Abstract: Provided is a processing chamber configured to contain a semiconductor substrate in a processing region of the chamber. The processing chamber includes a remote plasma unit and a direct plasma unit, wherein one of the remote plasma unit or the direct plasma unit generates a remote plasma and the other of the remote plasma unit or the direct plasma unit generates a direct plasma. The combination of a remote plasma unit and a direct plasma unit is used to remove, etch, clean, or treat residue on a substrate from previous processing and/or from native oxide formation. The combination of a remote plasma unit and direct plasma unit is used to deposit thin films on a substrate.

Abstract: There is provided a pixel circuit including an optically sensitive material (OSM) layer and a readout circuit. The OSM layer is arranged upon the readout circuit, and used to sense light energy to generate signal charges to be integrated in a floating diffusion. The readout circuit includes a source follower for amplifying a voltage on the floating diffusion within a readout interval, and the voltage on the floating diffusion is not changed by an external voltage pulse within the readout interval.

Abstract: A mounting-related device includes an articulated robot that is disposed in a movable space formed between a first conveyance section and a second conveyance section, holds, and moves a processing target object such that a posture of a mounting surface can be changed, and the first conveyance section and the second conveyance section include a rail attachment section that can attach and detach a pair of rail devices bridged between the first conveyance section and the second conveyance section for moving a board when conveying the board.

Abstract: The present disclosure relates to an attaching apparatus (2) and an attaching method. The attaching apparatus (2) includes: an auxiliary attaching structure having a protective film layer (20) and a support part (21), and the protective film layer (20) includes first areas (20a) and second areas (20b), each first area (20a) is configured to correspond to an installation area (10a), first sides of the first areas (20a) can be attached to body parts (13a) of rigid structural members on the installation areas (10a) corresponding to the first areas (20a) and receiving through holes (20c) or receiving recesses (20d) are formed at positions on the first areas (20a) corresponding to installation protrusions (13b), the second areas (20b) are configured to correspond to bending areas (10b); and a laminating jig (22) that can be located on a second side of the protective film layer (20).

Abstract: A semiconductor device includes a substrate, a gate structure disposed over the substrate, a drain structure disposed in the substrate, and a source structure disposed in the substrate on an n opposite side of the gate structure from the drain structure. The substrate includes a first semiconductor layer, a second semiconductor layer over the first semiconductor layer, and an insulating layer sandwiched between the first semiconductor layer and the second semiconductor layer. The source structure and the drain structure include a same conductivity type. The source structure includes at least an epitaxial layer. The source structure extends deeper into the substrate than the drain structure.

Abstract: An embodiment method includes forming first dummy gate stack and a second dummy gate stack over a semiconductor fin. A portion of the semiconductor fin is exposed by an opening between the first dummy gate stack and the second dummy gate stack. The method further includes etching the portion of the semiconductor fin to extend the opening into the semiconductor fin. A material of the semiconductor fin encircles the opening in a top-down view of the semiconductor fin. The method further includes epitaxially growing a source/drain region in the opening on the portion of the semiconductor fin.

Abstract: A package circuit structure includes a metal board including a first surface and a second surface, a plurality of embedded components, an insulating layer, and two antenna circuit boards. At least one first groove is recessed from the first surface. At least one second groove is recessed from the second surface. The first groove and the second groove are spaced with each other along a first direction perpendicular to a thickness direction of the metal board. Each embedded component is mounted in the first groove or the second groove. The insulating layer covers the first surface and the second surface and fills the first groove and the second groove. The antenna circuit boards are respectively stacked on two opposite sides of the insulating layer. Each antenna circuit board includes at least one antenna and at least one ground wiring. The metal board is electrically connected to each ground wiring.

Abstract: A semiconductor device includes a device isolation layer provided on a substrate, the device isolation layer defining first and second sub-active patterns, first and second gate electrodes crossing the first and second sub-active patterns, respectively, and an isolation structure provided on the device isolation layer between the first and second sub-active patterns. The first and second sub-active patterns extend in a first direction and are spaced apart from each other in the first direction. The device isolation layer includes a diffusion break region disposed between the first and second sub-active patterns. The isolation structure covers a top surface of the diffusion break region.

Abstract: A quality determination method includes: in a quality determination space, mapping a quality of a package product in which a plurality of devices are assembled in accordance with a predetermined design condition, with use of each test result of each of the plurality of devices; and determining a quality of the package product, on a basis of mapping result of the mapping.

Abstract: Systems and methods for generating monoenergetic ions are described. A duty cycle of a high parameter level of a multistate parameter signal is maintained and a difference between the high parameter level and a low parameter level of the multistate parameter signal is maintained to generate monoenergetic ions. The monoenergetic ions are used to etch a top material layer of a substrate at a rate that is self-limiting without substantially etching a bottom material layer of the substrate.

Abstract: A method for depositing a Group IV semiconductor on a surface of a substrate is disclosed. The method may include: providing a substrate within a reaction chamber and heating the substrate to a deposition temperature. The methods may further include: exposing the substrate to at least one Group IV precursor and exposing the substrate to at least one Group IIIA dopant precursor; wherein the at least one Group IIIA dopant precursor comprises a borohydride, an organic borohydride, a halide, or an organohalide. Semiconductor device structures including a Group IV semiconductor deposited by the methods of the disclosure are also provided.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes: providing a substrate including a first semiconductive region of a first conductive type and gate structures over the first semiconductive region, wherein a gap between the gate structures exposes a portion of the first semiconductive region; and forming a second semiconductive region of a second conductive type in the gap starting from the exposed portion of the first semiconductive region. The forming of the second semiconductive region includes: growing, in a chamber, an epitaxial silicon-rich layer having a first sidewall adjacent to the gate structures and a first central portion; and, in the chamber, shaping the epitaxial silicon-rich layer to form a second sidewall adjacent to the gate structures and a second central portion, wherein a first height difference between the first sidewall and the first central portion is greater than a second height difference between the second sidewall and the second central portion.

Abstract: A low temperature polysilicon panel has an edge region, the edge region includes a polysilicon film layer and an interval spacer layer located above the polysilicon film layer; a row of dummy pixel units are provided on the interval spacer layer; a first conductive thin film layer is provided above the dummy pixel unit; a passivation layer is insulated between the dummy pixel unit and the first conductive thin film layer. The dummy pixel units includes a thin film transistor and a data line electrically connected thereto for accessing a common signal; a first hole provided on the interval spacer layer, and the polysilicon film layer electrically connected to the data line through the first hole. The low temperature polysilicon panel can lead the charge collected on the polysilicon film layer to avoid the edge wounded of the polysilicon panel and prevent the leakage of the polysilicon panel edge.

Abstract: Embodiments of the present invention provide apparatus and methods for performing UV treatment and chemical treatment and/or deposition in the same chamber. One embodiment of the present invention provides a processing chamber including a UV transparent gas distribution showerhead disposed above a substrate support located in an inner volume of the processing chamber, a UV transparent window disposed above the UV transparent gas distribution showerhead, and a UV unit disposed outside the inner volume. The UV unit is configured to direct UV lights towards the substrate support through the UV transparent window and the UV transparent gas distribution showerhead.

Abstract: A method of manufacturing a semiconductor device includes: providing a substrate including a first semiconductive region of a first conductive type and gate structures over the first semiconductive region, where a gap between the gate structures exposes a portion of the first semiconductive region; and forming a second semiconductive region of a second conductive type in the gap starting from the exposed portion of the first semiconductive region. The forming of the second semiconductive region includes: growing, in a chamber, an epitaxial silicon-rich layer with a first growth rate around a sidewall adjacent to the gate structures that is greater than a second growth rate at a central portion; and, in the chamber, partially removing the epitaxial silicon-rich layer with an etchant with a first etching rate around the sidewall adjacent to the gate structures that is greater than a second etching rate at the central portion.

Abstract: Performing a distributed database transaction using parallel writes to a distributed append-only database system is provided. A central database and a plurality of distributed databases, also known as “shards”, may be used. A request made to implement a distributed transaction, requiring updates to one or more shards, results in a monotonically increasing identification (ID) number being assigned to a change set. The request and change set may be registered at the central database. Once the change set is completely written to all of the appropriate shards, the change set is marked as completed in the central database. After write completion, a change set ID boundary at the central database is advanced to indicate the current fully changed status of the distributed database.

Abstract: The invention provides a semiconductor structure and a method of preparing a semiconductor structure, which solves the problems of easy cracking, large warpage and large dislocation density which exist in a semiconductor compound epitaxial structure epitaxially grown on a substrate in the prior art. The semiconductor structure includes: a substrate; at least one periodic structure disposed over the substrate; wherein each of the periodic structures includes at least one period, each period including a first periodic layer and a second periodic layer which are sequentially stacked in an epitaxial direction.

Abstract: A drive capability of a dynamic logic circuit is improved. A logic circuit includes a dynamic logic circuit, a first output node, a first transistor that is diode-connected, and a capacitor. The dynamic logic circuit includes a second output node. The first transistor and transistors in the dynamic logic circuit have an n-type conductivity or a p-type conductivity. The first output node is electrically connected to a first terminal of the capacitor, and the second output node is electrically connected to a second terminal of the capacitor. A first terminal of the first transistor is electrically connected to the first output node, and a first voltage is input to a second terminal of the first transistor.

Abstract: Embodiments implement event- and/or condition-based machine monitoring for quality inspection in a manufacturing process. An application receives from a machine, an input comprising event(s) and/or condition(s) potentially affecting product quality. Such an event could be scheduled/unscheduled maintenance of the machine. An exemplary condition could be deviation an operating parameter of the machine that is being monitored. Based upon this input, the engine references a ruleset to output a level of Quality Assurance (QA) product inspection with a changed component (for example, including a more stringent tolerance requirement, an additional inspection step, and/or inspection of larger/additional product lots). Embodiments thus automatically link a rigor of product inspection with changes in machine state having the potential to degrade product quality.

Abstract: A method of manufacturing a source structure for a p-type metal-oxide-semiconductor (PMOS) field effect transistor (FET) is provided. In the method, a first epitaxial layer comprising Si1?xGex is formed on a source region of an FET, a second epitaxial layer comprising Si1?yGey is formed on the first epitaxial layer, a third epitaxial layer comprising Si1?zGez is formed on the second epitaxial layer. Z is smaller than y.

Abstract: Lithographic apparatuses suitable for, and methodologies involving, complementary e-beam lithography (CEBL) are described. In an example, a layout for a metallization layer of an integrated circuit includes a first region having a plurality of unidirectional lines of a first width and a first pitch and parallel with a first direction. The layout also includes a second region having a plurality of unidirectional lines of a second width and a second pitch and parallel with the first direction, the second width and the second pitch different than the first width and the first pitch, respectively. The layout also includes a third region having a plurality of unidirectional lines of a third width and a third pitch and parallel with the first direction, the third width and the third pitch different than the first and second widths and different than the first and second pitches.

Abstract: A method of fabricating a memory device is described. Generally, the method includes forming a channel from a semiconducting material overlying a surface of a substrate, and forming dielectric stack on the channel. A first cap layer is formed over the dielectric stack, and a second cap layer including a nitride formed over the first cap layer. The first and second cap layers and the dielectric stack are then patterned to form a gate stack of a device. The second cap layer is removed and an oxidation process performed to form a blocking oxide over the dielectric stack, wherein the oxidation process consumes the first cap layer. Other embodiments are also described.

Abstract: A semiconductor device (100) comprises: a semiconductor substrate (1); a drift region (2) of a first conductivity type having a trench in part of an upper portion thereof and arranged on a first main surface of the semiconductor substrate (100); an electric field reducing region (4) of a second conductivity type arranged, in a bottom portion of the trench, only around a corner portion and not in a center portion; an anode electrode (9) embedded in the trench; and a cathode electrode (10) arranged on a second main surface of the semiconductor substrate (100) which is opposite to the first main surface.

Abstract: The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

Abstract: A grid assembly for a substrate processing system includes a first portion including a first body defining a central opening, an inlet, an outlet, and an upper manifold that is located in the first body and that is in fluid communication with the inlet or the outlet. A second portion is arranged adjacent to the first portion and includes a second body defining a central opening. A plurality of tubes is arranged in the central opening of the second body. First ones of the plurality of tubes are in fluid communication with the upper manifold. A lower manifold is located in the second body and is in fluid communication with the other one of the inlet or the outlet. Second ones of the plurality of tubes are in fluid communication with the lower manifold. The grid assembly is arranged between a remote plasma source and a substrate.

Abstract: The present invention relates to a method for the production of cross-linked carbon nanotube network which are selected from aerogels and xerogels with improved performance and characteristics thereof. The invention is also concerned with carbon nanotube networks which are selected from aerogels and xerogels produced by such processes and uses thereof.

Abstract: A method is provided for forming a fin cut that enables a single diffusion break in very dense CMOS structures formed using bulk semiconductor substrates. A dummy gate is removed from a finned structure to expose the top regions of the fins, the bottom fin regions being within a shallow trench isolation region. Selective vapor phase etching follows sequential ion implantation of the top and bottom fin regions to form a diffusion break cut region. The non-implanted regions of the substrate and the shallow trench isolation region remain substantially intact during each etching procedure. Double diffusion break cut regions are also enabled by the method.

Abstract: A method for manufacturing semiconductor devices includes following steps. A substrate including a first gate structure and a second gate structure formed thereon is provided. The first gate structure and the second gate structure are complementary to each other. Next, a first mask layer covering the second gate structure is formed and followed by forming first recesses in the substrate at two respective sides of the first transistor. Then, forming the first recesses, a first epitaxial layer is formed in each first recess. After forming the first epitaxial layers, a local protecting cap is formed on the first epitaxial layers and followed by removing the first mask layer.

Abstract: Integrated circuits and methods for fabricating integrated circuits are provided. In an embodiment, a method is provided for fabricating an integrated circuit. The method includes forming a first FET trench in a first FET region and a second FET trench in a second FET region of an interlayer dielectric material on a semiconductor substrate, at least partially filling the first and second FET trenches with a work function metal to form a work function metal layer, and at least partially removing a portion of the work function metal layer in the second FET trench. The first FET trench is defined as an NFET trench and the second FET trench is defined as a PFET trench.

Abstract: Techniques are disclosed for systems and methods to provide shock impact mitigation for MEMS structures. A MEMS structure may include one or more actuators. An actuator may include a first frame having a spine, where the spine includes a body and a tip. The actuator may include a second frame connected to the first frame and including a shock stop, where the shock stop includes a surface in proximity to the spine tip. An actuator may include a shock cushion spring fixed relative to the spine tip and situated substantially between the spine tip and the shock stop surface, where the shock cushion spring is adapted to protect the spine tip from contact with the shock stop surface.

Abstract: To provide a semiconductor device which operates stably with few malfunctions due to noise, with low power consumption, and little variation in characteristics; a display device including the semiconductor device; and an electronic device including the display device. An output terminal is connected to a power supply line, thereby reducing variation in electric potential of the output terminal. In addition, a gate electrode potential which turns ON a transistor is maintained due to the capacitance of the transistor. Further, change in characteristics of the transistor is reduced by a signal line for reverse bias.

Abstract: The present disclosure provides a method of fabricating a semiconductor device with metal interconnections and a design of a tool for performing such a method. In one embodiment, a method of fabricating a semiconductor device, the method includes providing a semiconductor substrate, depositing a dielectric layer over the semiconductor substrate, forming at least one trench in the dielectric layer, and forming a metallization layer in the trench and over the dielectric layer. The method further includes performing a chemical mechanical polishing process to planarize the metallization layer and the dielectric layer, performing a surface treatment on the planarized dielectric layer to form a protection layer, cleaning the planarized metallization layer and the treated dielectric layer to remove residue from the chemical mechanical polishing process, and drying the cleaned metallization layer and dielectric layer in an inert gas environment.

Abstract: The present invention relates to a method for the production of cross-linked carbon nanotube networks which are selected from aerogels and xerogels with improved performance and characteristics thereof. The invention is also concerned with carbon nanotube networks which are selected from aerogels and xerogels produced by such processes and uses thereof.

Abstract: The present invention relates to ion mobility spectrometry, in particular to methods and devices for generating and delivering of ammonia gas as dopant into the ionization region of an ion mobility spectrometer. It provides an ion mobility spectrometer (IMS) with an ion source and device for generating ammonia gas, wherein the device comprises a dopant reservoir filled with alkali metal nitride or alkaline earth metal nitride, preferably lithium nitride and/or magnesium nitride, said reservoir being fluidly coupled to the ion source and to a water reservoir.

Abstract: A dielectric mandrel structure is formed on a single crystalline semiconductor layer. An amorphous semiconductor material layer is deposited on the physically exposed surfaces of the single crystalline semiconductor layer and surfaces of the mandrel structure. Optionally, the amorphous semiconductor material layer can be implanted with at least one different semiconductor material. Solid phase epitaxy is performed on the amorphous semiconductor material layer employing the single crystalline semiconductor layer as a seed layer, thereby forming an epitaxial semiconductor material layer with uniform thickness. Remaining portions of the epitaxial semiconductor material layer are single crystalline semiconductor fins and thickness of these fins are sublithographic. After removal of the dielectric mandrel structure, the single crystalline semiconductor fins can be employed to form a semiconductor device.

Abstract: A method includes etching a semiconductor substrate to form a recess in the semiconductor substrate, and reacting a surface layer of the semiconductor substrate to generate a reacted layer. The surface layer of the semiconductor substrate is in the recess. The reacted layer is then removed. An epitaxy is performed to grow a semiconductor material in the recess.

Abstract: Mechanisms for forming source/drain (S/D) regions of field effect transistors (FETs) are provided. The mechanisms eliminate dislocations near gate corners and gate corner defects (GCDs), and maintain transistor performance. The mechanisms described involve using a post-deposition etch to remove residual dislocations near gate corners after a cyclic deposition and etching (CDE) process is used to fill a portion of the recess regions with an epitaxially grown silicon-containing material. The mechanisms described also minimize the growth of dislocations near gate corners during the CDE process. The remaining recess regions may be filled by another silicon-containing layer deposited by an epitaxial process without forming dislocations near gate corners. The embodiments described enable gate corners to be free of dislocation defects, preserve the device performance from degradation, and widen the process window of forming S/D regions without gate corner defects and chamber matching issues.

Abstract: A method of manufacturing a semiconductor device is disclosed. In one embodiment, the method comprises: forming a gate stack on a substrate; etching the substrate on both sides of the gate stack to form C-shaped source/drain grooves; and wet-etching the C-shaped source/drain grooves to form ?-shaped source/drain grooves. With this method, it is possible to effectively increase stress applied to a channel region, to accurately control a depth of the source/drain grooves, and to reduce roughness of side walls and bottom portions of the grooves and thus reduce defects by etching the C-shaped source/drain grooves and then further wet-etching them to form the ?-shaped source/drain grooves.

Abstract: A transistor structure having an epitaxial layer deposited over an implanted substrate in order to reduce process variability. The epitaxial layer is able to be deposited doped, un-doped or lightly doped via up-diffusion from the implanted substrate, and used to form the channel for the transistor structure. As a result, this use of un-doped epitaxial layer provides the benefit of reducing process variability (e.g. random dopant fluctuation) and thus the transistor performance variability despite the small physical size of the transistors.

Abstract: A semiconductor device has a first element region, a second element region, and a first isolation region in a thin film region and a third element region, a fourth element region, and a second isolation region in a thick film region. It is manufactured with step (a) of providing a substrate having a silicon layer formed via an insulating layer, step (b) of forming element isolation insulating films in the silicon layer in the first isolation region and the second isolation region of the substrate step (c) of forming a hard mask in the thin film region, step (d) of forming silicon films over the silicon layer exposed from the hard mask in the third element region and the fourth element region, and step (e) of forming element isolation insulating films between the silicon films in the third element region and the fourth element region.

Abstract: An imager device is disclosed including a first substrate having an array of photo-sensitive elements formed thereon, a first conductive layer formed above the first substrate, a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer, a standoff structure formed above the first substrate, a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer, and an electrically powered device positioned above the standoff structure, the electrically powered device being electrically coupled to the second conductive layer.

Abstract: A faceted intrinsic buffer semiconductor material is deposited on sidewalls of a source trench and a drain trench by selective epitaxy. A facet adjoins each edge at which an outer sidewall of a gate spacer adjoins a sidewall of the source trench or the drain trench. A doped semiconductor material is subsequently deposited to fill the source trench and the drain trench. The doped semiconductor material can be deposited such that the facets of the intrinsic buffer semiconductor material are extended and inner sidewalls of the deposited doped semiconductor material merges in each of the source trench and the drain trench. The doped semiconductor material can subsequently grow upward. Faceted intrinsic buffer semiconductor material portions allow greater outdiffusion of dopants near faceted corners while suppressing diffusion of dopants in regions of uniform width, thereby suppressing short channel effects.

Abstract: Systems and methods of fabricating a FinFET in large scale integrated circuit are disclosed. One illustrative method relates to a dummy gate process, wherein the fin structure is only formed in the gate electrode region by performing a photolithography process and an etching of a first dummy gate on a flat STI surface using chemical mechanical polishing, forming drain and source regions, depositing a medium dielectric layer, polishing the medium dielectric layer till the top of the first dummy gate is exposed through the chemical mechanical polishing process again, removing the dummy gate material via a dry etching and a wet etching, and continuously etching the STI dielectric layer with the hard mask formed by the medium dielectric layer, thereafter performing the deposition of real gate dielectric and gate electrode material to complete the device structure.

Abstract: An embodiment of the present disclosure is directed to a semiconductor device. The semiconductor devise comprises a substrate. An epitaxially grown semiconductor material is disposed over at least a portion of the substrate. A nanotemplate structure is disposed at least partially within the semiconductor material. The nanotemplate structure comprises a plurality of dielectric nanoscale features defining a plurality of nanoscale windows. An air gap is disposed between at least a portion of one or more of the nanoscale features and the semiconductor material.

Abstract: Methods of fabricating isolation regions of semiconductor devices and structures thereof are disclosed. In a preferred embodiment, a semiconductor device includes a workpiece and at least one trench formed in the workpiece. The at least one trench includes sidewalls, a bottom surface, a lower portion, and an upper portion. A first liner is disposed over the sidewalls and the bottom surface of the at least one trench. A second liner is disposed over the first liner in the lower portion of the at least one trench. A first insulating material is disposed over the second liner in the lower portion of the at least one trench. A second insulating material is disposed over the first insulating material in the upper portion of the at least one trench. The first liner, the second liner, the first insulating material, and the second insulating material comprise an isolation region of the semiconductor device.

Abstract: A structure including nFET and pFET devices is fabricated by depositing a germanium-containing layer on a crystalline silicon layer. The crystalline silicon layer is converted to silicon germanium in the pFET region to provide a thin silicon germanium channel for the pFET device fabricated thereon. Silicon trench isolation is provided subsequent to deposition of the germanium-containing layer. There is substantially no thickness variation in the silicon germanium layer across the pFET device width. Electrical degradation near the shallow trench isolation region bounding the pFET device is accordingly avoided. Shallow trench isolation may be provided prior to or after conversion of the silicon layer to silicon germanium in the pFET region. The germanium-containing layer is removed from the nFET region so that an nFET device can be formed on the crystalline silicon layer.

Abstract: The present invention provides a method for manufacturing a deep-trench super PN junction. The method includes: a deposition step for forming an epitaxial layer on a substrate; forming a first dielectric layer and a second dielectric layer in sequence on the epitaxial layer; forming deep trenches in the epitaxial layer; completely filling the deep trenches with an epitaxial material and the epitaxial material is beyond the second dielectric layer; filling the entire surface of the second dielectric layer and the epitaxial layer such as Si using a third dielectric to from a surface filling layer with a predetermined height; etching back on the surface filling layer to the interface of the first dielectric layer and the epitaxial layer; and a removing step for removing the first dielectric layer, the second dielectric layer and the surface filling layer to planarize Si epitaxial material.

Abstract: Semiconductor devices with reduced substrate defects and methods of manufacture are disclosed. The method includes forming a dielectric material on a substrate. The method further includes forming a shallow trench structure and deep trench structure within the dielectric material. The method further includes forming a material within the shallow trench structure and deep trench structure. The method further includes forming active areas of the material separated by shallow trench isolation structures. The shallow trench isolation structures are formed by: removing the material from within the deep trench structure and portions of the shallow trench structure to form trenches; and depositing an insulator material within the trenches.

Abstract: A semiconductor device includes: a gate pattern over a substrate; recess patterns provided in the substrate at both sides of the gate pattern, each having a side surface extending below the gate pattern; and a source and a drain filling the recess patterns, and forming a strained channel under the gate pattern.

Abstract: A system and method for manufacturing multiple-gate semiconductor devices is disclosed. An embodiment comprises multiple fins, wherein intra-fin isolation regions extend into the substrate less than inter-fin isolation regions. Regions of the multiple fins not covered by the gate stack are removed and source/drain regions are formed from the substrate so as to avoid the formation of voids between the fins in the source/drain region.