Abstract: A socket for testing integrated circuit units has contact elements and holding members movable on a body and has a cover reciprocable toward the body to move the contact elements and holding members in selected sequence for receiving an integrated circuit unit in a carrier on the body and away from the body to permit the holding members to engage the carrier and to permit the contact elements to engage terminals on the integrated circuit on the carrier for releasably connecting the terminals in a test circuit.

Abstract: An IC socket includes a socket body having a plurality of contacts arranged in such a manner as to contact terminal members of an IC package. A contact shutter member is vertically movably mounted on the socket body and adapted, when lowering, to push the contacts against their elastic property so that the contacts will be displaced backward and downward to remove the contact relation.

Abstract: A connector assembly particularly adapted for burn-in/testing of IC chips (10) held in a TAB film carrier (16, 18) includes a frame (32) mounted on a printed circuit board (26), a lid (44) pivoted to the frame (32), and a handle (54) pivoted to the lid (44). The frame (32) holds a connector housing assembly (40) which has contact members (42) engaged with contact pads (28) on the printed circuit board (26). The carrier (16, 18) is placed in the frame (32) where it is releasably retained so that contact pads (14) on the film (12) engage the contact members (42) of the contact housing assembly (40). Then handle (54) is utilized to provide a mechanical advantage so that the lid (44) generates appropriate contact forces to ensure electrical connections between the contact pads (14) on the film (12) and the contact pads (28) on the printed circuit board 26 ), and the handle (54) includes a latch mechanism (58, 62) for locking the lid (44) to the frame (32).

Abstract: The present invention sets forth a low height socket for an integrated circuit chip carrier of the "Tape Pak" type. The unique contact is arranged in the shape of a tuning fork. The chip carrier, having flexible leads projecting outwardly from its sides, is placed in the lower body of the socket with the leads resting on top of their respective tuning fork contacts. The cover, having locking members projecting downwardly and in alignment with the tuning fork contacts, is forced into engagement with the lower body so that the locking members deflect the leads downwardly, bending them about the contacting portion of the tuning fork shaped contacts. The two arms of each tuning fork then has the locking member and a respective lead wedged therebetween.

Abstract: Disclosed is a connector for integrated circuit packages. The connector generally includes a cover assembly having a metal framework for fixedly securing the integrated circuit package without projecting pin elements of the package from the backside of the cover assembly in order to prevent the pin element from the damage and a socket assembly for mounting contact elements to connect with the pin elements. The framework is hinged to the cover assembly at one of the side edges thereof. The cover assembly can be combined with the socket assembly by means of the first engage portion of the cover assembly and the second engage portion of the socket assembly at the side edge opposed to the hinged side edge. After combination the hinged side edge of the cover assembly can be pressed against the socket assembly so as to connect the pin elements with the corresponding contact elements from the side edge having the engage portion towards the hinged side edge of the socket assembly one by one.

Abstract: An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).

Abstract: A socket assembly for top-loading IC devices having a cam member, actuated by a vertically moving guide member, positioned for engaging the contact elements and retracting the contacting portions thereof to allow insertion or removal of the IC device in relationship to the socket assembly.

Abstract: Test and burn-in sockets with many mechanical contacts require increased support strength, and with the increase in the number of contacts it is beneficial that the contacts are inserted before assembly, the contacts in the support comb are supported to restrict movement of the contact other than in the path of movement of the IC device, and the registration and movement of the IC device is sufficient to obtain good electrical contact and maintain electrical contact during temperature cycling.

Abstract: A chip carrier socket (2, 102) has a latching chip (30, 130) which extends across a recess (10, 110) of the chip carrier socket (2, 102) to maintain a chip carrier (22, 122) positioned in the recess (10, 110). The latching chip (30, 130) is mounted to the chip carrier socket (2, 102) in a manner which allows the latching chip (30, 130) to move between an open and a closed position. The latching chip (30, 130) is configured to cooperate with the chip carrier socket (2, 102) such that the latching chip (30, 130) is prevented from being accidentally removed from the chip carrier socket (2, 102) during the operation thereof, thereby eliminating the possibility of the latching chip (30, 130) making electrical contact with other circuitry provided in the area. An overstress member (170) is provided on the latching clip (130) to insure that the latching chip will be reliable over many cycles.

Abstract: A carrier for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20') or formed leads (20), a cover (60), flexible material (66), such as an elastomer, disposed between the cover (60) and base (30) surfaces, and pressure is maintained across the cover (60) and base (30) by way of finger (44) on a clip (40) on the base (30) engaging latching edges (68) of cover (60). The leads (22) of the integrated circuit package (20, 20') are thereby secured in position by the elastomeric material (66) which forms itself partially around each of the leads in response to pressure applied across the base (30) and cover (60) as hereinabove described. The disclosed invention eliminates the need for separate grooves or nests in the base (30) of the carrier for each lead of the integrated circuit package.

Abstract: A method of and apparatus for connecting electronic components, uses the component pins for insertion in the end of insulated electrical wire. The pin and the electric conductor are held in galvanic contact by the insulation around the wire and a bracket is provided for holding wire ends in the correct configuration for receiving component leads.

Abstract: An electrical socket for TAB ICs. More particularly, the socket includes a flexible etched film having an array of traces thereon, a base on which the film is positioned to receive a TAB IC thereover and a cover having a pressure plate for biasing the IC against the film to provide an electrical connection between respective traces on the IC and on the film.

Abstract: Chip carrier sockets, for providing an electrical connection between a first electrical component and a second electrical component, have terminals provided therein, the terminals have contacting portions and retention portions provided thereon. The contacting portions are provided to electrically engage leads of a chip carrier with is positioned in a recess of the chip carrier socket. A spacer is provided between the contacting portions and the retention portions, such that the spacer has a greater width than the distance provided between the contacting portion and the retention portion, This spacing, in combination with a resilient member, insure that the spacer is resiliently forced against the contacting portion and the retention portion, thereby insuring that the first electrical component will be positioned and maintained in electrical engagement with the contact portion of the terminal.

Abstract: A socket for mounting IC chip package on a printed circuit board has an elongated socket body having a plurality of contact elements aligned along the length of the socket body for contact with corresponding one of leads extending laterally from the IC chip package. A cover frame is fitted over the socket body to press the IC chip leads against the corresponding contact elements for positive electrical connection therebetween. The socket body carries between the longitudinal ends thereof the contact elements and is engaged at the longitudinal ends with the cover frame. Each contact element is struck from a metal strip to include a base and an anchor leg extending from one end of the base to be bent into the socket body, the other end of the base extending laterally and being bifurcated to form a vertically spaced pair of a spring leg for contact with the corresponding one of the IC chip leads and a terminal leg for connection with a circuit on the printed board.

Abstract: A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.

Abstract: An environmentally sealed chip carrier housing for mounting on a printed circuit board. The housing is formed of a dielectric material and comprises a base and an upstanding circular side wall, one surface of which is threadably configured for receipt of a cover member. The base is further provided with plural slots for receiving a like plurality of elongated elastomeric compressive type connectors, and support means for receiving a chip carrier thereon. A cover member is provided for threadably engaging the housing. The cover member is characterized by a top having a peripheral wall thereabout, where the top has a uniformly convex configuration such that the center portion is thicker than the outer portions thereof.

Abstract: A socket for mounting an integrated circuit unit on a printed circuit board comprises a plurality of inserts of a platable electrically insulating material each having an opening and an exterior surface portion. The inserts are mounted in rows in a support body so the openings are accessible from one side of the body and the exterior surface portions are exposed at an opposite side of the body. Electrically conductive layers are provided on the inner surfaces of the insert openings, preferably by electroless plating techniques using the body as a plating mask, to extend to the exterior surface portions of the inserts to be soldered to circuit paths on the printed circuit board at prescribed circuit locations. Contacts are disposed in the insert openings in electrical engagement with the electrically conductive layers therein for resiliently and detachably electrically engaging terminals of integrated circuit units or the like inserted into the openings.

Abstract: A contact frame for an IC card reader including, in particular, guide means for guiding or positioning the card, together with contact elements for providing electrical connection with conducting pads on the IC card via which circuits are established to the apparatus including the IC card reader, the contact frame being characterized by the fact that it comprises an inner frame (7) of insulating material molded over the contact elements (4) for providing electrical connection to the IC card, and two extensions (17, 18) extending the substance of the inner frame (7) sideways towards the side edges of the card and beyond said edges, each of said two extensions carrying means (6, 19, 20) for defining the positions of two card-guiding slideways (21, 22).

Abstract: An IC socket has a socket body having an IC package accommodating space therein; an IC mounting table disposed in the IC package accommodating space and adapted to support an IC package thereon; and a plurality of contacts planted in a socket body portion at the periphery of the mounting table; the plurality of contacts each having a resilient contact piece, IC terminals of the IC package, when the IC package is supported on the mounting table, being able to contact with the resilient contact pieces of the contacts, wherein the IC package mounting table is formed with a plurality of contact positioning grooves for receiving the resilient contact pieces therein, so that the resilient contact pieces are regulated by a wall for defining the positioning grooves.

Abstract: This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.

Abstract: A test socket has movable contact elements blanked from sheet metal to provide each element with a mounting leg part, a contact part at an edge of the blanked sheet metal, and a resilient curved part between the leg and contact parts permitting the contact part to be moved into and out of engagement with terminals of an IC unit to be tested in the socket and has a plurality of projections formed in side-by-side relation to each other in the edge of the sheet metal at the contact part for improving the making and breaking of electrical connection to the IC unit terminal.

Abstract: An IC socket has an IC supporting means which can be moved between an upper and a lower positions with an IC mounted on it, a first spring means for energizing the IC supporting means so that the IC supporting means is pushed up to the upper position, a contact for contacting with a lead of the IC when the IC supporting means is moved to the lower position against the force of the first spring means, an IC vertical movement operating means which can be moved between the upper and lower positions and adapted to push down the IC supporting means against the first spring means, a second spring means for energizing the IC vertical movement operating means so as to push up the same to the upper position, and a lock means for retaining the IC supporting means to the lower position against the force of the first spring means by the vertical movement operation of the IC vertical movement operating means against the force of the second spring means or in accordance with the force of the second spring so that the IC is

Abstract: Four embodiments of a burn-in socket for gull wing configured semiconductor packages are disclosed where each of the embodiments includes latching means which a mechanical advantage assisting in the installation of the carrier and package. Two of the embodiments include four centered posts which include helical ramparts which contact directly on the upper surface of the carrier. A third embodiment is disclosed which includes a lid which rotates over the upper face of the carrier, where the cover includes a post having a helical rampart where the helical rampart contacts a shoulder of the socket which lowers the cover. The fourth embodiment discloses two overlapping doors where the outer door contacts the inner door thereby closing the inner door moving the carrier downward.

Abstract: The socket is foreseen for fastening and connecting an electronic component with lined-up conducting pins, whereby the free end of the pins is parallel to the main plane of the component, as it is the case for the SMD components. The socket comprises a carrier of insulating material and contact elements maintained in the carrier and positioned each with its first flexible end in the face of a pin for applying a determined contact pressure on that pin when the component is mounted in the socket. The second end of the contact element can be soldered to a conductor in a circuit. The socket comprises further a comb of insulating material with teeth gliding in a guidance of the carrier.

Abstract: A retaining plate (30) is provided to insure that leads (4) secured in a protective carrier (2) are maintained in electrical engagement with conductive areas of a substrate (18). The configuration of the retaining plate (30) also insures that as the retaining plate (30) is installed onto posts (12) without exerting harmful stresses to the substrate (18). Projections (48) and openings (40) cooperate with recesses (54) and posts (12) respectively, to provide a failsafe manner to provide the contact pressure required without damaging any part of the socket (10), protective handler (2), or retaining plate (30).

Abstract: An IC socket includes a socket body which has an IC package placing area and resilient contacts around the IC package placing area, a cover pivotally attached to the socket body, a lock member pivotally attached to either the socket body or the cover for locking/unlocking the cover relative to the socket body, and IC lead pressing means movably mounted on the cover. The IC lead pressing means is provided integrally with pads for pressing the IC leads against the resilient contacts and is adapted to effect self-adjustment of its own movement so that the pads come into uniform contact with the IC leads.

Abstract: The socket is foreseen for fastening and connecting an electronic component with lined-up conducting pins, whereby the free end of the pins is parallel to the main plane of the component, as it is the case for the SMD components. The socket comprises a carrier of insulating material and contact elements maintained in the carrier and positioned each with its first flexible end in the face of a pin for applying a determined contact pressure on that pin when the component is mounted in the socket. The second end of the contact element can be soldered to a conductor in a circuit. The socket comprises further a comb of insulating material with teeth gliding in a guidance of the carrier.