Abstract: The auxiliary apparatus comprises a base plate having a plurality of wiring portions on one face, a plurality of probes, and assembling means for assembling the probes in parallel to each other into the base plate. The assembling means presses the probes by a needle pressing portion extending in the arranging direction of the probes, bringing at least a part of deformed portions of the probes into contact with the wiring portions of the base plate, and each probe is pressed at the tip end of its needle front portion continued to one end of the deformed portion against an electrode portion of a device under inspection. Thereby, the probe is sandwiched between the base plate and the needle pressing portion to be maintained in that state and, in addition, scrapes off a film such as an oxide film existing in the electrode portion by the tip end of the needle front portion.

Abstract: An IC carrier includes a carrier base, a carrier cover and a wiring sheet, through which an IC and a socket contact each other, interposed between the carrier cover and the wiring sheet. The IC is retained by the carrier base such that the IC and the wiring sheet face each other. The IC carrier further includes a plurality of connecting pins projecting from an opposing surface of one of the carrier base and the carrier cover. The connecting pins are inserted into through-holes formed in the wiring sheet and then press fitted into connecting holes formed in the other of the carrier base and the cover, so that an area in the vicinity of a peripheral edge of the wiring sheet is sandwiched between the carrier base and the carrier cover.

Abstract: Disclosed is method for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During a production phase, the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements.

Abstract: A backing plate facilitates electrical probing of VLSI IC signals in an array of signal via pads on the back side of a printed circuit board and which correspond to an LGA of socket pads on the front side of the printed circuit board. The backing plate is constructed of electrically non conductive mechanically stiff material that already has drilled therein a hole for each signal via pad that might be probed. Polyamide is a suitable material for such a backing plate. Special symbols, legends and suitable grid identification axes can be silk screened onto the side of the backing plate that remains visible when installed. The drilled insulative backing plate can be equipped with captive threaded studs, if desired. Alternatively, it may simply have holes to receive fasteners, or have captive female threaded fasteners in lieu of holes.

Abstract: A fuse clip is described for securing a fuse to a base and making electrical contact with fuse terminals, comprising a U-shaped contact clip having a bight portion positioned between two opposing legs. The bight portion, which provides a surface adjacent to the base, is initially arched away from the base and has an aperture to receive a fastening member for securing the contact clip to the base. Upon tightening the fastening member and securing the clip to the base, the fastening member causes the bight portion to flatten and the legs to be drawn towards one another. Thus, upon fastening, the legs are drawn from an initially extended position to a more contracted position.

Abstract: A combination latch and contact for use in an electrical socket. This ombination latch and contact comprises major resilient generally vertical member having an upper outwardly and downwardly extending cams surface superimposed over an engagement recess, a minor diagonal contact member having a terminal curved contact position adjacent a restraining projection and a base member. The base member may be superimposed on a printed wiring board (PWB) and has a lower contact position with a plurality of contact points.

Abstract: An IC socket comprises a socket body including a plurality of contacts for interconnecting an IC and a wiring board. Each of the contacts comprises a contacting arm including an upper end contact portion for a lead of an IC to overlie and contact, and a lower end contact portion including a downwardly facing projection capable of abutting with a wiring portion of the wiring board, and a pressing element projecting backwardly of the contacting arm from an area in the vicinity of a connecting portion between the projection and the contacting arm. The projection forming the lower end contact portion is received in an upwardly and downwardly open through-hole formed in the socket body, so as to be subjected to abutment with the wiring portion.

Abstract: A land grid array package or a ball grid array package is electrically connected by an elastomeric type layer (containing alternating elements of conductive and non-conductive silicone) to a printed wire board or motherboard. A hold-down collar engages the peripheral edges of the package and snaps into holes in the board in such manner as to create pressure on the elastomeric layer, causing the layer to compress and create through-going electrical paths between exposed lands or conductive elements on the bottom of the package and exposed conductive elements on the wiring board. In one embodiment, solder balls adhere to the exposed conductive elements on the bottom of the package. In this embodiment the collar is initially in two pieces which are fitted together to engage both the top and bottom edges of the substrate.

Abstract: An IC pressing mechanism in an IC socket comprises a cover mounted in such a way to be able to move upwardly and downwardly with respect to a socket body, an IC pressing lever movable between a pressing position and a releasing position with respect to an IC package in accordance with upward and downward movement of the cover, such that, in the pressing position, the IC pressing lever urges an IC lead against a contact on a socket body, and a transmission lever for linking the cover and the IC pressing lever together. The transmission lever is connected at an upper end side thereof to the cover through a pin and rotatable inwardly and is outwardly about the pin. A lower end side of the transmission lever and an outer end side of the IC pressing lever are connected together through a pin.

Abstract: A socket (2, 52) for attachment to a printed substrate (10, 60), has a central aperture therethrough. A connective part (3, 53) including a flexible insulative sheet (8, 58) is provided to cover the aperture and act as an electrically connective interface between an electrical part (31, 81) mounted in the socket and the printed substrate. The flexible sheet (8, 58) has a first contact means (5, 55) associated with a first surface of the flexible sheet for electrically connecting with leads (32, 82) of the electrical part and a second contact means (6, 56) associated with a second surface of the flexible sheet for electrically connecting with the printed substrate. An electroconductive member (7, 57) provides electrical connection between the first and second contact means. Such a socket is especially useful for testing electrical parts with high clock speeds and a large number of leads.

Abstract: An IC socket in which a presser cover is closed with respect to a socket body, and a body or leads of an IC loaded in the socket body are pressed by an IC pressing member attached to the presser cover so as to be contacted under pressure with contacts of the socket body. The IC pressing member and the presser cover are attached together through a resiliently engageable resilient engagement mechanism.

Abstract: A socket with a main socket body 10 for use in a burn-in test of a bare chip 80 with a large number of contact connectors BP is provided with a positioning plate 42 in the top of the socket body 10. This positioning plate has a plurality of through holes 42c with contact members 48 slidingly contained therein. The through holes 42c and contact members 48 are aligned in one to one relationship to contact connections on the bare chip on one side of positioning plate 42 and a plurality of electroconductive film contacts 50 on the other side of the positioning plate 42. The film contacts are movably supported in the socket. Additionally, the film contacts 50 are electrically connected in a one-to-one relationship to socket contact 56 contained in the socket for providing electrical connection between bare chip 80 and socket 10.

Abstract: An IC socket includes a retaining cover adapted to be closed onto a socket main body, and an IC retaining member when the cover is closed, the IC retaining member presses against an IC which, in turn presses against IC contacts mounted on the socket main body. In addition, the IC socket includes a spring for idly supporting the IC retaining member on the retaining cover via a shaft, and moreover, biasing the IC retaining member in the IC retaining direction. The spring is borne by the shaft, and a part of the reactive force of the contacts arising at the time of retaining the IC with the IC retaining member is absorbed in the spring.

Abstract: A technique for applying uniform force to an IC chip module, urging the module into electrical contact with one face of a circuit board, is provided. One face of the board has contact pads, and the module has contact members on one surface corresponding to the contact pads. A first clamping member is provided having a pressure applying section and a reaction section mounted for movement toward and away from each other. A second clamping member having a pressure applying section is provided. The module is interposed between the pressure applying element of one of the clamping members and the substrate with the contact members on the module in electrical contact with the pads on the board. Several pins interconnect the reaction section of the first clamping member and the second clamping member to restrain movement of the reaction section of the first clamping member away from the second clamping member.

Abstract: A computer system having a capability to permit replacing a surface mount component. The component is biased with a spring toward an area array site on a substrate mounted in the computer system enclosure, along with a power supply, a bus system, and connectors for communicating with units external to the enclosure. The component and spring are positioned within a base adjacent the area array site and mechanically held down with a coupler. An interconnect structure for use therewith is provided.

Abstract: A non-intrusive socket may be used to mount an electrical component such as a surface mount device (SMD) to a board such as a fabricated motherboard. The socket includes a plurality of legs attachable to and detachable from the board. The socket also includes a body contacting with the electrical component and applying a force to the electrical component such that a plurality of electrical leads of the electrical component directly contact a plurality of electrical contact pads formed on the board.

Abstract: An electrical assembly and actuating mechanism for use therewith in which conductor pairs of two circuit members (e.g., printed circuit board and electronic module or semiconductor chip) are effectively electrically coupled. A rigid plate is fixedly positioned relative to a first of the circuit members (e.g., using upstanding pins), a pressure plate is movably oriented relative to the rigid member, and an actuator (e.g., screw) moves within the rigid member to cause the pressure plate to engage the second circuit. Such engagement in turn causes the conductors of the second circuit member to forcibly engage the first circuit member's conductors. Solder balls and dendritic members can also be used for providing enhanced coupling without harm to either structures. The resulting assembly affords a low profile when in final position, as highly desired in the design of microelectronic packaging structures which the present invention is particularly related to.

Abstract: An interconnect system for providing electrical connection to bond pads of a semiconductor device (14) includes a socket (18) having a plurality of conductors (16) and a carrier assembly (10) receivable in the socket (18) carrying a semiconductor device (14). The carrier assembly comprises a substrate assembly (12) and a latch assembly (22, 122, 222). The substrate assembly (12) includes a substrate (12a) having a complaint membrane (12f) and a plurality of contact bumps (12i) on a top surface of the complaint membrane (12c) for contacting bond pads on the semiconductor device (14). The force applying latch assembly (22, 122, 222) applies pressure in making a temporary electrical connection between contact bumps (12i) and the bond pads of semiconductor device (14). Latch assembly (222) comprises a latch (232) which cooperates with a spring (231) to place a force on a lid (224, 324, 424) which in turn places a force on the semiconductor device (14).

Abstract: A connector for a circuit component comprises a rigid support frame having a central aperture into which the component may be placed, and spring means around the support and having a plurality of spring projections which project beyond the support frame for co-operation with perforations in a planar substrate, such as a PCB. The projections may have hook-shaped lower ends which locate against the underside of the PCB. A layer of anisotropically electrically conductive material is located between the component and the substrate. The connector and component together with the conductive layer in position form a substrate-mountable device.

Abstract: Disclosed is an electrical socket for connecting a generally planar integrated circuit (IC) having a plurality of peripheral laterally extending contacts to a printed wiring board (PWB) comprising an insulative element interposed between the processing unit and the PWB and having means for retaining the IC; a plurality of latching means positioned in spaced peripheral relation adjacent the base element; a cover element superimposed over the base element and comprising an insulative housing being peripherally engageable by said latching means and a resilient control member positioned in concentric relation with said housing and having a plurality of legs each extending radially from said central section toward one of the latching means; and a plurality of contact means positioned in spaced peripheral relation adjacent the base element to abut the contacts on the processing unit and the PWB.

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract: A circuit board has mounted thereon a component package which is secured in place by a retaining device designed to maintain the component package in place and protect it from shock and vibration. The retaining device includes a shortened and strengthened retaining arm which in one position acts to snap on to the component package thereby holding it in place. In a second position the retaining device is removed and repositioned relative to the component package to be utilized in providing a leveraging action to detach the component package from the circuit board.

Abstract: An IC socket is provided for obtaining a contact pressure between a contact of a socket body and a lead of an IC package placed on the contact by pressing down an IC package body or the IC lead by an IC presser. The IC socket comprises a cover movably mounted on an upper portion of the socket body for upward and downward movement, and a pressing lever. The pressing lever being axially movably supported for inward end outward movement and pivotally supported for upward and downward movement with respect to the socket body. An external end of the pressing lever is linked to the cover such that the pressing lever can move upwardly and downwardly in response to the vertical upward and downward movement of the cover.

Abstract: A socket for mounting an electrical part such as an IC chip 60 in a freely detachable manner in which the electrical part 60 has a plurality of connective terminal parts of a prescribed pitch, has socket terminals 50 fixed in the socket 10 and a plurality of electroconductive parts 34 positioned on an insulating substrate 32. Each of the electroconductive parts 34 has first and second contact areas (34a, 34b) areas with the first contact area 34a having the same pitch as the pitch between the connective terminal parts BP. The insulating substrate 32 is held by a spring biased support member to provide for reliable contacting with the electrical part 60. The first contact area 34a of the electroconductive parts 34 provides electrical connection with one of the connective terminal parts BP of the electrical part 60 and the second contact part 34b provides electrical connection with one of the socket terminals 50 thereby providing reliable electrical connections between the electrical part 60 and the socket.

Abstract: A surface mount type IC socket comprises first and second cover retainers respectively disposed over a full length of opposing side surfaces of a socket body, and a seat piece disposed on each end of the first and second retainers and adapted to be arranged in an area in the vicinity of a lower part of each corner portion of the socket body. The seat piece is soldered to a conductive pattern on a surface of a wiring board at an area in the vicinity of the corner part of each corner portion. An engagement piece is disposed on each end of the first and second cover retainers and protrudes sidewardly from a side surface of each corner portion of the socket body. An engagement claw disposed on each corner portion of an IC presser cover formed of a conductive plate is engaged with a respective engagement element so that the cover is removably mounted on the socket body.

Abstract: In an information processing system having a portable terminal unit, such as a hand-held computer, driven by a rechargeable battery and a data communication adaptor for enabling communication between the portable terminal unit and a host computer of the system, the terminal unit and the data communication adaptor are designed to minimize the size thereof in the following five ways. First, a memory card holding mechanism for connecting the memory card of the portable terminal unit is provided between a swinging back lid and a recess of the back casing. Second, a normal interface and a high-speed interface are both provided in the portable terminal unit and the the data communication adaptor respectively. Third, an auxiliary connector for an optimal device to extend a function of the portable terminal unit is provided in the opening of the casing of the portable terminal unit movable in three dimensions mounted on a printed circuit board.

Abstract: A module having an apertured conductive trace and an apertured substrate is disclosed wherein a clamp protectively retains the trace on the substrate. The clamp has a base with a number of retention means, such as posts, projecting downwardly therefrom, each of the retention means having a retention section adapted for retaining engagement with a corresponding aperture in the conductive trace. Each of the retention means is further adapted for fastening engagement with a corresponding aperture in the substrate.

Abstract: A connector (1) for connecting a substrate (2) with an electronic circuit to a printed circuit board (4) comprises a a housing (5) of insulating material with a zone (6) for receiving said substrate. A main surface of the substrate is provided with contact pads or the like arranged in a given grid pattern with a predetermined pitch in column and row directions and the substrate has side edges located at a predetermined location with respect to the contact pads and the printed circuit board has contact pads (3) arranged in the grid pattern. Through-holes (7) are provided in the zone in the grid pattern and contact members (8) are provided in at least a part of the through-holes. Further the connector comprises positioning means for locating the substrate with respect to the housing in such a manner that the through-holes of the housing are aligned with the contact pads of the substrate.

Abstract: A substrate, an alignment plate, a heat sink, a back plate, a plurality of spacers, and a plurality of nuts are used to removably package one or more semiconductor package into a single module. The semiconductor dies are packaged with tape automated bonding (TAB) packages having land grid array (LGA) outer lead bumps. The substrate comprises a number of land patterns, a number of alignment cavities, and a number of join cavities. The alignment plate is fabricated with a number of alignment pins, a number of housing cavities, and a number of join cavities. The heat sink is fabricated with a number of stems and a number of join cavities. The back plate is fabricated with a number of extrusions having threaded ends. The spacers are fabricated with ranged openings at both ends, and each spacer is loaded with a number of spring washers. The nuts are fabricated with stepped heads.

Abstract: A test socket for integrated circuits includes a lid having a pressure pad which may move independently of the lid. The pressure pad is operated by a lever creating a large mechanical advantage and is provided to apply a large normal force to an integrated circuit in the test socket after the lid is closed to ensure good electrical contact between the integrated circuit device and the contact pins of the test socket.

Abstract: A substrate, an alignment plate, a heat sink, a back plate, a plurality of spacers, and a plurality of nuts are used to removably package one or more semiconductor package into a single module. The semiconductor dies are packaged with tape automated bonding (TAB) packages having land grid array (LGA) outer lead bumps. The substrate comprises a number of land patterns, a number of alignment cavities, and a number of join cavities. The alignment plate is fabricated with a number of alignment pins, a number of housing cavities, and a number of join cavities. The heat sink is fabricated with a number of stems and a number of join cavities. The back plate is fabricated with a number of extrusions having threaded ends. The spacers are fabricated with flanged openings at both ends, and each spacer is loaded with a number of spring washers. The nuts are fabricated with stepped heads.

Abstract: A structure for electrical connection of an electric part includes a contact probe retained in a through-hole formed in a base member such that the contact probe can be compressed into the through-hole in an axial direction of the through-hole and restored therefrom, and an intermediate contact member turnably supported by the base member through a cantilevered-arm interposed between the contact probe and a contactor of the electric part.

Abstract: Electrical connection between a measurement instrument and a semiconductor device having internal elements sealed in a non-conductive package, is established by way of leads which protrude out of the semiconductor device, when it is mounted on an antistatic socket apparatus. The socket apparatus has a bearer which is made of a non-conductive material that has a resistance selected to permit diffusion of static charges but which otherwise maintains adequate electrical insulation properties. Protrusions on a mounting surface of the socket support the package through contact surfaces which have a total area smaller than that of the mounting surface of the bearer and which reduce the static charge generating frictional contact between the package and the socket apparatus.

Abstract: An electronic package assembly that has a clip which attaches a heat sink to an electronic package and can be rotated to separate the package from a socket. The assembly includes a socket that is mounted to a printed circuit board and attached to a lower frame. The electronic package is attached to an upper frame that is pivotally connected to the lower frame. The package can be plugged and unplugged from the socket by rotating the upper frame relative to the lower frame. The clip has a first end with an aperture that is connected to a corresponding tab of the lower frame, and a second opposite end that has an aperture which is connected to a corresponding tab of the upper frame. The clip has a spring portion that extends across the heat sink and which presses the heat sink onto the package. The second clip end has a handle portion which allows the end user to pull the clip and rotate the upper frame away from the lower frame to detach the package from the socket.

Abstract: A contact pin having a thin wall construction that makes good electrical connection with an IC socket without insulation due to oxide film forming on the surface of the lead and which does not easily break due to plastic deformation. An IC socket has a feature to prevent an IC device position from deviating and deforming its leads which can automatically position the IC device for secure contact with contact pins of an IC frame having leads by limited positioning of the IC device on a stage.

Abstract: An appartus for testing bare semiconductor chips, especially for burn-in testing, includes a chip holding socket which comprises a substrate portion having at least one pair of opposing grooves formed along respective edges thereof. A pair of resilient elongate members are inserted into the grooves, and act to hold a respective bare chip in the holding socket. Preferably, a plurality of such holding sockets are mounted and electrically connected to a main test board, by which test signals are provided to test the bare semiconductor chips. A method for manufacturing such a testing apparatus is also disclosed herein.

Abstract: A connector for protecting an IC comprising a connector body, a closed plate, and an annular air-tight sealing material. An air-tight chamber is formed centrally of the annular air-tight sealing material by compressing the annular air-tight sealing material between the connector main body and the closed plate. The IC is received in the air-tight chamber so as to be electrically contacted with the connector body.

Abstract: In a press-in connection type structure for connecting an electric part having a plurality of contact elements with a connection medium having a plurality of contact elements under pressure, a press-in connection type structure for an electric part being characterized in that a coil spring is used as the pressing mechanism. The coil spring is disposed in a horizontal posture generally along a contacting area between the contact elements, a compressive force being applied along a pressure line on one side of the horizontal coil spring extending along an axis of the coil spring, so that a multi-point pressing force is generated, as a reaction thereof, at each contacting point between each turn of the coil spring along another pressure line on the other side of the coil spring and the connection medium (or electric part), thereby electrically connecting the contact elements under pressure.

Abstract: Apparatus for interconnecting an integrated circuit device, such as an infrared device, having a plurality of leads to a multilayer printed wiring board having a plurality of interconnects. The apparatus comprises a flexprint circuit having a plurality of interconnects that are configured to mate with the plurality of interconnects on the printed wiring board. The flexprint circuit has wrinkles formed along its surface that form a spring, and a plurality of printed circuit leads that are coupled between the leads of the integrated circuit device and the interconnects. Fastening members is provided for forcibly interconnecting the respective pluralities of interconnects. Respective ends of the flexprint circuit may be folded so that the interconnects contact the interconnects disposed on the printed wiring board.

Abstract: A testing contactor is provided for testing small-size semiconductor devices with large currents at high frequencies. Each semiconductor device to be tested has a plurality of leads. The testing contactor includes a plurality of first electric contact elements. A first Kelvin contact for a lead is formed of a first electric contact element in contact with the lead. The testing contactor further includes a plurality of second electric contact elements and a plurality of electric connection elements. An electric connection element in contact with the lead effectively extends the lead. A second Kelvin contact is formed of a second electric contact element and an electric connection element, the second electric contact element in contact with the electric connection element and the electric connection element in contact with the lead.

Abstract: Disclosed is an IC socket for use in testing IC packages, comprising a socket body having a plurality of Y-shaped contact pieces so arranged as to permit them to contact the lead conductors of an IC packages to be tested and a lid which is spring-biased so as to rise up, and is responsive to application of a push for closing and covering the top of the socket body while pushing the lead conductors of the IC package against the contact pieces. the V-shaped head of the contact piece body has the effect of increasing the flexibility with which it accommodates a selected lead conductor, thus assuring that good contact can be made between the lead conductor, thus assuring that good contacts can be made between the lead conductors of the IC package and the contact pieces of the IC socket even after the IC socket is used many times.

Abstract: An assembly for mounting a plurality of electrical components having terminals with leads onto a surface of a printed circuit board is disclosed. The assembly includes a substantially planar configured electrically insulated body member having top to bottom surfaces. Cavities extend through the body member and are dimensioned for receiving an electrical component and holding the component laterally by the walls defining the cavity. An elastomer element with conductive portions is positioned adjacent to the bottom surface of the cavities and receives the leads of electrical components. A lid is connected to the body member and movable from an open position for allowing insertion and removal of electrical components to and from the cavities, and a closed position where the lid covers the cavities.

Abstract: A contact pin device for IC sockets includes a socket body having a plurality of contact pins; a floating plate which is sustained above socket body, always urged upward, and has contact receivers formed therein for receiving the contact pins; and a pressing member which is mounted on the floating plate and is used to press down a BGA type IC package having a plurality of downward protruding spherical connecting terminals. The floating plate allows the spherical connecting terminals of the IC package to be brought into contact with the contact pins in the contact receivers thereof. Further, the top ends of the contact pins are provided with contact sections for receiving and electrically connecting lower spherical sections other than spherical tips of the spherical connecting terminals. The contact pin device for IC sockets has a relatively simple configuration, but assures secure electrical connection between the connecting terminals and the contact members.

Abstract: A reusable carrier (10) for temporarily holding an integrated circuit (12) during burn-in and electrical test includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A flexible substrate (19) is attached to the base (14) with a suitable adhesive. Alignment posts (20) have tapered surfaces (22) that engage corners (24) of the integrated circuit (12) to position the integrated circuit (12) precisely on upper surface (26) of the substrate (19). A spring-loaded latch (28) engages projection (30) in aperture (32) of the base (14) to hold the lid (16) closed over the integrated circuit (12). Electrically conductive traces (34) on the surface (26) have contact bumps which engage contact pads on the underside of the circuit (12) to connect the integrated circuit (12) to peripheral contact pads (38) around edges (40) of the substrate (19).

Abstract: A testing contactor is provided for testing small-size semiconductor devices with large currents at high frequencies. Each semiconductor device to be tested has a plurality of leads. The testing contactor includes a plurality of first electric contact elements. A first Kelvin contact for a lead is formed of a first electric contact element in contact with the lead. The testing contactor further includes a plurality of second electric contact elements and a plurality of electric connection elements. An electric connection element in contact with the lead effectively extends the lead. A second Kelvin contact is formed of a second electric contact element and an electric connection element, the second electric contact element in contact with the electric connection element and the electric connection element in contact with the lead.

Abstract: This disclosure relates to testing apparatus (10), preferably an LGA burn-in test socket, for an integrated chip (28). The apparatus (10), arranged for mounting on a planar electronic device (46), such as a printed circuit board, includes a frame member (12) for mounting to the planar electronic device (46), where the frame member (12) includes a central opening (22) extending between first and second surfaces, and dimensionally sized to receive the chip (28). Recesses (35) are provided for receiving an electronic interface member (18) mounting plural flexible electrical connectors (106), such as an elastomeric connector, as known in the art, for engaging the traces or pads of the chip to the planar device during testing. Further, plural recesses (40) extend from at least the first surface, where each recess includes a compression spring (41). Positioned over and for engagement with the frame member is a floatably mounted force applying member (14) having first and second parallel surfaces.

Abstract: A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier includes a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Abstract: Flexible contact terminals configured from printed strip circuits and usable with integrated circuit test fixtures. The termination circuits include printed conductive pathways formed on a flexible, multi-layered substrate. The conductive paths are three dimensionally tailored for impedance and resilience. Circuit processing includes steps to profile etch the conductive paths at the X, Y and Z-axis, especially end terminations. A support fixture contains the termination circuits to provide resilient electrical test terminations to circuit components supported to a resilient component support.

Abstract: A test clip, or test adapter, is provided for connecting leads of a tester to terminals on a packaged integrated circuit. Spacers on the test clip, which act to precisely separate the contact pins, are formed separately using a stamping process. Spacers may be formed having a thickness which can be controlled to approximately one mil. Each of the individual spacers is sandwiched between two contact pins to provide precise spacing of the contact pins. A bar is inserted through a hole in each of the spacers and contact pins to form a linear array of contact pins and spacers. Two or four (as appropriate) of the linear arrays of contact pins/spacers are then mounted on a test clip body sized for a specific integrated circuit package. Each of the spacers may include an L-shaped extension which is urged under the integrated circuit package when the test clip is pressed onto the package so as to firmly secure the test clip to the package.

Abstract: An interconnect system (8) for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) with retractable contact portions (14) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b), a plurality of contact bumps (24) containing oxide-penetrating particles on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21), a fence (30) attached to the top surface of the compliant membrane (20b) for positioning the semiconductor device (21) so that the bond pads on the semiconductor device (21) are aligned with the contact bumps (24). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20).