Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Material, Contoured Surface, Etc.) Patents (Class 438/29)
  • Patent number: 11437553
    Abstract: A lighting device comprises a light-emitting module with light-emitting elements, wherein the light-emitting elements are arranged adjacent to each other and are configured to emit light towards a light-emitting side. The light-emitting module is configured such that the light-emitting elements can be addressed partially independently of each other, such that some may be brought into a switched-on state while others are brought into a switched-off state. A top layer is disposed on the light-emitting module at the light-emitting side. Further comprising a switching material capable of a reversible change in transmittance for the light emitted by changing to a higher transmittance in regions where the top layer situated on light-emitting elements in the switched-on state or to a lower transmittance in regions of the top layer situated in the switched-off state. The invention further refers to methods for producing and operating a lighting device and using a lighting device.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: September 6, 2022
    Assignee: Lumileds LLC
    Inventors: Nicola Bettina Pfeffer, Arjen Gerben Van der Sijde, Marcel Rene Bohmer
  • Patent number: 11430923
    Abstract: An embodiment of the present invention provides a micro light emitting diode (LED) array and its manufacturing method. The micro-LED includes a substrate, an epitaxial layer formed on the substrate, and a conversion film formed on the epitaxial layer. Pixels can be defined through lithography, and the pixel size can be very small. This method is characterized in that a mass transfer is not required.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: August 30, 2022
    Assignee: National Taiwan University
    Inventors: Ching-Fuh Lin, Chun-Yu Lin, Yi-Shan Lin, Jung-Kuan Huang
  • Patent number: 11424387
    Abstract: A micro-LED chip includes an epitaxial layered structure, and first and second electrodes. The epitaxial layered structure includes first-type and second-type semiconductor layers, and a light emitting layer sandwiched therebetween. The first and second electrodes are electrically connected to the first-type and second-type semiconductor layers, respectively. The micro-LED chip has a first distinctive region on an electrode surface of the first electrode. The first distinctive region has a surface morphology different from that of an adjacent region of the electrode surface of the first electrode. A method for manufacturing a micro-LED device including at least one micro-LED chip is also provided.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: August 23, 2022
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chia-En Lee, Chen-Ke Hsu, Zheng Wu
  • Patent number: 11411372
    Abstract: A method of manufacturing a light emitting element includes, at least: (A) forming a stacked structure 20 which includes a GaN-based compound semiconductor and in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are stacked, and forming a concave mirror section 43 on a first surface side of the first compound semiconductor layer 21; then (B) forming a photosensitive material layer 35 over the second compound semiconductor layer 22; and thereafter (C) exposing the photosensitive material layer 35 to light from the concave mirror section side through the stacked structure 20, to obtain a treatment mask layer including the photosensitive material layer 35, and then processing the second compound semiconductor layer 22 by use of the treatment mask layer.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: August 9, 2022
    Assignee: Sony Corporation
    Inventors: Tatsushi Hamaguchi, Jugo Mitomo, Susumu Sato, Hiroshi Nakajima, Masamichi Ito, Hidekazu Kawanishi
  • Patent number: 11404471
    Abstract: An optoelectronic semiconductor component may have a semiconductor body comprising a first region of an n-type conductivity, a second region of a p-type conductivity, an active region capable of generating electromagnetic radiation, a marker layer, a plurality of emission regions and a plurality of recesses. The active region is disposed between the first region and the second region in a plane parallel to the main extension plane of the semiconductor body. The recesses delimit the emission regions in lateral direction. Starting from the side of the first region facing away from the active region, the recesses extend transversely to the main plane of the semiconductor body in the direction of the second region and adjoin the marker layer or penetrate the marker layer completely. The recesses are formed only in the first region or the recesses extend into the second region and completely penetrate the active region.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: August 2, 2022
    Assignee: OSRAM OLED GMBH
    Inventors: Christian Mueller, Dominik Scholz, Joachim Hertkorn
  • Patent number: 11396156
    Abstract: Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill later is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: July 26, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Martin B. Wolk, Michael Benton Free, Margaret M. Vogel-Martin, Evan L. Schwartz, Mieczyslaw H. Mazurek, Terry O. Collier
  • Patent number: 11378670
    Abstract: An ultrasonic device includes nine ultrasonic array units arranged in a grid pattern of three rows and three columns, nine drive bypass wires that input and output drive signals to and from the respective ultrasonic array units, a first common bypass wire to which a common potential is applied, coupled to the eight ultrasonic array units, a second common bypass wire coupled to the ultrasonic array unit to which the first common bypass wire is not coupled, and a third common bypass wire coupling the first and the second common bypass wires. One of the drive bypass wires, the first common bypass wire, and the second common bypass wire is placed between the ultrasonic array units placed adjacent to each other. The third common bypass wire is placed inside of the ultrasonic array unit placed adjacent to the ultrasonic array unit coupled to the second common bypass wire.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: July 5, 2022
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Chikara Kojima, Koji Ohashi, Hironori Suzuki, Tomohide Onogi
  • Patent number: 11329260
    Abstract: A touch display device exhibiting low reflectivity is disclosed. The touch display device includes a light-blocking stack composed of at least two light-blocking color layers overlapping a plurality of touch electrodes disposed on an encapsulation unit, and a low-reflection layer disposed on the light-blocking stack, thereby absorbing external light without a separate polarizing plate, thus exhibiting low reflectivity.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: May 10, 2022
    Assignee: LG Display Co., Ltd.
    Inventors: Jae-Young Oh, Tae-Hwan Kim
  • Patent number: 11316071
    Abstract: Provided are an optical device that is a small and thin optical device including a redistribution layer and has high light emitting efficiency and light receiving efficiency, and a method for manufacturing the optical device. An optical device includes: a photoelectric conversion element configured to include a semiconductor substrate, a semiconductor layer capable of receiving or emitting light, and electrodes; a sealing portion configured to expose a surface of the photoelectric conversion element on the opposite side to an electrode-formed surface of the photoelectric conversion element on which the electrodes are formed; a redistribution layer configured to include a reflecting portion disposed in a region in which, when viewed in plan, the semiconductor layer and the electrodes do not overlap each other and configured to reflect the light to a side on which the semiconductor layer is located; and external connection terminals configured to be coupled to the redistributions.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: April 26, 2022
    Assignee: Asahi Kasei Microdevices Corporation
    Inventor: Toshiaki Fukunaka
  • Patent number: 11300722
    Abstract: An object is to promote a reduction in thickness of a light guide plate and suppress brightness non-uniformity of the light guide plate. A light guide plate, including: a light exit surface from which light is emitted; an opposite surface on an opposite side of the light exit surface; a depressed portion provided on the opposite surface; and a plurality of scattering portions which are provided on the light exit surface, the opposite surface, and a bottom surface of the depressed portion and which refract and scatter light, wherein the depressed portion has a tapered surface which spreads from the bottom surface of the depressed portion toward an opening of the depressed portion.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 12, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Shotaro Watanabe, Kazuhide Hirota, Naoki Ishimi
  • Patent number: 11271141
    Abstract: A light-emitting device including a light-emitting semiconductor chip having a semiconductor layer sequence having at least one light-emitting semiconductor layer and a light-outcoupling surface, the light-emitting device further including a wavelength conversion layer arranged on the light-outcoupling surface, the wavelength conversion layer including quantum dots.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: March 8, 2022
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Maria J. Anc, Darshan Kundaliya, Madis Raukas, David O'Brien
  • Patent number: 11258045
    Abstract: A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: February 22, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Kyuil Cho, Byung Sung Kwak, Robert Jan Visser
  • Patent number: 11239389
    Abstract: The disclosure provides a method for manufacturing a light-emitting element, including the following steps. A light-emitting diode is provided. An energy beam is applied to process a surface of the light-emitting diode, where a power density of the energy beam is greater than 0 mJ/cm2 and less than or equal to 2000 mJ/cm2. The light-emitting element manufactured using the method for manufacturing a light-emitting element disclosed in embodiments of the disclosure may improve light extraction efficiency, may have a relatively good light-emitting effect, and may be electrically connected to a drive circuit to constitute an electronic device.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: February 1, 2022
    Assignee: Innolux Corporation
    Inventors: Jian-Jung Shih, Tsau-Hua Hsieh
  • Patent number: 11233179
    Abstract: Wavelength converters, including polarization-enhanced carrier capture converters, for solid state lighting devices, and associated systems and methods are disclosed. A solid state radiative semiconductor structure in accordance with a particular embodiment includes a first region having a first value of a material characteristic and being positioned to receive radiation at a first wavelength. The structure can further include a second region positioned adjacent to the first region to emit radiation at a second wavelength different than the first wavelength. The second region has a second value of the material characteristic that is different than the first value, with the first and second values of the characteristic forming a potential gradient to drive electrons, holes, or both electrons and holes in the radiative structure from the first region to the second region. In a further particular embodiment, the material characteristic includes material polarization.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 25, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Martin F. Schubert, Vladimir Odnoblyudov
  • Patent number: 11222936
    Abstract: An organic light-emitting display apparatus including: a substrate; a pixel electrode located on the substrate; a pixel-defining film coveting an end portion of the pixel electrode; an intermediate layer located on the pixel electrode and including an emission layer; a counter electrode located on the intermediate layer; a passivation layer located on the counter electrode and including a cover portion covering a top surface of the counter electrode and a protrusion extending from an end portion of the cover portion away from the substrate; and an encapsulation member covering the passivation layer.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: January 11, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sehoon Jeong, Hyeyong Chu, Jaesik Kim, Yeonhwa Lee
  • Patent number: 11205666
    Abstract: An array substrate and a display panel are provided. The array substrate includes a first region and a second region. The first region corresponds to a display region of the display panel. The second region corresponds a non-display region of the display panel. The second region includes a substrate and an electrically conductive line formed on the substrate. The second region further includes at least one metal pattern formed between the substrate and the electrically conductive line.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: December 21, 2021
    Inventor: Zhihao Cao
  • Patent number: 11205683
    Abstract: An image sensor includes a substrate having a photoelectric conversion element therein, a first insulating layer on the substrate, a contact penetrating through the first insulating layer, a color filter on at least one side of the contact, and a moisture absorption prevention layer in contact with a sidewall of the contact and extending on an upper surface of the color filter.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: December 21, 2021
    Inventors: Kwan Sik Kim, Jin Hyung Kim, Chang Hwa Kim, Hong Ki Kim, Sang-Su Park, Beom Suk Lee, Jae Sung Hur
  • Patent number: 11201266
    Abstract: A light-emitting device includes a substrate including a base member having an upper surface having a substantially rectangular shape, a lower surface opposite to the upper surface, a first longer lateral surface, a second longer lateral surface opposite to the first longer lateral surface, a first shorter lateral surface, and a second shorter lateral surface opposite to the first shorter lateral surface, first wirings disposed on the upper surface, and second wirings disposed on the lower surface and each electrically connected with a respective one of the first wirings; at least one light-emitting element; and a light-reflective covering member covering lateral surfaces of the light-emitting element and the upper surface of the base member. The base member has at least one first recess open at the upper surface and the first longer lateral surface. Surfaces defining the at least one first recess are covered with the covering member.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: December 14, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tadaaki Ikeda
  • Patent number: 11201267
    Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: December 14, 2021
    Assignee: LUMILEDS LLC
    Inventors: Daniel Bernardo Roitman, Emma Dohner, Kentaro Shimizu, Marcel Rene Bohmer
  • Patent number: 11173737
    Abstract: A method for applying a patterned structure on a surface, comprising providing a donor substrate (1) comprising donor material (1a) between a light source (3) and a receiving surface (5), providing by means of the light source (3) a light pulse (3a) directed to the donor substrate (1), the light pulse (3a) being configured to cause the donor material (1a) to be transferred from the donor substrate (1) onto the receiving surface (5), wherein the donor substrate (1) comprises a pattern (2) of donor material (1a) on discrete portions (2a) of the donor substrate (1). The pattern (2) on the donor substrate (1) is transferred so as to form a pattern (4) of donor material (1a) on the receiving surface (5).
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: November 16, 2021
    Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
    Inventor: Gari Arutinov
  • Patent number: 11171289
    Abstract: Provided is a disclosure relating to a method for manufacturing an organic solar cell comprising providing a substrate; forming a first electrode on the substrate; forming a photoactive layer by coating a solution comprising a photoactive material and a solvent on the first electrode; drying the photoactive layer in a closed drying system having a constant volume; and forming a second electrode on the photoactive layer, and an organic solar cell manufactured using the same.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 9, 2021
    Inventors: Doowhan Choi, Jiyoung Lee, Songrim Jang, Younshin Kim
  • Patent number: 11171271
    Abstract: A structure with micro device includes a substrate, at least one micro device, and at least one holding structure. The micro device includes an epitaxial structure and an overcoat layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The overcoat layer includes a contact portion and an extension portion. The contact portion covers the peripheral surface and the bottom surface of the epitaxial structure. The extension portion connects the contact portion and extends in a direction away from the peripheral surface. The holding structure includes at least one connecting portion, at least one sacrificial portion and at least one holding portion. The connecting portion is disposed on the top surface of the epitaxial structure and the extension portion of the overcoat layer. The sacrificial portion connects the connecting portion and the holding portion.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: November 9, 2021
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Yi-Min Su, Sheng-Chieh Liang, Chih-Ling Wu, Gwo-Jiun Sheu, Yu-Yun Lo
  • Patent number: 11164844
    Abstract: In some embodiments, the present disclosure relates to a method of forming a package assembly. A wet etch stop layer is formed over a frontside of a semiconductor substrate. A sacrificial semiconductor layer is formed over the wet etch stop layer, and a dry etch stop layer is formed over the sacrificial semiconductor layer. A stack of semiconductor device layers may be formed over the dry etch stop layer. A bonding process is performed to bond the stack of semiconductor device layers to a frontside of an integrated circuit die, wherein the frontside of the semiconductor substrate faces the frontside of the integrated circuit die. A wet etching process is performed to remove the semiconductor substrate, and a dry etching process is performed to remove the wet etch stop layer and the sacrificial semiconductor layer.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: November 2, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen Yu Chen, Ming Chyi Liu, Eugene Chen
  • Patent number: 11127868
    Abstract: A photon-activated quantum dot capacitor and method of fabrication. A photon-activated quantum dot capacitor photodetector having a read only integrated circuit; and a photon-activated quantum dot capacitor chip hybridized with the read only integrated circuit, wherein said photon-activated quantum dot capacitor chip comprises colloidal quantum dots that detect photons as a change in a dielectric constant of the colloidal quantum dots of the photon-activated quantum dot capacitor chip, including the further implementation of a photodetector.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: September 21, 2021
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Pierre-Alain S. Auroux, Louise C. Sengupta, John E. King, Idan Mandelbaum, James A. Stobie, Laura A. Swafford, Chen J. Zhang, Christopher S. Badorrek, Michael J. Bowers, II, Myeongseob Kim, Tadd C. Kippeny, Don A. Harris
  • Patent number: 11101239
    Abstract: A process for packaging at least one component includes the steps of: a) providing a substrate and a packaging material layer, b) forming the packaging material layer into an adhesively semi-cured packaging material layer, c) adhering the adhesively semi-cured packaging material layer to an array, d) providing a packaging unit including at least one eutectic metal bump pair, e) permitting the eutectic metal bump pair to be in contact with at least one electrode pair on the array, f) subjecting the electrode pair to eutectic bonding to the eutectic metal bump pair, g) encapsulating the component by pressing, h) completely curing the adhesively semi-cured packaging material layer, and i) removing the substrate.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: August 24, 2021
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhibai Zhong, Chia-en Lee, Jinjian Zheng, Lixun Yang, Chen-ke Hsu, Junyong Kang
  • Patent number: 11073715
    Abstract: A method for producing a glass article from a glass member including a glass substrate including a first main surface, a second main surface and an end face, and an irregular layer formed in at least one of main surfaces, includes forming an irregular layer having a glass transition point Tg which is equal to or lower than a glass transition point in a central part of the glass member in a thickness-direction sectional view and performing a heat treatment on the glass member so as to have an equilibrium viscosity in the central part of the glass member in thickness-direction sectional view of 1017 Pa·s or lower.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: July 27, 2021
    Assignee: AGC Inc.
    Inventors: Takanori Fukushi, Satoshi Kanasugi, Makoto Fujii, Toru Ikeda
  • Patent number: 11070022
    Abstract: The present disclosure discloses a sector-shaped closely-packed laser generator, comprising a module packaging unit and a closely-packed output unit; the module packaging unit is provided therein with a plurality of single-die modules, and each of the single-die modules has a coupling optical fiber; the closely-packed output unit is provided therein with a silicon wafer whose surface has a plurality of V-shaped grooves, and the plurality of V-shaped grooves are arranged into a sector shape; and the coupling optical fibers of the single-die modules protrude from the module packaging unit and enter the closely-packed output unit, and are arranged in the V-shaped grooves after coating layers being stripped, to emit laser lights in directions of the arrangement of the V-shaped grooves.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: July 20, 2021
    Inventors: Zongyuan Sun, Rui Liu, Juyun Zhao, Lei Xu
  • Patent number: 11069751
    Abstract: A display device including a light source including a first electrode having a light reflectance for a first light of greater than or equal to about 60%; an organic light emitting layer disposed on the first electrode and emitting the first light; and a second electrode disposed on the organic light emitting layer and having a light transmittance in a visible wavelength region of greater than or equal to about 70%, wherein the light source has a first absorption peak in a wavelength region of about 650 nanometers (nm) to about 750 nm or a second absorption peak in a wavelength region of about 550 nm to about 600 nm at a viewing angle of about 55 degrees to about 85 degrees, and a color filter layer disposed above the light source and including a quantum dot configured to convert the first light into a second light.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: July 20, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG DISPLAY CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Tae Gon Kim, Sung Hun Lee, Ji Whan Kim, Shin Ae Jun, Deukseok Chung
  • Patent number: 11069784
    Abstract: FinFET devices with source/drain contacts with reduced resistance/capacitance power loss and with an enhanced processing window between the source/drain contacts and a gate via and methods of manufacture are described herein. A metal riser may be formed in a first recess of a source/drain contact of a first material. The metal riser and a contact via may be formed from a second material and the contact via may be formed over the metal riser to provide a hybrid source/drain contact of a finFET with a wide surface contact area at an interface between the source/drain contact and the metal riser. A dielectric fill material and/or a conformal contact etch stop layer may be used to form an isolation region in a second recess of the source/drain contact to extend a processing window disposed between the isolation region and a gate contact of the finFET.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: July 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chiang Tsai, Jyh-Huei Chen
  • Patent number: 11037902
    Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: June 15, 2021
    Assignee: Au Optronics Corporation
    Inventors: Tsung-Tien Wu, Chin-Yuan Ho, Chu-Yu Liu
  • Patent number: 11030434
    Abstract: Devices are provided for providing on-screen optical sensing of fingerprints by using an under-screen optical sensor module for improved optical fingerprint sensing including using an optical sensor module to include (1) an optical sensor array of optical detectors to detect light that carries a fingerprint pattern, (2) a pinhole layer structured to include an array of pinholes and located above the optical sensor array to spatially filter incident light to be detected by the optical detectors; and (3) a lens layer structured to include an array of lenses formed above the pinhole layer where the lenses are spatially separated and positioned so that one lens is placed above one corresponding pinhole in the array of pinholes and different lenses in the lens array are placed above different pinholes in the array of pinholes, respectively, to allow the optical sensor array to receive and detector the incident light.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 8, 2021
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Yi He, Bo Pi
  • Patent number: 10950675
    Abstract: A signal control unit for an organic light emitting diode (OLED) display device, includes a substrate structure including a plurality of active elements each corresponding to a pixel, a lower metal pattern disposed on the substrate structure, and electrically connected to a portion of the plurality of active elements, an insulating interlayer disposed on the substrate structure and at least partially covering the lower metal pattern, a via contact penetrating through the insulating interlayer and connected to the lower metal pattern, a metal electrode disposed on the insulating interlayer, and connected to the via contact, and an electrode passivation layer pattern substantially covering the metal electrode to expose a center portion of an upper surface of the metal electrode while covering a remainder of the upper surface and a side surface of the metal electrode. Therefore, leakage current which flows through the side surface of the metal electrode is suppressed.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: March 16, 2021
    Assignee: DB HITEK CO., LTD.
    Inventors: Dae Il Kim, Seung Ha Lee, Jung Hyun Lee, Jin Hyo Jung, Young Jin Kim, Dong Hoon Park
  • Patent number: 10948645
    Abstract: In an embodiment, a display device comprises a display panel and a backlight unit. The backlight unit comprises a substrate, phosphor film, light-emitting devices, and light-modifying portion. A part of light emitted by the light-emitting devices traveling along a first path that passes through the phosphor film and another part of the emitted light traveling along a second path that bypasses the phosphor film. The light-modifying portion is in the second path and modifies a color of the other part of the emitted light so that the modified color is closer to a color of the part of the light through the phosphor film than a color of the emitted light at the light-emitting devices.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: March 16, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: HyeokJoon Yoon, KiSeong Kim, SeungJu Gwon, Donghwi Kim
  • Patent number: 10930518
    Abstract: The present disclosure provides an OLED substrate and a manufacturing method thereof, a display device and a manufacturing method thereof, and belongs to the technical field of display technology. A manufacturing method for an OLED substrate of the present disclosure includes: forming, by a patterning process, a pattern including first electrodes of OLED devices and a pixel defining layer provided above the first electrodes above the base substrate, wherein the pixel defining layer includes a plurality of pixel partition walls spaced apart from each other, each of the pixel partition walls defines one of the first electrodes.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: February 23, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Zhijun Lv, Wenqu Liu, Liwen Dong, Shizheng Zhang, Ning Dang
  • Patent number: 10919270
    Abstract: Provided is a laminated glass, comprising: a soda lime glass; and a non-tempered alkali-free glass bonded to one surface of the soda lime glass, in which a thickness of the soda lime glass is larger than a thickness of the non-tempered alkali-free glass, and an elastic modulus of the non-tempered alkali-free glass is larger than an elastic modulus of the soda lime glass.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: February 16, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jun Hak Oh, Jae Hyuk Yoon, Chang Hee Lee, Byung Kook Choi
  • Patent number: 10910562
    Abstract: An organic electroluminescent device, a manufacturing method thereof and an evaporation apparatus are provided. The manufacturing method for the organic electroluminescent device includes: forming, on a base substrate, a first electrode layer; performing vacuum evaporation on an organic functional layer material to be evaporated, and performing a heat treatment, during the evaporation of the organic functional layer material to be evaporated, on the base substrate on which the first electrode layer is formed, so as to form an organic functional layer on the base substrate on which the first electrode layer is formed; and forming, on the base substrate on which the organic functional layer is formed, a second electrode layer.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 2, 2021
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xin Liu, Chao Kong
  • Patent number: 10884293
    Abstract: A display and a method of coating an alignment film are provided. The method of coating an alignment film includes step S10, providing substrate to-be-coating with the alignment film, positioned the substrate to-be-coating with the alignment film on optical bench; step S11, pressing against to the substrate by a print wheel has alignment film printing template, and rolling by predetermined coating direction, uniform coating alignment liquid on to-be-coating region of the substrate; wherein, the substrate rolling with the optical bench and forms changing angle with horizontal surface during the coating process; and step S12, controlling the optical bench for driving the substrate to vibrate after coating the to-be-coating region. In this invention provides a method could suit to difference mobility alignment film, it could greatly enhances uniformity of the alignment film such decrease opportunity to Mura happened by worse quality of printing the alignment film.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: January 5, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Junfeng Zheng
  • Patent number: 10886411
    Abstract: A semiconductor device includes a substrate, a transistor, a storage capacitor, a first insulating layer, and a second insulating layer. The transistor includes a semiconductor film, a gate insulating film, a first gate electrode, and a second gate electrode. The semiconductor film, the gate insulating film, and the first gate electrode are provided in this order from the substrate. The second gate electrode faces the first gate electrode across the semiconductor film. The storage capacitor includes a lower electrode and an upper electrode that are provided in this order from the substrate. The upper electrode faces the lower electrode and includes the same material as the semiconductor film. The first insulating layer is provided between the second gate electrode and the semiconductor film. The second insulating layer is provided between the lower electrode and the upper electrode and has a smaller thickness than the first insulating layer.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 5, 2021
    Assignee: JOLED INC.
    Inventor: Yasuhiro Terai
  • Patent number: 10879063
    Abstract: A method of fabricating a high-crystalline-quality and high-uniformity AlN layer within a high electron mobility transistor (HEMT) device with a metalorganic chemical vapor deposition (MOCVD) technique, includes: raising a temperature of a substrate to an ultra-high growth temperature; and supplying an Al source and an N source in pulses over the substrate under the ultra-high growth temperature, wherein the ultra-high growth temperature is at least 1300° C. At least for a first predetermined period of time in each cycle of the pulses, the Al source is switched on when the N source is switched off.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: December 29, 2020
    Assignee: SUZHOU HAN HUA SEMICONDUCTOR CO., LTD.
    Inventors: Xianfeng Ni, Qian Fan, Wei He
  • Patent number: 10879672
    Abstract: A semiconductor laser (100) and a method for processing the semiconductor laser are provided, so that modulation bandwidth can be increased.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: December 29, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Chen, Jing Hu, Zhiguang Xu
  • Patent number: 10862011
    Abstract: A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting element has a top surface, a bottom surface, a side surface, and a first electrical contact formed on the bottom surface. The distance between the top surface and the bottom surface has a first height (h1). The wavelength conversion layer has a first area (A1) located on the top surface of the light-emitting element and a second area (A2) located on the side surfaces and surrounding the first area. The first area has a second height (h2). The second area has a third height (h3) and a second width (w2). The second height (h2) is greater than the second width (w2). The difference of the third height and the sum of the first height and the second height is less than 15 ?m.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 8, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Yih-Hua Renn, Ching-Tai Cheng, Chun-Hua Shih
  • Patent number: 10862064
    Abstract: An organic light emitting diode (OLED) display panel includes a substrate, a reflective electrode disposed on the substrate, and a pixel define layer (PDL) formed on the substrate and the reflective electrode layer. The reflective electrode layer has multiple reflective structures, and each reflective structure has a first region and a second region. The PDL is provided with multiple openings corresponding to the reflective structures, such that the first region and the second region of each of the reflective structures are exposed in a corresponding one of the openings. Multiple organic emissive structures are correspondingly formed in the openings and covering the reflective structures, forming a plurality of pixels. For each respective pixel of the pixels, a first reflective ratio of the respective pixel corresponding to the first region is greater than a second reflective ratio of the respective pixel corresponding to the second region.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: December 8, 2020
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Yung-Sheng Ting, Yu-Ching Wang, Yi-Hui Lin
  • Patent number: 10840377
    Abstract: Provided is a method for manufacturing an inorganic material having a tensile stress, which includes: forming an inorganic stressor from an inorganic wafer made of an inorganic matter; forming an inorganic layer on the inorganic stressor; and etching a bulk inorganic matter at a lower portion of the inorganic stressor to generate an inorganic material having a tensile stress, wherein the inorganic layer has a tensile stress by etching the bulk inorganic matter to relieve a compressive stress applied to the inorganic stressor when the inorganic stressor is being formed. Therefore, FET and various circuits having higher charge mobility may be realized, and also, since characteristics may be maintained even when being applied to a plastic substrate, high performance flexible electronic device may be manufactured.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: November 17, 2020
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jong Hyun Ahn, Wonho Lee
  • Patent number: 10811441
    Abstract: A pixel array substrate including a substrate, an active device, a planarization layer, a first conductive layer, a first insulation layer and a second conductive layer is provided. The active device is disposed on the substrate. The planarization layer covers the active device and has a first opening. The first conductive layer is disposed on the planarization layer and is electrically connected with a first end of the active device. The first insulation layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulation layer. The first conductive layer and the second conductive layer cover a side surface of the first opening of the planarization layer.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: October 20, 2020
    Assignee: Au Optronics Corporation
    Inventors: Ming-Yao Chen, Kuo-Yu Huang, Wen-Ching Sung
  • Patent number: 10793468
    Abstract: A method of manufacturing an etched glass article includes the steps of jetting an image with a UV curable inkjet ink on a surface of the glass article; UV curing the image; etching the surface not covered by the UV cured image to obtain an etched image; and removing the UV cured image in an aqueous alkaline solution; wherein the UV curable inkjet ink includes a polymerizable composition, wherein at least 80 wt % of the polymerizable composition consists of: a) 15.0 to 70.0 wt % of an acryl amide; b) 20.0 to 75.0 wt % of a polyfunctional acrylate; and c) 1.0 to 15.0 wt % of a (meth)acrylate containing a carboxylic acid group, a phosphoric acid group or a phosphonic acid group-; with all weight percentages (wt %) based on the total weight of the polymerizable composition.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 6, 2020
    Inventors: Rita Torfs, Frank Louwet, Johan Loccufier, Mark Lens
  • Patent number: 10768275
    Abstract: An antenna apparatus includes a dielectric substrate, a base plate, an antenna unit, and a reflecting unit. A plurality of conductor patches are structured to resonate, at an operating frequency of the antenna unit, in a resonating direction which is different from a polarization direction Dan of a radio wave transmitted and received by the antenna unit.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: September 8, 2020
    Assignees: DENSO CORPORATION, SOKEN, INC.
    Inventors: Kazushi Kawaguchi, Kazumasa Sakurai, Toshiya Sakai, Asahi Kondo
  • Patent number: 10759992
    Abstract: A semiconductor nanocrystal and a preparation method thereof, where the semiconductor nanocrystal include a bare semiconductor nanocrystal and a water molecule directly bound to the bare semiconductor nanocrystal.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-Joo Jang, Seok-Hwan Hong, Shin-Ae Jun, Hyo-Sook Jang
  • Patent number: 10757768
    Abstract: The present invention relates to a light converting device (11) comprising a solid state light source (2) and a wavelength converting layer (3) arranged to at least partly wavelength convert the light emitted, in use, by the solid state light source (2), the wavelength converting layer (3) having a back side (4) facing the solid state light source (2) and a front side (5) opposite the back side (4), wherein the front side (5) of the wavelength converting layer (3) defines an exit window of the light converting device (11). The light converting device (11) further comprises a hydrophobic nanostructure (6) having spaced apart protrusions (66) arranged on the front side (5) of the wavelength converting layer (3) and a protective coating (7) applied on top of the hydrophobic nanostructure (6).
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 25, 2020
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Jordy Bernard Margreth Shoenmaekers, Peter Johannes Martinus Bukkems
  • Patent number: 10748853
    Abstract: A flexible display device is disclosed. In one aspect, the display device includes a flexible display panel including a display substrate, wherein the display substrate includes an active area for pixel circuits, an inactive area adjacent to the active area and having a pad area including a plurality of pad terminals, and a thin film encapsulation layer covering the active area. The display device also includes a display driver electrically connected to the pad terminals and a plurality of driving terminals each having a rounding unit. A conductive unit is configured to electrically connect the pad terminals to the respective driving terminals.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: August 18, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jonghwan Kim, Sangurn Lim
  • Patent number: 10707384
    Abstract: A light-emitting device includes a substrate including a base member having an upper surface having a substantially rectangular shape, a lower surface opposite to the upper surface, a first longer lateral surface, a second longer lateral surface opposite to the first longer lateral surface, a first shorter lateral surface, and a second shorter lateral surface opposite to the first shorter lateral surface, first wirings disposed on the upper surface, and second wirings disposed on the lower surface and each electrically connected with a respective one of the first wirings; at least one light-emitting element; and a light-reflective covering member covering lateral surfaces of the light-emitting element and the upper surface of the base member. The base member has at least one first recess open at the upper surface and the first longer lateral surface. Surfaces defining the at least one first recess are covered with the covering member.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: July 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tadaaki Ikeda