Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

Abstract: The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

Abstract: A socket for an electrical component including a socket main body 11 including a contact pin, an operating member 12 provided in the socket main body 11 in a vertically movable manner and urged upward, an opening/closing body 14 provided in the socket main body 11 as being capable of being opened and closed and configured to press an electrical component arranged in the socket main body 11 by being closed, an opening/closing link mechanism 15 connected to the opening/closing body 14 with a base end part 15a thereof connected to the socket main body 11 and the operating member 12 to close the opening/closing body 14 when being lifted by the operating member 14, and a depression mechanism 16 which depresses a leading end part 15b of the opening/closing link mechanism 15 when the opening/closing body 14 is closed.

Abstract: The present disclosure relates to a socket having a thin structure and to a spring contact suitable thereto. The socket includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110), a lower contact pin (120) assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a coil spring (130) supporting the upper and lower contact pins (110 and 120); a lower film plate (310) including a plurality of first through-holes (311) through which the respective spring contacts (100) are positioned; an intermediate plate (320) provided on the lower film plate (310) and including second through-holes formed at positions corresponding to the first through-holes (311); and an upper film plate (330) provided on the intermediate plate (320) and including third through-holes formed at positions corresponding to the second through-holes.

Abstract: An electrical connector includes an insulative housing extending in a horizontal direction, a plurality of conductive terminals retained in the insulative housing, a metallic stiffener surrounding the insulative housing, a load plate pivotally mounted upon the metallic stiffener and moveable between an open position and a closed position, and a carrier frame used for retaining and receiving a central processing unit (CPU) and carrying the CPU to the insulative housing. After retaining the CPU, the carrier frame is mounted on the insulative housing along a vertical direction perpendicular to the horizontal direction. The load plate is rotated to the closed position to fix the CPU on the insulative housing.

Abstract: A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.

Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

Abstract: A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.

Abstract: An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

Abstract: A conduction inspection jig includes a first member having first openings, a second member having second openings and formed to be positioned above the first member, a third member formed to be positioned between the first member and the second member such that the third member forms a space between the first member and the second member and at least substantially surrounds the space, and a probe formed to pass through one of the first openings and one of the second openings such that the probe extends through the space formed between the first member and the second member.

Abstract: A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.

Abstract: Systems for interfacing a printed circuit board assembly (PCBA) adapter module to a receiver housing are provided. The receiver housing may have a first interface mounted on the receiver housing via a first mount and the PCBA adapter module may have a second interface mounted on the adapter module via a second mount. One of the interfaces has a protruding feature that aligns the interfaces when matingly engaged, while the other interface has a centering hole opposite the protruding feature. The first centering hole is enlarged with respect to an axis of an insertion-angle plane such that the protruding feature substantially clears the centering hole without causing either interface to exceed a limit of free-play between that interface and its respective mount.

Abstract: To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the accommodated IC package 11; and a lever member 17 for pressing the cover member 15. A long hole 23h is provided on the socket body 13 to movably support the cover member 15, a third shaft 33 supported by the long hole 23h is provided on the cover member 15, and the cover member 15 is configured to be closed so that the cover member 15 is pushed down along the long hole 23h.

Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.

Abstract: A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.

Abstract: Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.

Abstract: A connector includes an insulative housing, a plurality of contacts retained in the housing, and a metallic stiffener surrounding the housing. A first pivot section and a second pivot section respectively located at opposite rear and front ends of the stiffener. A first lever is pivotally mounted upon the first pivot section and a second lever is pivotally mounted upon the second pivot section. The first lever includes a first pivot mounted upon the first pivot section, and a first handle moveable between a closed position and an open position. The first pivot includes an offset section on which a load plate is pivotally mounted. The first pivot section includes a stopper limiting outward rotation of both the first lever and the load plate at more than ninety degrees so as not to hinder loading/unloading the CPU with regard to the housing in the vertical direction.

Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

Abstract: To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.

Abstract: An electronic device testing apparatus with a locking mechanism for locking a press head and a socket plate is provided. When an electronic device is to be tested, a lifting arm is lowered so that a contact portion is in contact with the electronic device, and a locking mechanism is actuated to detain the press head on the socket plate. A pressing force generating device exerts a pressing force onto the electronic device and the socket plate, and at least a portion of a reaction force can be directed back to the locking mechanism. The locking mechanism is adapted to detain the press head on the socket plate. When the pressing force generating device generates a predetermined pressing force to certainly establish electrical connection between the electronic device and the chip socket, the reaction force produced by the chip socket may be distributed over the locking mechanism.

Abstract: The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

Abstract: The present invention aims to improve heat dissipation effect for an electrical component in a socket for electrical component in which a socket body and a cover member are separated. According to an embodiment, a cover member includes a frame-like cover body including an opening in a middle portion thereof, a heatsink provided to penetrate through the opening of the frame-like cover body, an elevating part supporting the heatsink, and a pressing part that is moveable to press the elevating part so as to press the heatsink against the electrical component. While the heatsink is pressed against the electrical component, the electrical component is fixed to the housing portion of the socket body. Accordingly, it is possible to make the heatsink perform heat dissipation for the electrical component. Thus, it is possible to obtain excellent heat dissipation effect with respect to the electrical component.

Abstract: A manufacturing method of a cartridge including an information storing element includes: a step of removing a first information storing element holding unit holding a first information storing element, from a frame including a positioning portion for positioning the first information storing element holding unit while leaving at least a part of the positioning portion, and of positioning a second information storing element holding unit including a second information storing element to a remaining portion of the positioning portion; and a step of connecting the second information storing element holding unit and the frame at the remaining portion.

Abstract: An electrical connector for electrically connecting an IC package to a substrate, includes an insulating housing (21), a stiffener (20) located on one side of the insulating housing (21) and a load plate (22) assembled to the stiffener (20) and being rotated between an opened position and a closed position, the stiffener (20) includes a first end (203) and an extending portion (208) extending upwardly and then horizontally in a direction far away from the insulating housing (21) from the first end (203), the extending portion (208) includes a receiving hole (209), the load plate (22) includes a body portion (220) and a hook (223) extending from on end of the body portion (220), the hook (223) is assembled to the receiving hole (209) and interlocks with the extending portion (208) to position the load plate (22) on the stiffener (20).

Abstract: The method includes providing a semiconductor chip having a first main face and a second main face opposite the first main face. The semiconductor chip includes an electrical device adjacent to the first main face. Material of the semiconductor chip is removed at the second main face except for a pre-defined portion so that a non-planar surface remains at the second main face.

Abstract: Guiding convexed and concaved parts provided on inner side surfaces of a female connector housing have inclining surfaces inclining with respect to a direction perpendicular to the inner side surfaces; whereas guided convexed and concaved parts provided on outer side surfaces of a male connector housing have inclining surfaces facing the inclining surfaces of the guiding convexed and concaved parts.

Abstract: A method and apparatus for mounting a semiconductor is disclosed. First, the semiconductor is mounted into the bracket of a lid while the lid is detached from a frame. Once the semiconductor has been loaded into the lid/bracket assembly, the loaded lid is mounted onto the frame. The lid is then locked in place on the frame by rotating a locking lever into a closed locked position.

Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.

Abstract: A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the IC socket can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for closing constituted so as to press upward an operation portion to be operated for closing formed to both side end portion of the latch and rotate the latch in an closing direction when the operating member moves upward.

Abstract: An electrical connector for use with an electronic package, includes a base having two posts. A plurality of contacts is received in the base. A carrier defines a center opening to receive the electronic package and two holes corresponding to the posts. The holes of the carrier cooperate with the posts of the base to guide the carrier loading the electronic package mount to the base.

Abstract: An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a number of contacts received therein, a load plate covering the insulating housing and rotating between an open position and a closed position and a holder assembled on the load plate for retaining the IC package. The holder is sandwiched between the insulating housing and the load plate and capable of loading the IC package to the insulating housing when the load plate is rotated to a close position.

Abstract: An electrical connector for use with an electronic package, includes an insulative housing defining an upward facing cavity, a plurality of contacts disposed in the cavity of the insulative housing with contacts sections extending into the cavity, and a carrier frame mounted to the insulative housing and having a main body defining an opening for allowing part of the electronic package passing through the opening. The carrier frame assembles to the insulative housing having a preliminary alignment state and a final alignment state.

Abstract: An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.

Abstract: An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.

Abstract: An electrical connector (100) for electrically connecting an IC package with a substrate and includes an insulative housing (1) with a plurality of contacts (10) received therein, a stiffener (3) located outside of the insulative housing (1) and includes a front end (20) and a rear end (21) opposite to the front end (20), a holding member (61) pivotally assembled to the front end (20) of the stiffener (2), a carrier (8) assembled to the holding member (61) for holding the IC package (9), a load plate (3) pivotally assembled to the rear end (21) of the stiffener (2) and includes an opening (310) to permit the exposing of the IC package (9), the load plate (3) presses on the holding member (61).

Abstract: A socket (100) of the present invention includes a base member (20), a cover member (30), a plurality of contacts (40), a latch member (60A) that is rotatably supported by the base member (20) and rotates in response to movement of the cover member (30), an adaptor (50) providing a mounting surface for an IC package and attached with the base member (20) so as to move in an up and down direction in response to the movement of the cover member (30), and a latch plate (200) rotatably attached with the adaptor (50A) and urged by an elastic member. The adaptor (50A) is formed with a latch guide (58) that moves the latch plate (200) in the vertical direction when the latch plate (200) presses the IC package.

Abstract: An electrical connector includes a reinforcement member including a pair of tabs having an outer curved surface; a load plate including a first side, a second side opposite to the first side and a third side connecting the first side and the second side at a front location while the first side and the second side are disconnected at a rear location; a lever including a driving portion and a shaft portion running through the reinforcement member and the load plate and is rotatably connected to rear ends of the first side and the second side. The shaft portion of the lever guides along the outer curved surface of the frame so as to move the load plate forwardly or backwardly.

Abstract: A socket for electrical part mounted on the wiring substrate to accommodate an electrical part. The present invention comprises a socket body, a floating plate and a holding structure. The socket body has a contact pin unit comprising a unit body in which the plural contact pins are mounted. The floating plate is mounted on upper side of the unit body to accommodate the electrical part, and comprises through holes into which the upper side contact portions of contact pins are inserted. The holding structure holds the floating plate in a descended state when the socket for the electrical part is not yet mounted on the wiring substrate, and releases the holding state of floating plate and makes the floating plate to be capable of moving vertically under the state of being urged upward when the socket for the electrical part is mounted on the wiring substrate.

Abstract: A loading device comprises a frame defining opposite top, bottom face, and a number of mounting holes extending through both the faces; a loading plate and a lever pivotally connected on the frame respectively, the loading plate being able to be locked on the frame by the lever; a number of screw members passing through corresponding mounting holes; a number of connecting members located below the bottom face of the frame and engaging with corresponding screw member; and a number of reinforcing members disposed between the bottom face and the connecting members for limiting movement of the frame relative to the connecting members.

Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: A socket protection device includes a fixing member, a cover, a limiting member, and an operation member. The fixing member is secured to a circuit board. The fixing member includes a pair of first connecting blocks. The cover includes a second connecting block, a first latching portion, and a second latching portion. The limiting member is secured to the circuit board. The operation member includes a shaft and an operation rod secured to the shaft. The shaft rotatably connects the cover to the fixing member via the first and second connecting blocks. When the operation rod is pressed to drive the shaft to rotate, the cover is rotated toward the socket. When the cover covers the socket, the first latching portion latches the limiting member, and the second latching portion latches the operation rod.

Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.

Abstract: A socket assembly, comprising a socket, a package received in the socket, a pressing member arranged upon the package and downwardly pressing the package and two heat pipes attached to the pressing member. The pressing member is formed with four arch grooves along a peripheral thereof, and the arch grooves allow linking members to pass therethrough and rotatablely retain the pressing member on a printed circuit board. Therefore, the pressing member can rotate in a certain range, by sliding the arch groove with respect to the linking member, to provide a flexible arrangement for heat pipes.

Abstract: A portable audio device having reduced sensitivity to RF interference over a predetermined frequency range from an adjacent mobile wireless communications device may include a portable housing, a battery carried thereby, a recharging power input connected to the battery, a digital signal input, and an audio analog signal output. A digital-to-analog converter (DAC) may be carried by the portable housing and powered by the battery for converting a selected digital audio file from a memory into an analog audio signal. An audio analog amplifier may be connected between the DAC and the audio analog signal output. A first RF filter(s) may be connected to the recharging power input, and a second RF filter(s) may be connected to the audio analog signal output, both for reducing RF interference over the predetermined frequency range from the adjacent mobile wireless communications device.

Abstract: In an electrical component socket, an electrical component can be removed easily even if a fixed contact potion bites into an electrical component terminal. In the electrical component socket (11), a floating plate (14) to accommodate an IC package (12) is provided in a socket body to be able to move up and down, and is biased upward by a biasing member. In a movable contact piece (15b) of a contact pin (15), a pressing projecting piece (15m) is formed. In the floating plate (14), a pressed part (14m) to be pressed by the pressing projecting piece (15m) is formed. When the movable contact piece (15b) is elastically deformed in an opening direction and a movable contact part (15g) separates from an IC lead (12b), the floating plate (14) rises upward by the biasing member, and the IC lead (12b) separates from a fixed contact part (15d).

Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Abstract: A socket connector (100) comprises a socket body (5), a plurality of contacts (3) received in the socket body (5), a lid (1) movably mounted on the socket body (5) and moving up and down along a vertical direction, a moving plate (4) movably mounted upon the socket body (5) and moving along a horizontal direction and an operating lever (2) located between the lid (1) and the moving plate (4), the operating lever (2) comprises a press member (22), the press member (22) presses on the top surface of the moving plate (4) to prevent the floating of the moving plate (4) in the vertical direction.