Abstract: This invention is a process and device for high speed electrolytic in-process dressing (HELID). The device of the present invention may be provided as an add on to an existing grinding machine or may be integrated into a grinding machine as a subsystem. Grinding machines which are subject to the present invention include, but are not limited to, surface, cylindrical, centerless and double-disk grinding machines.

Abstract: The polishing pad conditioner incorporates a plurality of diamond prisms 12 arranged regularly and protruding towards a surface to be processed, and a conducting bonding member 14 that fixes the diamond prisms into a single body. The conducting bonding member 14 is provided with a conducting metal plate 15 with a plurality of holes 15a for embedding the diamond prisms 12, and a conducting sintered metal 16 that is filled into the spaces between the holes and the diamond prisms and sintered. The conducting bonding member can be dressed electrolytically by passing a flow of conducting liquid 24 through the gap between the member and an electrode placed opposite. Thus, the surface of a polishing pad can be reprocessed (reconditioned) to an appropriate roughness, so the conditioner can continue to operate under even, stable conditions for a very long time, with a rather low manufacturing cost and without contaminating the silicon wafers.

Abstract: A lapping surface patterning system includes a patterning apparatus which can be removably mounted over the lapping surface of a continuous polishing tool. The patterning apparatus includes a radial arm having a movable cutting tool carriage mounted thereon. The cutting tool carriage positions a cutting tool at a desired radius from the center of the lapping surface. The patterning apparatus further includes an outer support having a carriage which positions an outer end of the radial arm, thereby positioning the cutting tool at a desired angular position. A motion control system transmits control signals to the two carriages, thereby driving the cutting tool over a desired pattern. This system can be used to repeatedly and consistently form a pattern of grooves in the lapping surface of the polishing tool.

Abstract: A method for controlling a polishing characteristic of a polishing pad used in planarization of a substrate. The method preferably includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the planarizing surface soften and/or become more soluble, and/or material comprising the planarizing surface attains approximately its glass transition temperature. The waste matter accumulations and/or a portion of the planarizing surface are in this way softened and more easily removed. The planarizing surface is either heated directly by directing a flow of heated planarizing liquid or heated air to the planarizing surface or indirectly by heating a support surface beneath the polishing pad or by heating the air proximate to the polishing pad.

Abstract: An apparatus for polishing an object, includes (a) a rotatable circular polishing plate (11) having a polishing surface on which an object (12) is to be polished, (b) a pressurizer (21) which applies a pressure to an object (12) to make the object (12) contact with the polishing surface, (c) a first unit (13) which supplies polishing solution containing abrasive, to the polishing surface, (d) a dresser (23) which dresses the polishing surface, and (e) a second unit (14) which is located downstream of the dresser (23) and upstream of the first unit (13) in a direction of rotation of the polishing plate (11) and which has an absorption surface (31) through which the second unit sucks the polishing solution from the polishing surface, the absorption surface (31) being formed thereon with a plurality of pivots (35).

Abstract: An apparatus and a method for transferring a rotational torque from a hub frame to a one-piece hub shaft onto which a pad conditioning disc is attached are described. The apparatus is a one-piece hub shaft for mounting into a hub-frame. To provide a great improvement over the conventional design wherein a hub spacer is mounted to a hub shaft by screw means, the present invention conditioning head is assembled together by frictionally engaging a key and a flat surface on the hub shaft to a slot opening on the hub frame such that any catastrophic failure due to a screw breakage can be avoided. The present invention novel frictional engagement further provides a more uniform torque transfer between the two components.

Abstract: A conditioning element for trueing and dressing a polishing pad used in a chemical mechanical polishing process (CMP) in connection with the manufacture of semi-conductors is provided with a relatively thin protective coating comprising a material resistant to corrosive attack by CMP slurry compositions, including those particularly well-suited to resist the harsher highly acidic slurry compositions. The CMP conditioning disk comprises a substrate having a surface carrying a monolayer of superabrasive particles braze bonded to the disk and a relatively thin liquid impermeable protective coating which is applied over the surface of the braze bond material and abrasive particles.

Abstract: Specific embodiments of the present invention are directed to a method of forming a polishing pad having a smaller diameter than an object to be planarized and to be used for planarizing the object by chemical-mechanical planarization. The method comprises placing a polishing surface of the polishing pad in contact with an abrasive surface of a conditioning object having a shape identical to the object to be planarized. The polishing surface of the polishing pad is engaged with the abrasive surface of the conditioning object under conditions substantially equal to the conditions to be applied for planarizing the object. The polishing surface is observed, and is disengaged from the abrasive surface of the conditioning object when abrasion of a center region of the polishing surface of the polishing pad by the abrasive surface of the conditioning object is initially detected.

Abstract: A method and apparatus for improving the pad conditioning process of a polishing pad in a chemical-mechanical polishing apparatus employs closed loop control of the polishing pad conditioning process. An arrangement includes a pad conditioning head carried by an arm that is coupled to an arm support located remotely from the conditioning head. A down force sensor in the arm support measures the down force exerted by the pad conditioning head through the conditioning disk. A controller receives the down force measurements from the down force sensor and controls the arm support to controllably vary the down force exerted by the pad conditioning head. The conditioning apparatus is thus controlled in response to the feedback from the down force measurements in a closed loop control to modify the conditioning process and control the pad wear uniformity.

Abstract: A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (58) comprises shoulder screws (50), polymer bearings (51), a static plate (52), a wave spring (54), and a floating plate (55). Wave spring (54) is placed between static plate (52) and floating plate (55). The shoulder screws (50) connect through the static plate (52) and fasten to the floating plate (55) to hold the wave spring (54) in a preloaded condition. The polymer bearings (51) prevent the shoulder screws (50) from contacting the static plate (52). Wave spring (54) allows the floating plate (55) to move in a non-parallel position to the static plate (52) for angular compensation in the pad conditioning process.

Abstract: An object of the present invention is to provide a lapping machine in which abrasive grains can be efficiently and completely removed from a lapping plate. In the lapping machine of the present invention, a lapping plate has a lapping face and rotates about a rotary shaft. A moving member has a wiping face extended in a longitudinal and moves, in a plane parallel to the lapping face of the lapping plate, in the direction perpendicular to the wiping face. A driving mechanism moves the moving member. With this structure, the moving member securely catches and removes foreign substances from the lapping plate. The foreign substances left can be completely removed in a short time and the working efficiency of the lapping steps can be highly improved.

Abstract: A system for conditioning rotatable polishing pads used to planarize and polish surfaces of thin film integrated circuits deposited on semiconductor wafer substrates, microelectronic, and optical system. The system has a pad conditioning apparatus, process fluids, a vacuum capability to pull waste material out of the conditioning pad, self-contained flushing means, and a piezo-electric device for vibrating the pad conditioning apparatus.

Abstract: The operation of a polishing pad conditioner for a CMP apparatus is monitored. The polishing pad conditioner includes a housing, a first drive pulley disposed in the housing and connected to a motor at a first side of the housing, a conditioning head having a diamond disk for conditioning the polishing pad and mounted to a second side of the housing, a second pulley coupled to the conditioning head for transferring the driving force from the drive pulley to the conditioning head, a timing belt engaged with the first and second pulleys, an air supply tube for supplying air under pressure to the conditoner head to force the head against a polishing pad of the CMP apparatus, and at least one sensor disposed in the housing for sensing the operation of the conditioning head.

Abstract: A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion.

Abstract: An ELID centerless grinding apparatus comprising: a blade 2 for horizontally supporting a rotator workpiece 1 and and a regulating wheel 10 driven to rotate around a horizontal shaft center. An outer surface of the workpiece is subjected to ELID grinding by using a conductive grinding wheel 4. An outer peripheral portion of the wheel 10 includes a conductive elastic member 11 and abrasion resisting particles 12. An electrolytic electrode 14 is provided in close vicinity to an outer peripheral surface of the wheel 10. An electrolytic power supply 16 applies an electrolytic voltage between the electrolytic electrode and the wheel. A conductive electrolytic fluid is flow between the electrode and the wheel and the member 11 is removed by the electrolytic dressing to cause the abrasion resisting particles 12 to project, while the particles 12 are brought into contact with the outer peripheral surface of the workpiece 1 to rotate around its shaft center.

Abstract: A chemical-mechanical polishing (CMP) pad conditioner. The conditioner has a non-uniform conditioning surface with a plurality of conditioning elements. The non-uniform surface comprises a first section having a first cutting volume per unit width and a second section having a second cutting volume per unit width that is different from the first cutting volume per unit width. The difference in cutting volume may be provided by different projected widths of the individual conditioning elements, by a difference in the linear density between the two sections, or by a difference in the cutting depth. A CMP tool comprising a polishing pad, a conditioning pad having the disclosed structure, and a mechanism for moving the polishing pad relative to the pad conditioner is also provided. A method is further provided for uniformly conditioning a CMP pad using a conditioner having the structure described.

Abstract: A polishing apparatus has a plurality of polishing stations for polishing materials to be polished and a plurality of cleaning stations for cleaning the materials being polished, the polishing stations and the cleaning stations being alternately arranged; and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations and the cleaning stations successively. The arm includes a polishing head for holding the material being polished. Each of the cleaning stations comprises a retainer stand on which the material being polished is placed, and a cleaning device for cleaning the material being polished in a state held by the polishing head, cleaning the material being polished in a state placed on the retainer stand, and cleaning the polishing head in a state where the material being polished is separated from the polishing head.

Abstract: A chemical mechanical polishing apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, a washer having a cleaning device; and a dresser. The dresser comprises a bottom disk contacting the polishing pad. The dresser can move between the polishing pad and the washer. When the dresser moves into the washer, a diamond zone on the bottom disk cleans the polishing pad, and the cleaning device cleans the diamond zone.

Abstract: An apparatus and a method for transferring a rotational torque from a hub frame to a hub shaft onto which a pad conditioning disc is attached are disclosed. The apparatus is constructed by a hub frame, a hub shaft and a hub spacer that is assembled to the hub shaft. Providing a great improvement over the conventional design wherein a hub spacer is mounted to a hub shaft by screw means, the present invention conditioning head is assembled together by frictionally engaging a key on the hub spacer to a slot opening on the hub shaft such that any catastrophic failure due to screw breakage can be avoided. The present invention novel frictional engagement further provides a more uniform torque transfer between the two components.

Abstract: Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism (31) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism (31) includes a housing (32) and a moveable mount (33). The housing (32) and the moveable mount (33) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts (39) buffer a threaded shaft (36) from side loading on the moveable mount (33). Polymer bearings (51) connected to moveable mount (33) provide a low friction contact surface to bearing shafts (39). A polymer translation nut (41) connects to the moveable mount (33) and is threaded onto the threaded shaft (36).

Abstract: A quick coupler for mounting a rotational disk which enables the rotational disk to be quick connect to or disconnect from a pad conditioner disk holder is disclosed. The quick coupler consists of two major components of a disk holder and a travel housing. The disk holder is formed in a ring shape having a center aperture in a polygon shape for intimately engaging a polygon-shaped shaft of the travel housing such that a rotational torque can be transmitted from the travel housing to the disk holder. Each side of the polygon is provided with a steel ball and a recessed slot behind the ball for receiving a jutting key operated by a retractable ring attached to the travel housing. The travel housing is formed in a cylindrical shape that has a first end threaded for engaging a drive means and a second end in the polygon shape.

Abstract: An improved burr for sharpening the grinding surface of a pulpstone includes a novel tooth configuration for better wear of the burr and enhanced grinding properties of the pulpstone. The profile configuration of the burr teeth has a truncated tip portion in the form of a rounded tip portion, a flat tip portion, or an obtusely angled tip portion to avoid a sharply pointed tip. The tip portion connects opposite sides of the tooth, with the sides forming either a symmetrical or an asymmetrical tooth profile using linear, convex involute, and concave involute side configurations. The present invention comprises a further improvement to a pulpstone sharpening burr, wherein the lead angle of the burr teeth changes periodically over the axial length of the burr to provide the pulpstone with a wave-like groove pattern.

Abstract: A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear.

Abstract: A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The conditioning disk for a CMP pad is divided into regions defined by a size difference of abrasive grains formed on the body surface in each region of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains onto the body surface multiple times. In addition, a used conditioning disk may be reworked by detaching the abrasive grains from the body, and attaching new abrasive grains. A used conditioning disk can also be cleaned of by-products of the conditioning process by a cleaning method using a HF solution or BOE (buffered oxide etch) solution.

Abstract: A semiconductor wafer processing system, more specifically, a chemical mechanical planarization system including a polishing media reconditioning system. In one embodiment, the polishing media reconditioning system comprises at least a first and second conditioning roller that contact a working surface of a polishing media while rotating in opposite directions. Other embodiments include conditioning plates disposed on a carrier that includes the polishing head, a conditioning roller or disk that traverses the surface of the polishing media and a conditioning disk that conditions the polishing media while retained in the polishing head. Alternatively, the polishing media may be conditioned utilizing the devices embodied above remotely from the processing system.

Abstract: A conductive grindstone 12, a circular disk-like discharge electrode 14 with an outer rim 14a that can access a machining surface 12a of the grindstone, an electrode rotating device 16, a position controlling device 18 that controls the relative position between the outer rim of the electrode and the grindstone, a voltage applying device 20 for applying voltage pulses between the grindstone and the electrode, and a mist-supplying device 22 that supplies pressurized conductive mist between the grindstone and the electrode are provided. The pressurized conductive mist is a mixture of a low-conductivity aqueous solution and compressed air. A plasma discharge is generated between the grindstone and the electrode by means of this pressurized conductive mist, and the grindstone is subjected to truing.

Abstract: A movable frame assembly to move a device for dressing a grinding wheel for the sharpening an ice skate blade. The device uses a housing surrounding a grinding wheel and movable frame with a swing arm. A dressing tool is mounted in the dresser swing arm and the dresser swing arm is rotatable between a storage position and an operating position. The movable frame assembly slides along rails to allow positioning of the dressing tool into the grinding wheel. Horizontally and vertically disposed bearings are positioned beside and under a rail with resiliently biased bearings are held against the top of the rail. The bearings help the rails of the movable frame move smoothly. The rails are spaced apart by yokes on the arm or a bar across the top of the dresser to prevent binding as the movable frame is slid for dressing the wheel. Adjustment of the rails is also provided for by adjustment slots at the back of the rails.

Abstract: A CMP system and methods make repeatable measurements of eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. Force applied to the carrier may be accurately measured even though such force is eccentrically applied to such carrier. The CMP system and method provide the repeatable measurement features while supplying fluids within the carrier to the wafer and to a wafer support without interfering with the polishing operations. Similarly, the CMP system and methods remove fluids from the wafer or puck carrier without interfering with the CMP operations. An initial coaxial relationship between an axis of rotation and a carrier axis is maintained during application of the eccentric force, such that a sensor is enabled to make repeatable measurements, as defined above, of the eccentric forces, and the carrier may be a wafer or a puck carrier.

Abstract: A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.

Abstract: A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner includes a substrate having formed with a plurality of geometrical protrusions of an uniformed height on at least one of its sides, and a cutting portion having a diamond layer or an uniformed thickness formed substantially on a whole surface of the side of the substrate having the geometrical protrusions. The geometrical protrusions have a flat upper surface or the upper surface may comprise a plurality of smaller geometrical protrusions formed by recessed grooves. The substrate is made from ceramic or cemented carbide materials and have a shape of a disk, a plate having multiple corner, a cup, a segment, or a doughnut with flattened upper and lower surfaces. The conditioner may further include a body portion being fixedly attached to the substrate at a side opposite to the side having formed with geometrical protrusions for linking the cutting portion to conditioning equipment.

Abstract: A tool and method are provided for the abrasive machining of a substantially planar surface. The tool has a base body and a plurality of elements which are mounted on the base body and form a planar coating which is used as a working coating during machining of the surface.

Abstract: A method and apparatus for qualifying a polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes at least one qualifying member including at least one collimated hole structure, wherein the collimated hole structure forms multiple channels within the qualifying member. The method includes providing at least one qualifying member formed with at least one capillary tube array, wherein the capillary tube array forms multiple channels within the qualifying member, pressing the qualifying member against the polishing pad, and moving the qualifying member along the polishing pad along a trajectory to simulate the polishing of a semiconductor wafer.

Abstract: A planarization apparatus has a stocker in which a dressing board is stored. The dressing board is picked up from the stocker and mounted on a chuck table by a transport robot. Then, dressing of a grinding wheel or a polishing pad is performed with the dressing board. Thereafter, the used dressing board is withdrawn into the stocker by the transport robot after the process through cleaning and drying.

Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and is pressed against the polishing cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. Relative rotation between the top ring and the presser ring is achieved during polishing.

Abstract: It is arranged such that the least common multiple of two numbers m and n of which one is prime to the other, is made as large as possible where the number m is the rotational speed (rpm) of a platen with a polishing pad affixed thereto and the number n is the rotational speed (rpm) of a carrier with a wafer mounted thereon. As a result of such arrangement, it is not until the platen completes m revolutions that a point on the polishing pad that comes into contact with a fixed point on the wafer returns to the original contact point with the fixed point at the start of polishing, and the resulting trajectory is therefore spread uniformly over the polishing pad.

Abstract: In the electrodeposited abrasive wheel 20 of the abrasive tool according to the present invention, plural mound parts 21, which are upheaved at the central domain of base metal 19 in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer 22 is formed on a base metal 19, and plural ultra abrasive grains 14 are adhered only to each mound parts 21 by electrodeposited metal phase 25, and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part 21a and top 21b of the mound parts 21 at the small abrasive-grain-layer parts 24. Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range.

Abstract: The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.

Abstract: A surface treating article including a surface conditioning member, a fastener including a generally planar surface and a drive member, and a layer of adhesive between the surface conditioning member and the planar surface of said fastener, where the layer of adhesive includes rotational orientation. The present invention also provides a preferred method of attaching a fastener to a surface conditioning member that includes inducing relative rotation between a fastener and a surface conditioning member with a layer of adhesive in contact with a planar surface of the fastener and the surface conditioning member so as to soften the layer of adhesive and thereafter stopping the relative rotation between the fastener and the surface treating member.

Abstract: A grinding apparatus for grinding a spline ball groove on a workpiece comprises a rod-shaped grindstone, having a distal end portion with a curved surface corresponding to the groove to be ground, and a spindle mechanism for rotating the grindstone. The spindle mechanism and the grindstone are supported by means of a supporter in a manner such that they are inclined at a given angle to an axis of the workpiece. A rotary dresser, which has a dress groove corresponding to the curved surface of the distal end portion of the grindstone, is disposed near the grinding apparatus. The grindstone can be reciprocated along the axis of the workpiece by a drive mechanism between the workpiece and the dresser without changing its angle of inclination.

Abstract: The present invention is a method and apparatus for conditioning a polishing pad used for chemically mechanically polishing semiconductor wafers. The conditioning device includes a rigid elongated element that resists bowing or warping during the conditioning process. Abrasive elements are supported by a substantially planar bottom surface of the rigid element. The abrasive elements may have a diamond layer cut into a grid pattern to provide an abrasive surface. The conditioning device is preferably used to condition a polishing pad supported by a rigid platen. The conditioning device is pressed against and swept across the polishing pad by an actuator while the polishing pad is rotated to uniformly condition the polishing pad. This uniform conditioning, while avoiding the bowing and warping of the prior art, provides a superior conditioning process for the polishing pad.

Abstract: The object of the present invention is to provide a polishing apparatus having a grinding member in a compact design that can provide high efficiency for both polishing and dressing operations, and prevents tilting of the grinding member even if the rotation axis thereof is moved away from the outer periphery of the object. A polishing apparatus for an object, comprises: an object holder for holding an object to be polished, such that a surface of the object to be polished faces upward; a dresser disk holder for holding a dresser disk for dressing, such that a dressing surface thereof faces upward; and a grinding member for polishing the object, and for being dressed by the dresser disk, by pressing and sliding the grinding member relative to the object and the dresser disk.

Abstract: A polishing apparatus is used for polishing a plate-like workpiece, such as a semiconductor wafer or a glass substrate. The polishing apparatus has a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a dresser for dressing the polishing surface by pressing a desired position of the polishing surface.

Abstract: A multi-functional conditioner set for a chemical-mechanical polishing station. The multi-functional conditioner set has at least two conditioning heads each made from a different material such as diamond dust and nylon. The multi-functional conditioner set also includes an ejection tube for delivering chemical agents and de-ionized water to the conditioning heads. Moreover, a vibrator is attached to the ejection tube to transmit ultrasonic or megasonic vibration to the chemical agents and de-ionized water. The conditioning heads can be arranged in various combinations and the ejection tube set to various control settings. Hence, a polishing pad can be cleaned or reconditioned and residual diamond particles on the polishing pad can be removed. Furthermore, the conditioner set occupies only a single area above the polishing table of the polishing station.

Abstract: A conformal disk holder for holding a rotating disk against a surface of a polishing pad is described. The conformal disk holder can be used for any polishing apparatus, but is particularly suited for use in a CMP pad conditioning disk. The conformal disk holder is constructed by a cover member, a flexural plate member and a base member. The flexural plate member has a center protrusion with a downwardly facing convex surface for intimately engaging an upwardly facing concave surface on a center protrusion of the base member. The intimate engagement between the convex surface and the concave surface allows at least a 5° tilt of the base member from a horizontal plane, and preferably allows a tilt between about 5° and about 30°.

Abstract: With a time control means for a wetting treatment of a fixed abrasive platen provided, the fixed abrasive platen is set in a good wet state in advance prior to the start of polishing. The time control means may be incorporated in the body of a flattening/machining apparatus, or alternatively a wetting retaining mean may newly be separately provided instead. While the fixed abrasive platen is rapidly transformed through expansion due to wetting, the wetting treatment is desirably performed till a transformation ratio thereof is stabilized at 0.0005% or less.

Abstract: A conditioning disk including a unitary thermoplastic polymer sheet material cut a unitary circular plate formed with gear teeth along its circular edge, and formed with block form protrusions that are impelled in a sweeping motion by rotation of the unitary plate as a planetary gear in meshed engagement with a sun gear and a ring gear of a polishing apparatus.

Abstract: The present invention provides a multi-conditioner arrangement of a CMP system. The CMP system according to the present invention comprises a polishing table, a polishing pad positioned on the polishing table, a plurality of carrier heads on the polishing pad functioning in holding semiconductor wafers, and a plurality of conditioners positioned between the two neighboring carrier heads on the polishing pad for recovering the surface texture of the polishing pad. Herein, a plurality of conditioners are in a one-to-one arrangement to a plurality of carrier heads, each conditioner producing a back and forth motion in a radiant direction. Therefore, the lifetime of the polishing pad is extended, the wafer-to-wafer difference is reduced, and spatial coverage is increased.

Abstract: The present invention generally provides an apparatus and a method for conditioning a polishing pad in a polishing system. In one embodiment, the apparatus includes a conditioning disk having conditioning elements disposed on the bottom surface and away from the center portion of the disk. In another embodiment, the apparatus includes a base plate and a ring-shaped plate in which the conditioning elements are disposed on the ring-shaped plate. In still another embodiment, the apparatus includes a conditioning disk having conditioning elements disposed on the bottom surface and away from the center portion of the disk and having brush bristles disposed on the center portion of the disk.

Abstract: A dresser unit including a dresser 20 and a driving shaft 21 for rotationally driving the dresser 20 is operatively mounted to a dresser supporting mechanism so that the dresser unit can be moved up and down freely with respect to the dresser supporting mechanism, wherein a piston-cylinder mechanism 40 is installed between the dresser unit and the dresser supporting mechanism for pushing up the dresser unit by an upward force of fluid pressure, and a fluid at a predetermined pressure level is supplied to the piston-cylinder mechanism 40 from a compressed air source 67 via a pressure control unit 65, the compression force applied to a turntable 10 by the dresser is precisely controlled and adjusted based on a balance between the own weight of the dresser unit and the upward force exerted by the piston-cylinder mechanism 40.

Abstract: A polishing apparatus has a polishing table having a polishing surface, a carrier for carrying a plate-like member and bringing the plate-like member into contact with the polishing surface, and a dresser including a dressing tool adapted to be brought into contact with the polishing surface to dress or normalize the polishing surface. The carrier is movable along a first path between a work position for bringing into contact the plate-like member with the polishing surface and a rest position. The dresser is movable along a second path between a work position for bringing the dressing tool into contact with the polishing surface and a rest position. The first and second paths have a common overlapping area. A contact prevention device is provided to prevent the carrier and the dresser from coming into contact with each other.