Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Material, Contoured Surface, Etc.) Patents (Class 438/29)
  • Patent number: 11127868
    Abstract: A photon-activated quantum dot capacitor and method of fabrication. A photon-activated quantum dot capacitor photodetector having a read only integrated circuit; and a photon-activated quantum dot capacitor chip hybridized with the read only integrated circuit, wherein said photon-activated quantum dot capacitor chip comprises colloidal quantum dots that detect photons as a change in a dielectric constant of the colloidal quantum dots of the photon-activated quantum dot capacitor chip, including the further implementation of a photodetector.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: September 21, 2021
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Pierre-Alain S. Auroux, Louise C. Sengupta, John E. King, Idan Mandelbaum, James A. Stobie, Laura A. Swafford, Chen J. Zhang, Christopher S. Badorrek, Michael J. Bowers, II, Myeongseob Kim, Tadd C. Kippeny, Don A. Harris
  • Patent number: 11101239
    Abstract: A process for packaging at least one component includes the steps of: a) providing a substrate and a packaging material layer, b) forming the packaging material layer into an adhesively semi-cured packaging material layer, c) adhering the adhesively semi-cured packaging material layer to an array, d) providing a packaging unit including at least one eutectic metal bump pair, e) permitting the eutectic metal bump pair to be in contact with at least one electrode pair on the array, f) subjecting the electrode pair to eutectic bonding to the eutectic metal bump pair, g) encapsulating the component by pressing, h) completely curing the adhesively semi-cured packaging material layer, and i) removing the substrate.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: August 24, 2021
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhibai Zhong, Chia-en Lee, Jinjian Zheng, Lixun Yang, Chen-ke Hsu, Junyong Kang
  • Patent number: 11073715
    Abstract: A method for producing a glass article from a glass member including a glass substrate including a first main surface, a second main surface and an end face, and an irregular layer formed in at least one of main surfaces, includes forming an irregular layer having a glass transition point Tg which is equal to or lower than a glass transition point in a central part of the glass member in a thickness-direction sectional view and performing a heat treatment on the glass member so as to have an equilibrium viscosity in the central part of the glass member in thickness-direction sectional view of 1017 Pa·s or lower.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: July 27, 2021
    Assignee: AGC Inc.
    Inventors: Takanori Fukushi, Satoshi Kanasugi, Makoto Fujii, Toru Ikeda
  • Patent number: 11070022
    Abstract: The present disclosure discloses a sector-shaped closely-packed laser generator, comprising a module packaging unit and a closely-packed output unit; the module packaging unit is provided therein with a plurality of single-die modules, and each of the single-die modules has a coupling optical fiber; the closely-packed output unit is provided therein with a silicon wafer whose surface has a plurality of V-shaped grooves, and the plurality of V-shaped grooves are arranged into a sector shape; and the coupling optical fibers of the single-die modules protrude from the module packaging unit and enter the closely-packed output unit, and are arranged in the V-shaped grooves after coating layers being stripped, to emit laser lights in directions of the arrangement of the V-shaped grooves.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: July 20, 2021
    Inventors: Zongyuan Sun, Rui Liu, Juyun Zhao, Lei Xu
  • Patent number: 11069784
    Abstract: FinFET devices with source/drain contacts with reduced resistance/capacitance power loss and with an enhanced processing window between the source/drain contacts and a gate via and methods of manufacture are described herein. A metal riser may be formed in a first recess of a source/drain contact of a first material. The metal riser and a contact via may be formed from a second material and the contact via may be formed over the metal riser to provide a hybrid source/drain contact of a finFET with a wide surface contact area at an interface between the source/drain contact and the metal riser. A dielectric fill material and/or a conformal contact etch stop layer may be used to form an isolation region in a second recess of the source/drain contact to extend a processing window disposed between the isolation region and a gate contact of the finFET.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: July 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Chiang Tsai, Jyh-Huei Chen
  • Patent number: 11069751
    Abstract: A display device including a light source including a first electrode having a light reflectance for a first light of greater than or equal to about 60%; an organic light emitting layer disposed on the first electrode and emitting the first light; and a second electrode disposed on the organic light emitting layer and having a light transmittance in a visible wavelength region of greater than or equal to about 70%, wherein the light source has a first absorption peak in a wavelength region of about 650 nanometers (nm) to about 750 nm or a second absorption peak in a wavelength region of about 550 nm to about 600 nm at a viewing angle of about 55 degrees to about 85 degrees, and a color filter layer disposed above the light source and including a quantum dot configured to convert the first light into a second light.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: July 20, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG DISPLAY CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Tae Gon Kim, Sung Hun Lee, Ji Whan Kim, Shin Ae Jun, Deukseok Chung
  • Patent number: 11037902
    Abstract: A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: June 15, 2021
    Assignee: Au Optronics Corporation
    Inventors: Tsung-Tien Wu, Chin-Yuan Ho, Chu-Yu Liu
  • Patent number: 11030434
    Abstract: Devices are provided for providing on-screen optical sensing of fingerprints by using an under-screen optical sensor module for improved optical fingerprint sensing including using an optical sensor module to include (1) an optical sensor array of optical detectors to detect light that carries a fingerprint pattern, (2) a pinhole layer structured to include an array of pinholes and located above the optical sensor array to spatially filter incident light to be detected by the optical detectors; and (3) a lens layer structured to include an array of lenses formed above the pinhole layer where the lenses are spatially separated and positioned so that one lens is placed above one corresponding pinhole in the array of pinholes and different lenses in the lens array are placed above different pinholes in the array of pinholes, respectively, to allow the optical sensor array to receive and detector the incident light.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 8, 2021
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Yi He, Bo Pi
  • Patent number: 10948645
    Abstract: In an embodiment, a display device comprises a display panel and a backlight unit. The backlight unit comprises a substrate, phosphor film, light-emitting devices, and light-modifying portion. A part of light emitted by the light-emitting devices traveling along a first path that passes through the phosphor film and another part of the emitted light traveling along a second path that bypasses the phosphor film. The light-modifying portion is in the second path and modifies a color of the other part of the emitted light so that the modified color is closer to a color of the part of the light through the phosphor film than a color of the emitted light at the light-emitting devices.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: March 16, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: HyeokJoon Yoon, KiSeong Kim, SeungJu Gwon, Donghwi Kim
  • Patent number: 10950675
    Abstract: A signal control unit for an organic light emitting diode (OLED) display device, includes a substrate structure including a plurality of active elements each corresponding to a pixel, a lower metal pattern disposed on the substrate structure, and electrically connected to a portion of the plurality of active elements, an insulating interlayer disposed on the substrate structure and at least partially covering the lower metal pattern, a via contact penetrating through the insulating interlayer and connected to the lower metal pattern, a metal electrode disposed on the insulating interlayer, and connected to the via contact, and an electrode passivation layer pattern substantially covering the metal electrode to expose a center portion of an upper surface of the metal electrode while covering a remainder of the upper surface and a side surface of the metal electrode. Therefore, leakage current which flows through the side surface of the metal electrode is suppressed.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: March 16, 2021
    Assignee: DB HITEK CO., LTD.
    Inventors: Dae Il Kim, Seung Ha Lee, Jung Hyun Lee, Jin Hyo Jung, Young Jin Kim, Dong Hoon Park
  • Patent number: 10930518
    Abstract: The present disclosure provides an OLED substrate and a manufacturing method thereof, a display device and a manufacturing method thereof, and belongs to the technical field of display technology. A manufacturing method for an OLED substrate of the present disclosure includes: forming, by a patterning process, a pattern including first electrodes of OLED devices and a pixel defining layer provided above the first electrodes above the base substrate, wherein the pixel defining layer includes a plurality of pixel partition walls spaced apart from each other, each of the pixel partition walls defines one of the first electrodes.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: February 23, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Zhijun Lv, Wenqu Liu, Liwen Dong, Shizheng Zhang, Ning Dang
  • Patent number: 10919270
    Abstract: Provided is a laminated glass, comprising: a soda lime glass; and a non-tempered alkali-free glass bonded to one surface of the soda lime glass, in which a thickness of the soda lime glass is larger than a thickness of the non-tempered alkali-free glass, and an elastic modulus of the non-tempered alkali-free glass is larger than an elastic modulus of the soda lime glass.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: February 16, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jun Hak Oh, Jae Hyuk Yoon, Chang Hee Lee, Byung Kook Choi
  • Patent number: 10910562
    Abstract: An organic electroluminescent device, a manufacturing method thereof and an evaporation apparatus are provided. The manufacturing method for the organic electroluminescent device includes: forming, on a base substrate, a first electrode layer; performing vacuum evaporation on an organic functional layer material to be evaporated, and performing a heat treatment, during the evaporation of the organic functional layer material to be evaporated, on the base substrate on which the first electrode layer is formed, so as to form an organic functional layer on the base substrate on which the first electrode layer is formed; and forming, on the base substrate on which the organic functional layer is formed, a second electrode layer.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 2, 2021
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xin Liu, Chao Kong
  • Patent number: 10884293
    Abstract: A display and a method of coating an alignment film are provided. The method of coating an alignment film includes step S10, providing substrate to-be-coating with the alignment film, positioned the substrate to-be-coating with the alignment film on optical bench; step S11, pressing against to the substrate by a print wheel has alignment film printing template, and rolling by predetermined coating direction, uniform coating alignment liquid on to-be-coating region of the substrate; wherein, the substrate rolling with the optical bench and forms changing angle with horizontal surface during the coating process; and step S12, controlling the optical bench for driving the substrate to vibrate after coating the to-be-coating region. In this invention provides a method could suit to difference mobility alignment film, it could greatly enhances uniformity of the alignment film such decrease opportunity to Mura happened by worse quality of printing the alignment film.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: January 5, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Junfeng Zheng
  • Patent number: 10886411
    Abstract: A semiconductor device includes a substrate, a transistor, a storage capacitor, a first insulating layer, and a second insulating layer. The transistor includes a semiconductor film, a gate insulating film, a first gate electrode, and a second gate electrode. The semiconductor film, the gate insulating film, and the first gate electrode are provided in this order from the substrate. The second gate electrode faces the first gate electrode across the semiconductor film. The storage capacitor includes a lower electrode and an upper electrode that are provided in this order from the substrate. The upper electrode faces the lower electrode and includes the same material as the semiconductor film. The first insulating layer is provided between the second gate electrode and the semiconductor film. The second insulating layer is provided between the lower electrode and the upper electrode and has a smaller thickness than the first insulating layer.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: January 5, 2021
    Assignee: JOLED INC.
    Inventor: Yasuhiro Terai
  • Patent number: 10879063
    Abstract: A method of fabricating a high-crystalline-quality and high-uniformity AlN layer within a high electron mobility transistor (HEMT) device with a metalorganic chemical vapor deposition (MOCVD) technique, includes: raising a temperature of a substrate to an ultra-high growth temperature; and supplying an Al source and an N source in pulses over the substrate under the ultra-high growth temperature, wherein the ultra-high growth temperature is at least 1300° C. At least for a first predetermined period of time in each cycle of the pulses, the Al source is switched on when the N source is switched off.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: December 29, 2020
    Assignee: SUZHOU HAN HUA SEMICONDUCTOR CO., LTD.
    Inventors: Xianfeng Ni, Qian Fan, Wei He
  • Patent number: 10879672
    Abstract: A semiconductor laser (100) and a method for processing the semiconductor laser are provided, so that modulation bandwidth can be increased.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: December 29, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Chen, Jing Hu, Zhiguang Xu
  • Patent number: 10862011
    Abstract: A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting element has a top surface, a bottom surface, a side surface, and a first electrical contact formed on the bottom surface. The distance between the top surface and the bottom surface has a first height (h1). The wavelength conversion layer has a first area (A1) located on the top surface of the light-emitting element and a second area (A2) located on the side surfaces and surrounding the first area. The first area has a second height (h2). The second area has a third height (h3) and a second width (w2). The second height (h2) is greater than the second width (w2). The difference of the third height and the sum of the first height and the second height is less than 15 ?m.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 8, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Yih-Hua Renn, Ching-Tai Cheng, Chun-Hua Shih
  • Patent number: 10862064
    Abstract: An organic light emitting diode (OLED) display panel includes a substrate, a reflective electrode disposed on the substrate, and a pixel define layer (PDL) formed on the substrate and the reflective electrode layer. The reflective electrode layer has multiple reflective structures, and each reflective structure has a first region and a second region. The PDL is provided with multiple openings corresponding to the reflective structures, such that the first region and the second region of each of the reflective structures are exposed in a corresponding one of the openings. Multiple organic emissive structures are correspondingly formed in the openings and covering the reflective structures, forming a plurality of pixels. For each respective pixel of the pixels, a first reflective ratio of the respective pixel corresponding to the first region is greater than a second reflective ratio of the respective pixel corresponding to the second region.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: December 8, 2020
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Yung-Sheng Ting, Yu-Ching Wang, Yi-Hui Lin
  • Patent number: 10840377
    Abstract: Provided is a method for manufacturing an inorganic material having a tensile stress, which includes: forming an inorganic stressor from an inorganic wafer made of an inorganic matter; forming an inorganic layer on the inorganic stressor; and etching a bulk inorganic matter at a lower portion of the inorganic stressor to generate an inorganic material having a tensile stress, wherein the inorganic layer has a tensile stress by etching the bulk inorganic matter to relieve a compressive stress applied to the inorganic stressor when the inorganic stressor is being formed. Therefore, FET and various circuits having higher charge mobility may be realized, and also, since characteristics may be maintained even when being applied to a plastic substrate, high performance flexible electronic device may be manufactured.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: November 17, 2020
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jong Hyun Ahn, Wonho Lee
  • Patent number: 10811441
    Abstract: A pixel array substrate including a substrate, an active device, a planarization layer, a first conductive layer, a first insulation layer and a second conductive layer is provided. The active device is disposed on the substrate. The planarization layer covers the active device and has a first opening. The first conductive layer is disposed on the planarization layer and is electrically connected with a first end of the active device. The first insulation layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulation layer. The first conductive layer and the second conductive layer cover a side surface of the first opening of the planarization layer.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: October 20, 2020
    Assignee: Au Optronics Corporation
    Inventors: Ming-Yao Chen, Kuo-Yu Huang, Wen-Ching Sung
  • Patent number: 10793468
    Abstract: A method of manufacturing an etched glass article includes the steps of jetting an image with a UV curable inkjet ink on a surface of the glass article; UV curing the image; etching the surface not covered by the UV cured image to obtain an etched image; and removing the UV cured image in an aqueous alkaline solution; wherein the UV curable inkjet ink includes a polymerizable composition, wherein at least 80 wt % of the polymerizable composition consists of: a) 15.0 to 70.0 wt % of an acryl amide; b) 20.0 to 75.0 wt % of a polyfunctional acrylate; and c) 1.0 to 15.0 wt % of a (meth)acrylate containing a carboxylic acid group, a phosphoric acid group or a phosphonic acid group-; with all weight percentages (wt %) based on the total weight of the polymerizable composition.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 6, 2020
    Inventors: Rita Torfs, Frank Louwet, Johan Loccufier, Mark Lens
  • Patent number: 10768275
    Abstract: An antenna apparatus includes a dielectric substrate, a base plate, an antenna unit, and a reflecting unit. A plurality of conductor patches are structured to resonate, at an operating frequency of the antenna unit, in a resonating direction which is different from a polarization direction Dan of a radio wave transmitted and received by the antenna unit.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: September 8, 2020
    Assignees: DENSO CORPORATION, SOKEN, INC.
    Inventors: Kazushi Kawaguchi, Kazumasa Sakurai, Toshiya Sakai, Asahi Kondo
  • Patent number: 10759992
    Abstract: A semiconductor nanocrystal and a preparation method thereof, where the semiconductor nanocrystal include a bare semiconductor nanocrystal and a water molecule directly bound to the bare semiconductor nanocrystal.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-Joo Jang, Seok-Hwan Hong, Shin-Ae Jun, Hyo-Sook Jang
  • Patent number: 10757768
    Abstract: The present invention relates to a light converting device (11) comprising a solid state light source (2) and a wavelength converting layer (3) arranged to at least partly wavelength convert the light emitted, in use, by the solid state light source (2), the wavelength converting layer (3) having a back side (4) facing the solid state light source (2) and a front side (5) opposite the back side (4), wherein the front side (5) of the wavelength converting layer (3) defines an exit window of the light converting device (11). The light converting device (11) further comprises a hydrophobic nanostructure (6) having spaced apart protrusions (66) arranged on the front side (5) of the wavelength converting layer (3) and a protective coating (7) applied on top of the hydrophobic nanostructure (6).
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 25, 2020
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Jordy Bernard Margreth Shoenmaekers, Peter Johannes Martinus Bukkems
  • Patent number: 10748853
    Abstract: A flexible display device is disclosed. In one aspect, the display device includes a flexible display panel including a display substrate, wherein the display substrate includes an active area for pixel circuits, an inactive area adjacent to the active area and having a pad area including a plurality of pad terminals, and a thin film encapsulation layer covering the active area. The display device also includes a display driver electrically connected to the pad terminals and a plurality of driving terminals each having a rounding unit. A conductive unit is configured to electrically connect the pad terminals to the respective driving terminals.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: August 18, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jonghwan Kim, Sangurn Lim
  • Patent number: 10707384
    Abstract: A light-emitting device includes a substrate including a base member having an upper surface having a substantially rectangular shape, a lower surface opposite to the upper surface, a first longer lateral surface, a second longer lateral surface opposite to the first longer lateral surface, a first shorter lateral surface, and a second shorter lateral surface opposite to the first shorter lateral surface, first wirings disposed on the upper surface, and second wirings disposed on the lower surface and each electrically connected with a respective one of the first wirings; at least one light-emitting element; and a light-reflective covering member covering lateral surfaces of the light-emitting element and the upper surface of the base member. The base member has at least one first recess open at the upper surface and the first longer lateral surface. Surfaces defining the at least one first recess are covered with the covering member.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: July 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tadaaki Ikeda
  • Patent number: 10700133
    Abstract: Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes a photocurable monomer and a photopolymerization initiator. The photocurable monomer includes a monomer containing no aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups represented by Formula 1.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: June 30, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hye Jin Kim, Sung Min Ko, Mi Sun Kim, Seong Ryong Nam, Ji Yeon Lee, Mi Jeong Choi
  • Patent number: 10679850
    Abstract: A thin-film manufacturing method, a thin-film manufacturing apparatus, a manufacturing method for a photoelectric conversion element, a manufacturing method for a logic circuit, a manufacturing method for a light-emitting element, and a manufacturing method for a light control element with which number-of-layers control and laminating and film-forming of different kinds of materials is described. A thin-film manufacturing method according to the present technology includes bringing an electrically conductive film-forming target into contact with a first terminal and a second terminal, heating a first region that is a region of the film-forming target between the first terminal and the second terminal by applying voltage between the first terminal and the second terminal, supplying a film-forming raw material to the first region; and forming a thin film in the first region by controlling reaction time such that a thin film having a desired number of layers is formed.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: June 9, 2020
    Assignee: Sony Corporation
    Inventors: Koji Kadono, Shinji Imaizumi
  • Patent number: 10658811
    Abstract: An optical component for optical semiconductor includes a wavelength converting member including a fluorescent part having an upper surface, a lower surface, and one or more lateral surfaces, and containing a fluorescent material, and a light-reflecting part disposed adjacently surrounding the one or more lateral surfaces of the fluorescent part when viewed from above, and a light-transmissive member disposed below the wavelength converting member. A dielectric multilayer film is disposed on an upper surface of the light-transmissive member at least at a region facing the fluorescent part, the dielectric multilayer film is configured to transmit excitation light incident from below the light-transmissive member and to reflect fluorescent light emitted from the fluorescent part. Further, a space is formed between the fluorescent part and the dielectric multilayer film, and the light-reflecting part and the light-transmissive member are connected by a connecting member made of a metal material.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 19, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Soichiro Miura, Masatsugu Ichikawa, Takehito Shimatsu
  • Patent number: 10651207
    Abstract: A display device may include a substrate; a plurality of signal lines on the substrate; a plurality of scan lines on the substrate, the scan lines crossing the signal lines; and a plurality of thin film transistors at crossing positions of the scan lines and the signal lines. The scan lines include some first scan lines and some second scan lines. Each of the second scan lines has an end connected to a load element.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: May 12, 2020
    Assignee: Japan Display Inc.
    Inventors: Daichi Hosokawa, Naoki Miyanaga, Masakatsu Kitani
  • Patent number: 10615305
    Abstract: Embodiments relate to a method for fabricating a light-emitting-diode (LED). A metal layer is deposited on a p-type semiconductor. The p-type semiconductor is on an n-type semiconductor. The metal layer is patterned to define a p-metal. The p-type semiconductor is etched using the p-metal as an etch mask. Similarly, the n-type semiconductor is etched using the p-metal and the p-type semiconductor as an etch mask to define individual LEDs.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: April 7, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Celine Claire Oyer, Allan Pourchet
  • Patent number: 10566468
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: February 18, 2020
    Assignee: AMS SENSORS SINGAPORE PTE. LTD
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
  • Patent number: 10525674
    Abstract: A laminated glazed automobile roof including two outer and inner sheets of glass and inserted sheets joining the sheets of glass, and including, arranged between the two sheets of glass, an LC (liquid crystal film) assembly for controlling light transmission, and light-emitting diode (LED) lighting elements.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: January 7, 2020
    Assignee: AGC GLASS EUROPE
    Inventors: Sebastien Linthout, Rostislav Losot, Jonathan Vivier
  • Patent number: 10514596
    Abstract: An optical device includes a first plate having a first transparent region defining an exit face of the device, and a second plate having a second transparent region defining an entrance face of the device. At least one lens is formed over at least one of the first and second transparent regions. First and second planar reflectors are spaced apart and fixed between the first and second plates in mutually-parallel orientations diagonal to the first and second plates, thereby defining an optical path through the device from the entrance face, reflecting from the first and second reflectors, through the exit face and passing through the at least one refractive surface.
    Type: Grant
    Filed: October 21, 2018
    Date of Patent: December 24, 2019
    Assignee: APPLE INC.
    Inventors: Moshe Kriman, Adar Magen
  • Patent number: 10516013
    Abstract: The present disclosure relates to an ultra high density transparent flat panel display. The present disclosure provides a transparent flat panel display including: a driving current line, a data line and a sensing line running in a vertical direction on a substrate; a scan line and a horizontal sensing line running in a horizontal direction on the substrate; an emission area disposed between the driving current line and the data line; and a transparent area disposed between the data line and the sensing line.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: December 24, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: Sungman Han, Eunji Park, Kihyung Lee
  • Patent number: 10509265
    Abstract: The invention provides a photo-alignment apparatus and a photo-alignment method. In photo-alignment apparatus, a movable polarizing element is disposed between loading platform and light source; when the LC panel to be aligned uses display mode of horizontal alignment, moving the polarizing element to below light source to convert non-polarized light emitted from light source into linearly polarized light to irradiate on the LC panel to be aligned to perform alignment; when the LC panel to be aligned uses display mode of vertical alignment, moving the polarizing element to a region outside of below light source, so that the non-polarized light emitted from light source irradiating on the LC panel to be aligned to perform alignment. As such, the present invention can be applied to horizontal alignment and vertical alignment respectively, improve the usability of the photo-alignment apparatus, reduce the manufacturing cost, save space and reduce management load.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: December 17, 2019
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Yanjun Song
  • Patent number: 10510975
    Abstract: A light emitting diode and a light emitting diode display, the light emitting diode including a first electrode; a second electrode overlapping the first electrode; an emission layer between the first electrode and the second electrode; and an electron injection layer between the second electrode and the emission layer, wherein the electron injection layer includes a lanthanide element, an alkali meta first element, and a halogen second element, and wherein the first element and the second element are included in the electron injection layer in an amount of 1 vol % to 20 vol %, based on a total volume of a material including the lanthanide element, the first element, and the second element.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong Chan Kim, Dong Hoon Kim, Won Jong Kim, Ji Young Moon, Dong Kyu Seo, Ji Hye Lee, Da Hea Im, Sang Hoon Yim, Yoon Hyeung Cho, Won Suk Han
  • Patent number: 10510976
    Abstract: A light-emitting apparatus including a light-emitting device, a light-guiding structure and a light output structure is provided. The light-emitting device includes a light-emitting layer. The light-guiding structure is configured to guide light emitted from the light-emitting layer. The light-guiding structure is disposed beside the light-emitting device and a refractive index of the light-guiding structure is greater than or equal to an average refractive index of the light-emitting device. The light output structure is configured to receive the light guided by the light-guiding structure to output the light out of the light-emitting apparatus.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: December 17, 2019
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Yi-Hsiang Huang, Yu-Tang Tsai, Kuan-Ting Chen
  • Patent number: 10488723
    Abstract: A display device includes a display panel, a window on the display panel, and an adhesive member between the display panel and the window, wherein the window includes a base substrate and a light-shielding pattern layer, the base substrate including a first region overlapping the display panel, and a second region extending and protruding outward from the display panel, the light-shielding pattern layer being on the first region and the second region and including a groove adjacent to an outer surface of the display panel.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: November 26, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sang Hoon Lim, Sung Jin Jang, Yeol Choi
  • Patent number: 10490707
    Abstract: A method of producing optoelectronic components includes A) providing a carrier and optoelectronic semiconductor chips including contact elements arranged on a contact side of the semiconductor chip; B) applying the semiconductor chips laterally next to one another on to the carrier, wherein the contact sides face the carrier during application; C) applying an electrically-conductive layer at least on to subregions of the sides of the semiconductor chip not covered by the carrier; D) applying a protective layer at least on to subregions of side surfaces of the semiconductor chips running transversely to the contact surface; E) electrophoretically depositing a converter layer on to the electrically-conductive layer, wherein the converter layer is configured to convert at least part of radiation emitted by the semiconductor chip into radiation of a different wavelength range; and F) removing the electrically-conductive layer from regions between the converter layer and the semiconductor chips.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: November 26, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Siegfried Herrmann
  • Patent number: 10476035
    Abstract: A flexible display apparatus is provided in the present disclosure and includes a flexible substrate, an organic electroluminescent device, and a plurality of thin film transistors disposed between the flexible substrate and the organic electroluminescent device. The organic electroluminescent device is controlled by the thin film transistors to emit light. The flexible substrate is doped with a plurality of nano-particles that are configured to refract the light emitted from the organic light-emitting layer to an external environment.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: November 12, 2019
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Dan Bai
  • Patent number: 10453963
    Abstract: This application discloses a method for manufacturing an array substrate. The array substrate manufacturing method includes: providing a first substrate; forming gate layers on the first substrate; forming a gate insulation layer on the first substrate, and covering the gate layers; forming an amorphous silicon layer on the gate insulation layer; forming a metal layer on the amorphous silicon layer; forming a photo-sensitive photoresist layer on the metal layer; etching the amorphous silicon layer by using inert gas or nitrogen plasma, to form a groove; forming source layers and a drain layer; removing the photo-sensitive photoresist layer; and forming a passivation layer on the source layers, where a baking process is performed on the photo-sensitive photoresist layer, so that the photo-sensitive photoresist layer flows to some extent so as to form a protection layer, so as to cover the metal layer in a non-active switch channel region.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: October 22, 2019
    Assignee: HKC CORPORATION LIMITED
    Inventor: Huailiang He
  • Patent number: 10439107
    Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: October 8, 2019
    Assignee: Cree, Inc.
    Inventors: Sten Heikman, James Ibbetson, Zhimin Jamie Yao, Fan Zhang, Matthew Donofrio, Christopher P. Hussell, John A. Edmond
  • Patent number: 10388834
    Abstract: To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, there is provided a nitride semiconductor wafer having ultraviolet light-emitting elements on a substrate 12, each element including a semiconductor laminated portion 21 constituted by an n-type AlGaN layer 16, an active layer 17 composed of an AlGaN layer, and p-type AlGaN layers 19 and 20, an n-electrode 23, a p-electrode 22, a protective insulating film 24, first and second plated electrodes 25 and 26, and a fluororesin film 27. The p-electrode is formed on an upper surface of the p-type AlGaN layer in the first region R1 and the n-electrode is formed on an upper surface of the n-type AlGaN layer in the second region R2. The protective insulating film has openings for exposing at least parts of the n-electrode and the p-electrode.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: August 20, 2019
    Assignees: SOKO KAGAKU CO., LTD., AGC INC.
    Inventors: Akira Hirano, Ko Aosaki
  • Patent number: 10388831
    Abstract: A light-emitting device including a window layer-cum-support substrate, a light-emitting portion provided on the window layer-cum-support substrate and including a second semiconductor layer of a second conductivity type, an active layer, and first semiconductor layer of a first conductivity type in stated order, a first ohmic electrode provided on the first semiconductor layer, and insulator top coat at least partially coating the first semiconductor layer surface and light-emitting portion side surface, wherein the first semiconductor layer surface and surface of the window layer-cum-support substrate are roughened, and the first semiconductor layer includes at least two layers of an active-layer-side layer and roughened-side layer, and roughened-side layer is formed of material having lower Al content than the active-layer-side layer.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: August 20, 2019
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Junya Ishizaki, Shogo Furuya
  • Patent number: 10325890
    Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: June 18, 2019
    Assignee: Bridgelux, Inc.
    Inventors: R. Scott West, Tao Tong, Mike Kwon, Michael Solomensky
  • Patent number: 10290632
    Abstract: Alternating Current (AC)-coupled switch and metal capacitor structures for nanometer or low metal layer count processes are provided. According to one aspect of the present disclosure, a switch and capacitor structure comprises a substrate comprising a device region with a Field Effect Transistor (FET) formed therein, the FET having a source terminal comprising a structure in a first metal layer and a drain terminal comprising a structure in the first metal layer, and a capacitor comprising a first plate and a second plate, the first plate comprising a structure in a second metal layer, the second metal layer being above the first metal layer, the structure of the first plate being electrically connected to the structure of the drain terminal, and the second plate comprising a structure in the second metal layer, the structure of the first plate spaced from the structure of the second plate.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: May 14, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Baker Scott, George Maxim, Dirk Robert Walter Leipold, Marcus Granger-Jones
  • Patent number: 10267963
    Abstract: Provided are a wavelength conversion member and a wavelength conversion element which are capable of reducing the decrease in luminescence intensity with time and the melting of a component material when irradiated with light of a high-power LED or LD, and a light emitting apparatus using the wavelength conversion member or the wavelength conversion element. A wavelength conversion member contains, in % by mass, 70 to 99.9% inorganic phosphor particles and 0.1 to 30% easily sinterable ceramic particles, wherein the easily sinterable ceramic particles are interposed between the inorganic phosphor particles and the inorganic phosphor particles are bound together by the easily sinterable ceramic particles.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: April 23, 2019
    Assignee: NIPPON ELECTRIC GLASS CO., LTD.
    Inventors: Naoki Fujita, Tadahito Furuyama, Shunsuke Fujita
  • Patent number: 10251238
    Abstract: In various embodiments, a stretchable electroluminescent device may be provided. The electroluminescent device may include a first contact structure. The first contact structure may include an ionic conductor layer. The electroluminescent device may also include a second contact structure. The electroluminescent device may additionally include an emission layer between the first contact structure and the second contact structure. The emission layer may be configured to emit light when an alternating voltage is applied between the first contact structure and the second contact structure.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: April 2, 2019
    Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Jiangxin Wang, Pooi See Lee, Guofa Cai