile group-substituted hydroxyl group, an acid generator, an onium salt of perfluoroalkyl ether carboxylic acid, and an organic solvent, prebaking, exposing, baking, and developing in an organic solvent such that the unexposed region of film is dissolved away and the exposed region of film is not dissolved. In image formation via positive/negative reversal by organic solvent development, the resist film is characterized by a high dissolution contrast between the unexposed and exposed regions.

Abstract: A radiation-sensitive composition includes a polymer component, a radiation-sensitive acid generator and a solvent component. The polymer component includes a first polymer that includes an acidic group, a group in which an acidic group is protected by an acid-dissociable group, or a both thereof. The solvent component includes a first solvent which is a solvent shown by a general formula (C1-a), a solvent shown by a general formula (C1-b), a solvent shown by a general formula (C1-c), or a mixture thereof.

Abstract: There are provided a resin composition for laser engraving that can give a relief printing plate having excellent hardness, film elasticity, printing durability, and aqueous ink transfer properties and that has excellent rinsing properties for engraving residue generated when laser-engraving a printing plate and excellent engraving sensitivity in laser engraving, a relief printing plate precursor employing the resin composition for laser engraving, a process for producing a relief printing plate employing the same, and a relief printing plate obtained thereby.

Abstract: A process for making a relief printing plate is provided that includes (1) a step of crosslinking by means of heat and/or light a relief-forming layer formed from a resin composition containing (Component A) a compound having a hydrolyzable silyl group and/or a silanol group, (Component B) a thermoplastic elastomer, and (Component C) a polymerizable compound, and (2) a step of forming a relief layer by laser-engraving the crosslinked relief-forming layer.

Abstract: Disclosed is a photosensitive resin composition for a color filter protective layer including a cross-linkable alkali soluble resin including a repeating unit represented by the following Chemical Formula 1, a reactive unsaturated compound, a photopolymerization initiator, and a solvent. In Chemical Formulae 1 to 3, R1 to R6 and A1 to A3 are the same as in the detailed description.

Abstract: Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

Abstract: A photoresist composition is provided. The photoresist composition comprises two or more kinds of photoinitiators having different activation wavelengths whose difference is at least 20 nm. The photoresist composition has high sensitivity and forms a pattern whose thickness is easy to control depending on the exposure intensity through a slit or transflective mask. Further provided are a transparent thin film formed using the photoresist composition and a liquid crystal display device comprising the thin film.

Abstract: A self-assemblable polymer is disclosed, having first and second molecular configurations with the first molecular configuration has a higher Flory Huggins parameter for the self-assemblable polymer than the second molecular configuration, and the self-assemblable polymer is configurable from the first molecular configuration to the second molecular configuration, from the second molecular configuration to the first molecular configuration, or both, by the application of a stimulus. The polymer is of use in a method for providing an ordered, periodically patterned layer of the polymer on a substrate, by ordering and annealing the polymer in its second molecular configuration and setting the polymer when it is in the first molecular configuration.

Abstract: Problem to be Solved To provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving. Solution A photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.

Abstract: A composition for forming column spacers is provided. The composition comprises a radical polymerization inhibitor. The use of the composition enables simultaneous formation of a saturated pattern and a semi-transmissive pattern as column spacer patterns having different shapes, whose difference in thickness is controllable as desired although the sensitivity is slightly reduced, through a slit or semi-transmissive mask by varying the kind and amount of the radical polymerization inhibitor. Further provided are column spacers formed using composition and a liquid crystal display using the column spacers.

Abstract: A resist pattern forming method contains, in order: (1) a step of forming a resist film by using a negative chemical-amplification resist composition containing: (A) polymer compound having a repeating unit represented by the specific formula, (B) a phenolic compound being capable of crosslinking the polymer compound (A) by the action of an acid and having two or more benzene rings and four or more alkoxymethyl groups, and (C) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (2) a step of exposing the film, and (4) a step of, after exposure, developing the film by using a developer containing an ester-based solvent having a carbon number of 7 or 8.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) comprising a repeating unit (A) containing a group that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and a repeating unit (B) containing a group that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, and any of compounds (Q) of general formula (1) below.

Abstract: This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.

Abstract: Negative-working imageable elements have a hydrophilic substrate and a single thermally-sensitive imageable layer. This layer can include an infrared radiation absorbing compound and polymeric particles that coalesce upon thermal imaging. These coalesceable polymeric particles comprise a thermoplastic polymer and a colorant to provide improved visible contrast between exposed and non-exposed regions in the imaged element, such as lithographic printing plates.

Abstract: To provide a photosensitive resin composition which is a material for a printing original plate for laser engraving which generates no printing deficiencies and from which a printing plate with a satisfactory resolution can be produced. A printing original plate for laser engraving where image is formed by irradiation of laser beam to form a printing plate, characterized in that the photosensitive resin composition layer consists of a photosensitive resin composition in which soluble polyamide or soluble polyether urethane urea, ethylenic unsaturated monomer and photopolymerization initiator are essential ingredients and the amount of (meth)acryloyl group in the photosensitive resin composition is 0.25 to 0.40 mol per 100 g of the photosensitive resin composition.

Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition containing a compound (A) which contains at least one phenolic hydroxyl group and at least one group where a hydrogen atom in a phenolic hydroxyl group is substituted by a group represented by the following General Formula (1).

Abstract: A chemical amplification resist composition contains: (A) a polymer compound having a phenolic hydroxyl group and a group formed by substituting a substituent for a hydrogen atom of a hydroxyl group in a phenolic hydroxyl group and satisfying the following (a) to (c) at the same time: (a) the polydispersity is 1.2 or less, (b) the weight average molecular weight is from 2,000 to 6,500, and (c) the glass transition temperature (Tg) is 140° C. or more.

Abstract: The present invention relates to a polymer resin compound including a new polycyclic compound, and a photosensitive resin composition including the polymer resin compound as an effective binder matrix. In particular, the photosensitive resin composition according to the present invention uses a polymer resin compound, which includes a compound having double cyclic structure in one molecule as a monomer, as a binder matrix. Accordingly, the photosensitive resin composition has an excellent photosensitivity and an excellent developing property, and has a low distortion property during plastic processing. For this reason, the photosensitive resin composition has an advantage of curing various transparent photosensitive materials used to manufacture a color filter of a liquid crystal display, for example, a column spacer, an overcoat, a passivation material, and the like.

Abstract: The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

Abstract: Disclosed is a blue resin composition for a color filter that includes a colorant including an azaporphyrin-based dye and a blue pigment, an acrylic-based binder resin, a reactive unsaturated compound, a polymerization initiator, and a solvent.

Abstract: Disclosed is a polymerizable composition characterized by containing at least (A) a photopolymerization initiator represented by the following general formula (1); (B) a coloring agent; (C) a polymerizable monomer; (D) a binder polymer; and (E) a solvent. wherein, in formula (1), R1 represents an aromatic group; R2 represents a group represented by any one of the above Formulae (2-1) to (2-3); R3 represents an alkyl group or the like; and A represents a single bond or —C(?O)—; X1, X2, and Y each independently represent a hydrogen atom, an alkyl group or the like and Z represents an atomic group which may form an arbitrary ring structure containing a carbon-carbon double bond.

Abstract: Exemplary embodiments provide materials and methods for a pen that can include a writing end for writing an image on an erasable medium and an erasing end for locally erasing an image from the erasable medium.

Abstract: A radiation-sensitive composition containing 1 to 80% by weight of a solid component and 20 to 99% by weight of a solvent. The solid component contains a compound B which has (a) a structure derived from a polyphenol compound A by introducing an acid-dissociating group to at least one phenolic hydroxyl group of the polyphenol compound A which is synthesized by a condensation between a di- to tetrafunctional aromatic ketone or aromatic aldehyde each having 5 to 36 carbon atoms with a compound having 1 to 3 phenolic hydroxyl groups and 6 to 15 carbon atoms, and (b) a molecular weight of 400 to 2000. The composition containing the compound B is useful as an acid-amplified, non-polymeric resist material, because it is highly sensitive to radiation such as KrF excimer lasers, extreme ultraviolet rays, electron beams, and X-rays, and provides resist patterns with a high resolution, high heat resistance, and high etching resistance.

Abstract: A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5). [In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; 1 and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.

Abstract: An alkali developable photosensitive resin composition contains (J) a photopolymerizable unsaturated compound having a structure resulting from the addition reaction of (B) a compound having a ?-diketone moiety or a compound having a ?-ketoester group to the (meth)acryloyl group of (A) a compound having at least two (meth)acryloyl groups and a hydroxyl group and subsequent esterification of the hydroxyl group of the resulting addition product with (C) a polybasic acid anhydride. The compound having a ?-diketone moiety is preferably a novel ?-diketone compound represented by general formula (I): wherein R1 is a C1-C20 alkyl group; R2 represents R11, OR11, COR11, SR11, CONR12R13, or CN; R11, R12, and R13 are each hydrogen, a C1-C20 alkyl group, etc.; a is 0 to 3; and b is 0 to 4.

Abstract: The invention relates to holographic media containing specific photopolymers, a process for the production thereof, and unsaturated glycidyl ether acrylate urethanes as writing monomers which are suitable for the preparation of photopolymers.

Abstract: A method of forming a polarizing material is provided including exposing a layer of dichroic material to activating light illumination to provide an ordered structure with a distinguished absorption axis and thus photo-induce polarization, and fixing the induced polarization by polymerization of the dichroic layer. Novel polarizing materials formed thereby are also provided. By selectively exposing regions of the dichroic material to differing activating radiation, different regions with different polarization axes can be created. The polarizing material can also be provided with a coating or coatings to alter the spectral responses, and a stack formed of a plurality if dichroic layers can be provided.

Abstract: A near-infrared absorbing dye has an anion of formula (1) wherein A1 is H or CF3, R0 is OH or —OC(?O)—R?, and R? is a monovalent hydrocarbon group. The dye has excellent solvent solubility as well as good optical properties and heat resistance, offering the advantages of easy coating and effective working during film formation. The dye free of heavy metal in its structure is advantageously used in the process of fabricating semiconductor devices.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method using the composition are provided, the composition including (A) a compound capable of decomposing by the action of an acid to increase the solubility of the resin (A) in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a basic compound; and (D) a specific compound containing at least two specific alicyclic hydrocarbon groups each substituted with a hydroxyl group.

Abstract: Disclosed is a photosensitive resin composition including (A) a photopolymerizable monomer including a compound represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification, (B) a binder resin, (C) a photopolymerization initiator, (D) a pigment and (E) a solvent, and a color filter using the same.

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, and etching away the sacrificial film pattern through an aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) coating a substrate with a composition comprising a cresol novolac resin, a crosslinker, and a photoacid generator, (B) heating to form a sacrificial film, (C) patternwise exposure, (D) development to form a sacrificial film pattern, and (E) forming crosslinks within the cresol novolac resin.

Abstract: A positive photosensitive resin composition including: (a) a resin capable of being dissolved in an aqueous alkaline solution; (b) a compound having two or more oxetanyl groups; (c) a diazonaphthoquinone compound; and (d) a solvent.

Abstract: Disclosed is a photosensitive resin composition that provides an excellent water developability, drying property, and image reproducibility. The photosensitive resin composition comprises a water-dispersible latex (A), a rubber (B), a surfactant (C), a photopolymerizable monomer (D), and a photopolymerization initiator (E). A ratio of a mass of the component (C) to a total mass of the components (A), (B), and (C) is within a range of 0.1 to 20%. A ratio of a mass of the component (A) to a total mass of the components (A) and (B) is within 20 to 90%. A size of a dispersed phase consisting mainly of the component (B) is 10 ?m or smaller.

Abstract: The present invention relates to a composition comprising a photoresist polymer and a fluoropolymer. In one embodiment, the fluoropolymer comprises a first monomer having a pendant group selected from alicyclic bis-hexafluoroisopropanol and aryl bis-hexafluoroisopropanol and preferably a second monomer selected from fluorinated styrene and fluorinated vinyl ether. The invention composition has improved receding contact angles with high refractive index hydrocarbon fluids used in immersion lithography and, thereby, provides improved performance in immersion lithography.

Abstract: A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.

Abstract: A colored curable composition including: (A) a pigment dispersion containing (a-1) a pigment, (a-2) a compound having a pigment mother nucleus structure and an amino group in a molecule, and (a-3) a resin having an acid group and a polymerizable group; (B) an oxime ester initiator; and (C) a polymerizable compound.

Abstract: Disclosed are a photosensitive resin composition for a color filter and a color filter including the same. The photosensitive resin composition for a color filter may include (A) an acrylic-based copolymer including a structural unit represented by the following Chemical Formula 1 and a structural unit represented by the following Chemical Formula 2, wherein the substituents of Chemical Formula 1 and Chemical Formula 2 are the same as defined in the specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a pigment; and (E) a solvent.

Abstract: A negative type resist composition for a color filter including (A) a pigment dispersant, (B) a pigment, (C) an alkaline-soluble resin, (D) a polyfunctional monomer, (E) a photo initiator and (F) a solvent.

Abstract: Disclosed are a photosensitive resin composition and a light blocking layer using the same. The photosensitive resin composition includes (A) a cardo-based monomer represented by the following Chemical Formula 1 or 2, wherein the substituents of Chemical Formula 1 and Chemical Formula 2 are the same as defined in the detailed description, (B) a cardo-based resin, (C) a reactive unsaturated compound, (D) a pigment, (E) an initiator, and (F) a solvent.

Abstract: To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I): wherein U and V represent a divalent organic group, and at least one of U and V is a group containing an aliphatic chain structure having 1 to 30 carbon atoms; (b) a photosensitizer; (c) a solvent; and (d) a crosslinking agent capable of causing crosslinking or polymerization by heating.

Abstract: Disclosed is a volume phase hologram recording material of high sensitivity, high contrast, and excellent record retention properties and also disclosed is a volume phase hologram recording medium using the said material. The volume phase hologram recording material mainly contains a three-dimensional crosslinked polymer matrix, a radically polymerizable monomer, and a photoradical polymerization initiator. The three-dimensional crosslinked polymer matrix is formed from a matrix-forming compound having two photoradically polymerizable unsaturated groups and two non-photoradically polymerizable hydroxyl groups represented by the following general formula (1) and another matrix-forming compound having no photoradically polymerizable group.

Abstract: Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter may include (A) a copolymer including a structural unit represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a pigment; and (E) a solvent.

Abstract: A black curable composition for a wafer-level lens including (A) a metal-containing inorganic pigment, (B) a polymerization initiator, (C) a polymerizable compound, and (D) a cardo resin.

Abstract: Provided is a pattern forming method that is excellent in resolving power such as pre-bridging dimension, a roughness performance such as line edge roughness, and development time dependency, and an actinic-ray-sensitive or radiation-sensitive resin composition and a resist film used for the pattern forming method. The pattern forming method includes (1) forming a film using an actinic-ray-sensitive or radiation-sensitive resin composition that contains a resin (A) and a compound (B) which has a polymerizable group and generates an acid by being irradiated with actinic rays or radiations; (2) exposing the film; and (3) developing the exposed film using a developer that contains an organic solvent, wherein a pattern formed in this method is a negative pattern.

Abstract: The invention relates to photopolymerizable flexographic printing elements which contain ethylenically unsaturated, alicyclic monomers and hard flexographic printing plates, in particular cylindrical continuous seamless flexographic printing plates, which can be produced therefrom.

Abstract: A triphenylmethane-based complex dye, a photosensitive resin composition, and a color filter, the triphenylmethane-based complex dye being represented by the following Chemical Formula 1:

Abstract: A lithographic printing plate precursor in a positive-type with an infrared-sensitivity, having a support and an image recording layer provided on the support, the support having a hydrophilic surface, the recording layer having a particular resin, an amphoteric surfactant and/or an anionic surfactant, and an infrared absorbing agent, wherein the particular resin being at least one of resins selected from the group consisting of a polyurethane resin, a poly (vinyl acetal) resin, and maleimide resin A.

Abstract: Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) an acrylic-based binder resin including a structural unit represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; (D) a pigment; and (E) a solvent.

Abstract: The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.

Abstract: A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.