Abstract: An organic light emitting display device including: a substrate; a plurality of first electrodes formed over the substrate; a pixel defining layer (PDL) formed over the substrate, and separating the plurality of first electrodes from one another when viewed in a thickness direction of the display device; a plurality of light emitting layer portions formed over one of the plurality of first electrodes; at least a second electrode formed over the plurality of light emitting layer portions; and a filter unit formed over the at least a second electrode. The filter unit includes a black matrix layer defining a plurality of openings, an organic layer formed over the black matrix layer and the plurality of openings, and comprising a plurality of lens-shaped embossed portions, and a plurality of color filters formed over the organic layer.

Abstract: An optoelectronic semiconductor chip includes a semiconductor layer stack and a mirror. The semiconductor layer stack has an active layer for generating electromagnetic radiation. The minor is arranged on an underside of the semiconductor layer stack. The mirror has a first region and a second region, the first region containing silver and the second region containing gold. A method of producing such a semiconductor chip is also defined.

Abstract: According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device also includes a first electrode layer having electrical continuity with the first semiconductor layer and a second electrode layer provided on the second semiconductor layer, the second electrode layer including a metal portion having a thickness not less than 10 nanometers and not more than 100 nanometers along a direction from the first semiconductor layer to the second semiconductor layer.

Abstract: The light-emitting diode includes first and second layers of semiconductor material, having opposite conductivity types, an active light-emitting area located between the first and second layers of semiconductor material, an electrode arranged on the first layer of semiconductor material and a photonic crystal formed in the first layer of semiconductor material. The photonic crystal and the electrode are separated by a distance optimized to simultaneously promote the electric injection and minimize the light absorption in the LED.

Abstract: An organic light-emitting diode display and method of manufacturing the same are provided in the present invention. The organic light-emitting diode display includes an anode layer and a cathode layer opposite to and spaced apart from each other, an organic light-emitting layer disposed between the anode layer and the cathode layer, wherein the organic light-emitting layer includes primary color regions and mixed color regions, and a color deviation protective layer disposed between the anode layer and the organic light-emitting layer or between the organic light-emitting layer and the cathode layer, and the color deviation protective layer is provided with insulating patterns corresponding to the mixed color regions to prevent light generation from the mixed color regions. The manufacturing method features the step of disposing a color deviation protective layer to prevent light generation from the mixed color regions of the organic light-emitting layer and solve conventional color deviation issue.

Abstract: Provided is a liquid crystal display device, including: an array substrate; a plurality of pixels sectioned by video signal lines and scanning signal lines formed on the array substrate; a TFT arranged for each of the plurality of pixels; and a pixel electrode arranged inside each of the plurality of pixels. The TFT includes a channel semiconductor layer and the pixel electrode that are formed of a seamless layer made of an oxide semiconductor. The pixel electrode has an electrical conductivity larger than an electrical conductivity of the channel semiconductor layer under a state in which a gate voltage is not applied.

Abstract: A semiconductor light emitting device according to an embodiment includes a semiconductor layer, a first resin layer provided on the semiconductor layer, first fluorescer particles disposed in the first resin layer, and a second resin layer provided on the first resin layer to contact the first resin layer. Recesses are made in a surface of the first resin layer contacting the second resin layer. The recesses are filled with portions of the second resin layer.

Abstract: Provided is a light emitting diode having a nanostructure capping pattern and a method of manufacturing the same. A light-emitting structure including a first semiconductor layer, a second semiconductor layer, and an active layer between the first and second semiconductor layers is provided. A nanostructure is provided on the light-emitting structure and a nanostructure capping pattern covering the nanostructure is provided. A refractive index of the nanostructure capping pattern is higher than that of air and lower than that of the nanostructure.

Abstract: A method of manufacturing a light-emitting element. The method includes forming an underlayer that includes a reflective electrode, forming a bank that has liquid repellency, irradiating the bank with characteristic energy rays to decrease liquid repellency of the bank, and forming a functional layer. The bank is formed on the underlayer and is provided with an opening and an inclined portion surrounding the opening. The opening has a shape that has a long axis and a short axis and is positioned above the reflective electrode. In plan view, end sections of the inclined portion in a direction of the long axis overlap the upper surface of the reflective electrode, while central sections of the inclined portion in the direction of the long axis do not overlap the upper surface of the reflective electrode.

Abstract: A method of forming a light sheet includes printing a layer of inorganic LEDs on a first conductive surface of a substrate, depositing a first dielectric layer, and depositing a second conductor layer over the LEDs so that the LEDs are connected in parallel. At least one of the first conductive surface or the second conductor layer is transparent to allow light to escape. A phosphor layer may be formed over the light sheet so that the LED light mixed with the phosphor light creates white light. The flat light sheet is then folded, such as by molding, to form a three-dimensional structure with angled light emitting walls and reflective surfaces to control a directionality of the emitted light and improve the mixing of light. The folds may form rows of angled walls or polygons.

Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a sealing member configured to cover a lower surface of the semiconductor layer and a side surface of the semiconductor layer to protrude to be higher than an upper surface of the semiconductor layer at a side of the semiconductor layer, a fluorescer layer provided above the semiconductor layer and the sealing member, and an insulating film provided between the sealing member and the semiconductor layer and between the sealing member and the fluorescer layer. A corner of a protruding portion of the sealing member is rounded.

Abstract: A columnar light emitting device is provided. The columnar light emitting device includes an upper transparent electrode layer, a lower transparent electrode layer disposed to be separated from the upper transparent electrode layer, a columnar light emitting structure pattern-formed between the upper transparent electrode layer and the lower transparent electrode layer, a fluorescent part formed between a plurality of the columnar light emitting structures, a P-type electrode pad formed on the upper transparent electrode layer, and an N-type electrode pad formed under the lower transparent electrode layer. The columnar light emitting structure includes a U-GaN layer, an N-type semiconductor layer, an emission layer, and a P-type semiconductor layer.

Abstract: An organic light emitting diode (OLED) display includes a display substrate, a display element layer disposed on the display substrate and comprising a plurality of pixels, a thin film encapsulation layer disposed on the display substrate and the display element layer, a retardation film disposed on the thin film encapsulation layer, a capacitive pattern disposed on the retardation film, a polarizing plate disposed on the capacitive pattern, and a window disposed on the polarizing plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.

Abstract: A method of manufacturing a semiconductor light emitting element includes preparing a semiconductor stacked layer structure by stacking a first semiconductor layer and a second semiconductor layer in this order, forming a second electrode and an insulating layer in this order on the second semiconductor layer, exposing the first semiconductor layer by removing a part of the second semiconductor layer, forming a first electrode by forming a metal layer on the exposed first semiconductor layer and the insulating layer and flattening a surface of the metal layer, forming a first electrode-side bonding layer having a top layer made of Au on the first electrode, preparing a support substrate including a support substrate-side bonding layer having a top surface made of Au, and bonding the first electrode-side bonding layer and the support substrate-side bonding layer.

Abstract: An optoelectronic device comprises a semiconductor stack having a first surface, a contact layer having a first pattern on the first surface for ohmically contacting the semiconductor stack, a void in the semiconductor stack and surrounding the contact layer, and a mirror structure on the first surface and covering the contact layer, wherein the first surface has a first portion which is not covered by the contact layer and a second portion covered by the contact layer, and the first portion is rougher than the second portion.

Abstract: Methods to improve the reflection of light emitting devices are disclosed. A method consistent with the present disclosure includes forming a light generating layer over a site-isolated region of a substrate. Next, forming a first transparent conductive layer over the light generating layer. Forming a low refractive index material over the first transparent conductive layer, and in time, forming a second transparent conductive layer over the low refractive index material. Subsequently, forming a reflective material layer thereon. Accordingly, methods consistent with the present disclosure may form a plurality of light emitting devices in various site-isolated regions on a substrate.

Abstract: A display panel includes a first pixel electrode electrically connected to a first switching electrode, and includes a plurality of first branches forming micro slits, a second pixel electrode electrically connected to a second switching electrode, and including a plurality of second branches forming micro slits, and a third pixel electrode electrically connected to a third switching electrode, and including a plurality of third branches forming micro slits. The first branches are spaced apart from each other by a first space, and have a first width. The second branches are spaced apart from each other by a second space, and have a second width. The third branches are spaced apart from each other by a third space, and have a third width. At least one of the first width, the second width and the third width is different from the other widths.

Abstract: Provided is a method of manufacturing a nitride-based light emitting diode. According to the method, a substrate having a nano to micron sized pattern including a bottom section and a convex section, wherein a lower end diameter of the convex section is 0.1 to 3 times a light emitting wavelength of the light emitting diode, and a buffer layer formed on the substrate and formed as a GaN layer are manufactured. According to the method of manufacturing the nitride-based light emitting diode, light extraction is significantly improved, and the nano to micron sized pattern, economically formed.

Abstract: Embodiments of the invention include a semiconductor light emitting device, a first wavelength converting member disposed on a top surface of the semiconductor light emitting device, and a second wavelength converting member disposed on a side surface of the semiconductor light emitting device. The first and second wavelength converting members include different wavelength converting materials.

Abstract: A light-emitting diode is provided. The light-emitting diode includes an N-type epitaxial layer, a light-emitting layer disposed on a portion of the N-type epitaxial layer to expose a partial surface of the N-type epitaxial layer, and a P-type epitaxial layer disposed on the light-emitting layer, wherein the P-type epitaxial layer has a ladder-shaped sidewall. The light-emitting diode further includes a P-type electrode disposed on the P-type epitaxial layer and an N-type electrode disposed on the exposed surface of the N-type epitaxial layer. Furthermore, a method of fabricating a light-emitting diode is also provided. The method includes performing an anisotropic-etching process to a P-type epitaxial layer to form a rounded or a right-angled ladder on the sidewall of the P-type epitaxial layer.

Abstract: In an organic EL element, a concave-convex pattern layer having a first concave-convex shape, a first electrode, an organic layer, and a second electrode layer are stacked on a substrate in this order. Further, an auxiliary layer is provided between the concave-convex pattern layer and the first electrode. A surface of the auxiliary layer on the first electrode side has a second concave-convex shape. The change ratio of the standard deviation of depths of the second concave-convex shape with respect to the standard deviation of depths of the first concave-convex shape is 70% or less. The organic EL light-emitting element, which has a high light extraction efficiency while preventing the occurrence of a leak current, can be obtained.

Abstract: A light emitting device includes a transistor, a light reflection layer, a first insulation layer that includes a first layer thickness part, a second layer thickness part, and a third layer thickness part, a pixel electrode that is provided on the first insulation layer, a second insulation layer that covers a peripheral section of the pixel electrode, a light emission functional layer, a facing electrode, and a conductive layer that is provided on the first layer thickness part. The pixel electrode includes a first pixel electrode which is provided in the first layer thickness part, a second pixel electrode which is provided in the second layer thickness part, and a third pixel electrode which is provided in the third layer thickness part. The first pixel electrode, the second pixel electrode, and the third pixel electrode are connected to the transistor through the conductive layer.

Abstract: A method of fabricating a light emitting diode, which includes an n-type contact layer and a light generating structure adjacent to the n-type contact layer, is provided. The light generating structure includes a set of quantum wells. The contact layer and light generating structure can be configured so that a difference between an energy of the n-type contact layer and an electron ground state energy of a quantum well is greater than an energy of a polar optical phonon in a material of the light generating structure. Additionally, the light generating structure can be configured so that its width is comparable to a mean free path for emission of a polar optical phonon by an electron injected into the light generating structure.

Abstract: A light-emitting device comprises: a first semiconductor layer; a transparent conductive oxide layer including a diffusion region having a first metal material and a non-diffusion region devoid of the first metal material, wherein the non-diffusion region is closer to the first semiconductor layer than the diffusion region; and a metal layer formed on the transparent conductive oxide layer, wherein the metal layer is pervious to a light emitted from the active layer and comprises a pattern.

Abstract: A light emitting diode and a method of fabricating the same, the light emitting diode including: a gallium nitride-based compound semiconductor layer; a first metal layer including Mg and disposed in the form of islands that are in ohmic contact with the gallium nitride-based compound semiconductor layer; a second metal layer including Ni, covering the first metal layer, and contacting the gallium nitride-based compound semiconductor layer between the islands of the first metal layer; and a reflective metal layer covering the second metal layer.

Abstract: An organic light emitting diode (OLED) emitting light downward through a transparent substrate. The OLED embeds a microcavity formed between a cathode and an anode and includes a plurality of organic layers including a light emitting layer. The plurality of organic layers include at least a first layer made of an organic doped material aimed at enhancing the transport of electrons; and at least a second layer made of an organic doped material aimed at enhancing the transport of holes. The anode is obtained by deposition of a semitransparent layer of silver (Ag) over the transparent substrate to be directly in contact with the first doped organic layer. Then, thicknesses of the first and second doped organic layers can be freely adapted to best adjust the optical characteristics of the microcavity for the wavelength of monochromatic light to be produced by the OLED.

Abstract: An IZO layer (113) is formed on an a-ITO layer (112), and resist patterns (202R, 202G) having different film thicknesses are formed in at least sub-pixels (71R, 71G). The a-ITO layer (112) and the IZO layer (113) are etched by utilizing (i) a reduction in thickness of the resist patterns (202R, 202G) by ashing and (ii) a change in etching tolerance due to transformation from the a-ITO layer (112) into a p-ITO layer (114).

Abstract: A semiconductor light emitting device includes: a light emission structure in which a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer are sequentially stacked; a first electrode formed on the first conductive semiconductor layer; an insulating layer formed on the second conductive semiconductor layer and made of a transparent material; a reflection unit formed on the insulating layer and reflecting light emitted from the active layer; a second electrode formed on the reflection unit; and a transparent electrode formed on the second conductive semiconductor layer, the transparent electrode being in contact with the insulating layer and the second electrode.

Abstract: An optoelectronic device comprises a body of an indirect bandgap semiconductor material having a surface and a photon active region on one side of the surface. A light directing arrangement is formed integrally with the body on an opposite side of the surface.

Abstract: The invention relates to an organic light-emitting part having a functional layer stack (10), which functional layer stack has a substrate (1), a first electrode (2) above the substrate, an organic functional layer stack (4) above the first electrode, having an organic light-emitting layer (5), and a second electrode (3) above the organic functional layer stack, wherein a layer (1, 2, 3) of the functional layer stack (10) forms a carrier layer (6) for a diffusion layer (7), wherein the diffusion layer (7) has at least one first and one second organic component (71, 72) having indices of refraction that differ from each other, wherein the first organic component (71) is hydrophobic and the second organic component (72) is hydrophilic, wherein the glass transition temperature of a mixture of the first organic component (71) and the second organic component (72); lies above the room temperature and wherein the first organic component (71) and the second organic component (72) are partially segregated in the diff

Abstract: An LED die includes a substrate, a first buffer layer, a second buffer layer, a plurality of nanospheres, a first semiconductor layer, an active layer and a second semiconductor layer. The first buffer layer, the second buffer layer, the first semiconductor layer, the active layer and the second semiconductor layer are formed successively on the substrate. The substrate has a plurality of protrusions on a surface thereof. The nanospheres are located on the protrusions and covered by the second buffer layer and located in the second buffer layer. The present disclosure also provides a method of manufacturing an LED die.

Abstract: A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface.

Abstract: The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between adjacent two of the plurality of LEDs, wherein the first metal features, the second metal features and the metal pillars are configured to electrically connect the plurality of LEDs.

Abstract: Systems and methods are provided for depositing thin patterned films of materials in which individual elements of the patterned film are deposited by two or more nozzles having different geometries. The different nozzle geometries may include one or more of different throttle diameters, different exhaust diameters, different cross-sectional shapes, different bore angles, different wall angles, different exhaust distances from the substrate, and different leading edges relative to the direction of movement of the nozzles or the substrate. Methods may include steps of ejecting a carrier gas and a material from a plurality of nozzles and depositing the material on a substrate in a plurality of laterally spaced elements.

Abstract: A method is provided for producing a radiation-emitting semiconductor chip, in which a first wavelength-converting layer is applied over the radiation exit face of a semiconductor body. The application method is selected from the following group: sedimentation, electrophoresis. In addition, a second wavelength-converting layer is applied over the radiation exit face of the semiconductor body. The second wavelength-converting layer is either produced in a separate method step and then applied or the application method is sedimentation, electrophoresis or printing. Furthermore, a radiation-emitting semiconductor chip and a radiation-emitting component are provided.

Abstract: An organic light emitting display device including: a substrate; a plurality of first electrodes formed over the substrate; a pixel defining layer (PDL) formed over the substrate, and separating the plurality of first electrodes from one another when viewed in a thickness direction of the display device; a plurality of light emitting layer portions, each of which is formed over one of the plurality of first electrodes; at least a second electrode formed over the plurality of light emitting layer portions; and a filter unit formed over the at least a second electrode. The filter unit includes a black matrix layer having an opening and a plurality of color filters formed over the black matrix layer, and each color filter comprising at least one embossed portion formed over one of the plurality of openings.

Abstract: An LED die includes a substrate, a light emitting structure, electrodes, a first transparent protecting layer, a reflection layer, and a second transparent protecting layer. The light emitting structure includes a first semiconductor layer, an active layer, a second semiconductor layer successively formed on the substrate. A part of first semiconductor layer being exposed. A first electrode is formed the first semiconductor layer. A second electrode is formed on the second semiconductor layer. The first transparent protecting layer, the reflection layer, and the second transparent protecting layer successively formed on the first electrode. The present disclosure also provides a method of manufacturing the LED die.

Abstract: The present invention discloses a diode and a manufacturing method thereof and a display apparatus. The diode comprises a composite anode, a transparent metal oxide layer, a basic stack layer, and a composite cathode. The composite anode comprises a transparent anode layer and a first transparent metal layer. The first transparent metal layer is formed on the transparent anode layer. The transparent metal oxide layer is formed on the first transparent metal layer. The basic stack layer is formed on the transparent metal oxide layer. The composite cathode comprises two second transparent metal layers. The two second transparent metal layers are formed on the basic stack layer. Both transmittance and efficiency of the diode are significantly improved. The reliability of the diode is improved to elongate the lifetime of the diode.

Abstract: According to one embodiment, a semiconductor light emitting device includes an n-type layer, a light emitting layer, a p-type layer, and a transparent electrode. The n-type layer includes a nitride semiconductor and has a thickness not more than 500 nm. The light emitting layer is provided on the n-type layer. The p-type layer is provided on the light emitting layer and includes a nitride semiconductor. The transparent electrode contacts the n-type layer. The n-type layer is disposed between the transparent electrode and the light emitting layer.

Abstract: To provide a light-emitting device that is provided with an optical member firmly bonded to a semiconductor light-emitting element and has a high light extraction efficiency, the light-emitting device includes a light-emitting element having a semiconductor layer and an optical member bonded to the light-emitting surface of the light-emitting element with a metal film being interposed therebetween wherein the metal film has a thickness in a film-forming rate conversion not less than 0.05 nm nor more than 2 times of an atomic diameter of the metal atoms forming the metal film.

Abstract: A method of producing an optoelectronic semiconductor chip includes growing an optoelectronic semiconductor layer sequence on a growth substrate, forming an electrically insulating layer on a side of the optoelectronic semiconductor layer sequence facing away from the growth substrate by depositing particles of an electrically insulating material by an aerosol deposition method, and at least partly removing the growth substrate after forming the electrically insulating layer.

Abstract: An organic light emitting diode display includes an organic light emitting panel, a high refractive organic film layer on the organic light emitting panel, the high refractive organic film layer including a convex portion having a convex shape with respect to the organic light emitting panel, a low refractive organic film layer on the high refractive organic film, the low refractive organic film layer including a concave portion corresponding to the convex portion of the high refractive organic film layer, a color filter on the low refractive organic film layer, and a light blocking member having an opening corresponding to the color filter.

Abstract: Organic electroluminescent element capable of conveniently and precisely establishing the emission color of the element and capable of fine-adjusting the emission color in the white region. The organic electroluminescent element includes a pair of electrodes and a light-emitting layer provided between the electrodes and presents an emission color at the coordinate Ao (Xo, Yo) in the CIE 1931 chromaticity coordinate system. The light-emitting layer contains in the same layer, a white light emitting material A1 that presents an emission color at the coordinate A1 (x1, y1) in the CIE 1931 chromaticity coordinate system and a white light emitting material A2 that presents an emission color at the coordinate A2 (x2, y2) different from the coordinate A1 (x1, y1) in the CIE 1931 chromaticity coordinate system. A distance LA1-A2 between the coordinates A1 (x1, y1) and A2 (x2, y2) in the CIE 1931 chromaticity coordinate system satisfies LA1-A2<0.13.

Abstract: An optoelectronic semiconductor laser includes a growth substrate; a semiconductor layer sequence that generates laser radiation; a front facet at the growth substrate and at the semiconductor layer sequence, wherein the front facet constitutes a main light exit side for the laser radiation generated in the semiconductor laser and has a light exit region at the semiconductor layer sequence; a light blocking layer for the laser radiation, which partly covers at least the growth substrate at the front facet such that the light exit region is not covered by the light blocking layer; and a bonding pad at a side of the semiconductor layer sequence facing away from the growth substrate, wherein a distance between the bonding pad and the light blocking layer at least at the light exit region is 0.1 ?m to 100 ?m.

Abstract: Disclosed herein is a method of separating a GaN substrate by wet etching. The method employs chemical lift-off, and includes forming oxide layers separated from each other and a GaN column in each space between the oxide layers on a substrate, forming an n-GaN layer covering an upper space on the oxide layers and the n-GaN columns, sequentially forming an active layer, a p-GaN layer, and a p-type electrode on the n-GaN layer, and removing the oxide layers and wet etching the n-GaN columns to separate the substrate. The method can achieve improvement in epitaxial growth of GaN and reduction in fabrication costs through a simple process. In addition, the method can increase a luminous area and light extraction efficiency.

Abstract: The invention is directed to the provision of a method for manufacturing a semiconductor light-emitting element that eliminates the need for preparing a plurality of different fluorescent sheets. The method for manufacturing the semiconductor light-emitting element containing an LED die includes the steps of arranging the LED die on a fluorescent sheet containing a fluorescent substance and adjusting the amount by which the LED die is depressed into the fluorescent sheet so that the semiconductor light-emitting element has a desired color emission.

Abstract: A method of device growth and p-contact processing that produces improved performance for non-polar III-nitride light emitting diodes and laser diodes. Key components using a low defect density substrate or template, thick quantum wells, a low temperature p-type III-nitride growth technique, and a transparent conducting oxide for the electrodes.

Abstract: An LED includes a first pedestal and may be fabricated by coating a first phosphor layer on the LED, thinning the first phosphor layer to expose the first pedestal, forming a second pedestal on the first pedestal, coating a second phosphor layer and thinning the second phosphor layer to expose the second pedestal. Alternatively, an LED having a pedestal is coated with a first phosphor layer, coated with a second phosphor layer and then planarized to expose the pedestal. Related structures are also provided.

Abstract: A technique of manufacturing a display device with high productivity is provided. In addition, a high-definition display device with high color purity is provided. By adjusting the optical path length between an electrode having a reflective property and a light-emitting layer by the central wavelength of a wavelength range of light passing through a color filter layer, the high-definition display device with high color purity is provided without performing selective deposition of light-emitting layers. In a light-emitting element, a plurality of light-emitting layers emitting light of different colors are stacked. The closer the light-emitting layer is positioned to the electrode having a reflective property, the shorter the wavelength of light emitted from the light-emitting layer is.