Abstract: An arrangement for a motor vehicle for central connection of electrical components, the arrangement comprises a housing, a plurality of supply circuits and control circuits, a plurality of circuit straps punched out of metal sheets and printed circuit boards, the supply circuits and the control circuits being formed so that the supply circuits are formed exclusively from the punched circuit straps and the control circuits are formed exclusively from the printed circuit boards, the printed circuit boards with the punched circuit straps and their intermediate insulations being assembled in a plurality of layers in a substantially identical surface configuration to form a printed circuit pack.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: An IC card includes a circuit board having a generally planar substrate with at least one electrical component mounted thereon. A receptacle including terminals is mounted at an edge of the circuit board. A pair of cover panels sandwich the circuit board therebetween. At least one conductive ground clip holds the cover panels in assembled condition sandwiching the circuit board therebetween. A ground circuit on the circuit board engages the grounding clip. At least a portion of the grounding clip is exposed exteriorly of the IC card for engaging an appropriate ground on an appropriate mating electrical apparatus.

Abstract: A printed circuit board clamp, for clamping a printed circuit board to a housing of electronic, electric and apparatus installations, is secured to at least one fixing stud (1) disposed at the bottom of the housing and is provided with a bore (2). The clamp has an elongated body (4) having two ends (6 and 7) and an interconnecting neck portion (8) between the ends. The clamp also has fixing assembly (14-17) for securing the printed circuit board to the clamp. Each of the two ends of the clamp has a throughgoing aperture (9, 10) for screws or the like. At least one of the apertures is elongatedly shaped for securing the clamp to the fixing stud. To substantially facilitate mounting of printed circuit boards within different housings, the clamp includes at least a weakening point (25, 26) that can be broken manually without any tools in order to separate the ends (6, 7) of the clamp from the neck portion.

Abstract: This is a data card frame provided with a unique end rail which is bifurcated to form a receptacle port which can accept any number of different connector headers each of which is designed not only to mate with a selected external plug or terminal but is further uniquely designed to mate with a particular data card being supported in the frame. The receptacle port in the frame is also provided with locking detents coded to assure the correct positioning of the connector header in the receptacle port during insertion therein. The receptacle port is further provided with metal latching inserts matching locking hooks on a mating external plug that permit the external plug to be inserted into, with minimal force and securely latched thereto.

Abstract: A guide mechanism prevents an improperly oriented PC card from being inserted a significant distance into a PC slot. A pair of PC card guide mechanisms are coupled to a PC male connector. A PC card is received at the guides as the card is inserted and pushed toward the male connector. Each guide mechanism includes a proximal end that engages an edge of the male connector, and a distal flanged end that receives the PC card. A guide rail extends between the proximal and distal ends of each guide mechanism. At least one guide mechanism includes a flexible arm along its guide rail. At the tip of the arm is a keying mechanism responsive to the PC card orientation. When the PC card is properly oriented, the card slides over the keying mechanism pushing it aside to traverse the guide rail. When the PC card is improperly oriented, the card is blocked by the keying mechanism so as not to traverse the guide rail.

Abstract: A connector system for an add in PC card for supplying network communications functions to a host computer wherein the connector to the network is a RJ type universal jack consisting of a socket and plug. A cavity in the card is formed by an opening in the short dimension of the frame opposite the 68 position connector and the top and bottom covers. A carriage is mounted in the cavity so that it can slide in and out and occupy at least two positions. The carriage consists of a socket portion for making contact with the RJ type plug and a support and contact portion that mechanically supports the carriage within the card and also makes the electrical contact between the carriage and the card. In the first of the two positions, substantially all of the carriage is within the cavity. In the second of the two positions, the socket portion of the carriage is outside of the cavity. In this position, the socket is electrically connected to the printed circuit board.

Abstract: An electronics housing that is compliant with a type II PCMCIA standard includes a frame (101) and coupled thereto a first and a second cover (103, 137), a connector (121) with a body (123) and a plurality of terminals (131), and a carrier (111) with a first side (113) and a second side (115). The first cover (103) includes an interior surface (105) with the carrier (111) disposed adjacent thereto and an interface surface (107). The body (123) is disposed adjacent to the interface surface (107) and includes a plurality of openings (129) extending through the body. The plurality of terminals (131) each includes a receptacle (133) and an integral contact (135) where the receptacle is disposed within the opening and the integral contact extends from the body and is formed to be mechanically coupled to the second side (115).

Abstract: A transmit/receive (T/R) module of a phased array radar having a unified housing comprising an integrated connector as part of the module housing, thereby eliminating a hermetic joint between a group of DC signal pins and the module housing. Power and RF signal connector pins are provided in the housing. The pins of the connectors are inserted within the module housing with a glass compression seal around each pin.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when the contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A unit for providing a socket for a plurality of removably mountable peripheral devices to a computer including a receptacle for receiving the body of such removably mountable peripheral devices, the receptacle being generally block shaped and having a pair of generally-parallel generally-rectangular outer surfaces separated by a distance which is small compared to dimensions of the rectangular surfaces, the receptacle including conductors for electrically connecting to any such removably mountable peripheral devices and being designed to fit within the interior of a computer; a first circuit board having a generally-rectangular shape; interface circuitry for effecting a connection of such removably mountable peripheral devices to a bus of a computer within which the unit is positioned, the interface circuitry being mounted on the first circuit board and having electrical connections on the surface of the first circuit board to the receptacle, the first circuit board being mounted to the receptacle; a second

Abstract: An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).

Abstract: A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole.

Abstract: The present invention makes it easier to connect board modules to each other and to increase reliability in a portable semiconductor apparatus having two board modules within a frame. Upper-row connection pins and lower-row connection pins have electrode leads, each having connection portions divided into two parts that are arranged in respective upper and lower rows. One of the board modules is inserted between one upper-row electrode lead and one lower-row electrode lead and electrically connected. The other board module is inserted between another upper-row electrode lead and another lower-row electrode lead and electrically connected. In this way, the board modules are electrically connected to each other.

Abstract: An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

Abstract: A host structure is provided for terminal adapters that are part of a distributed computer architecture. Each computer system is in turn connected to a number of synchronous or asynchronous terminals via the network and terminal adapters, each terminal adapter connected, on one hand, to the network and, on the other hand, to at least one terminal via a synchronous or asynchronous transmission link. The host structure can contain a number of adapter cards, each containing the electronic circuit of an adapter, and is composed of a first compartment with the adapter cards, and a second compartment with an equal number of connection cards. The connection cards each enable connecting a number of terminals to a particular adapter.

Abstract: An IC card arranged so that a connector cannot come off a frame during an assembly process in which the connector and a circuit board are accommodated in the frame and panels are thereafter attached to obverse and reverse surfaces of the frame. Projections on sides of the connector and resilient engaging/fixing hooks with oblique surfaces on the frame are engaged. As the connector is forced into the frame, the projections of the connector are brought into engagement with and temporarily deflect the engaging/fixing hooks of the frame. The connector is thereby fixed firmly on the frame.

Abstract: A low profile header assembly for an encapsulated instrument includes a plate member with a cavity which is on the side of the plate member external to the instrument. Terminal pins extend through the plate member both within the cavity and beyond its periphery. Hybrid amplifier circuitry is disposed within the cavity and electrically connected to the pins within the cavity. The cavity is hermetically sealed and the internal components of the instrument are electrically connected to the terminal pins within the instrument shell.

Abstract: A terminal structure includes a portion of a flexible printed circuit board and a plurality of metal terminals each consisting of a slender, elongate metal plate. The circuit board has a plurality of electrically conductive patterns provided on a resin film, a prescribed portion of the board having a connector insertion portion of a width substantially the same as that of an insertion hole of a connector. The plurality of metal terminals are placed in parallel on the flexible printed circuit board in such a manner that distal ends thereof are situated adjacent a distal end of the connector insertion portion, and each metal terminal is fixedly bonded to a respective one of the electrically conductive patterns provided on the flexible printed circuit board.

Abstract: A mother board assembly includes a mother board which has a top face and a first connector mounted on the top face. A first mounting seat is mounted on the top face on one side of the first connector and includes at least one resilient first positioning member which is substantially C-shaped. The first positioning member defines a first groove and has two spaced free ends. A second mounting seat is mounted on the top face on the other side of the first connector and includes at least one second positioning member which has a substantially U-shaped retaining portion that defines a second groove. A curved plate portion extends from the retaining portion in a direction away from the first mounting seat. An interface card has a front end, a rear end, a bottom face and a second connector mounted on the bottom face between the front and rear ends.

Abstract: A computer functional card connecting apparatus comprised of a base having two parallel channel frames at two opposite ends thereof at right angles, wherein the base has a step block longitudinally disposed at the top with pin holes formed thereon, an elongated groove longitudinally disposed on the bottom with vertical contact pins made thereon for connecting to a mother board, transverse contact pins on an inner side for electrically connecting a computer functional card that has been inserted in between the two parallel channel frames, and a circuit board set between the step block and the bottom groove for electrically connecting said transverse contact pins, the vertical contact pins and the pin holes.

Abstract: Overlapping chip replaceable subunits for RIS or ROS array bars are disclosed. The subunits include a planar semiconductive substrate having at least one component and supporting circuitry on a surface thereof. The semiconductive substrate has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The planar semiconductive substrate is mounted on a planar support which can be, for example, a daughterboard/heat sink assembly having at least one electrode having a terminal at one end thereof. The planar support also has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The width of the support is less than the width of the semiconductive substrate so that the first and second side edges of the planar semiconductive substrate extend outwardly beyond the first and second side edges, respectively, of the support.

Abstract: Mounting only electronic parts on a printed circuit board puts a limit on the mounting density. According to the invention, electronic parts are mounted on a flexible board. This flexible board is then mounted on a printed circuit board to thereby increase the mounting density.

Abstract: A universal connector of the "D"-type for use on the ends of cables connecting electronic equipment, the connector permitting ready customizing for particular applications. A circuit board is inserted, in one embodiment within the hood shield of the "D"-type connector that has a terminal strip for the mechanical joining of wires of the cable. This circuit board also has junction points for being joined, as by soldered connections, to pins of the connector, and fuse links joining the terminal strip and the junction points. In another embodiment, the circuit board and its components is within an auxiliary body, with this auxiliary body being connected to the "D"-type connector via pigtail cable. The connector is customized by electrically destroying (blowing) selected fuse links by passing current therethrough whereby the remaining fuse links form selected circuit paths between the pins of the connector and the cable.

Abstract: A stacked double density memory module may be formed from two industry standard memory chips, by jumpering the unused and chip enable pins on one chip and then stacking the jumpered chip on the other chip with the pins on the jumpered (top) chip contacting the corresponding pins on the other (bottom) chip except for the chip select pins. In a preferred embodiment for use with 64K or one megabit DRAMs, the top chip is jumpered with a U-shaped strap which runs from the unused pin to the chip enable pin. The chip enable pin is bent toward the chip body to retain the strap in place. The technique may also be employed for stacking other industry standard memory or array chips.

Abstract: A coupling plate with a plurality of electric coupling points comprises, in a preferred embodiment, a pair of plane plates (10, 12), between which there is provided an electrically insulating carrier layer (11), on which a pattern of electrically conducting areas (21-26) is provided. In the preferred embodiment, an electric coupling point is provided for each mechanical coupling stud (15) projecting from the upper side of the top plate (10). The studs (15) are hollow and flush with projections (19) on the lower plate (12) so that punched parts of the electrically conducting areas (20, 22, 24, 26) are just moved into the hollow coupling studs by means of the projections (19) on the lower plate (12), thus making the conducting areas accessible through cuts (16) in the coupling studs (15). The invention also concerns a method of producing such a plate and a board consisting of a plurality of interconnected plates of said type.

Abstract: A stack layer structure is formed wherein solderable metal layers are provided at least at two ends thereof, and at least a metal layer for preventing the diffusion of solder is inserted between the two metal layers. In an interboard connection terminal and a method of manufacturing the same, a pair of solder bumps are fixed to be in contact with the two surfaces of the resultant stack layer structure.