Abstract: A polishing apparatus applicable to a dry-in/dry-out polishing system is capable of increasing the capacity of processing substrates to be polished, e.g. semiconductor wafers, per unit of time and per unit area of installation. A polishing unit includes a turntable having a polishing surface, and at least two wafer carriers each adapted to hold a wafer and to press the wafer against the polishing surface. Each wafer carrier is supported by a pivot shaft and movable between a polishing position where the wafer is polished on the turntable and a transfer position for transferring the wafer. The at least two wafer carriers can be situated at the polishing position simultaneously and also alternately.

Abstract: A polishing apparatus for polishing a plate-like workpiece by way of a relative sliding motion between the plate-like workpiece and a polishing surface. The polishing apparatus comprises a carrier for holding the plate-like workpiece.

Abstract: Thin, planar substrates are carried on a substrate carrier (20) through a polishing operation. The substrate carrier (20) is injection molded or modified-injection molded from a plastic material, and includes one or more receptacles for receiving the substrates to be carried through the polishing process. A drive force transmission arrangement is also included in the substrate carrier (20) through which the carrier may be driven in the polishing process. The substrate carrier (20) is relatively non-abrasive and composed of melt processable engineering polymers or blends. Non-abrasive fillers or reinforcing material may also be included in the plastic.

Abstract: The abrasive machine is capable of preventing deformation and bad abrasion of an abrasive cloth, maintaining flatness of an abrasive face of an abrasive plate and improving abrading accuracy. The abrasive machine comprises the abrasive plate and a holding unit for holding a work piece. In the holding unit, an inner head has a first concave section. An outer head has a second concave section. A holding plate is provided in the first concave section. An elastic holding member forms a first chamber. An outer enclosing member is provided to the outer head. An inner enclosing member is provided between the outer enclosing member and the inner head. A pressing member presses the abrasive face of the abrasive plate and encloses the holding plate. An elastic ring member a second chamber. A pressurizing unit pressurizes the chambers so as to press the work piece and the pressing member onto the abrasive face.

Abstract: A description is given of an apparatus and a method for grinding a workpiece, in particular a shaft part. According to the method, the workpiece is clamped in place for the grinding working and its geometry is subsequently ground in such a way as to maintain its dimensions and shape. According to the invention, at least part of the surface of the workpiece is precision-worked at least partly at the same time as the grinding. The apparatus according to the invention has a work-spindle headstock and a tailstock for clamping the workpiece in place as well as a grinding unit with a grinding wheel for grinding the workpiece. The grinding unit and workpiece are arranged movably in relation to each other in a controlled manner. The apparatus according to the invention additionally has a precision-working unit, which can be moved according to the geometry of the workpiece in such a way that at least part of the surface of the workpiece is able to undergo precision working.

Abstract: A reinforced bladder for a chemical-mechanical planarization (CMP) polishing device includes an elastomer infused with a reinforcing material. The elastomer can be a rubber such as EPDM. The reinforcing material can be a chopped fiber such as aramid. Alternatively, the reinforcing material can be a sheet (such as a triaxial or hexaxial weave of aramid) embedded in and infused with the elastomer.

Abstract: An apparatus for manufacturing a semiconductor device includes a rotatable spindle, a head detachably connected to the spindle, and a clamp for clamping outer circumferential surfaces of the spindle and the head to one another so that the head may be driven by the spindle. The clamp has an annular clamping frame sized to encircle the outer circumferential surfaces of the spindle and the head, a projection disposed on one end of the clamping frame, a lever pivotally connected to the other end of the clamping frame, and a fastener pivotally connected to the lever and configured to hook over the projection. Once the fastener is hooked over the projection, the lever is pivoted to force the ends of the annular clamping frame together and thereby produce a clamping force that secures the spindle and head to one another. The clamp can be manipulated easily and with a simple motion to clamp the head to the spindle. Also, the parts of the clamp generate little mechanical friction.

Abstract: A polishing method for wafer, comprises the steps of; adhering a wafer to a wafer adhesion part of a holding plate through a wax, and rubbing the wafer with a polishing pad, wherein grooves are formed on the wafer adhesion part and extend to the outside of the wafer adhesion part.

Abstract: Apparatus and methods of polishing substrates are disclosed. A retaining ring for a polishing apparatus includes an inner surface exposed to contact a peripheral edge of a substrate to be polished against a polishing surface, a bottom surface exposed to contact the polishing surface while the substrate is being polished, and a wear marker indicative of a preselected amount of wear of the bottom surface. The inner surface, bottom surface and wear marker may form part of a retaining ring used in chemical mechanical polishing operations. In one method, one or more substrates may be polished against a polishing surface using the retaining ring, and at least a portion of the retainer may be replaced when the bottom surface has been worn away by the preselected amount indicated by the wear marker.

Abstract: The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support operatively coupled to the edge support, the back support having at least one surface for supporting a back side of the object during planarization. The surface for supporting the back side provides a substantially friction free interface between the surface and the back side of the object to allow the object to move across the surface of the back support. In some embodiments, an edge support is movably coupled to an edge of an object for supporting and positioning the object during planarization.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

Abstract: Devices and methods for releasably attaching substrate assemblies to carrier heads of planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. One aspect of the invention is directed toward a backing member for use in a carrier head to selectively couple a substrate assembly to the carrier head via a vacuum force before, during and after planarizing the substrate assembly. The backing member can include a body having a first section with a first surface configured to be received by the carrier head and a second section with a second surface configured to support a backside of the substrate assembly. The first and second sections of the body are preferably composed of flexible, incompressible materials. The backing member also includes a first vacuum passageway extending, through the body and a plurality of second vacuum passageways coupled to the first passageway.

Abstract: A chuck for optical components for fine grinding and/or polishing, has a plurality of supporting elements (9) of elastic material for the components and an arrangement for feeding or discharging air relative to the rear side of each supporting element. The chuck has a basic body (1) with a spindle shank (2) having a central bore (3) and a cover part (6) for accommodating the supporting elements. The basic body (1) is designed in a pot shape (5) with an encircling rim (4), and the cover part (6), provided with a flat base area, is put onto the rim (4) in an airtight manner. The cover top side (15) has cylindrical recesses (8) which lie symmetrically to the axis (17) of the spindle shank (2) and are designed for the insertion of the elastic supporting elements (9). Each of the recesses (8) is fluidly connected to the common pot space (5) of the basic body (1) via at least one bore (13).

Abstract: The present invention provides a polishing apparatus comprising a carrier head having a periphery, a first region, a carrier ring, and a second region. The carrier ring is coupled to the periphery. The carrier ring and carrier head are configured to cooperatively receive an object to be polished. The first region is associated with the carrier head and is capable of manifesting a polarity proximate the carrier ring. The second region is associated with the carrier ring and is capable of manifesting the polarity proximate the first region. The first and second regions have like polarities that create a repelling force between the carrier head and the carrier ring.

Abstract: The device according to the invention for the tailstock end centering and clamping of a rotational workpiece with a circular-cylindrical end comprises a housing with a shank for accommodation in a tailstock barrel, and a chucking pot with a collet located in the housing for rotation about the axis of rotation of the workpiece. In accordance with the invention the collet is closable by way of the axial advancing action of the tailstock, and the axial tailstock thrust effecting the closing and clamping of the collet is transmitted to the workpiece in such manner that it is applied to the center of the workpiece, and the latter is displaceable into the center without friction generating radial sliding of the collet.

Abstract: An apparatus and method are disclosed for a carrier that is able to create independently controllable pressure zones on the back surface of a wafer while the front surface of the wafer is being planarizing against an abrasive surface. The carrier has a central disk shaped recess surrounded by a plurality of concentric ring shaped recesses. The recesses are covered by a diaphragm thereby creating a central disk shaped plenum and a plurality of surrounding ring shaped plenums. A central disk shaped piston and a plurality of surrounding ring shaped pistons are suspended on the diaphragm so that a portion of each piston may move in and out of their corresponding plenum in the carrier. An independently controllable fluid communication path is placed in fluid communication with each plenum thereby allowing the pressure exerted on each piston to be independently controllable.

Abstract: An apparatus for rotating a semiconductor substrate is provided which comprises a substrate holder for carrying the substrate thereon, a rotor for directly or indirectly supporting the substrate holder, a magnetic floating mechanism for magnetically floating and supporting the rotor in a non-contact state, and magnetic rotating mechanism for magnetically rotating the rotor. The magnetic floating mechanism and magnetic rotating mechanism are formed as a single integral unit structure. The unit structure includes a first set of windings for generating a magnetic field to provide the rotor with a rotating force, and a second set of windings for generating a magnetic field to float and support the rotor at a predetermined position. The first and second sets of windings are disposed on a single yoke plate made of a magnetic material.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the cuter portion may be significantly less than the width of the middle portion. The carrier head may also includea flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.

Abstract: A wafer mounting plate for mounting a wafer in a chemical mechanical polishing process and a method for using the wafer mounting plate are disclosed. The novel mounting plate for a silicon wafer is designed to incorporate a concave mounting surface for contacting a wafer with a flexible membrane layer thereinbetween. The wafer mounting plate is further provided with a plurality of apertures therethrough for use as vacuum passageways for picking up a wafer through a perforated or breathable membrane layer. The concave surface of the wafer mounting plate that contacts the wafer substantially eliminates stress concentration problems imposed on the wafer by conventional wafer mounting plates. The present invention novel apparatus therefore not only eliminates the edge defect problem that is normally associated with the conventional mounting plates, but further solves the wafer breakage problem frequently caused by stress concentration imposed on the wafer by a bumper ring.

Abstract: A method and a grinding machine for centerless angular plunge grinding a workpiece are disclosed. The workpiece is rotatable about a first axis and has essentially cylindrical sections of different diameter and at least one shoulder located between the sections. The grinding wheel has a conically shaped periphery and is rotated about its axis inclined relative to the workpiece axis by a predetermined angle. The grinding wheel is brought into engagement with the workpiece with at least an axial surface line of its periphery. The grinding wheel and the workpiece are fed-in relative to one another by a predetermined amount of overmeasure. The feeding-in is effected in at least two steps. In a first step the feeding-in is effected essentially in a radial direction. In a second step the feeding-in is effected essentially in an axial direction. In the first step essentially the overmeasure in the area of the cylindrical sections is removed. In the second step essentially the overmeasure of the shoulder is removed.

Abstract: A process is for producing a semiconductor wafer with a front surface and a back surface, in which the semiconductor wafer is subjected to two-sided polishing. The process includes the following: (a) producing a hydrophobic surface on the semiconductor wafer by treating the semiconductor wafer with an aqueous HF solution; (b) simultaneous polishing of the front surface and the back surface of the semiconductor wafer with a surface which has been rendered hydrophobic, with an alkaline polishing abrasive being continuously supplied between two rotating upper and lower polishing plates, which are both covered with a polishing cloth, the pH of the polishing abrasive being from pH 8.5 to pH 12.5; (c) after an intended polishing abrasion has been reached, supplying a stopping agent to the semiconductor wafer; and (d) removing the semiconductor wafer from the polishing plates.

Abstract: The time to grind a workpiece can be reduced by selecting a grinding wheel whose width is not substantially greater than wheel strength considerations require, and which may therefore be less than the axial length fo the region to be ground providing a work rest or work steady to increase the workpiece stiffness if required, and performing a succession of plunge grinding steps so as to grind the whole of the said axial region. Typically the grinding wheel is an electroplated CBN wheel, and the width of the grinding wheel selected is the narrowest permissible given the desired feed rate and motive power available.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A polishing apparatus includes a polishing pad, a substrate holder, and a retainer ring. The polishing pad is adhered to a polishing table. The substrate holder urges, while it holds a substrate as a polishing target, a polishing target surface of the substrate against the polishing pad. The retainer ring is formed on a holding surface of the substrate holder to correspond to the circumference of the substrate. The retainer ring has a resin portion formed on its surface which is to come into contact with the polishing pad, and an annular resin holding portion for holding the resin portion and made of a material having a higher mechanical strength than the resin portion.

Abstract: A new method is provided to edge and bevel the periphery of a semiconductor substrate. The wafer is positioned in a horizontal plane and held in place against two positioning pegs. The wafer is rotated and slurry is distributed over the periphery of the substrate surface. The periphery of the wafer is entered into one or more abrasive fixtures, also referred to as bevel/edge heads. These abrasive fixtures will create the desired edge and the desired bevel around the periphery of the substrate.

Abstract: The present invention discloses a slotted retaining ring for use in a chemical mechanical polishing head which can be fabricated by providing a plurality of slot recesses in a bottom surface of the retaining ring. Each of the plurality of slot recesses may be formed in a tapered shape with a base portion adjacent to the outer periphery of the ring and a tip portion of a smaller width than the base portion adjacent to the inner periphery of the retaining ring. The tip portion of the tapered shape is normally spaced apart from the inner periphery such that excessive polishing of the wafer edge can be avoided. The present invention further discloses a method for chemical mechanical polishing a semiconductor wafer by using the slotted retaining ring for holding a polishing head therein.

Abstract: A roll grinding system includes a roll with a pair of longitudinally opposite ends, a longitudinal axis extending between the ends, and an outer surface. A material removal tool is movable in a travel path along a length of the roll. The material removal tool has a generally flat working surface oriented generally parallel to the travel path. A longitudinal displacement drive is connected with the material removal tool for moving the material removal tool along the travel path. A pair of supports are respectively positioned at and rotatably carry a corresponding end of the roll. At least one transverse displacement drive is provided, with each transverse displacement drive being connected with a corresponding support and configured to move the corresponding support in directions generally toward and away from the longitudinal axis.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A workpiece can be simply taken out from a surface plate by a small force without being damaged even though the workpiece is stuck to the workpiece through the surface tension of polishing liquid intervening between the workpiece and the surface plate. By using a takeout device comprising a chucking means for chucking the workpiece and a posture control mechanism for changing the posture of the chuck means, the workpiece horizontally set on the surface plate is chucked by the chuck means in its horizontal posture, and then the chuck means 15 is inclined by the posture control mechanism so as to lift up one end part of the workpiece W in order to separate the workpiece from the surface plate. Thereafter the workpiece can be lifted up in its entirety so as to be taken out from the surface plate.

Abstract: An annular ring assembly is provided in which mechanical elements of the retaining ring assembly maintain strict planar flatness, rigidity, high tolerances and surface stability control. Additionally, glues, adhesives, and epoxies are eliminated from the construction of the plastic retaining and backing ring assembly. Further, adverse chemical reaction and contamination from adhesives that are typically in direct contact with chemical slurry and substrate layers undergoing polishing are eliminated. As a result, the present invention provides a low cost alternative to suppliers and manufacturers of retaining rings and facilitates a method to exchange, recondition and recycle the retaining ring for an infinite period, thus reducing consumable waste materials. Further, the ring assembly maintains uniform mechanical properties and strict tolerances after post reconditioning, thus reducing the variability and maintaining process consistency.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a base and a flexible membrane extending beneath the base to define a pressurizable chamber. The flexible membrane may be secured to the base, to a retaining ring surrounding the mounting surface, or to a support structure movably connected to the base by, for example, an adhesive, an O-ring seal, a sealant, or by fitting the membrane into a recess. A lower surface of the flexible membrane provides a mounting surface for a substrate.

Abstract: This invention involves a containment ring that may be used in conjunction with a substrate carrier used for polishing a substrate to give the substrate a smooth and planar surface. The containment ring is generally constructed such that it tilts independently of the substrate carrier platen that supports the substrate during polishing. The containment ring is constructed with a surface that supports a small perimeter portion of the back side of the substrate during polishing and has an enclosed area sufficient to allow the substrate to precess.

Abstract: The invention provides a polishing machine and a three-chambered polishing head structure and method that improves the polishing uniformity of a substrate across the entire surface of the substrate, particularly near the edge of the substrate that is particularly beneficial to improve the uniformity of semiconductor wafers during Chemical Mechanical Polishing (CMP). In one aspect, the invention provides a method of controlling the polishing pressure over annular regions of the substrate, such as a wafer, in a semiconductor wafer polishing machine.

Abstract: An apparatus and method is disclosed for uniformly deglazing and finishing flat and arcuate surfaces of transmission and other automotive parts. A tapered part support engages a central opening of parts from different models and manufacturers having different size openings. Smaller parts are held in place without tightening or loosening clamps. Larger parts are simply and easily stabilized by a hold down. Operation of a power tool on the working surface of the parts continually rotates the part and part support with respect to a hand held power finishing tool. Working surfaces are thereby uniformly deglazed and roughened for replacement. High productivity is provided with an inexpensive low maintenance tool that even small shops can afford.

Abstract: A chemical-mechanical polishing machine having an improved wafer retainer ring design for the polishing head, comprising a polishing table, a polishing pad, a polishing head and a wafer retainer ring, wherein the polishing pad is above the polishing table, the polishing head is above the polishing pad, and the wafer retainer ring is mounted onto the polishing head. Improvement of the retainer ring design includes the formation of a plurality of guiding holes around the periphery of the retainer ring such that the guiding hole axis follows the centrifugal line produced by a rotating polishing head. Furthermore, the guiding hole has a gradual diffusing structure from the outer inlet to the inner outlet.

Abstract: The present invention relates generally to a device used to process workpieces. In particular, the invention relates to a carrier that is used to support a workpiece during workpiece honing, grinding, or polishing. The carrier includes a rigid core coated with a fiber-free, scratch-resistant material to prevent scratching of workpieces disposed in the carrier. An adhesive layer is typically used to attach the scratch-resistant layer to the rigid core. The adhesive film and the scratch-resistant films may be attached to the rigid core by hot pressing.

Abstract: A wafer polishing head utilizes a wafer backing member having a wafer facing pocket which is sealed against the wafer and is pressurized with air or other fluid to provide a uniform force distribution pattern across the width of the wafer inside an edge seal feature at the perimeter of the wafer to urge (or press) the wafer uniformly toward a polishing pad. Wafer polishing is carried out uniformly without variations in the amount of wafer material across the usable area of the wafer. A frictional force between the seal feature of the backing member and the surface of the wafer transfers rotational movement of the head to the wafer during polishing. A pressure controlled bellows supports and presses the wafer backing member toward the polishing pad and accommodates any dimensional variation between the polishing head and the polishing pad as the polishing head is moved relative to the polishing pad.

Abstract: A double side grinding apparatus for thin disklike work comprises a pair of rotatable grinding wheels having opposed circular grinding faces provided by respective end faces and so arranged as to be movable relative to each other axially thereof, and work rotating means for rotating the thin disklike work about its own axis while supporting the work in a grinding position between the grinding faces so that opposite surfaces of the work to be worked on face the respective grinding faces of the pair of the wheels, with an outer periphery of the work intersecting an outer periphery of each grinding face and with the center of the work positioned inwardly of the grinding faces.

Abstract: A carrier fixture that does not include transport channels or openings for directing a slurry to a substrate being polished. The carrier fixture may have an inner support coupled to a ring member that contacts a substrate during polishing. The carrier fixture may also have outer supports coupled to the ring member. The carrier fixture is used to manufacture integrated circuits.

Abstract: An apparatus for sensing and correcting force levels and vibrational frequencies in a cylindrical grinding machine which has active centers. The active centers have imbedded shear load sensors and imbedded actuators. The sensors provide real time grinding information and allow for a determination of undesirable force levels and vibrational frequencies. The actuators are a pair of piezoelectric stacks disposed on opposing sides of the center body in indentations. A voltage applied by a controller causes the piezoelectric stacks to expand and contract. The action of the piezoelectric stacks causes the tip of the center to laterally displace and apply a lateral force to the workpiece. An AC voltage waveform may be applied for force control. A DC voltage may be applied for displacement; for example, to rapidly remove the workpiece from the grinding wheel or to correct for misalignment between the workpiece and the wheel.

Abstract: A workpiece holding mechanism is used for holding a wafer. The wafer is sandwiched between a holding plate of the workpiece holding mechanism and a polishing pad attached to a polishing turn table. The workpiece is pressed against the polishing pad with a predetermined pressure so that the bottom surface of the wafer is polished. Water is confined within a fluid confinement space defined between an elastic membrane and the holding plate so as to press the wafer via the elastic membrane. There is provided a volume adjustment screw that can be advanced toward the fluid confinement space and be retracted therefrom. Through adjustment of the screw, the elastic membrane is caused to have a flat surface, so that the elastic member is in close contact with the entire surface of the wafer. A holding membrane made of polyurethane foam is bonded to the surface of the elastic membrane, and a template is bonded to the surface of the holding membrane so as to improve the holding performance.

Abstract: A process for chucking and machining an elongated cylindrical article made of a ceramic material according to the present invention, comprises the steps of: (1) chucking the elongated cylindrical ceramic article between chuck heads at longitudinally opposite end portions of said ceramic article; (2) holding the elongated cylindrical article between the chuck heads under such a low chucking pressure as allowing the ceramic article to slip inside a driven side chuck head while being kept inside the chuck heads at the opposite end portions, and slipping the ceramic article inside the chuck heads for a given time under rotation of a driving chuck head so that any positional deviation between the location of a center axis passing centers of of the chuck heads and an axis of the ceramic article may be removed due to a self aligning centrifugal action of the ceramic article; (3) raising the chucking pressure of the chuck heads to such a level as required for machining the ceramic article; and (4) then machining a su

Abstract: A chemical-mechanical polishing apparatus includes a wafer carrier with a very low center of gravity which allows pressure to be applied evenly on a wafer being polished. The wafer carrier includes top, center, and bottom mating subassemblies with only the center and bottom subassembly or wafer holder actually rotating. The bottom of the central subassembly and the top of the bottom subassemblies are shaped as negative and positive, mating truncated pyramids with a downward extension at the center axis of the central subassembly which terminates in a ball in a recess in the top of the lower subassembly. The ball is positioned as low as possible to provide a very low center of gravity to ensure even pressure distribution over a wafer being polished. The truncated pyramidal shapes are to provide a geometry which exhibits a rigid structure with incrementally decreasing mass with distance from the central axis.

Abstract: It is provided a drive and control device for a grinding machine of the type comprising a rotatable abrasive wheel (2), translating members (3) of the wheel (3) with respect to a rotating piece (4) to be ground, and restoring means (5) to reset the wheel (2) comprising a diamond-resetting member (6) and a balancing member (7), the device comprising sensor members (10) adapted to detect the piece roundness and electronic means (19) adapted to generate actuating signals (23) of the restoring means (5), in the presence of a roundness of the piece (4) different from a predetermined roundness. The process consists in grinding the piece and simultaneously measuring the piece diameter until achievement of a predetermined diameter, detecting the piece roundness, and operating said restoring means in interlocked relationship with the detected roundness.

Abstract: A retainer ring for retaining a thin workpiece during machining thereof, the retaining ring being of a design which facilitates distribution of an abrasive slurry used in the machining operation.

Abstract: A carrier apparatus for positioning and biasing a substrate against a polishing pad. The carrier apparatus includes a resilient membrane which loads the substrate against the pad. The membrane is configured to create one or more vacuum regions which chuck the substrate to the membrane so that the carrier may move the substrate on and off the polishing pad. In addition, the membrane may be pressurized to dechuck the substrate and allow the substrate to be front loaded or to float on the polishing pad. A retaining ring is directly adhered to the membrane to define a substrate receiving portion of the membrane. The retaining ring limits twisting of the membrane with respect to the substrate. In addition, the membrane is protected from the polishing pad by a right angled and annular shield. The membrane has a circumferential dimple expansion member prevent the center of the membrane from doming during the polishing process.

Abstract: A holding fixture for a wheel and tire assembly enabling a single person to perform an operation on the tire such as grooving or the like. The fixture comprises a first U-shaped bracket having a base for mounting on a wall or other vertical surface and legs extending perpendicularly from the vertical surface. A second similar U-shaped bracket has a vertical base and horizontal legs adjustably bolted to the legs of the first bracket. The vertical base of the second bracket supports a horizontally extending support tube. A rotatable tube segment has a wheel mounting plate for a wheel and tire assembly affixed to one of its ends and a slotted positioning ring affixed to its other end. The tube segment and its slotted ring and mounting plate are captively and rotatively mounted on the support tube so that a tire and wheel assembly affixed to the mounting plate is rotatable about the support tube. A lock assembly is affixed to the support tube and the base of the second bracket.