With External, Contact Enhancing Clamp Patents (Class 439/73)
  • Patent number: 11963326
    Abstract: An electrical connector includes an insulative housing extending in a horizontal direction, a plurality of conductive terminals retained in the insulative housing, a metallic stiffener surrounding the insulative housing, a load plate pivotally mounted upon the metallic stiffener and moveable between an open position and a closed position, and a carrier frame used for retaining and receiving a central processing unit (CPU) and carrying the CPU to the insulative housing. After retaining the CPU, the carrier frame is mounted on the insulative housing along a vertical direction perpendicular to the horizontal direction. The load plate is rotated to the closed position to fix the CPU on the insulative housing.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: April 16, 2024
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shan-Yong Cheng, Chen-Wei Yang
  • Patent number: 11865674
    Abstract: A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: January 9, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Chun-Nan Chen, Ming-Te Lin, Chi-Ming Tsai
  • Patent number: 11852656
    Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: December 26, 2023
    Inventors: Bum Mo Ahn, Seung Ho Park, Tae Hwan Song
  • Patent number: 11832417
    Abstract: A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: November 28, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu
  • Patent number: 11800666
    Abstract: An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: October 24, 2023
    Assignee: International Business Machines Corporation
    Inventors: Noah Singer, Jeffrey Allen Zitz, Mark D. Schultz, John Torok, Yuet-Ying Yu, William L. Brodsky, Shawn Canfield
  • Patent number: 11789063
    Abstract: A conduction inspection jig includes a first member having first openings, a second member having second openings and formed to be positioned above the first member, a third member formed to be positioned between the first member and the second member such that the third member forms a space between the first member and the second member and at least substantially surrounds the space, and a probe formed to pass through one of the first openings and one of the second openings such that the probe extends through the space formed between the first member and the second member.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: October 17, 2023
    Assignee: IBIDEN CO., LTD.
    Inventors: Takayuki Mori, Taishi Takeda
  • Patent number: 11784427
    Abstract: A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: October 10, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Peng Li, Changwei Liang
  • Patent number: 11626675
    Abstract: Systems for interfacing a printed circuit board assembly (PCBA) adapter module to a receiver housing are provided. The receiver housing may have a first interface mounted on the receiver housing via a first mount and the PCBA adapter module may have a second interface mounted on the adapter module via a second mount. One of the interfaces has a protruding feature that aligns the interfaces when matingly engaged, while the other interface has a centering hole opposite the protruding feature. The first centering hole is enlarged with respect to an axis of an insertion-angle plane such that the protruding feature substantially clears the centering hole without causing either interface to exceed a limit of free-play between that interface and its respective mount.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: April 11, 2023
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventor: Greg Alden Lloyd
  • Patent number: 11381047
    Abstract: To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the accommodated IC package 11; and a lever member 17 for pressing the cover member 15. A long hole 23h is provided on the socket body 13 to movably support the cover member 15, a third shaft 33 supported by the long hole 23h is provided on the cover member 15, and the cover member 15 is configured to be closed so that the cover member 15 is pushed down along the long hole 23h.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: July 5, 2022
    Assignee: ENPLAS CORPORATION
    Inventor: Osamu Hachuda
  • Patent number: 11349232
    Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: May 31, 2022
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Junji Oosaka, Yuichi Takenaga, Akihiro Matsunaga
  • Patent number: 11199577
    Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: December 14, 2021
    Assignee: TSE CO., LTD.
    Inventors: Chang Su Oh, Bo Hyun Kim
  • Patent number: 10667409
    Abstract: A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: May 26, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Heiner Jacobs, Martin Rittner, Ulrich Kessler
  • Patent number: 10527670
    Abstract: Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: January 7, 2020
    Assignee: XILINX, INC.
    Inventors: Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet Singh Gandhi, Tien-Yu Lee, Henley Liu, David M. Mahoney, Mohsen H. Mardi
  • Patent number: 10485129
    Abstract: A connector includes an insulative housing, a plurality of contacts retained in the housing, and a metallic stiffener surrounding the housing. A first pivot section and a second pivot section respectively located at opposite rear and front ends of the stiffener. A first lever is pivotally mounted upon the first pivot section and a second lever is pivotally mounted upon the second pivot section. The first lever includes a first pivot mounted upon the first pivot section, and a first handle moveable between a closed position and an open position. The first pivot includes an offset section on which a load plate is pivotally mounted. The first pivot section includes a stopper limiting outward rotation of both the first lever and the load plate at more than ninety degrees so as not to hinder loading/unloading the CPU with regard to the housing in the vertical direction.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: November 19, 2019
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventor: Fang-Jwu Liao
  • Patent number: 10290565
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: May 14, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • Patent number: 10274535
    Abstract: To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: April 30, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Yuki Ueyama
  • Patent number: 10254308
    Abstract: An electronic device testing apparatus with a locking mechanism for locking a press head and a socket plate is provided. When an electronic device is to be tested, a lifting arm is lowered so that a contact portion is in contact with the electronic device, and a locking mechanism is actuated to detain the press head on the socket plate. A pressing force generating device exerts a pressing force onto the electronic device and the socket plate, and at least a portion of a reaction force can be directed back to the locking mechanism. The locking mechanism is adapted to detain the press head on the socket plate. When the pressing force generating device generates a predetermined pressing force to certainly establish electrical connection between the electronic device and the chip socket, the reaction force produced by the chip socket may be distributed over the locking mechanism.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: April 9, 2019
    Assignee: CHROMA ATE INC.
    Inventor: Chien-Ming Chen
  • Patent number: 9900970
    Abstract: The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: February 20, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen
  • Patent number: 9859641
    Abstract: The present invention aims to improve heat dissipation effect for an electrical component in a socket for electrical component in which a socket body and a cover member are separated. According to an embodiment, a cover member includes a frame-like cover body including an opening in a middle portion thereof, a heatsink provided to penetrate through the opening of the frame-like cover body, an elevating part supporting the heatsink, and a pressing part that is moveable to press the elevating part so as to press the heatsink against the electrical component. While the heatsink is pressed against the electrical component, the electrical component is fixed to the housing portion of the socket body. Accordingly, it is possible to make the heatsink perform heat dissipation for the electrical component. Thus, it is possible to obtain excellent heat dissipation effect with respect to the electrical component.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: January 2, 2018
    Assignee: ENPLAS CORPORATION
    Inventor: Osamu Hachuda
  • Patent number: 9332666
    Abstract: An electrical connector for electrically connecting an IC package to a substrate, includes an insulating housing (21), a stiffener (20) located on one side of the insulating housing (21) and a load plate (22) assembled to the stiffener (20) and being rotated between an opened position and a closed position, the stiffener (20) includes a first end (203) and an extending portion (208) extending upwardly and then horizontally in a direction far away from the insulating housing (21) from the first end (203), the extending portion (208) includes a receiving hole (209), the load plate (22) includes a body portion (220) and a hook (223) extending from on end of the body portion (220), the hook (223) is assembled to the receiving hole (209) and interlocks with the extending portion (208) to position the load plate (22) on the stiffener (20).
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: May 3, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Cheng-Chi Yeh, Chih-Kai Yang
  • Patent number: 9329569
    Abstract: A manufacturing method of a cartridge including an information storing element includes: a step of removing a first information storing element holding unit holding a first information storing element, from a frame including a positioning portion for positioning the first information storing element holding unit while leaving at least a part of the positioning portion, and of positioning a second information storing element holding unit including a second information storing element to a remaining portion of the positioning portion; and a step of connecting the second information storing element holding unit and the frame at the remaining portion.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: May 3, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Sadaaki Tani, Tatsuya Kanno
  • Patent number: 9123806
    Abstract: The method includes providing a semiconductor chip having a first main face and a second main face opposite the first main face. The semiconductor chip includes an electrical device adjacent to the first main face. Material of the semiconductor chip is removed at the second main face except for a pre-defined portion so that a non-planar surface remains at the second main face.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: September 1, 2015
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Joachim Mahler
  • Patent number: 9116316
    Abstract: Guiding convexed and concaved parts provided on inner side surfaces of a female connector housing have inclining surfaces inclining with respect to a direction perpendicular to the inner side surfaces; whereas guided convexed and concaved parts provided on outer side surfaces of a male connector housing have inclining surfaces facing the inclining surfaces of the guiding convexed and concaved parts.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: August 25, 2015
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Toshikuni Kondo, Noritsugu Enomoto
  • Patent number: 9011170
    Abstract: A method and apparatus for mounting a semiconductor is disclosed. First, the semiconductor is mounted into the bracket of a lid while the lid is detached from a frame. Once the semiconductor has been loaded into the lid/bracket assembly, the loaded lid is mounted onto the frame. The lid is then locked in place on the frame by rotating a locking lever into a closed locked position.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 21, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Keith A. Sauer, Kelly K Smith, Robert J. Hastings, Chong Sin Tan
  • Patent number: 8970243
    Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: March 3, 2015
    Assignee: Advantest Corporation
    Inventors: Yoshinari Kogure, Takashi Fujisaki, Kiyoto Nakamura
  • Patent number: 8926354
    Abstract: A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the IC socket can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for closing constituted so as to press upward an operation portion to be operated for closing formed to both side end portion of the latch and rotate the latch in an closing direction when the operating member moves upward.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: January 6, 2015
    Assignee: Enplas Corporation
    Inventor: Kenji Hayakawa
  • Patent number: 8905765
    Abstract: An electrical connector for use with an electronic package, includes a base having two posts. A plurality of contacts is received in the base. A carrier defines a center opening to receive the electronic package and two holes corresponding to the posts. The holes of the carrier cooperate with the posts of the base to guide the carrier loading the electronic package mount to the base.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8834191
    Abstract: An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a number of contacts received therein, a load plate covering the insulating housing and rotating between an open position and a closed position and a holder assembled on the load plate for retaining the IC package. The holder is sandwiched between the insulating housing and the load plate and capable of loading the IC package to the insulating housing when the load plate is rotated to a close position.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: September 16, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Fang-Jwu Liao
  • Patent number: 8834192
    Abstract: An electrical connector for use with an electronic package, includes an insulative housing defining an upward facing cavity, a plurality of contacts disposed in the cavity of the insulative housing with contacts sections extending into the cavity, and a carrier frame mounted to the insulative housing and having a main body defining an opening for allowing part of the electronic package passing through the opening. The carrier frame assembles to the insulative housing having a preliminary alignment state and a final alignment state.
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: September 16, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Albert Harvey Terhune, IV
  • Patent number: 8827723
    Abstract: An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: September 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Jwu Liao, Chun-Yi Chang
  • Publication number: 20140038437
    Abstract: An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.
    Type: Application
    Filed: January 2, 2013
    Publication date: February 6, 2014
    Inventors: Fang-Jwu Liao, Chun-Yi Chang
  • Publication number: 20140011377
    Abstract: An electrical connector (100) for electrically connecting an IC package with a substrate and includes an insulative housing (1) with a plurality of contacts (10) received therein, a stiffener (3) located outside of the insulative housing (1) and includes a front end (20) and a rear end (21) opposite to the front end (20), a holding member (61) pivotally assembled to the front end (20) of the stiffener (2), a carrier (8) assembled to the holding member (61) for holding the IC package (9), a load plate (3) pivotally assembled to the rear end (21) of the stiffener (2) and includes an opening (310) to permit the exposing of the IC package (9), the load plate (3) presses on the holding member (61).
    Type: Application
    Filed: March 29, 2013
    Publication date: January 9, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHENG-CHI YEH
  • Patent number: 8602805
    Abstract: A socket (100) of the present invention includes a base member (20), a cover member (30), a plurality of contacts (40), a latch member (60A) that is rotatably supported by the base member (20) and rotates in response to movement of the cover member (30), an adaptor (50) providing a mounting surface for an IC package and attached with the base member (20) so as to move in an up and down direction in response to the movement of the cover member (30), and a latch plate (200) rotatably attached with the adaptor (50A) and urged by an elastic member. The adaptor (50A) is formed with a latch guide (58) that moves the latch plate (200) in the vertical direction when the latch plate (200) presses the IC package.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: December 10, 2013
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Hideyuki Takahashi, Hideki Sano
  • Patent number: 8597035
    Abstract: An electrical connector includes a reinforcement member including a pair of tabs having an outer curved surface; a load plate including a first side, a second side opposite to the first side and a third side connecting the first side and the second side at a front location while the first side and the second side are disconnected at a rear location; a lever including a driving portion and a shaft portion running through the reinforcement member and the load plate and is rotatably connected to rear ends of the first side and the second side. The shaft portion of the lever guides along the outer curved surface of the frame so as to move the load plate forwardly or backwardly.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: December 3, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Albert Harvey Terhune, IV, Wei-Te Chung
  • Patent number: 8562367
    Abstract: A socket for electrical part mounted on the wiring substrate to accommodate an electrical part. The present invention comprises a socket body, a floating plate and a holding structure. The socket body has a contact pin unit comprising a unit body in which the plural contact pins are mounted. The floating plate is mounted on upper side of the unit body to accommodate the electrical part, and comprises through holes into which the upper side contact portions of contact pins are inserted. The holding structure holds the floating plate in a descended state when the socket for the electrical part is not yet mounted on the wiring substrate, and releases the holding state of floating plate and makes the floating plate to be capable of moving vertically under the state of being urged upward when the socket for the electrical part is mounted on the wiring substrate.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: October 22, 2013
    Assignee: Enplas Corporation
    Inventor: Yuji Yokoyama
  • Patent number: 8550826
    Abstract: A loading device comprises a frame defining opposite top, bottom face, and a number of mounting holes extending through both the faces; a loading plate and a lever pivotally connected on the frame respectively, the loading plate being able to be locked on the frame by the lever; a number of screw members passing through corresponding mounting holes; a number of connecting members located below the bottom face of the frame and engaging with corresponding screw member; and a number of reinforcing members disposed between the bottom face and the connecting members for limiting movement of the frame relative to the connecting members.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: October 8, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shuo-Hsiu Hsu
  • Patent number: 8523163
    Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: September 3, 2013
    Assignee: TechWing., Co. Ltd.
    Inventors: Yun-Sung Na, Dong-Han Kim, Young-Yong Kim
  • Patent number: 8514579
    Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.
    Type: Grant
    Filed: May 10, 2010
    Date of Patent: August 20, 2013
    Assignee: Infineon Technologies AG
    Inventors: Thilo Stolze, Olaf Hohlfeld, Peter Kanschat
  • Patent number: 8460012
    Abstract: A socket protection device includes a fixing member, a cover, a limiting member, and an operation member. The fixing member is secured to a circuit board. The fixing member includes a pair of first connecting blocks. The cover includes a second connecting block, a first latching portion, and a second latching portion. The limiting member is secured to the circuit board. The operation member includes a shaft and an operation rod secured to the shaft. The shaft rotatably connects the cover to the fixing member via the first and second connecting blocks. When the operation rod is pressed to drive the shaft to rotate, the cover is rotated toward the socket. When the cover covers the socket, the first latching portion latches the limiting member, and the second latching portion latches the operation rod.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: June 11, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hai-Qing Zhou, Yi-Xin Tu
  • Patent number: 8441275
    Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: May 14, 2013
    Assignee: Tapt Interconnect, LLC
    Inventor: Patrick J Alladio
  • Patent number: 8398411
    Abstract: A socket assembly, comprising a socket, a package received in the socket, a pressing member arranged upon the package and downwardly pressing the package and two heat pipes attached to the pressing member. The pressing member is formed with four arch grooves along a peripheral thereof, and the arch grooves allow linking members to pass therethrough and rotatablely retain the pressing member on a printed circuit board. Therefore, the pressing member can rotate in a certain range, by sliding the arch groove with respect to the linking member, to provide a flexible arrangement for heat pipes.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: March 19, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventors: Cheng-Ching Chien, Nan-Hung Lin, Chih-Pi Cheng
  • Patent number: 8391933
    Abstract: A portable audio device having reduced sensitivity to RF interference over a predetermined frequency range from an adjacent mobile wireless communications device may include a portable housing, a battery carried thereby, a recharging power input connected to the battery, a digital signal input, and an audio analog signal output. A digital-to-analog converter (DAC) may be carried by the portable housing and powered by the battery for converting a selected digital audio file from a memory into an analog audio signal. An audio analog amplifier may be connected between the DAC and the audio analog signal output. A first RF filter(s) may be connected to the recharging power input, and a second RF filter(s) may be connected to the audio analog signal output, both for reducing RF interference over the predetermined frequency range from the adjacent mobile wireless communications device.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: March 5, 2013
    Assignee: Research In Motion Limited
    Inventors: Lizhong Zhu, Michael Corrigan, George Mankaruse
  • Patent number: 8366454
    Abstract: In an electrical component socket, an electrical component can be removed easily even if a fixed contact potion bites into an electrical component terminal. In the electrical component socket (11), a floating plate (14) to accommodate an IC package (12) is provided in a socket body to be able to move up and down, and is biased upward by a biasing member. In a movable contact piece (15b) of a contact pin (15), a pressing projecting piece (15m) is formed. In the floating plate (14), a pressed part (14m) to be pressed by the pressing projecting piece (15m) is formed. When the movable contact piece (15b) is elastically deformed in an opening direction and a movable contact part (15g) separates from an IC lead (12b), the floating plate (14) rises upward by the biasing member, and the IC lead (12b) separates from a fixed contact part (15d).
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: February 5, 2013
    Assignee: Enplas Corporation
    Inventor: Hirohisa Ohno
  • Patent number: 8363410
    Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: January 29, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Eiji Kobori, Takeyuki Suzuki
  • Patent number: 8342870
    Abstract: A socket connector (100) comprises a socket body (5), a plurality of contacts (3) received in the socket body (5), a lid (1) movably mounted on the socket body (5) and moving up and down along a vertical direction, a moving plate (4) movably mounted upon the socket body (5) and moving along a horizontal direction and an operating lever (2) located between the lid (1) and the moving plate (4), the operating lever (2) comprises a press member (22), the press member (22) presses on the top surface of the moving plate (4) to prevent the floating of the moving plate (4) in the vertical direction.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: January 1, 2013
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wen-Yi Hsieh, Ke-Hao Chen
  • Patent number: 8279606
    Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: October 2, 2012
    Assignee: Dell Products L.P.
    Inventor: Lawrence Alan Kyle
  • Patent number: 8272880
    Abstract: A socket includes: a circuit board; a plurality of connection terminals disposed on the circuit board; a plurality of contacts each fixed to a corresponding one of the connection terminals, wherein each of the contacts is formed of a conductive elastic member, each of the contacts comprising: a tail portion fixed to the corresponding connection terminal; an extending portion connected to the tail portion and extending in a direction substantially parallel with a surface of the circuit board; a rise portion connected to the extending portion and extending in a direction substantially perpendicular to the surface of the circuit board; and a tip portion connected to the rise portion.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: September 25, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Masato Tanaka
  • Patent number: 8259462
    Abstract: An electrical connector assembly (100) includes an insulative housing (2), a micro chip (1) arranged on the insulative housing, a PCB (3) located below the insulative housing, a number of contacts (5) received in the insulative housing and a locking element (4) interconnecting the insulative housing onto the PCB. The contacts extend beyond an upper surface of the insulative housing and solder with the micro chip. The contacts extend below a lower surface of the insulative housing and contact with the PCB.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: September 4, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Shuo-Hsiu Hsu, Nan-Hung Lin
  • Patent number: 8251715
    Abstract: An electrical connector is adapted for electrically connecting an electronic package (3) to a circuit board. The electrical connector includes an insulative housing (10) for receiving an electronic package, a stiffener (30) supporting the insulative housing, a pair of latching members (50) mounted on the stiffener and pivotable about a respective first axis therethrough, and a lever (70) mounted on the stiffener and pivotable about a second axis perpendicular to the first axis, the lever being operable to pivot the latching members to a closed position for pressing against the electronic package.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 8251714
    Abstract: An electrical connector is adapted for electrically connecting an electronic package (3) to a circuit board. The electrical connector includes an insulative housing (11), a stiffener (13) supporting the insulative housing and formed with a stopper (137), a clip (30) formed with a depressing portion (34), and a leaf (50) formed with an anchor (52). The clip is mounted on the stiffener and is pivotable between a first position and a second position. The leaf is mounted on the clip and is pivotable between the second position and a locked position. When the leaf is positioned at the locked position, the anchor is blocked by the stopper and the depressing portion of the clip depresses the electronic package.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: August 28, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Cheng-Chi Yeh