With External, Contact Enhancing Clamp Patents (Class 439/73)
  • Patent number: 7699620
    Abstract: A clip comprises two pieces of load plates. Each load plate has a pressing portion extending downwardly in a middle position thereof and two retention portions at two ends thereof, the two pieces of load plates across dispose when the load plates are secured.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: April 20, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Nan-Hung Lin, Fu-Pin Hsieh
  • Patent number: 7699637
    Abstract: An LGA connector includes an insulative housing accommodating a plurality of terminals, a stiffener disposed around the insulative housing and a cover attached to the stiffener. The stiffener includes a front end, an opposite rear end, and two substantially vertical sidewalls connecting the front and rear ends. The cover is pivotally mounted to the rear end of the stiffener. The cover includes a pair of lateral sides having blocking walls being bent downwardly and distant to the sidewalls of the stiffener. One of the sidewall of the stiffener and the blocking wall of the cover has a self-aligning portion extending towards the other for leading the blocking wall to prevent the cover from inclining when the cover is rotated from an open position to a close position. Thus, the cover is shielded on the insulative housing safely without interfering with the insulative housing.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: April 20, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 7690926
    Abstract: An electrical connector assembly comprises a stiffener including a base with a first portion and a second portion, insulative housing, a load plate and a lever. An embossed portion is formed on the base and has substantial distance to a first end of the first portion. An insulative housing is disposed between the first portion and the second portion. A load plate is pivotally mounted on the second portion of the stiffener. A lever is pivotally assembled to the first portion of the stiffener to lock the load plate and includes a retaining portion adjacent to the embossed portion to abut against the lever when it is rotated.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: April 6, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Chi Yeh, Ke-Hao Chen
  • Patent number: 7692281
    Abstract: A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: April 6, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Matthew Richard McAlonis, Justin Shane McClellan, James Lee Fedder
  • Patent number: 7690938
    Abstract: An electrical connector assembly (100) includes a housing (10), a number of signal terminals loaded in the housing (10) and a stiffener (11) disposed around the housing (10), a metal clip (13) and a lever (12) attached to two opposite sides of the stiffener (11), wherein a securing plate (15) is disposed between the metal clip (13) and the chip module (14), and the securing plate (15) is mounted above an upper surface of the chip module (14).
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: April 6, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hao-Yun Ma, Shih-Wei Hsiao
  • Patent number: 7686636
    Abstract: An electrical connector includes a frame (2) defining a substantially rectangular configuration and header and rear portions (22), a cover (3) moveably disposed on the frame and including a supporting surface (31) with a plurality of holes (311) defined therein, a lever (4) having a cam portion (42) disposed on the rear portion of the frame to drive the cover to move from a first position to a second position, a base (1) disposed within the frame and under the cover and an engaging member (6) retained in one side of the frame. The engaging member defines an engaging portion (63) at one end thereof which can engage with the lever when the lever arrives at a vertical position relative to the base.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: March 30, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chun-Fu Lin
  • Publication number: 20100062623
    Abstract: An IC socket comprises an insulative housing adapted to accommodate an IC package and a pressing device pivotably attached to the insulative housing. The insulative housing defines some first pivoting holes at two opposite ends thereof and some second pivoting holes distant with the first pivoting holes. A pair of first shafts are assembled in the first pivoting hole of the insulative housing to pivotally latch the pressing device on the insulative housing and are movable in a vertical direction, so that the pressing device is floatable and can engage with different packages of different thickness. Two second shafts are assembled in the second pivoting holes. The IC socket further includes a plurality of spring members linking the first shafts and the second shafts to make the pressing device downwardly in a vertical direction.
    Type: Application
    Filed: August 28, 2009
    Publication date: March 11, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MING-YUE CHEN, HSIU-YUAN HSU
  • Publication number: 20100055938
    Abstract: An electrical connector assembly for establishing electrical connection between an Integrated Package (IC) and a Printed Circuit Board (PCB) is provided. The electrical connector assembly comprises an insulative housing, a plurality of contacts received in the insulative housing, a PCB adapted to have the insulative housing mounted thereon and a metal reinforcement element disposed on a lower surface of the housing and soldered to the PCB. By way abovementioned, a back plate may be canceled and space under the PCB is saved under a condition that steady mechanical connection between the PCB and the housing is achieved.
    Type: Application
    Filed: August 28, 2009
    Publication date: March 4, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHUO-HSIU HSU, NAN-HUNG LIN
  • Publication number: 20100055937
    Abstract: An electrical connector assembly (100) includes an insulative housing (1), a number of contacts (7) received in the insulative housing (1), a loading arrangement (3) covered the insulative housing (1), a pressing member (2) pressing the loading arrangement (3) and a fix member (4) pressing the pressing member (2) to securely locate the pressing member (2) on the insulative housing (1). The loading arrangement (3) defines a body plate (31) and a tab (32) extending from the body plate (31). The pressing member (2) defines a pressing portion (211) for pressing the tab (32) of the loading arrangement (3) and a stop portion (212) located on the insulative housing (1).
    Type: Application
    Filed: August 26, 2009
    Publication date: March 4, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Hao-Yun Ma
  • Publication number: 20100055939
    Abstract: A socket, adapted for electrically connecting an IC package to a printed circuit board, comprises an insulative housing accommodating a plurality of contacts and a cover pivotally assembled on an end of the insulative housing. The insulative housing has two lateral sides and a base portion disposed between the lateral sides, and each lateral side is formed with two incepting portions on two opposite ends thereof. The cover has two fixing portions extending downwardly from two sides thereof and corresponding to the incepting portions of the insulative housing. When the cover rotates to a close position, the fixing portion of the cover directly latches the incepting portion of the insulative housing to prevent the cover from tilting.
    Type: Application
    Filed: August 28, 2009
    Publication date: March 4, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SHUO-HSIU HSU
  • Patent number: 7666002
    Abstract: An electrical connector comprises an insulative housing (1) comprising a bottom wall (11) and a locking member (131) extending downwardly from the bottom wall (11), a plurality of contacts (4) received in the insulative housing (1) and a fastening device (3) locked with the insulative housing (1) for fastening the electronic package (2) on the insulative housing (1). Thus even if exert an upwardly force on the electronic package (2), the electronic package (2) can also securely located on the insulative housing (1).
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: February 23, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Nan-Hung Lin, Fang-Chu Liao
  • Patent number: 7666022
    Abstract: An electrical connector is for electrically connecting an electronic package with a circuit substrate. The connector includes a housing having a plurality of conductive terminals, a fastening device including a load plate for pressing the electronic package and a retaining member for securing the load plate. The load plate defines a first edge, a second edge opposite to the first edge, a third edge pivoted to the fastening device and a fourth edge adjacent to the first edge and the second edge. The four edges jointly define an opening in the middle thereof with the first and second edges each having a pressing portion. Corners of the opening near the third edge extend upwardly. During the rotation of the load plate, the pressing portions will abut against the electronic package prior to the corners near the third edge, and thereby prevent the corners from abutting against the electronic package.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: February 23, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hung-Yang Yeh, Cheng-Chi Yeh
  • Patent number: 7666029
    Abstract: A burn-in socket for testing an integral circuit package includes a base defining a cavity, an adapter received in the cavity of the base, an alignment plate secured to the adapter, and a cover movable mounted to the base. The alignment plate is detachable assembled to the adapter so as to the burn-in socket can apply to different IC package when the alignment plate is replaced with another.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: February 23, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chun-Fu Lin
  • Publication number: 20100041254
    Abstract: A socket adapted for interconnecting an IC package (3), such as TSOP (Thin Small Outline Package), and a circuit board, includes a socket body (1), a plurality of contacts (2) received in the socket body, and an operating member (5) movable mounted on the socket body. Each contact includes a base portion (21) retained into the slot of the socket body and a first and a second contact beams (24, 25), each extending upwardly from an upper edge of the base portion. When a force is applied on the operating member, both of the first and the second contact beams cooperated with the operating member and moving away from its original position.
    Type: Application
    Filed: August 18, 2009
    Publication date: February 18, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hsiu-Yuan Hsu, Wei-Chih Lin
  • Publication number: 20100035455
    Abstract: A socket connector (1) for electrically connecting a Central Processing Unit (CPU) with a Printed Circuit Board (PCB), includes a base (10), a cover (20) and a shaft (30) attached to the cover and pivotally driving the cover to move on the base. The base has a plurality of conductive contacts received therein and defines a plurality of apertures (104) in the middle thereof. The cover forms a plurality of pillars (208) extending through the apertures and forward a lower surface of the base. The pillars are moveable in the apertures along with the cover.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 11, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: KUN TANG, JIE-FENG ZHANG, WEN HE
  • Publication number: 20100035447
    Abstract: A burn-in socket, for electrically connecting an IC package to a print circuit board, includes a base, a lid assembled upon the base and being movable up and down relative to the base and a latch pivotally linking to the base by a first shaft thereof. The latch defines a through hole which receives a second shaft pivotally linking to the lid. When being brought by the lid, the second shaft moves up and down in the through hole and drives the latch to rotate.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 11, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: KE-HAO CHEN, WEN-YI HSIEH
  • Patent number: 7658633
    Abstract: A socket adapted for electrically connecting an IC package and a PCB, comprising: a body mounted on the PCB for electrically connecting the IC package, two bolts mounted on the PCB and beside the body and a clip for retaining the IC package in the body. The bolt has a header portion on the top with biggest size, a middle portion and a screw portion engaging with the PCB. The clip has two attaching portions, each defining a hatch at a free end thereof, the clip links with the bolt by inserting the attaching portion toward the bolt to make the middle portion be received in the hatch and the header portion be upon the hatch to prevent the attaching portion from upward movement.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: February 9, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Albert Harvey Terhune, IV, Darrell Wertz, David Gregory Howell, Ming-Lun Szu
  • Patent number: 7651340
    Abstract: An improved IC chip actuator cover assembly for an IC socket includes a pedestal assembly spring-mounted to the bottom of a carrier housing and side leaf springs or other similar force transferring means on the pedestal assembly which transmit a z-axis force to the corner regions of the pedestal assembly for advancing the pedestal assembly in the z-axis direction against an IC chip in the IC socket. The compliance of the leaf springs maintains a constant and precise actuating force on the IC chip when the IC chip is contacted by the pusher end portion or portions of the pedestal assembly. In a preferred aspect of the invention, the front, back, and sides of the carrier housing define a central cavity region above the pedestal assembly for permitting air flow through the carrier housing to improve the heat dissipation capability of the cover assembly.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: January 26, 2010
    Assignee: Essai, Inc.
    Inventors: Nasser Barabi, Oksana Kryachek, Chee-Wah Ho
  • Publication number: 20100009558
    Abstract: An electrical connector (1) for receiving an IC package includes a socket body (2) with a plurality of contacts (4) therein. A cover (3) is pivotally mounted with respect to the socket body (2) and defines an inner side close to the socket body (2) and an outer side opposite to the socket body (2). A heat sink (5) is provided to be mounted with the cover (3) by a plurality of fasteners (6). The fasteners (6) are inserted into the cover (3) and the heat sink (6) from the inner side of the cover (3).
    Type: Application
    Filed: July 14, 2009
    Publication date: January 14, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Wei-Chih Lin, Wen-Yi Hsieh
  • Publication number: 20100003838
    Abstract: A burn-in socket includes a base, a sliding plate mounted to the base and having a number of pin holes, a number of contacts secured to the base and an actuator mounted on the base. The contacts each comprise a base portion and a pair of arms received in the pin holes of the sliding plate. The actuator includes a frame and a number of actuating portion for driving the sliding plate to move in a transversal direction. The actuating portion has a protrusion at a top end thereof and the protrusion makes the sliding plate not only open one of the pair of arms, but also push a solder ball received in the pair of arms away from the other one of the pair of arms.
    Type: Application
    Filed: July 1, 2009
    Publication date: January 7, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JIA-JIA CAI, QUAN WANG, ZHEN-QI YANG, FU-JIN PENG
  • Publication number: 20090325404
    Abstract: An electrical connector includes a socket body, a retention frame adjacent to the socket body, and a load plate attached to the retention frame and capable of rotating toward or away from the socket from an open position to a close position. A number of contacts are attached to the socket body and each has a base section, a retention section extending upwardly from the base section, a contact section bending from the retention section, and a tail section extending downwardly from the base section. The tail section includes a stick section and a reinforcement section bending from the stick section for increasing the rigidity of the tail section.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 31, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: NAN-HUNG LIN, CHENG-CHI YEH
  • Publication number: 20090325403
    Abstract: A socket, mounted on a printed circuit board for electrically connecting an IC package, comprises an insulative housing receiving a plurality of contacts, a linking member and a cover. The insulative housing and the linking member are mounted on the printed circuit board, and the linking member is located beside of the insulative housing. The cover is formed with a first end pivotally assembled to the linking member and a second end opposite to the first end. The second end is provided with a tongue portion to be retained to the printed circuit board by a screw and a projecting piece extending from a side of the tongue portion to be handled by operator to lift and open the cover.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 31, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHENG-CHI YEH
  • Patent number: 7639026
    Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: December 29, 2009
    Assignee: Johnstech International Corporation
    Inventors: Dennis B. Shell, Mathew L. Gilk, Jose E. Lopez
  • Patent number: 7628651
    Abstract: An electrical connector (100) mounted on a printed circuit board (1) includes a housing unit (2), an outer shield (4) enclosing the housing unit, and a connecting assembly (5) connecting the outer shield to the printed circuit board. The connecting assembly has a supporting member (51), a conductive member (50) extending through the supporting member and a washer (52). The supporting member has a head (501) and a body (502) surrounded by the supporting member (51). The washer locks with the body and resists against an upper surface of the printed circuit board for grounding.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: December 8, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Patent number: 7618277
    Abstract: A cover member 34 is moved upward when a semiconductor device 26 disposed in a positioning member 44 is held by an absorption pad 24 to pinch an electrode portion 26a of the semiconductor device 26 with movable contact portions 46M and 46F of a contact terminal 46ai.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: November 17, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Masaru Sato
  • Patent number: 7616973
    Abstract: A portable audio device having reduced sensitivity to RF interference over a predetermined frequency range from an adjacent mobile wireless communications device may include a portable housing, a battery carried thereby, a recharging power input connected to the battery, a digital signal input, and an audio analog signal output. A digital-to-analog converter (DAC) may be carried by the portable housing and powered by the battery for converting a selected digital audio file from a memory into an analog audio signal. An audio analog amplifier may be connected between the DAC and the audio analog signal output. A first RF filter(s) may be connected to the recharging power input, and a second RF filter(s) may be connected to the audio analog signal output, both for reducing RF interference over the predetermined frequency range from the adjacent mobile wireless communications device.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: November 10, 2009
    Assignee: Research In Motion Limited
    Inventors: Lizhong Zhu, Michael Corrigan, George Mankaruse
  • Publication number: 20090275220
    Abstract: Disclosed herein is a test and burn-in socket for integrated circuits. The socket includes a socket body (37). A lead guide (36) is provided under the socket body. A slide (35) is mounted to the socket body to move horizontally. A plurality of slide springs (39) is elastically supported between the slide and the socket body, thus allowing the slide to smoothly restore an original position thereof. A contact guide (31) is provided above the slide to guide positions of upper contact terminals of contacts. An IC guide (30) is provided above the contact guide to guide a position of an IC. A cover (21) is provided to move vertically from the socket body (37). A latch (29) presses the IC. The socket also includes the contacts (33).
    Type: Application
    Filed: December 19, 2005
    Publication date: November 5, 2009
    Inventor: Dong Weon Hwang
  • Patent number: 7601009
    Abstract: One embodiment of the present invention is a socket useful to contact an electronic device, the socket including: (a) one or more contactor holder plates including one or more first through holes having a first hole cross sectional area, and one or more second through holes having a second hole cross sectional area; (b) one or more first contactors having a body with a first body cross sectional area disposed in the first through holes; (c) one or more second contactors having a body with a second body cross sectional area disposed in the second through holes; and (d) a heat sink in thermal contact with one or more of the one or more contactor holder plates; wherein a first ratio of the first hole cross sectional area to the first body cross sectional area is different from a second ratio of the second hole cross sectional area to the second body cross sectional area.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: October 13, 2009
    Assignee: Centipede Systems, Inc.
    Inventor: Thomas H. Di Stefano
  • Patent number: 7591065
    Abstract: An assembly for a semiconductor package comprises an electrical connector and a tool located upon the electrical connector. The electrical connector has an insulating housing and a plurality of terminals adapted for electrically connecting with the semiconductor package. The tool is formed with a body having a through hole, and a funnelform casing formed at a bottom end of the through hole for aligning and guiding the semiconductor package into the electrical connector.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: September 22, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Ming-Yue Chen
  • Publication number: 20090233464
    Abstract: An electrical connector (1) mounted to a printed circuit board (7) for receiving an IC package includes a substantially rectangular insulative housing (2) mounted to the printed circuit board (7), a plurality of contacts (3) received in the insulative housing (2), a retention member (5) mounted to the printed circuit board (7) by a pair of fasteners (6) and separated from the insulative housing (2), and a load plate (4) pivotally mounted to the retention member (5) and capable of moving between a closed position and an open position. The load plate (4) has at least one section able to engage with the fasteners (6) so that the load plate (4) is constrained when rotating relative to the retention member (5).
    Type: Application
    Filed: March 17, 2009
    Publication date: September 17, 2009
    Inventor: Cheng-Chi Yeh
  • Patent number: 7588442
    Abstract: An LGA connector (100) comprises an insulative housing (20) defining a plurality of side surfaces (21), a stiffener (30) surrounding the insulative housing (20) and comprising a bottom plate (31) and a plurality of sidewalls (33) extending upwardly from the bottom plate (31), the bottom plate (31) defining a window (313) for accommodating the insulative housing (20), a clip (40) pivotally engaged to one end of the stiffener (30) and comprising a main plate (41) and a pair of side plates (411) extending from the two opposite sides of the main plate (41), and a lever (50) engaged to the other end of the stiffener (30) for fastening the clip (40). Each side surface (21) and corresponding sidewall (33) define a gap therebetween for accommodating the side plate (411) and the bottom plate (31) defines a pair of slots (314) connected with the window (313).
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: September 15, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hao-Yun Ma
  • Patent number: 7586280
    Abstract: A control module for controlling a rotational closure system of a vehicle. The control module may include a printed circuit board having an electronic circuit disposed thereon. The electronic circuit may be used to control a rotational closure system of the vehicle. A header may be connected to the printed circuit board. The header may include a top side and a bottom side having a relative, non-zero degree angle formed therebetween. Pins may extend from the bottom of the header to form an electrical connection with the electronic circuit on the printed circuit board. An angle sensor may be positioned on the top side of the header and be electrically connected to the pins of the header to communicate with the electronic circuit. The angle sensor may generate an angle signal for the electronic circuit to use in positioning the rotational closure system.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: September 8, 2009
    Assignee: Flextronics Automotive Inc.
    Inventors: Gary Warren, Steven Steane, Reginald Grills, Thomas Frommer, Darren Van Roon
  • Patent number: 7572129
    Abstract: An electrical connector assembly (100) comprises an electrical connector for connecting an electronic package with a circuit substrate (4) and including an stiffener (1) defining a through hole (121) in a periphery, a fastening device (3) for fixing the electrical connector to the circuit substrate (4) via the corresponding through hole (121), a hollow restricting device (2) defining a plurality of protruding portions (24) interferencing with the fastening device (3) make the fastening device (3) securely located on the stiffener (1). At the same time, the restricting device (2) located between the stiffener (1) and the circuit substrate (4) function as a stand-off, make it more easy to assemble the stiffener (1) to the circuit substrate (4).
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: August 11, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chia-Wei Fan
  • Patent number: 7568918
    Abstract: A pressing surface portion of a presser member for selectively holding a semiconductor device is supported to be movable upward and downward in accordance with the up/down motion of a cover member to be close to or away from a alignment plate, as well as to be rotatable between a position directly above the alignment plate and a predetermined waiting position.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: August 4, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Kazumi Uratsuji, Hideki Sato
  • Patent number: 7565843
    Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque indicating assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque indicating assembly includes a threaded interface member and a torque indicator.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: July 28, 2009
    Assignee: Ironwood Electronics, Inc.
    Inventors: Ilavarasan Palaniappa, Mickiel P. Fedde, Ranjit Raghunath Patil, Meghann Fedde, Sultan Mahmood Faiz
  • Patent number: 7563144
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: July 21, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Patent number: 7556507
    Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: July 7, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Shuuji Kunioka, Katsumi Suzuki, Eiichi Murakoshi
  • Publication number: 20090170350
    Abstract: An electrical connector is for electrically connecting an electronic package with a circuit substrate. The connector includes a housing with a plurality of conductive terminals received therein, a fastening device for securing the electronic package. The fastening device includes a pressing member for pressing and securing the electronic package and a retaining member for securing the pressing member. At least one of the pressing member, the retaining member are produced from ferrite stainless steel material, and has a layer of high temperature resistant organic thin film thereon.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 2, 2009
    Inventors: Zhan-Jun Xu, Been-Yang Liaw, Fu-Jin Peng
  • Patent number: 7548422
    Abstract: A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insulating base, a top cover pivotally assembled to an edge of the bottom cover, a pressing board retained to the bottom cover, a heat sink module disposed on the bottom cover, and a fan mounted on the top cover.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: June 16, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wayne Hsieh
  • Patent number: 7540763
    Abstract: In an electrical connector adapted to be interposed between two connection objects to electrically connect the connection objects to each other, a flexible conductive film, mounted on a base member, includes a flexible insulating film having an outer surface and an inner surface. The flexible insulating film is folded near a rear edge of the base member into a generally U shape with the outer surface kept on the outside. The flexible conductive film has a film conductive pattern formed not only the outer surface of the flexible insulating film but also on the inner surface of the flexible insulating film.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: June 2, 2009
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Takuya Takahashi, Takeshi Takahashi
  • Patent number: 7540745
    Abstract: A burn-in socket for receiving an IC package (2) is provided. The burn-in socket includes a socket body with a plurality of contacts (7) disposed therein and a cover (6) rotatablely coupled to the socket body. The socket body defines a receiving space (500) for receiving the IC package (2) to be tested therein. The cover (6) has a pushing portion (611) capable of pressing on the IC package (2) toward the socket body when the cover (6) is turned to a closed position. At least one pair of pick-up arrangements (8) are provided around the pushing portion (611) for automatic pick-up of the IC package (2).
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: June 2, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wei-Chih Lin
  • Patent number: 7535713
    Abstract: An IC socket includes a socket body with a plurality of contacts disposed therein, a lid pivotably coupled to the socket body, a pushing member connected to the lid, and a heat sink fixed to said pushing member and being movable in a height direction relative to the lid. Because of being fixed to the pushing member, the heat sink can move with the pushing member and keep pressing on an IC chip in the case, for example, the changing of the thickness or position of the IC chip.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: May 19, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chun-Fu Lin
  • Patent number: 7534112
    Abstract: A socket connector (1) for electrically connecting an integrated circuit package to a printed circuit board comprises a stiffener (3) including a base plate, an opening defined in a approximate central area of the base plate, a plurality of grooves (30) defined in the base plate and not communicated with the opening, an socket body (2) assembled in the opening of the stiffener, a plurality of latches (22) extending from the socket body and received in the grooves of the base plate, the edge of the socket body distant to the edge of the opening of the stiffener, a plurality of terminals received in the socket body.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: May 19, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Zhi-Gang Xing, Qing-Feng Wang
  • Publication number: 20090111293
    Abstract: An apparatus for protecting an array of pins of an electronic device is provided. The apparatus includes a pin protector defining an array of holes therethrough, wherein each hole is configured to receive one of the pins. The apparatus also comprises a spring element configured to bias the pin protector away from the electronic device toward an end of each of the pins. The spring element is also configured to allow the pin protector to be retracted toward the electronic device to expose the pins for insertion into a socket or similar component.
    Type: Application
    Filed: October 29, 2007
    Publication date: April 30, 2009
    Inventors: Brandon Rubenstein, Roger Nattkemper, Eric Daniel
  • Publication number: 20090104796
    Abstract: An electrical connector (100) mounted on a printed circuit board (1) includes a housing unit (2), an outer shield (4) enclosing the housing unit, and a connecting assembly (5) connecting the outer shield to the printed circuit board. The connecting assembly has a supporting member (51), a conductive member (50) extending through the supporting member and a washer (52). The supporting member has a head (501) and a body (502) surrounded by the supporting member (51). The washer locks with the body and resists against an upper surface of the printed circuit board for grounding.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 23, 2009
    Inventor: Cheng-Chi Yeh
  • Patent number: 7517230
    Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: April 14, 2009
    Assignee: International Business Machines Corporation
    Inventors: John Lee Colbert, Mark Kenneth Hoffmeyer
  • Patent number: 7517229
    Abstract: A land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts. A lever is pivotally mounted on a second end of the insulative housing. The lever has a locking portion for locking the cover member in the closed position. A metallic reinforcing plate is positioned on a bottom surface of the housing. The metallic reinforcing plate extends between the first end and the second end of the insulative housing.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: April 14, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hao-Yun Ma
  • Publication number: 20090088008
    Abstract: Method and apparatus for installing a processor into electronic communication with a socket. The land grid array socket connector includes a socket housing secured to a circuit board and an array of upwardly extending pins for electronic communication with contact pads on the processor. The socket connector provides a carriage configured to receiving the processor through a lateral opening and support a perimeter edge of the processor. A mechanical linkage couples the carriage and the socket housing for substantially vertically translating the processor relative to the socket. A plurality of alignment features upwardly extends from the socket housing along the perimeter of the array of pins. Each of the alignment features has an inwardly-facing tapered surface for registering the edge of the processor and biasing the processor into a position where the array of contact pads are aligned with the array of pins as the processor is lowered.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 2, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Justin Potok Bandholz, Jonathan Randall Hinkle, Clifton Ehrich Kerr, John Frank Nations, Jr., William James Sommerville
  • Patent number: 7511375
    Abstract: In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: March 31, 2009
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Toshitaka Kuroda, Minoru Hisaishi
  • Patent number: 7510403
    Abstract: An electrical connector (1) for electrically connecting a chip module to a printed circuit board includes an insulative housing (2), a number of contacts received in the insulative housing, and a metal stiffener (3) partially surrounding the insulative housing. The insulative housing has an upper mounting surface, opposite lower connecting surface, and defines a number of contact-receiving passageways penetrating through said mounting and connecting surfaces thereof. The contacts are received in the contact-receiving passageways of the insulative housing adapted for electrically connecting with said chip module and the printed circuit board which respectively assembled to the mounting surface and the connecting surface of the insulative housing. The insulative housing has a portion located below the metal stiffener and confronted by the metal stiffener to prevent the deformation of the insulative housing.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: March 31, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hao-Yun Ma