Abstract: To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the accommodated IC package 11; and a lever member 17 for pressing the cover member 15. A long hole 23h is provided on the socket body 13 to movably support the cover member 15, a third shaft 33 supported by the long hole 23h is provided on the cover member 15, and the cover member 15 is configured to be closed so that the cover member 15 is pushed down along the long hole 23h.

Abstract: A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.

Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.

Abstract: A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.

Abstract: Integrated (IC) package testing systems and methods for testing an IC package are provided herein that accommodate IC packages having different die heights. In one example, the IC package testing system includes a test fixture base, a socket, and a test fixture head. The socket is disposed on the test fixture base and configured to receive an IC package for testing. The test fixture head is movable towards and away from the base. The test fixture head includes a base plate and a plurality of independently movable pushers. The plurality of pushers are configured to engage the IC package disposed the socket.

Abstract: A connector includes an insulative housing, a plurality of contacts retained in the housing, and a metallic stiffener surrounding the housing. A first pivot section and a second pivot section respectively located at opposite rear and front ends of the stiffener. A first lever is pivotally mounted upon the first pivot section and a second lever is pivotally mounted upon the second pivot section. The first lever includes a first pivot mounted upon the first pivot section, and a first handle moveable between a closed position and an open position. The first pivot includes an offset section on which a load plate is pivotally mounted. The first pivot section includes a stopper limiting outward rotation of both the first lever and the load plate at more than ninety degrees so as not to hinder loading/unloading the CPU with regard to the housing in the vertical direction.

Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.

Abstract: To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.

Abstract: An electronic device testing apparatus with a locking mechanism for locking a press head and a socket plate is provided. When an electronic device is to be tested, a lifting arm is lowered so that a contact portion is in contact with the electronic device, and a locking mechanism is actuated to detain the press head on the socket plate. A pressing force generating device exerts a pressing force onto the electronic device and the socket plate, and at least a portion of a reaction force can be directed back to the locking mechanism. The locking mechanism is adapted to detain the press head on the socket plate. When the pressing force generating device generates a predetermined pressing force to certainly establish electrical connection between the electronic device and the chip socket, the reaction force produced by the chip socket may be distributed over the locking mechanism.

Abstract: The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

Abstract: The present invention aims to improve heat dissipation effect for an electrical component in a socket for electrical component in which a socket body and a cover member are separated. According to an embodiment, a cover member includes a frame-like cover body including an opening in a middle portion thereof, a heatsink provided to penetrate through the opening of the frame-like cover body, an elevating part supporting the heatsink, and a pressing part that is moveable to press the elevating part so as to press the heatsink against the electrical component. While the heatsink is pressed against the electrical component, the electrical component is fixed to the housing portion of the socket body. Accordingly, it is possible to make the heatsink perform heat dissipation for the electrical component. Thus, it is possible to obtain excellent heat dissipation effect with respect to the electrical component.

Abstract: A manufacturing method of a cartridge including an information storing element includes: a step of removing a first information storing element holding unit holding a first information storing element, from a frame including a positioning portion for positioning the first information storing element holding unit while leaving at least a part of the positioning portion, and of positioning a second information storing element holding unit including a second information storing element to a remaining portion of the positioning portion; and a step of connecting the second information storing element holding unit and the frame at the remaining portion.

Abstract: An electrical connector for electrically connecting an IC package to a substrate, includes an insulating housing (21), a stiffener (20) located on one side of the insulating housing (21) and a load plate (22) assembled to the stiffener (20) and being rotated between an opened position and a closed position, the stiffener (20) includes a first end (203) and an extending portion (208) extending upwardly and then horizontally in a direction far away from the insulating housing (21) from the first end (203), the extending portion (208) includes a receiving hole (209), the load plate (22) includes a body portion (220) and a hook (223) extending from on end of the body portion (220), the hook (223) is assembled to the receiving hole (209) and interlocks with the extending portion (208) to position the load plate (22) on the stiffener (20).

Abstract: The method includes providing a semiconductor chip having a first main face and a second main face opposite the first main face. The semiconductor chip includes an electrical device adjacent to the first main face. Material of the semiconductor chip is removed at the second main face except for a pre-defined portion so that a non-planar surface remains at the second main face.

Abstract: Guiding convexed and concaved parts provided on inner side surfaces of a female connector housing have inclining surfaces inclining with respect to a direction perpendicular to the inner side surfaces; whereas guided convexed and concaved parts provided on outer side surfaces of a male connector housing have inclining surfaces facing the inclining surfaces of the guiding convexed and concaved parts.

Abstract: A method and apparatus for mounting a semiconductor is disclosed. First, the semiconductor is mounted into the bracket of a lid while the lid is detached from a frame. Once the semiconductor has been loaded into the lid/bracket assembly, the loaded lid is mounted onto the frame. The lid is then locked in place on the frame by rotating a locking lever into a closed locked position.

Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.

Abstract: A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the IC socket can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for closing constituted so as to press upward an operation portion to be operated for closing formed to both side end portion of the latch and rotate the latch in an closing direction when the operating member moves upward.

Abstract: An electrical connector for use with an electronic package, includes a base having two posts. A plurality of contacts is received in the base. A carrier defines a center opening to receive the electronic package and two holes corresponding to the posts. The holes of the carrier cooperate with the posts of the base to guide the carrier loading the electronic package mount to the base.

Abstract: An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a number of contacts received therein, a load plate covering the insulating housing and rotating between an open position and a closed position and a holder assembled on the load plate for retaining the IC package. The holder is sandwiched between the insulating housing and the load plate and capable of loading the IC package to the insulating housing when the load plate is rotated to a close position.

Abstract: An electrical connector for use with an electronic package, includes an insulative housing defining an upward facing cavity, a plurality of contacts disposed in the cavity of the insulative housing with contacts sections extending into the cavity, and a carrier frame mounted to the insulative housing and having a main body defining an opening for allowing part of the electronic package passing through the opening. The carrier frame assembles to the insulative housing having a preliminary alignment state and a final alignment state.

Abstract: An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.

Abstract: An electrical connector assembly for electrically connecting a central processing unit (CPU) to a printed circuit board (PCB), includes an electrical connector and a shield device. The electrical connector includes an insulative housing, a number of contacts received in the insulative housing, and a load plate mounted upon the insulative housing. The shield device includes an upper section providing a loading force to the load plate, and side sections located on four sides of the electrical connector.

Abstract: An electrical connector (100) for electrically connecting an IC package with a substrate and includes an insulative housing (1) with a plurality of contacts (10) received therein, a stiffener (3) located outside of the insulative housing (1) and includes a front end (20) and a rear end (21) opposite to the front end (20), a holding member (61) pivotally assembled to the front end (20) of the stiffener (2), a carrier (8) assembled to the holding member (61) for holding the IC package (9), a load plate (3) pivotally assembled to the rear end (21) of the stiffener (2) and includes an opening (310) to permit the exposing of the IC package (9), the load plate (3) presses on the holding member (61).

Abstract: A socket (100) of the present invention includes a base member (20), a cover member (30), a plurality of contacts (40), a latch member (60A) that is rotatably supported by the base member (20) and rotates in response to movement of the cover member (30), an adaptor (50) providing a mounting surface for an IC package and attached with the base member (20) so as to move in an up and down direction in response to the movement of the cover member (30), and a latch plate (200) rotatably attached with the adaptor (50A) and urged by an elastic member. The adaptor (50A) is formed with a latch guide (58) that moves the latch plate (200) in the vertical direction when the latch plate (200) presses the IC package.

Abstract: An electrical connector includes a reinforcement member including a pair of tabs having an outer curved surface; a load plate including a first side, a second side opposite to the first side and a third side connecting the first side and the second side at a front location while the first side and the second side are disconnected at a rear location; a lever including a driving portion and a shaft portion running through the reinforcement member and the load plate and is rotatably connected to rear ends of the first side and the second side. The shaft portion of the lever guides along the outer curved surface of the frame so as to move the load plate forwardly or backwardly.

Abstract: A socket for electrical part mounted on the wiring substrate to accommodate an electrical part. The present invention comprises a socket body, a floating plate and a holding structure. The socket body has a contact pin unit comprising a unit body in which the plural contact pins are mounted. The floating plate is mounted on upper side of the unit body to accommodate the electrical part, and comprises through holes into which the upper side contact portions of contact pins are inserted. The holding structure holds the floating plate in a descended state when the socket for the electrical part is not yet mounted on the wiring substrate, and releases the holding state of floating plate and makes the floating plate to be capable of moving vertically under the state of being urged upward when the socket for the electrical part is mounted on the wiring substrate.

Abstract: A loading device comprises a frame defining opposite top, bottom face, and a number of mounting holes extending through both the faces; a loading plate and a lever pivotally connected on the frame respectively, the loading plate being able to be locked on the frame by the lever; a number of screw members passing through corresponding mounting holes; a number of connecting members located below the bottom face of the frame and engaging with corresponding screw member; and a number of reinforcing members disposed between the bottom face and the connecting members for limiting movement of the frame relative to the connecting members.

Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: A socket protection device includes a fixing member, a cover, a limiting member, and an operation member. The fixing member is secured to a circuit board. The fixing member includes a pair of first connecting blocks. The cover includes a second connecting block, a first latching portion, and a second latching portion. The limiting member is secured to the circuit board. The operation member includes a shaft and an operation rod secured to the shaft. The shaft rotatably connects the cover to the fixing member via the first and second connecting blocks. When the operation rod is pressed to drive the shaft to rotate, the cover is rotated toward the socket. When the cover covers the socket, the first latching portion latches the limiting member, and the second latching portion latches the operation rod.

Abstract: An electronic device test fixture deploys a plurality of contact elements in a dielectric housing. The plumb arrangement of contact elements each include an armature or transversal configured to first depress and then slide laterally when urged downward by the external contacts of a device under test. The rotary movement of the transversal is optimized via the configuration of a surrounding forked regulator such that surface oxide deposition on the external device under test terminal is disrupted to reliably minimize contact resistance without damaging or unduly stressing the electrical junction of the device under test.

Abstract: A socket assembly, comprising a socket, a package received in the socket, a pressing member arranged upon the package and downwardly pressing the package and two heat pipes attached to the pressing member. The pressing member is formed with four arch grooves along a peripheral thereof, and the arch grooves allow linking members to pass therethrough and rotatablely retain the pressing member on a printed circuit board. Therefore, the pressing member can rotate in a certain range, by sliding the arch groove with respect to the linking member, to provide a flexible arrangement for heat pipes.

Abstract: A portable audio device having reduced sensitivity to RF interference over a predetermined frequency range from an adjacent mobile wireless communications device may include a portable housing, a battery carried thereby, a recharging power input connected to the battery, a digital signal input, and an audio analog signal output. A digital-to-analog converter (DAC) may be carried by the portable housing and powered by the battery for converting a selected digital audio file from a memory into an analog audio signal. An audio analog amplifier may be connected between the DAC and the audio analog signal output. A first RF filter(s) may be connected to the recharging power input, and a second RF filter(s) may be connected to the audio analog signal output, both for reducing RF interference over the predetermined frequency range from the adjacent mobile wireless communications device.

Abstract: In an electrical component socket, an electrical component can be removed easily even if a fixed contact potion bites into an electrical component terminal. In the electrical component socket (11), a floating plate (14) to accommodate an IC package (12) is provided in a socket body to be able to move up and down, and is biased upward by a biasing member. In a movable contact piece (15b) of a contact pin (15), a pressing projecting piece (15m) is formed. In the floating plate (14), a pressed part (14m) to be pressed by the pressing projecting piece (15m) is formed. When the movable contact piece (15b) is elastically deformed in an opening direction and a movable contact part (15g) separates from an IC lead (12b), the floating plate (14) rises upward by the biasing member, and the IC lead (12b) separates from a fixed contact part (15d).

Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Abstract: A socket connector (100) comprises a socket body (5), a plurality of contacts (3) received in the socket body (5), a lid (1) movably mounted on the socket body (5) and moving up and down along a vertical direction, a moving plate (4) movably mounted upon the socket body (5) and moving along a horizontal direction and an operating lever (2) located between the lid (1) and the moving plate (4), the operating lever (2) comprises a press member (22), the press member (22) presses on the top surface of the moving plate (4) to prevent the floating of the moving plate (4) in the vertical direction.

Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts.

Abstract: A socket includes: a circuit board; a plurality of connection terminals disposed on the circuit board; a plurality of contacts each fixed to a corresponding one of the connection terminals, wherein each of the contacts is formed of a conductive elastic member, each of the contacts comprising: a tail portion fixed to the corresponding connection terminal; an extending portion connected to the tail portion and extending in a direction substantially parallel with a surface of the circuit board; a rise portion connected to the extending portion and extending in a direction substantially perpendicular to the surface of the circuit board; and a tip portion connected to the rise portion.

Abstract: An electrical connector assembly (100) includes an insulative housing (2), a micro chip (1) arranged on the insulative housing, a PCB (3) located below the insulative housing, a number of contacts (5) received in the insulative housing and a locking element (4) interconnecting the insulative housing onto the PCB. The contacts extend beyond an upper surface of the insulative housing and solder with the micro chip. The contacts extend below a lower surface of the insulative housing and contact with the PCB.

Abstract: An electrical connector is adapted for electrically connecting an electronic package (3) to a circuit board. The electrical connector includes an insulative housing (10) for receiving an electronic package, a stiffener (30) supporting the insulative housing, a pair of latching members (50) mounted on the stiffener and pivotable about a respective first axis therethrough, and a lever (70) mounted on the stiffener and pivotable about a second axis perpendicular to the first axis, the lever being operable to pivot the latching members to a closed position for pressing against the electronic package.

Abstract: An electrical connector is adapted for electrically connecting an electronic package (3) to a circuit board. The electrical connector includes an insulative housing (11), a stiffener (13) supporting the insulative housing and formed with a stopper (137), a clip (30) formed with a depressing portion (34), and a leaf (50) formed with an anchor (52). The clip is mounted on the stiffener and is pivotable between a first position and a second position. The leaf is mounted on the clip and is pivotable between the second position and a locked position. When the leaf is positioned at the locked position, the anchor is blocked by the stopper and the depressing portion of the clip depresses the electronic package.

Abstract: A grounding structure, for connecting to an opposite connecting electrical device with a metal casing, is assembled on a circuit board having at least one grounding component. The grounding structure includes a conductive mechanism electrically connected to the metal casing of the opposite connecting electrical device; and at least one conductive pad, disposed between the conductive mechanism and the circuit board, and contacting the conductive mechanism and the grounding component of the circuit board. The grounding structure of the invention can transmit the disturbance to be advantageous for signal transmitting between the opposite connecting electrical device and the circuit board.

Abstract: An electrical connector includes a socket with a number of electrical contacts and a loading mechanism surrounding the socket. The loading mechanism includes a stiffener, a load plate mounted to one end of the stiffener and rotating from an open position to a closed position, and a sliding latch mounted to an opposite end of the stiffener. The load plate has a plate portion and a tongue extending downwardly from the plate portion at said opposite end. The sliding latch moves on the stiffener in a horizontal direction and a vertical direction to lock or unlock the load plate.

Abstract: A fastener for a socket connector includes a frame and a pressing assembly. The frame has an opening and a plurality of protrusions. The protrusions extend from inner edges of the frame toward the opening. The pressing assembly has a cover and a buckling piece. The cover is pivotally connected to the frame. The buckling piece locks the cover on the frame. Using the above arrangement, the protrusions are used to accurately align the socket connector within the opening, thus the inter edge surface of the frame is aligned with the outer peripheral surface of the socket connector. In this way, the pressing assembly of the frame can be operated accurately to lock and press a chip module on the socket connector.

Abstract: An electrical connector includes a socket with a number of electrical contacts and a loading mechanism surrounding the socket. The loading mechanism includes a stiffener, a load plate, and a latch mounted to opposite ends of the stiffener, respectively. The load plate has a plate portion and a tongue extending downwardly from the plate portion at said opposite end. The load plate and the latch rotate on opposite ends of the stiffener from an open position to a closed position. The latch defines a pair of looped sections snapping a pair of protrusions on the tongue as to lock the load plate on the stiffener at the closed position.

Abstract: The socket releasably couples a packaged integrated circuit to a circuit board. The socket includes a clamp, a latch, and an array interconnect. The clamp is configured to be pivotally coupled to a circuit board. The latch is configured to be coupled to the circuit board and configured to releasably hold the clamp in a predetermined position. The array interconnect configured to be coupled to the printed circuit board. In use the latch releasably holds the hinged clamp in the predetermined position to clamp both a packaged integrated circuit between the clamp and the array interconnect, and the array interconnect between the packaged integrated circuit and the circuit board.

Abstract: A burn-in socket assembly comprises a base, a loading member and a plurality of contacts. The base has a bottom wall, a plurality of sidewalls and a cavity surrounded by the bottom wall and the sidewalls, the bottom wall defines a plurality of contact receiving holes. The loading member is assembled within the base for loading an integrated circuit package and defines a plurality of passageways corresponding to the contact receiving holes of the base. The contacts are received in the contact receiving holes of the base and the passageways of the loading member. The bottom wall is further formed with a plurality of protruding strips on a top surface thereof and between two adjacent rows of the contact receiving holes to support the loading member.

Abstract: A component loading system includes a board having a socket, wherein the board includes a first mounting member and a pair of first heat dissipater coupling posts that extend from the board adjacent the socket. A base member defines two base member securing holes, wherein the base member is secured to the board using the pair of first heat dissipater coupling posts such that a first heat dissipater coupling post extends through each base member securing hole. A loading member includes a pair of second heat dissipater coupling posts extending from the loading member, wherein the loading member is operable to be secured to the board by coupling the loading member to the base member and securing the loading member to the board using the first mounting member, and wherein a heat dissipater is operable to be coupled to the base member and the loading member using the pair of first heat dissipater coupling posts and the pair of second heat dissipater coupling posts.

Abstract: A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts.