Abstract: The invention relates to testing apparatus, such as the type known as a burn-in test socket for integrated circuit "chips", where the chips are essentially planar electronic devices having a plurality of chip leads or traces, laterally projecting therefrom, for electrical interconnection to complementary traces on a planar electronic device, such as a mother board, upon which the socket may be mounted, during testing. The socket comprises a frame member for mounting to the planar electronic device, where the frame member includes electrical means for engaging chip leads and applying electrical current thereto during testing. A second element of the socket is a two-piece, adjustable cover member consisting of first and second members floatably mounted together by plural compression springs, where the first and second members are axially movable relative to one another.

Abstract: An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21).

Abstract: A test probe including a flexible membrane (12) having an array of test probe contacts (14) capable of softly and gently contacting pads on a device under test is provided with a structure that effectively applies tension to the membrane while at the same time automatically leveling the membrane and removing distortions. A small pressure plate (30) is bonded to the inner surface of the membrane behind the test probe contacts. A pressure post (58) having a pointed or rounded end (64) is pressed against the pressure plate (30a) and makes pivotal contact with the plate. A spring (50) including an adjustment screw (56) that axially adjusts the compression of the spring, applies pressure through the pivot point to the pressure plate and thus to the membrane at its test probe contacts.

Abstract: A socket with a base 10 and a cover member 20 rotable with respect to the base 10 for use especially in a burn-in test of an electrical part 100 with a narrow pitch between leads 100a of the electrical part which has a holding cover 27 within the cover 20 which is rotable and pivotable and a plurality of thin insulating sheet members 15 positioned between a plurality of contacts 14 contained in the base 10 to insure reliable operation.

Abstract: An IC socket is provided in which an IC package is loaded on a socket base and a pressing cover is closed relative to the socket base to cause an IC pressing member mounted on the pressing cover to press leads on the IC package against contacts of the IC socket. The IC pressing member is provided with a plurality of unitary pressing pads, and the IC pressing member is shiftable to different pressing positions to utilize different unitary pressing pads.

Abstract: The contacts extending from the four sides of a flat-pack are releasably held against corresponding contacts extending from the sides of a socket for the flat-pack, by means of a cover comprising four arms pivotally mounted on the socket each near one of its four corners; by pivoting the arms downwardly against the tops of the flat-pack contacts, these contacts are pressed against, and held in positive contact with, the underlying socket contacts, and by pivoting the arms upwardly, the flat-pack can be released for removal and subsequent replacement. In addition, the cover is usefully mounted in position on the flat-pack even when the flat-pack is free of the socket, in which use it serves to protect the leads of the flat-pack in handling and during storage, for example.

Abstract: A socket for carrying an integrated circuit (IC) package. The socket, which is particularly useful for burn-in testing, includes a base 18 which houses a plurality of conductive contacts 46 and a movable top 108 which is shiftably connected to the base. A table 32 is connected to the base 18 and supports the IC package after insertion. The socket also includes a contact actuation plate 72 which is operably connected to the movable top 108 and is shiftable with the top. Latches 96 are shiftably connected to the base 18 and shift with the top 108 between latched and unlatched positions to secure the IC atop the table during testing. The actuator plate 72 may also include retractable location pins 82 to insure proper IC alignment in the socket.

Abstract: An IC socket has a plurality of contacts arranged so as to be subjected to pressing contact with terminal members of an IC package loaded on an IC loading portion. An elastic sheet, whose base material itself has compressibility and restorability, is disposed on the IC loading portion. The IC package loaded on the IC loading portion is supported on the elastic sheet.

Abstract: A connector for an integrated circuit (IC) chip to secure the IC chip during testing. The connector includes a unique latching system with a pivotal contact pad carried beneath a latch plate for self-adjusting alignment prior to engaging the leads of the IC chip. The latching system also includes an actuator and hook member pivotally connected to the latch plate in an over center movement fashion to increase the clamping force uniformly across IC leads.

Abstract: A socket for mounting an external integrated circuit on a printed circuit board is described. The socket includes a base having a bottom that can be mounted on the printed circuit board and a top that can receive the external integrated circuit. A plurality of connectors are located on the top of the base for coupling to the external integrated circuit. An in-socket embedded integrated circuit is embedded inside the base for providing a predetermined electronic function. The external integrated circuit and the in-socket embedded integrated circuit occupy substantially minimized space on the printed circuit board. The external integrated circuit can be a microprocessor and the in-socket integrated circuit can also include a microprocessor. The socket can be used for a computer system that allows the embedded microprocessor functioning when the external microprocessor is not coupled to the plurality of connectors of the base.

Abstract: A connector and contact for electrically interconnecting terminals of an upgraded circuit module directly to the leads of a pre-existing electronic component affixed to contact pads on a substrate through a separable connection, the connector having a frame upon which contacts are retainably positioned to form the interconnection between respective terminals and leads and a clamping mechanism for holding the upgraded circuit module, the connector, and the pre-existing electronic component together to maintain the electrical interconnection.

Abstract: A zero-insertion-force test socket is provided which utilizes a unique contact structure to reduce the overall force necessary to actuate the socket while retaining a high contact force. Two separate contact spring portions are used to isolate that portion of the contact which supplies contact pressure from that portion of the contact which allows travel of the contact away from the path of a device to be inserted into the socket.

Abstract: A hinged cover for an electrical socket having a top plate fixed relative the socket's housing and a cover plate pivotally attached to the top plate for removably retaining an electronic package in electrical engagement with contacts within the housing by compressing the electronic package against the contacts. The top plate is fixed relative to the housing of the socket and has integrally formed hinge members and first latch portions. The cover plate is pivotally movable between an open position and a closed position. The cover plate has an integrally formed complementary hinge member that is receivable about the hinge member and a second latch portion integrally formed with the cover plate and disconnectably engageable with the first latch portion to hold the cover in the closed position, thereby enabling the cover plate to exert the necessary force against the electronic package.

Abstract: For electrically connecting a pair of circuit members each provided with a plurality of contact pads, an electric connector comprises a unitary insulator having through holes at locations corresponding to the contact pads on the circuit members. Each of the through holes is provided with an internal radial projection and adapted for holding a contact member therein. The contact member is given in the form of a substantially W-shaped leaf spring which has a central palate portion for engagement with the radial projection in the through hole and a pair of free end terminals for contact with the contact pads on the circuit members. Use of the unitary insulator reduces investment on insulator mould and advanced coupling of the contact members to the insulator simplifies assembly operation.

Abstract: Apparatus for electrically interconnecting a lead of an integrated circuit device to a terminal spaced at a distance from the lead, such as on a printed circuit board. The apparatus is also useful for interconnecting two printed circuit boards. The apparatus includes a housing which has at least two flanges extending therefrom. The flanges are spaced a distance with an elastomeric element captured thereby and extending therebetween. A conductive contact is mounted on the elastomeric element and thus freely suspended for contact with terminals to be interconnected. A multiplicity of such contacts may be arranged in a suitable pattern for interconnecting specified integrated circuit devices with a printed circuit board. The contact shape can be generally disk-like to provide maximum wiping action and to facilitate air-tight contact between the terminal and interconnect apparatus.

Abstract: Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.

Abstract: A top-load test and burn-in socket, for use with IC devices having a plurality of contact terminals located in a predetermined pattern on a surface of said device, adapted for automation has a base supporting a plurality of contacts, a flexible film having a conductive wiring pattern formed thereon, and an elastomeric support having a size and shape to support said first set of conductive pads with the flexible film being folded about said elastomeric support. A movable cover and a pair of cams afford the retraction of springs which press the IC device against the film along opposite ends.

Abstract: A socket for use in mounting of an electrical part with lead members has a main base member with contact elements secured therein and a reciprocating cover member movable up and down with respect to said base member and including a cam member adapted to engage said contact elements so that as said cover member moves from a first original position to a second position and back again the contact elements likewise move from the first position to a second position and then back again to the first position. This movement allows the insertion of the electrical part into the socket and the contacting of the contact elements with the lead members.

Abstract: An improved contact for use in a high density chip carrier socket mounted on a circuit member which utilizes a cover which to wedge the leads of the chip carrier into electrical engagement with a respective contact. A tool receiving recess is incorporated into the contact so that the forces exerted on the socket while pressing the cover into place can be opposed, minimizing the forces exerted on the connection between the socket and the circuit member, typically a solder joint. Providing a tool, that operates from one side of the circuit member, in order to press the cover into place while engaging the contact recess to oppose the insertion related forces, which can also pull the cover from the contacts, without exerting significant forces on the connection, by engaging a lip in the cover while pressing on the carrier.

Abstract: A high density land grid array test socket comprises a leadless component contact socket assembly and a fixture. The contact socket assembly can be assembled with a variety of contact terminal end configurations and adapted for a desired mode of circuit board interface. In one embodiment, the test socket fixture includes a latching mechanism and a hinged lid assembly which allow quick and reliable manual installation of a device under test (DUT). An alternative embodiment includes snap latches, extension springs and alignment bushings which permit robotically controlled insertion and removal from the test socket. A bias clip or spring is incorporated in the test sockets for assuring proper alignment of the chip carrier with the contact socket assembly. The test socket creates reliable contacts with short electrical paths for low signal distortion and reduced chip loading.

Abstract: An IC socket which can be used commonly in IC packages whose outer leads are different from each other. A receiving base having a stepped bottom surface on which an IC package is placed is movably disposed in a first hole of a main body portion of the IC socket. A sliding member having a stepped top surface is brought into abutment with the stepped bottom surface of the receiving base and is movably disposed in a second hole of the main body portion. By sliding the sliding member, the height of the receiving base can be changed in steps in accordance with the stepped bottom surface, making it possible to change the height of the receiving base according to the shape of the outer leads of an IC package placed on the receiving base.

Abstract: An elastic pressure member is disposed between adjacent first elastic contacts arranged on a base member such that the elastic pressure member corresponds to second contacts arranged on a cover member. Parts of the plurality of leads arranged on an electric part are given contact pressure by elasticity of the first contacts, and the remainder of the leads are given contact pressure against the second contacts by elasticity of the elastic pressure member.

Abstract: A modular chip carrier socket of integral construction and method of making the same for electrically engaging the leads of an integrated chip carrier to the conductors on a substrate that structurally simulates the monolithic molded plastic construction of chip carrier specific sockets. Where the modular socket is designed for minimal lead time manufacture of nonstandard sockets with limited application specific components. Standard contact modules, supporting contacts therein, are permanently affixed to an application specific base plate to form a socket of modular construction prior to assembly of the socket upon the substrate. An embodiment of the invention has improved thermal characteristics over the molded sockets by using a base plate having the same coefficient of thermal expansion as the substrate.

Abstract: An integrated circuit package has multiple integrated circuits (ICs) mounted face down directly on one surface of a flexible circuit which is disposed in an opening of a rigid signal carrier, such as a pin grid array. The flexible circuit provides connections among the ICs, and also between the ICs and the signal carrier via wirebonds. The flexible circuit is attached to a rigid support ring that is bonded to the signal carrier adjacent to the opening. A thermally conductive lid covers the opening and contacts the backs of the ICs for heat removal. A rigid plate presses elastomeric pads against the other surface of the flexible circuit to maintain firm contact between the flexible circuit and the ICs and also between the ICs and the lid. The package may be hermetically sealed by attaching a cover to the support ring.

Abstract: The invention is embodied in a TAB frame with wide spaced area array contacts. The area array contacts serve to transform the narrow pitch contacts which connect to a chip mounted on the tab frame into wide spaced TAB edge contacts. These area array contacts allow for the convenient connection of the TAB frame to a printed circuit board and eliminate the need for fine line printed circuit board technology to support the TAB assembly.

Abstract: A chip carrier socket assembly (10) for electrical connecting leads (81) on a chip carrier (80) to a board on which the socket is seated, comprises a base (20) having a chip carrier receiving opening (22) in relation to peripheral walls (24) thereof. A plurality of lower contacts (70) are disposed in the base (20) for electrical connecting to the respective printed circuit board pads. The socket (10) further includes a cover (40) complementarily positioned on the base (20). The cover (40) has therethrough a central opening corresponding to the opening (22) of the base (20) and surrounded by circumferential walls (44). A corresponding plurality of upper contacts (60) are disposed in the cover (40) for mechanically pressing against and electrically connecting to the leads (81) of the chip carrier (80). The chip carrier (80) can be retained within the cover (40) by means of the upper contacts (60) thereof without regard to the base (20).

Abstract: An electrical socket includes a base having a generally central reception area which can receive an electronic device having leads extending to a peripheral region of the reception area. Multiple pressure members are fixed with respect to the base in a manner permitting movement between open and closed positions. Each of the pressure members has a pressure applying portion which is disposed in the peripheral region when the pressure member is in the closed position and is disposed outwardly of the peripheral region when the pressure member is in the open position. A circuit carrying member having conductive traces extends to within the peripheral region. Springs engage the pressure members when in the closed position and bias the pressure applying portions toward the traces, whereby the electrical leads can extend under the pressure applying portions and be urged by biasing forces against the traces.

Abstract: This invention relates to an IC socket, and more particularly an IC socket comprising a socket base plate having contacts on which the IC lead wires of the mounted IC are mounted and contacted, a pushing cover to be closed against the socket base plate through IC, and a pushing member for pressing the IC lead wires against the contacts in response to the closing operation of the pushing cover. Means for making a positive prevention of the displacements of the pushing positions of the IC lead wires by the pushing member is provided, that is, the pushing cover is rotatably supported on the socket base plate, the pushing member is supported on the socket base plate separate from the pushing cover and the pivoting shaft is supported in a longitudinal hole extending in a vertical direction and the pushing cover can be rotated and moved up and down vertically.

Abstract: Each contactor 5 is implanted in an insulating substrate 1 at an inclination angle, and its contacting portion 6 is diagonally moved along the inclined axis of movement to accumulate a contacting pressure with respect to an electric part terminal 4.

Abstract: An electrical connector with manual retainer and enhanced contact coupling is provided which comprises: an insulative mounting socket (30) including a base portion (35), slots (38) formed on the top face of the base portion, a wall (31) upstanding from the top of the base portion, and indents (33) formed on the bottom face (39) of the base portion; a retainer (10) including a main surface (11) sized to fit over the electrical component (20) received in the mounting socket, at least a first and a second stuffer (12) depending downward from the main surface and sized to fit against the leads (22) received in the slots; at least a first and a second latch mechanism each including at least one fulcrum (12) coupled to the stuffer, a lever bar (17) coupled to the fulcrum, at least one leg (14) depending downward from the lever bar, a latch protrusion (16) coupled to the leg and formed to extend on the outside of the wall such that the first latch protrusion physically contacts with the indents when the retainer is

Abstract: An IC card connector is provided for connecting an IC card having a terminal array to external equipment. The connector includes a base member having a plurality of electrically conductive contacts exposed on one side of the base member for engaging the terminal array of the IC card. A cover is hinged to the base member for movement toward and away from the one side of the base member. The cover has a receptacle for securing the IC card thereon for movement therewith, whereby closing of the cover onto the base member effects engagement of the IC card terminal array with the contacts on the cover.

Abstract: A device for mounting a flat package on a circuit board, comprises a rectangular base frame attached to the circuit board, a rectangular clamping frame and a cover frame for releasable locking engagement with the base frame for retaining the clamping frame in pressing engagement with a flat package mounted on the circuit board within the base frame. The clamping frame has recesses formed in respective corners and lands forming stop surfaces with elastic strip locating grooves formed on opposite sides thereof. Further elastic strip locating grooves and elastic strip anchoring grooves of constricted cross-sectional size, extend along a lower, clamping face and on the undersides of the lugs. The base frame has contact guiding wall surfaces extending downwardly and inwardly from respective corners thereof for retaining the flat package contacts in precise alignment with respect pads of the circuit board.

Abstract: An electric connection structure including a first circuit board having a terminal on one side thereof, a second circuit board having a terminal on one side thereof, flexible wiring means having a flexible base and a wiring portion thereon and electrically connecting the terminal of the first circuit board with the terminal of the second circuit board. The first and second circuit boards are in face-to-face contact with each other at terminal-free sides thereof; the flexible wiring means catches the first and second circuit boards so as to come into contact with their terminals at the wiring portion. A holding device removably clamps the first and second circuit boards together with the wiring portion of the flexible wiring means sandwiched by the holding device and the first and second circuit boards so as to press the wiring portion against the terminals of the first and second circuit boards.

Abstract: A non-invasive connector for testing an integrated circuit package has a connector housing with a substantially rectangular recess adapted to fit over the integrated circuit package. A plurality of teeth made of an insulative material extend laterally inward from the edges of the connector housing into the recess. The spacing between the teeth is predetermined to enable the teeth to be removably inserted between the integrated circuit leads as said connector housing is fitted in place. Test leads extend from the connector housing into the space between said teeth to make electrical contact with the integrated circuit leads. Electrical connections are provided through the connector housing between these test leads and external testing equipment by means of pins and a flexible circuit assembly. In addition, an elastomeric pad can be positioned between the connector housing and the test leads to exert an inward biasing force against the test leads to maintain electrical contact with the integrated circuit leads.

Abstract: A high density land grid array test socket comprises a leadless component contact socket assembly and a fixture. The contact socket assembly can be assembled with a variety of contact terminal end configurations and adapted for a desired mode of circuit board interface. In one embodiment, the test socket fixture includes a latching mechanism and a hinged lid assembly which allow quick and reliable manual installation of a device under test (DUT). An alternative embodiment includes snap latches, extension springs and alignment bushings which permit robotically controlled insertion and removal from the test socket. A bias clip or spring is incorporated in the test sockets for assuring proper alignment of the chip carrier with the contact socket assembly. The test socket creates reliable contacts with short electrical paths for low signal distortion and reduced chip loading.

Abstract: An electrical socket (10) for electrically connecting a leaded chip carrier (24) to a substrate is disclosed. The socket (10) includes a frame-shape base (12) with contacts (14) around the periphery of a central opening. Each contact (14) has a pair of outwardly extending, spaced apart arms (64,72) with one arm (72) having a recess (82) on an inside surface (80). The socket (10) also includes a cover (16) with locking members (18) around the periphery of a central opening. The locking members (18) include cantilever beams (90,92) which enter the space (74) between the contact arms (64,72) to press a lead (28) from the carrier (24) against one arm (64).

Abstract: An IC socket structure suitable for supporting a surface-mount type of IC (integrated circuit) package includes an IC socket having electrical contacts disposed in corresponding relation to pins of the IC package, the electrical contacts being elastically held, a printed board on which a peripheral circuit associated with the IC package is disposed, the printed board having lands disposed in locations corresponding to the respective pins of the IC package and electrically connected to the peripheral circuit, and a lid having a projection and covering the IC socket. The lid fixes the IC package in such a manner that the printed board and the pins of the IC package are pressed in contact with each other between the electrical contacts of the IC socket and the projection of the lid with the pins of the IC package maintained in electrical contact with the lands of the printed board.

Abstract: A radial lead type electronic component includes a couple of plate-type lead terminals projecting from a protective resin member in the same direction. These lead terminals are provided with inclined edges, which make the body portions gradually narrowed toward leg portions, in leg-side edges of body portions. Among inclined edges, inclinations .theta..sub.1 of the outer ones with respect to the leg-projecting direction are greater than inclinations .theta..sub.2 of the inner ones with respect to the same direction. Thus, the electronic component is relieved from stresses which are applied thereto upon insertion in a printed circuit board or a cut-and-clinch operation.

Abstract: An electrical socket (40) for burn-in/tests of PQFP devices (38) is disclosed. The socket (40) includes a base (42) on which a flexible etched circuit member (46) is placed and pressure members (44) pivotally attached to the base (42) with fingers (82) biased against contact pads (112) on conductive traces (98). The device (38) is located on the base (42) with leads (14) pressed against the contact pads (112) by the fingers (82) for electrical engagement therebetween.

Abstract: The invention is embodied in a demountable TAB assembly. By using two springs in series, the present invention is able to maintain reliable contact between the TAB frame and the printed circuit board even if the elastomeric spring relaxes. The present invention also incorporates a novel TAB frame using contacts formed into an area-array. This area-array concept eliminated the need for fine line printed circuit board technology to support the TAB assembly.

Abstract: A chip carrier socket assembly is provided for an integrated circuit chip having leads extending therefrom. The assembly includes an insulating housing and an insulating cover for positioning a chip carrier therebetween. A plurality of terminals are mounted on the housing for contacting the leads of the chip carrier. At least one pair of resilient complementarily interengaging latch arms, one latch arm on the housing and the other latch arm on the cover, are provided for securing the cover to the housing about the chip carrier. The latch arms are concealed within a cavity of the assembled housing and cover to prevent unintentional unlatching of the latch arms. An access opening is provided in the cover, communicating with the cavity, and through which the latch arms can be unlatched from outside the assembled housing and cover.

Abstract: A connector for an LGA IC device or a PGA IC device comprises an array of terminals in a housing each with a receptacle portion receiving a contact member mounted on the upper end of an axially extending compression spring for tilting movement into engagement with the receptacle wall at two, axially spaced locations by engagement with a pin or land depressing the spring. The contact member may be retained within the receptacle providing a socket for a pin of a PGA IC device or formed as a pin protruding from the free end of the receptacle for engagement with a land of an LGA IC device, in both cases providing a force assisting disconnection of the device.

Abstract: A novel wadded wire-plunger contact is provided which possesses excellent durability and desired functional characteristics in a large variety of applications such as the testing of IC chips.

Abstract: A connector for an integrated circuit (IC) to secure the IC during testing. The connector includes a unique latching system which includes an actuator and a hook which are pivotally connected in an over-center movement fashion to significantly increase the clamping force from the force applied to latch the actuator or a connected latch plate.

Abstract: An IC carrier has a base and a cover pivotably attached to the base through a shaft coupling. One end of the cover is provided with a plurality of shafts forming the shaft coupling and arranged at spaced intervals. The base is provided with a short recess portion shorter than the length of the shaft and a recess portion equal to or longer than the length of the shafts. The short and long recess portions are spaced on one end of the base at an equal interval to the spacing of the shafts. One end of the recess portions is provided with a shaft receiving portion for receiving ends of the corresponding shaft. The cover can be bent in the thickness direction and the shafts can be inclined in accordance with the bending of the cover.

Abstract: A socket comprises a housing member having a recess for receiving an electronic package therein, the housing member supporting a plurality of contact members for making contact with respective leads of the electronic package. A cover is pivotally mounted on the housing member for covering the electronic package received in the recess and for holding the electronic package therein under pressure. An adapter is provided for receipt in the housing member, the adapter having means for receiving and aligning the leads of the electronic package in a preferred pattern. The adapter has an opening therein arranged to communicate with the electronic package in assembly. The cover is made of aluminum or other good thermally conductive material and includes a recessed portion projecting inwardly through the adapter opening for making contact with the electronic package. As such, in assembly, heat generated by the electronic package is effectively released through the cover.

Abstract: An electronic package including a first circuitized substrate (e.g., printed circuit board) and a flexible circuitized substrate wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member and associated frame member, the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible substrate.

Abstract: A contact shutter mechanism in an IC socket has a socket body which has a plurality of contacts arranged in such a manner as to be able to contact with terminals of an IC package. A contact shutter member vertically movably disposed on the socket body is adapted to displace, when pushed down, the contacts backward against the resiliency thereof to remove contact between the terminals of the IC package and the contacts and to bring an IC loading portion into a released state. The shutter member has a contact pushing portion adapted to rendering a backward displacement force to the contacts. The contact pushing portion is formed with an inclined surface. The inclined surface is formed at a front-stage pushing portion with a gently inclined surface and at a rear-stage pushing portion with a steeply inclined surface.

Abstract: A contact pin aligned in an IC socket body can be made by stamping, the pin comprising a base, a connecting terminal, a first contacting piece provided at the corresponding position to said connecting terminal and having a slanted or vertical contacting face, a second contacting piece connected to said base through a spring part, and a contacting face to make a conductive contact with the other face. The second contacting face can instead be angular to make a linear contact.

Abstract: An electrical connector including a top clamp plate, two circuit bars, a resilient pressure pad, a bottom clamp plate, and means for fastening two flexible circuits and a third circuit device in mating electrical contact therein is disclosed. Each flexible circuit is mounted on and wrapped about a separate one of the circuit bars with an adhesive to provide a solidly backed sub-assembly. The top clamp plate is then fastened to the sub-assemblies with screws and retaining clips to create a single sub-assembly. The resilient pressure pad is mounted on the bottom clamp plate and the third circuit device is mounted thereon. Each circuit bar is then mounted over the third circuit device to make electrical contact between the third circuit device and each flexible circuit. The components are aligned using pins extending upward from the bottom clamp plate. The single sub-assembly is then fastened to the bottom clamp plate using screws to complete the assembly.