Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor Patents (Class 438/51)
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Publication number: 20140264660Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: Butterfly Network, Inc.Inventors: Jonathan M. Rothberg, Keith G. Fife, Tyler S. Ralston, Gregory L. Charvat, Nevada J. Sanchez
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Publication number: 20140264647Abstract: A method of forming a monolithic CMOS-MEMS hybrid integrated, packaged device comprising the steps of: providing a semiconductor substrate; forming MEMS or NEMS materials on the substrate having conductive, structural, or dielectric layers; forming at least one opening(s) on the semiconductor substrate; positioning on the substrate at least one prefabricated MEMS, NEMS, or semiconductor chip(s), wherein the chip(s) comprise a side facing the substrate; applying at least one filler material(s) in the opening(s) on the semiconductor substrate; applying at least one metallization layer electrically connecting chip(s) to the MEMS or NEMS materials; and performing at least one micro or nano fabrication etching step to remove a portion of the MEMS or NEMS materials.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Inventors: Rakesh Katragadda, Ganapathy Krishna Kumar, Manveen Saluja
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Patent number: 8836130Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. In the semiconductor device, silver arranged on a semiconductor element and silver arranged on a base are bonded. No void is present or a small void, if any, is present at an interface between the semiconductor element and the silver arranged on the semiconductor element, no void is present or a small void, if any, is present at an interface between the base and the silver arranged on the base, and one or more silver abnormal growth grains and one or more voids are present in a bonded interface between the silver arranged on the semiconductor element and the silver arranged on the base.Type: GrantFiled: December 21, 2011Date of Patent: September 16, 2014Assignee: Nichia CorporationInventors: Masafumi Kuramoto, Satoru Ogawa, Teppei Kunimune
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Publication number: 20140252507Abstract: Embodiments of the present disclosure are related to MEMS devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material. In various embodiments, the cavity between the membrane and the substrate is formed by removing a sacrificial layer through the openings. In one or more embodiments, the openings in the membrane are closed by depositing the dielectric material on the sidewalls of the openings and the upper surface of the membrane.Type: ApplicationFiled: March 5, 2013Publication date: September 11, 2014Applicant: STMICROELECTRONICS PTE LTD.Inventors: Ravi Shankar, Olivier Le Neel, Shian Yeu Kam, Tien Choy Loh
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Publication number: 20140256077Abstract: The present invention discloses an adhesive-free method for preparation of micro electro-mechanical structure, comprising forming a micro electro-mechanical structure on a first substrate, forming an enclosing space for immersing liquid on the first or second substrate, and applying pressure to fix the first and second substrate. Before applying the pressure, the assembly including the two substrates is flipped, to make the contact surface immersed by the immersing liquid.Type: ApplicationFiled: November 13, 2013Publication date: September 11, 2014Applicant: Sagatek Co., Ltd.Inventors: Jung-Hsiang Chen, Cheng-Szu Chen, Bo-Ting Chen
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Patent number: 8829672Abstract: A semiconductor package includes: a dielectric layer having opposite first and second surfaces; a semiconductor chip embedded in the dielectric layer and having a plurality of electrode pads; a plurality of first metal posts disposed on the electrode pads of the semiconductor chip, respectively, such that top ends of the first metal posts are exposed from the first surface; at least a second metal post penetrating the dielectric layer such that two opposite ends of the second metal post are exposed from the first and second surfaces, respectively; a first circuit layer formed on the first surface for electrically connecting the first and second metal posts; and a second circuit layer formed on the second surface for electrically connecting the second metal post. The semiconductor package dispenses with conventional laser ablation and electroplating processes for forming conductive posts in a molding compound, thereby saving fabrication time and cost.Type: GrantFiled: July 31, 2012Date of Patent: September 9, 2014Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Yan-Heng Chen, Jung-Pang Huang, Hsin-Yi Liao, Shih-Kuang Chiu, Guang-Hwa Ma
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Publication number: 20140246738Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.Type: ApplicationFiled: March 4, 2013Publication date: September 4, 2014Applicant: UNISEM (M) BERHADInventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan
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Publication number: 20140246739Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.Type: ApplicationFiled: December 27, 2013Publication date: September 4, 2014Applicant: Unisem (M) BerhadInventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
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Publication number: 20140246708Abstract: An integrated circuit device includes a first layer comprising at least two partial cavities, an intermediate layer bonded to the first layer, the intermediate layer formed to support at least two Micro-electromechanical System (MEMS) devices, and a second layer bonded to the intermediate layer, the second layer comprising at least two partial cavities to complete the at least two partial cavities of the first layer through the intermediate layer to form at least two sealed full cavities. The at least two full cavities have different pressures within.Type: ApplicationFiled: March 1, 2013Publication date: September 4, 2014Inventors: Shyh-Wei Cheng, Jui-Chun Weng, Hsi-Cheng Hsu, Chih-Yu Wang, Jung-Kuo Tu, Che-Jung Chu, Yu-Ting Hsu
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Patent number: 8822253Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.Type: GrantFiled: November 1, 2013Date of Patent: September 2, 2014Assignee: Micronas GmbHInventors: Tobias Kolleth, Pascal Stumpf, Christian Joos
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Patent number: 8822252Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: GrantFiled: September 20, 2013Date of Patent: September 2, 2014Assignee: Invensense, Inc.Inventors: Kegang Huang, Jongwoo Shin, Martin Lim, Michael Julian Daneman, Joseph Seeger
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Patent number: 8823116Abstract: A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function. The MEMS element is mounted on the ASIC element, so that a gap exists between the micromechanical structure and the back-end stack of the ASIC element. The cap wafer is mounted above the micromechanical structure of the MEMS element. A pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, which diaphragm structure spans a pressure connection in the rear side of the ASIC element.Type: GrantFiled: June 11, 2013Date of Patent: September 2, 2014Assignee: Robert Bosch GmbHInventor: Heribert Weber
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Patent number: 8820160Abstract: A method for producing a sensor element, wherein at least parts of the sensor element are subjected to at least one plasma treatment process during production. The plasma treatment process may be either a plasma cleaning process and/or a plasma activation process. During the plasma treatment process, a base element and/or a carrier element of the sensor element is subjected to a plasma treatment process before a placement process and/or before a contact-connecting process with electrical connection means. The sensor element is equipped with at least one measurement probe element and/or at least one electronic circuit. This method is used to produce a sensor element, such as a speed sensor element, that may be used in a motor vehicle.Type: GrantFiled: October 1, 2009Date of Patent: September 2, 2014Assignee: Continental Teves AG Co. oHGInventors: Andreas Doering, Edmond De Volder, Dietmar Huber, Jakob Schillinger, Martin Watzlawik
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Publication number: 20140239423Abstract: Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided. In one embodiment, the MEMS device fabrication method forming a via opening extending through a sacrificial layer and into a substrate over which the sacrificial layer has been formed. A body of electrically-conductive material is deposited over the sacrificial layer and into the via opening to produce an unpatterned transducer layer and a filled via in ohmic contact with the unpatterned transducer layer. The unpatterned transducer layer is then patterned to define, at least in part, a primary transducer structure. At least a portion of the sacrificial layer is removed to release at least one movable component of the primary transducer structure. A backside conductor, such as a bond pad, is then produced over a bottom surface of the substrate and electrically coupled to the filled via.Type: ApplicationFiled: February 28, 2013Publication date: August 28, 2014Inventor: Lianjun Liu
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Publication number: 20140242739Abstract: Systems and methods for a pressure sensor are provided, where the pressure sensor comprises a housing having a high side input port that allows a high pressure media to enter a high side of the housing and a low side input port that allows a low pressure media to enter a low side of the housing when the housing is placed in an environment containing the high and low pressure media; a substrate mounted within the housing; a stress isolation member mounted to the substrate; a die stack having sensing circuitry bonded to the stress isolation member; a low side atomic layer deposition (ALD) applied to surfaces, of the substrate, the stress isolation member, and the die stack, exposed to the low side input port; and a high side ALD applied to surfaces, of the stress isolation member and the die stack, exposed to the high side input port.Type: ApplicationFiled: February 26, 2014Publication date: August 28, 2014Applicant: Honeywell International Inc.Inventor: Gregory C. Brown
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Publication number: 20140239353Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.Type: ApplicationFiled: November 19, 2013Publication date: August 28, 2014Applicant: Invensense, Inc.Inventors: Michael Julian Daneman, Mei-Lin Chan, Martin Lim, Fariboz Assaderaghi, Erhan Polatkan Ata
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Patent number: 8815624Abstract: A method of forming a capped die forms a cap wafer having a top side and a bottom side. The bottom side is formed with 1) a plurality of device cavities having a first depth, and 2) a plurality of second cavities that each have a greater depth than the first depth. At least some of the plurality of second cavities each generally circumscribe at least one of the device cavities. The method then secures the cap wafer to a device wafer in a manner that causes a plurality of the device cavities each to circumscribe at least one of circuitry and structure on the device wafer. Next, the method removes at least a portion of the top side of the cap wafer to expose the second cavities. This forms a plurality of caps that each protect the noted circuitry and structure.Type: GrantFiled: June 22, 2011Date of Patent: August 26, 2014Assignee: Analog Devices, Inc.Inventors: Mitul Dalal, Li Chen
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Patent number: 8815623Abstract: A differential pressure sensor comprises a membrane arranged over a cavity on a semiconductor substrate. A lid layer is arranged at the top side of the device and comprises an access opening for providing access to the top side of the membrane. A channel extends laterally from the cavity and intersects with a bore. The bore is formed by laser drilling from the bottom side of the substrate and provides access to the bottom side of the membrane. The bore extends all through the substrate and optionally into the lid layer.Type: GrantFiled: August 5, 2009Date of Patent: August 26, 2014Assignee: Sensirion AGInventors: Johannes Bühler, Felix Mayer, Matthias Streiff, René Hummel, Robert Sunier
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Patent number: 8815625Abstract: A pressure sensor having a structure, which includes a supporting body, a circuit arrangement and at least one circuit support. The circuit arrangement includes circuit components, amongst which detection means for generating electrical signals representing a quantity to be detected. The at least one circuit support is connected to the supporting body and has a surface, formed on which is a plurality of said circuit components, amongst which electrically conductive paths, where the circuit support is laminated on the first face of the supporting body.Type: GrantFiled: July 14, 2011Date of Patent: August 26, 2014Assignee: Metallux SAInventor: Massimo Monichino
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Publication number: 20140231934Abstract: According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.Type: ApplicationFiled: August 8, 2013Publication date: August 21, 2014Inventor: Tomohiro SAITO
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Publication number: 20140231935Abstract: The present invention provides a multi-axial acceleration sensor and a method of manufacturing the multi-axial acceleration sensor. The method includes: providing a substrate having a lead plane; disposing a first sensor chip onto the lead plane, wherein a wire bonding plane of the first sensor chip is perpendicular to the lead plane; and disposing a second sensor chip onto the lead plane, wherein a wire bonding plane of the second sensor chip is in parallel with the lead plane.Type: ApplicationFiled: August 9, 2013Publication date: August 21, 2014Applicant: PixArt Imaging Inc.Inventor: Wei-Chung Wang
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Patent number: 8809081Abstract: An electronic device comprising at least one die stack having at least a first die (D1) comprising a first array of light emitting units (OLED) for emitting light, a second layer (D2) comprising a second array of via holes (VH) and a third die (D3) comprising a third array of light detecting units (PD) for detecting light from the first array of light emitting units (OELD) is provided. The second layer (D2) is arranged between the first die (D1) and the third die (D3). The first, second and third array are aligned such that light emitted from the first array of light emitting units (OLED) passed through the second array of via holes (VH) and is detected by the third array of light detecting units (PD). The first array of light emitting units and/or the third array of light detecting units are manufactured based on standard semiconductor manufacturing processes.Type: GrantFiled: October 22, 2013Date of Patent: August 19, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Fred Roozeboom, Herbert Lifka, Fredrik Vanhelmont, Wouter Dekkers
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Publication number: 20140225206Abstract: A semiconductor die (20) includes a substrate (30) and microelectronic devices (22, 26) located at a surface (32) of the substrate (30). A cap (34) is coupled to the substrate (30), and the microelectronic device (22) is positioned in the cavity (24). An outgassing material structure (36) is located within a cavity (24) between the cap (34) and the substrate (30). The outgassing material structure (36) releases trapped gas (37) to increase the pressure within the cavity (24) from an initial pressure level (96) to a second pressure level (94). The cap (34) may include another cavity (28) containing another microelectronic device (26). A getter material (42) may be located within the cavity (28). The getter material (42) is activated to absorb residual gas (46) in the cavity (28) and decrease the pressure within the cavity (28) from the initial pressure level (96) to a third pressure level (92).Type: ApplicationFiled: February 11, 2013Publication date: August 14, 2014Inventors: Yizhen Lin, Chad S. Dawson, Hemant D. Desai, Lisa H. Karlin, Keith L. Kraver, Mark E. Schlarmann
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Publication number: 20140227817Abstract: A manufacturing process of a M EMS device divides a substrate for fabricating u MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein.Type: ApplicationFiled: April 18, 2014Publication date: August 14, 2014Applicant: MIRADIA, INC.Inventors: YU-HAO CHIEN, HUA-SHU WU, SHIH-YUNG CHUNG, LI-TIEN TSENG, YU-TE YEH
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Patent number: 8803261Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion can be made greater than the cross-sectional area of the membrane, thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane. The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.Type: GrantFiled: March 10, 2014Date of Patent: August 12, 2014Assignee: Wolfson Microelectronics plcInventors: Anthony Bernard Traynor, Richard Ian Laming, Tsjerk H. Hoekstra
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Patent number: 8802474Abstract: A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.Type: GrantFiled: March 19, 2014Date of Patent: August 12, 2014Assignee: Freescale Semiconductor, Inc.Inventors: Jinzhong Yao, Wai Yew Lo, Lan Chu Tan, Xuesong Xu
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Patent number: 8802503Abstract: An LED package with an extended top electrode and an extended bottom electrode is formed from a first metal and a second metal. An LED is on an inner end of the first metal. An outer end of the first metal has been bent upward twice 90 degrees to form a top flat as an extended top electrode of the package. An outer end of the second metal has been bent downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package. The LED and a bonding wire may be encapsulated with glue.Type: GrantFiled: March 11, 2014Date of Patent: August 12, 2014Assignee: Cheng Kung Capital, LLCInventor: Jiahn-Chang Wu
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Publication number: 20140217521Abstract: An encapsulated MEMS device includes stress-relief trenches in a region of its substrate that surrounds the movable micromachined structures and that is covered by a cap, such that the trenches are fluidly exposed to a cavity between the substrate and the cap. A method of fabricating a MEMS device includes fabricating stress-relief trenches through a substrate and fabricating movable micromachined structures, and capping the device prior art encapsulating the device.Type: ApplicationFiled: February 1, 2013Publication date: August 7, 2014Applicant: ANALOG DEVICES, INC.Inventors: Houri Johari-Galle, Michael W. Judy
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Publication number: 20140218133Abstract: A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.Type: ApplicationFiled: February 6, 2013Publication date: August 7, 2014Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)Inventor: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
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Patent number: 8796059Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.Type: GrantFiled: January 25, 2012Date of Patent: August 5, 2014Assignee: STMicroelectronics S.r.l.Inventors: Lorenzo Baldo, Chantal Combi, Mario Francesco Cortese
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Patent number: 8796058Abstract: Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.Type: GrantFiled: November 2, 2011Date of Patent: August 5, 2014Assignee: International Business Machines CorporationInventors: Russell T. Herrin, Daniel R. Miga, Anthony K. Stamper
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Publication number: 20140213007Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: ApplicationFiled: September 20, 2013Publication date: July 31, 2014Applicant: InvenSense, Inc.Inventors: Kegang HUANG, Jongwoo SHIN, Martin LIM, Michael Julian DANEMAN, Joseph SEEGER
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Publication number: 20140210019Abstract: An integrated MEMS sensor package is disclosed. The package comprises a sensor chip with a top surface and a bottom surface. The top surface comprises an opening. The bottom surface is attached to a substrate with electrical inter-connects. A lid is coupled to the top surface with an adhesive material. The lid may have an opening to expose the sensor chip to ambient environment.Type: ApplicationFiled: January 30, 2013Publication date: July 31, 2014Applicant: INVENSENSE, INC.Inventors: Steven S. NASIRI, Nim H. TEA, Stephen LLOYD
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Patent number: 8791532Abstract: The sensor assembly comprises a substrate (1), such as a flexible printed circuit board, and a sensor chip (2) flip-chip mounted to the substrate (1), with a first side (3) of the sensor chip (2) facing the substrate (1). A sensing area (4) and contact pads (5) are integrated on the first side (3) of the sensor chip (2) and located in a chamber (17) between the substrate (1) and the sensor chip (2). Chamber (17) is bordered along at least two sides by a dam (16). Underfill (18) and/or solder flux is arranged between the sensor chip (2) and the substrate (1), and the dam (16) prevents the underfill from entering the chamber (17). An opening (19) extends from the chamber to the environment and is located between the substrate (1) and the sensor chip (2) or extends through the sensor chip (2).Type: GrantFiled: November 18, 2009Date of Patent: July 29, 2014Assignee: Sensirion AGInventors: Markus Graf, Werner Hunziker, Franziska Brem, Felix Mayer
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Patent number: 8790946Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.Type: GrantFiled: February 2, 2012Date of Patent: July 29, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao, Chun-Wen Cheng, Chia-Shiung Tsai
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Publication number: 20140207014Abstract: A micromachined fluid flow regulating device is disclosed comprising a fluid flow channel, at least one flow orifice formed in the channel, defining an inlet portion of the channel upstream of the flow orifice, an outlet portion of the channel downstream of the flow orifice, the fluid having a flow direction from the inlet portion to the outlet portion of the channel. At least one piston is arranged upstream of the flow orifice, movably suspended in the channel by a spring means such that the piston is movable by the fluid in the flow direction of the fluid, towards the flow orifice, to regulate a fluid flow through the flow orifice. The disclosure further relates to the use of a micromachined flow regulating device in a breath analysis device and to a method of fabricating a flow regulating device.Type: ApplicationFiled: January 17, 2014Publication date: July 24, 2014Inventors: Niclas Roxhed, Staffan Johansson, Goran Stemme, Hans Peter Starck Johnson
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Publication number: 20140203380Abstract: In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.Type: ApplicationFiled: January 23, 2013Publication date: July 24, 2014Applicant: INFINEON TECHNOLOGIES AGInventor: Horst Theuss
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Publication number: 20140206123Abstract: Exemplary microelectromechanical system (MEMS) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (SOI) substrate, wherein the SOI substrate includes a first silicon layer separated from a second silicon layer by an insulator layer; processing the first silicon layer to form a first structure layer of a MEMS device; bonding the first structure layer to a substrate; and processing the second silicon layer to form a second structure layer of the MEMS device.Type: ApplicationFiled: January 24, 2013Publication date: July 24, 2014Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Kai-Chih Liang, Chung-Hsien Lin, Chun-wen Cheng
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Publication number: 20140203421Abstract: A device includes a first substrate bonded with a second substrate structure. The second substrate structure includes an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the outgasing prevention structure.Type: ApplicationFiled: April 15, 2014Publication date: July 24, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Pao SHU, Chia-Ming HUNG, Wen-Chuan TAI, Hung-Sen WANG, Hsiang-Fu CHEN, Alex KALNITSKY
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Publication number: 20140206124Abstract: A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.Type: ApplicationFiled: March 19, 2014Publication date: July 24, 2014Applicant: Freescale Semiconductor, Inc.Inventors: Jinzhong Yao, Wai Yew Lo, Lan Chu Tan, Xuesong Xu
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Patent number: 8785231Abstract: A semiconductor device includes a sensor portion, a cap portion, and an ion-implanted layer. The sensor portion has a sensor structure at a surface portion of a surface. The cap portion has first and second surfaces opposite to each other and includes a through electrode. The surface of the sensor portion is joined to the first surface of the cap portion such that the sensor structure is sealed between the sensor portion and the cap portion. The ion-implanted layer is located on the second surface of the cap portion. The through electrode extends from the first surface to the second surface and is exposed through the ion-implanted layer.Type: GrantFiled: January 24, 2013Date of Patent: July 22, 2014Assignee: DENSO CORPORATIONInventors: Kazuhiko Sugiura, Tetsuo Fujii, Hisanori Yokura
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Patent number: 8786111Abstract: In one embodiment, a semiconductor package includes a vertical semiconductor chip having a first major surface on one side of the vertical semiconductor chip and a second major surface on an opposite side of the vertical semiconductor chip. The first major surface includes a first contact region and the second major surface includes a second contact region. The vertical semiconductor chip is configured to regulate flow of current from the first contact region to the second contact region along a current flow direction. A back side conductor is disposed at the second contact region of the second major surface. The semiconductor package further includes a first encapsulant in which the vertical semiconductor chip and the back side conductor are disposed.Type: GrantFiled: May 14, 2012Date of Patent: July 22, 2014Assignee: Infineon Technologies AGInventors: Edward Fuergut, Joachim Mahler, Khalil Hosseini, Hans-Joerg Timme
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Patent number: 8778704Abstract: A self-powered integrated circuit (IC) device includes a lead frame and a solar cell having first and second main surfaces. The solar cell is mounted on a surface of the lead frame. An IC chip is also provided. A first electrical interconnector electrically couples the IC chip to the lead frame and a second electrical interconnector electrically couples the solar cell to the IC chip. A portion of the first main surface of the solar cell is configured to receive light from an external source. The solar cell converts energy of the received light into electrical power that is supplied to the IC chip. A mold compound encapsulates the IC chip, the first and second electrical interconnectors, and at least a portion of the solar cell.Type: GrantFiled: March 24, 2013Date of Patent: July 15, 2014Assignee: Freescale Semiconductor, Inc.Inventors: Teck Beng Lau, Wai Yew Lo, Chin Teck Siong
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Patent number: 8778739Abstract: A method of manufacturing a lead frame, includes forming a rectangular first dimple includes, first inclined side surfaces inclined to a depth direction, and arranged in two opposing sides in one direction, and standing side surfaces standing upright to a depth direction, and arranged in two opposing sides in other direction, on a backside of a die pad by a first stamping, and forming a second dimple having second inclined side surfaces inclined on the backside of the die pad by a second stamping, such that a second inclined side surfaces of the second dimple are arranged in side areas of the standing side surfaces of the first dimple, wherein the standing side surfaces are transformed into reversed inclined side surfaces inclined to a reversed direction to the first inclined side surfaces, and a front side of the die pad is semiconductor element mounting surface.Type: GrantFiled: January 28, 2013Date of Patent: July 15, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventor: Hitoshi Miyao
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Patent number: 8778741Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.Type: GrantFiled: December 19, 2008Date of Patent: July 15, 2014Assignee: Texas Instruments IncorporatedInventors: Robert M. Duboc, Terry Tarn
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Patent number: 8779535Abstract: Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.Type: GrantFiled: March 14, 2012Date of Patent: July 15, 2014Assignee: Analog Devices, Inc.Inventors: Thomas M. Goida, Jicheng Yang
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Patent number: 8772884Abstract: A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.Type: GrantFiled: August 6, 2013Date of Patent: July 8, 2014Assignee: Apple Inc.Inventors: Robert Henry Bond, Alan Kramer, Giovanni Gozzini
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Publication number: 20140186987Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.Type: ApplicationFiled: February 19, 2014Publication date: July 3, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: YU WEN HSU, SHIH TING LIN, JEN YI CHEN, CHAO TA HUANG
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Publication number: 20140183672Abstract: An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface.Type: ApplicationFiled: September 18, 2013Publication date: July 3, 2014Applicant: FUJITSU LIMITEDInventors: Hajime KUBOTA, Masayuki ITOH, Masakazu KISHI
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Publication number: 20140183670Abstract: Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices are guide wires that include a capacitive pressure-sensing component disposed at a distal portion of the guide wire. Methods of making such intravascular devices, including various manufacturing and assembling techniques, are disclosed. Systems associated with such intravascular devices and methods of using such devices and systems are also disclosed.Type: ApplicationFiled: December 18, 2013Publication date: July 3, 2014Applicant: Volcano CorporationInventors: Bret C. Millett, Paul Douglas Corl