Abstract: The probe pin cartridge is held in the cartridge accommodating region of the frame body when the slider members are in the locked state, and detachable from the cartridge accommodating region when the slider members are in the unlocked state by the operation of the operating buttons.

Abstract: An LGA connector (100) adapted for receiving an electronic package (10), includes a housing (2) and a number of contacts received in the housing, a stiffener (3) enclosing the housing, a cover (5) pivotable between an open position and a closed position, and a lever (4) adapted for retaining the cover. The cover includes a pair of opposite first edges (53) each having a pair of resisting beams (531) extending toward opposite directions and projecting toward the housing. The resisting beams resiliently resist against the electronic package when the cover is rotated to the closed position.

Abstract: An IC socket includes a base holding a plurality of contacts therein, at least one latch pivotably attached to the base, and at least one pressing member mounted on the base and being vertically movable relative to the base. The pressing member comprises at least one pair of pressing tabs extending toward the base and engaging with the latch to actuate the latch to pivotally move relatively to the base, a horizontal member physically connecting with the pair of pressing tabs, and an opening defined above the horizontal member and between the two pressing tabs. The horizontal member formed on the pressing member can enhance the intensity of the pressing member and prevent the pressing member from deformation and breakage.

Abstract: A contact includes a substantially rectangular base plate. A linking member extends from the base plate such that the linking member is perpendicular thereto. A first elastic contact arm extends obliquely upward from a tip end of the linking member. The first elastic contact arm has a contact member for electrically connecting the first elastic contact arm to an integrated circuit socket. A second elastic contact arm extends obliquely downward from a tip end of the linking member. The second elastic contact arm has a contact member for electrically connecting the second elastic contact arm to a circuit board.

Abstract: A land grid array connector (100) has a stiffener defining a window (305) thereon, a metal clip (40) pivotably coupling with stiffener, a lever (50) engaging on the stiffener, a housing (10) received in the window of the stiffener and a number of contacts mounted to the housing. The lever includes a pair of locating portions (501) and an offset actuating portion (503) disposed between the locating portions. The clip includes a projecting portion (400) having a depress portion (405) for receiving the offset actuating portion of the lever, a protruding portion (406) bending upwardly and inwardly from an end of the depress portion and a pair of guiding portions (4060) extending outwardly from the protruding portion for resisting against opposite ends of the offset actuating portion.

Abstract: Techniques for a land grid array (LGA) socket loaded mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and a LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed.

Abstract: An electrical connector is used for connecting a chip module to a circuit board, and includes an insulating body, conducting pins, a rod, and a fastening device. The rod includes a pressing rod, and fastening portions. The pressing rod has a pressing portion for pressing the chip module. The fastening portions are located at two ends of the rod. The fastening device includes a back plate, and a fastening hook that is located on the back plate. The fastening portion of the rod is wedged to the fastening hook of the fastening device. Thereby, the chip module is firmly fastening in the insulating body. The assembling process is easy. Furthermore, because both ends of the rod have the fastening portions, the electrical connector can achieve the same effect, without the enhancing flake, the pressing board and the moving part. Its structure is simple, and the manufacturing cost is low.

Abstract: An electrical connector assembly (1) comprises a housing (10), an operating member (11), a cover (12) pivotally engaged in one side of the housing (10), a shaft (14) for connecting the cover (12) to the housing (10) and a plurality of terminals (13). The operating member (11) defines a number of receiving holes (110), and the housing (10) defines a plurality of passageways (100) corresponding to the receiving holes (110). The terminal (13) comprises a contact engaging portion (131) received in the housing (10) for contacting with the chip module (2), an retaining portion (132) received in the received hole (110), a tail (1) connecting to the printed circuit board and a neck portion (134) connecting the retaining portion (132) and the contact engaging portion (131). The operating member (11) is floatably supported by a first projection (1341) formed on the first connecting portion (134).

Abstract: A socket for electrically connection an electronic package to a circuit board, comprises: a socket body (10) receiving a number of terminals; a floating board (11) located upon the socket body; a cover (12) rotatablely assembled to the socked body, the cover formed with at least a position portion; a pressure board (13) correspondingly formed with at least one clasp for latching with the position portion of the cover to retain the pressure board to the cover.

Abstract: A purpose of the invention is to provide a socket and a socket base, capable of holding the retainers outside the viewing field of the camera in spite of the size and/or shape of the retainers when measuring contact gaps, for example.

Abstract: An electrical connector (1) comprises an insulative housing (4), a stiffener (6) defined around the housing (4), a clip (7) pivotably engaged on one end of the stiffener (6), and a lever (8) engaged on an opposite end of the stiffener (6) for fastening the clip (7) onto the housing (4). The housing (4) comprises an upper surface (44) and a lower surface (45) opposite to the upper surface (44) and a platform surface (47) projected between the upper surface (44) and the lower surface (45) and a planar sidewall (40) surrounded thereof. The sidewall (1) comprises an upper section (42) and a lower section (48) that is the circumference of the upper sidewall (42) is longer than that of the lower sidewall (48).

Abstract: A land grid array socket (12) includes a dielectric housing (30) and a number of conductive terminals (40) secured thereto. A stiffener (50) having a pair of transverse flanges (504, 508) and a pair of discrete longitudinal sidewall (506) is disposed around the housing. A load plate (60) is pivotally attached to one of the flange for downwardly pressing a land grid array package seated on the terminals toward the housing. A lever (70) is moveably coupled to the other flange for locking the load plate in position.

Abstract: A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.

Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers.

Abstract: An electric connector having an insulating body, a plurality of terminals received in the insulating body and a press unit pressing a chip module. The press unit has at least one elastic arm. The elastic arm has a driving portion. At least one limiting body is formed on the insulating body. When the driving portion is driven, the limiting body serves to limit the elastic arm not to over-deform.

Abstract: An electrical connector for connection to an electrical component assembly along a connection axis is provided. The electrical connector includes a body holding a first array of electrical contacts. The first array of electrical contacts are configured to electrically connect to a second array of electrical contacts of the electrical component assembly. An alignment pin extends outwardly from the body. The alignment pin is configured to be received within an alignment opening of the electrical component assembly for aligning the electrical component assembly with the body. The alignment pin includes at least one slot configured to receive an edge portion of the electrical component assembly that at least partially defines the alignment opening thereof.

Abstract: A socket activation assembly is configured to close over a component and drive a gear during closure that activates a socket to engage the component.

Abstract: A socket for an electrical part has a socket body 14 and a contact pin 15. The contact pin 15 has a fixed portion 15e fixed to a through hole 14d of the socket body 14, a plate-like elastic pieces 15b extending upward from the fixed portion 15e and a contact portion 15c to contact the electrical part. The elastic piece 15b is elastically deformable along a plate surface of the elastic piece so as to cause the contact portion to contact to and separate from a terminal of the electrical part. A biting portion 15f formed between the fixed portion 15e and the contact portion 15c for biting a bitten portion 14h formed on an inner wall of the through hole 14d. When the biting portion 15f bites the bitten portion 14h, vertical movement of the contact pin 15 is restricted and also a preload is given to the elastic pieces 15b in a direction of closing the contact portion 15c of the elastic piece 15b.

Abstract: An electrical connector adapted for connecting a camera module to a printed circuit board via a flexible printed circuit comprises a shield and a spring plate. The shield includes a pair of opposite rear and front walls, a pair of left and right walls adjacent to the rear and front walls, and a flat bottom wall connecting the walls together to enclose a cavity for receiving the camera module. The spring plate is mounted on the bottom wall of the shell and has a main portion and a number of elastic arms extending outward from the two opposite sides of the main portion. Each of the front and rear wall of the shield includes an upright base extending upwardly from the bottom wall, a retaining section extending upwardly from the center of the upright base, and a pair of fastening sections extending from both sides of the retaining section and bending toward the receiving cavity.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape generating module, and a clamping arrangement for clamping the first, second and shape generating modules together. The shape generating module imparts a desired shape to the second module for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer, a second insulating layer and a shape producing layer disposed between the first and second insulating layers. The shape producing layer includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract: An electrical connector socket includes an electrical connector and a pick-up cap assembled on the electrical connector according to the present invention is used for connecting chip module on a circuit board. The electrical connector includes a main body having an insulated body and a plurality of terminals electrically connected with the chip module and mounted inside the insulated body, and a metal clip assembled with the main body for pressing the chip module on the terminal. The pick-up cap is disposed on the main body and basically is above the metal clip. There is no need to design a new pick-up cap. Therefore, the design and development cost are reduced and such pick-up cap is more universal.

Abstract: An LGA electrical connector (100) includes an insulative housing (2) for receiving an LGA package (7), a stiffener (3) for grasping a periphery of the housing, a first cover member (4) attached to a front end of the stiffener, a second cover member (5) and a lever (6) respectively attached to opposite ends of the stiffener. The first cover member is adapted for engaging a top surface of the LGA package, while the second cover member is rotatable to rest upon the first cover member and locked at its free end by the lever. With the first and second cover members attached to opposite sides of the LGA connector, the LGA package will be disposed in a parallel relationship with respect to the top surface of the housing when the cover members are rotated upon the LGA package.

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.

Abstract: To attain an object of providing an insert for holding wide-ranging kinds of area array type electronic components and realizing certain connection between external terminals of an area array type electronic component and connection terminals of a socket, and an electronic component testing apparatus and an electronic component testing method using the same, a thin plate 163 for supporting an IC device 2 is positioned between an external terminal face 23 of the IC device 2 and a connection terminal face 42 of a socket 40, and a thickness of the thin plate 163 is made to be approximately equal to or less than a distance between a tip portion of the external terminals 22 and the external terminal face 23.

Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.

Abstract: An electric connector used for connecting a chip module includes an insulating body, an electric conducting terminal, a latch base, and an attaching cover, and both sides of the attaching cover press on both sides of the latch base respectively. Both sides of the attaching cover of the electric connector of the invention press on both sides of the latch base respectively, such that both ends of the attaching cover can be fixed directly onto both ends of the latch base without being fixed onto the metal upper casing of the latch base, so as to avoid redesigning the attaching cover when there is a slight modification of the structure of the metal upper casing that the attaching cover cannot be installed onto the metal upper casing, and effectively lowering the design and development cost and enhancing the universal applicability of the attaching cover.

Abstract: Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.

Abstract: An electrical connector (1) for electrically connecting an electrical chip to a printed circuit board includes a base (3), a number of contacts, a stiffener (4) partially surrounding the base, a metal clip (5) pivotally assembled to one end of the stiffener, and a lever (6) pivotally assembled to opposite the other end of the stiffener. The base has a number of contact receiving passageways, and includes a mounting surface (314) for arranging the electrical chip and opposite connecting surface (315) for positioning to the printed circuit board. The contacts are received in the contact receiving passageways of the main body. The base defines a plurality of through slots (310) extending from mounting surface to the connecting surface thereof for transferring heat produced by the electrical chip outwardly.

Abstract: An IC socket for testing an IC package is provided including a socket body (10), a press cover (14) preferably pivotally mounted to a first longitudinal end (101) of the socket body so as to be rotatable with respect to the socket body, and a press member (12) disposed between the socket body and the press cover to have an end thereof (121) essentially pivotally mounted to the press cover at a position adjacent the first longitudinal end of the socket body. Thus, by providing the mounting of the press member to the press cover at such a position, a latching member (141) detachably attached to the press cover will be less damaged in comparison with the conventional IC socket.

Abstract: A test socket-lid assembly for testing electronic devices such as IC chips consists of a socket sub-assembly and a lid-sub-assembly, which is separated from the socket sub-assembly. In the lid sub-assembly, the lid is pivotally connected to the frame and supports a spring-loaded pusher that can slide in a vertical direction relative to the lid and can perform rocking movements relative to the lid. The assembly is distinguished from existing devices of this type in that the IC chip is supported and clamped in the lid sub-assembly and in that the entire lid sub-assembly together with the clamped and spring-loaded pusher is attached to the socket by guiding the lid sub-assembly in a transverse direction along the socket guide to the position wherein the spring plungers are locked into their respective openings on the surface of the socket.

Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.

Abstract: A land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts. A lever is pivotally mounted on a second end of the insulative housing. The lever has a locking portion for locking the cover member in the closed position. A metallic reinforcing plate is positioned on a bottom surface of the housing. The metallic reinforcing plate extends between the first end and the second end of the insulative housing.

Abstract: An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

Abstract: An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

Abstract: An adapter and method for aligning and connecting the external leads of at least one integrated circuit device to conductors on a substrate of a multi-chip module. The adapter includes a component frame configured to receive the integrated circuit device. The component frame is attached to a support member. The support member with attached component frame is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit device are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have a component frame attached thereto, is placed over the opposing side of the multi-chip module substrate. The ends of the first support member are attached to the ends of the second support member such that the external leads of the IC device are forced into electrical contact with the corresponding conductors on the multi-chip module substrate.

Abstract: An electrical connector comprises a base mounted on a PCB, a cover for holding a CPU, and a plurality of contacts each of which has a supporting portion received in the base and an engaging portion reaching out of the base. The cover is formed with a number of through holes for fixing the contact. Every engaging portion crosses and partially extends out of the corresponding through hole. In process of assembly, each contact is pressed and generates elastic deformation, which causes its engaging portion to move. The CPU and the cover can move with the engaging portion simultaneously.

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape generating module, and a clamping arrangement for clamping the first, second and shape generating modules together. The shape generating module imparts a desired shape to the second module for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer, a second insulating layer and a shape producing layer disposed between the first and second insulating layers. The shape producing layer includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract: A tool for aligning a semiconductor package with an electrical connector, comprises a body, a plurality of latching members assembled to the body and a back plane. The body defines a center through hole which has a funnelform casing at bottom end thereof for aligning and guiding the semiconductor package. The latching member has a latching portion for retaining the tool to the electrical connector.

Abstract: One embodiment of the present invention is a socket useful to contact an electronic device, the socket including: (a) one or more contactor holder plates including one or more first through holes having a first hole cross sectional area, and one or more second through holes having a second hole cross sectional area; (b) one or more first contactors having a body with a first body cross sectional area disposed in the first through holes; (c) one or more second contactors having a body with a second body cross sectional area disposed in the second through holes; and (d) a heat sink in thermal contact with one or more of the one or more contactor holder plates; wherein a first ratio of the first hole cross sectional area to the first body cross sectional area is different from a second ratio of the second hole cross sectional area to the second body cross sectional area.

Abstract: A pressure device for a test socket includes a main pressure body (70) defining a substantially rectangular opening sized to allow a sub-pressure body (60) to be therewithin, and the sub-pressure body accommodated within the main pressure body. At least one passage (601, 701) is formed on lateral sections between the main pressure body and the sub-pressure body. A fastening member (10) is to be within the at least one passage for fastening the sub-pressure body to the main pressure body, and includes a core section (101) and an end (102) attached to the core section. The end of the fastening member defines a surface shaped to facilitate a wrench to be engaged therewithin, which is easy to extract the fastening member from the passages of the main pressure body and the sub-pressure body by the use of the conventional wrench available in the factory.

Abstract: An IC package is guided to the proper position therefore on a mounting surface of an IC socket with good mounting workability, while preventing buckling and deformation of contacts. In addition, a guide member is enabled to be urged upward stably, without increasing the number of parts. The IC socket includes: an insulative housing that holds a plurality of contacts; a cover plate; and a lever. A guide member, which includes: a pair of guide rails for guiding the IC package; and a link member for linking the guide rails to each other, is attached to the housing. Spring arms for urging the guide member upward are provided on the guide rails and the link member. Regulating members that regulate upward movement of the guide member at a position, where the guided IC package does not contact the electrical contacts, are provided on the housing and the guide member.

Abstract: In an electrical socket including a base for receiving a connection object in a predetermined direction, a plurality of contacts are held by the base and adapted to be contacted with the connection object. A pusher is rotatably held by the base and has an acting portion and an operating portion which is adapted to be operated. The pusher is continuously urged by a spring so that the connection object is brought into press contact with the contact via the acting portion. A cover is coupled to the base to be movable in the predetermined direction. One of the cover and the operating portion has a contact surface faced to the other in the predetermined direction. The other of the cover and the operating portion has a roller adapted to roll on the contact surface following the movement of the cover.

Abstract: A socket for an electrical part has a socket body 14 and a contact pin 15. The contact pin 15 has a fixed portion 15e fixed to a through hole 14d of the socket body 14, a plate-like elastic pieces 15b extending upward from the fixed portion 15e and a contact portion 15c to contact the electrical part. The elastic piece 15b is elastically deformable along a plate surface of the elastic piece so as to cause the contact portion to contact to and separate from a terminal of the electrical part. A biting portion 15f formed between the fixed portion 15e and the contact portion 15c for biting a bitten portion 14h formed on an inner wall of the through hole 14d. When the biting portion 15f bites the bitten portion 14h, vertical movement of the contact pin 15 is restricted and also a preload is given to the elastic pieces 15b in a direction of closing the contact portion 15c of the elastic piece 15b.

Abstract: A socket connector includes a metallic stiffener (12), an insulative housing (11), a load plate (14), a load lever (15) and a plurality of plastic supporting posts (16). The stiffener defines a central opening (120) in a middle portion thereof, the opening being surrounded by two pairs of inner surfaces (1201). The housing defines a recessed conductive zone (110) surrounded by sidewalls (111). The housing partially received in the opening of stiffener, and sidewalls interferentially engage with the inner surfaces in a direction parallel to the opening. The plastic supporting posts engage with the stiffener and are partially below the stiffener.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Abstract: A socket (10) for a semiconductor package having a plurality of solder balls (5) at its bottom surface. The socket (10) includes a socket body having a plurality of contacts (11) arranged in a shape to correspond in arrangement to the solder balls (5) of the semiconductor package. Each of the contacts (11) has a first and second contact piece contactable with the corresponding solder ball (5) while clamping the corresponding solder ball (5) from both side. The socket (10) includes a placing plate (13) capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate (13) without contact of the solder balls (5) of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls (5) of the placed semiconductor package are contactable with the corresponding first and second contact pieces.

Abstract: According to some embodiments, at least one spring element is provided for a load compensator along with a restraining portion that maintains a pre-load compression for the spring element. Moreover, at least one surface may be provided to transfer force associated with an integrated circuit and a set of electrical contacts.

Abstract: A sporting system is described, having a sport board that can be attached to a shoe construction using Velcro®.

Abstract: A center processing unit (CPU) socket holds a CPU and has a base and a cushion. The base has a bottom, a contact seat, multiple contacts, a cover and a latch. The contact seat is mounted in the bottom and has a recess. The contacts are mounted in the recess in multiple lines. The cover is mounted pivotally on the base and has a latch tab. The latch has a locking tab selectively engaging the latch tab. The cushion is mounted in the recess and has multiple springs and a CPU backplate. The springs are mounted in the recess. The CPU backplate is mounted on the springs and has multiple slots corresponding to the contacts. The CPU backplate cooperates with the springs during installation of a CPU to oppose a force pushing the CPU down in the CPU socket so the contacts will not be damaged.