Abstract: A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: An apparatus and a method for mounting a conditioning disk to a conditioning head for use in a chemical mechanical polishing apparatus. A torroidal-shaped bearing mount is fixedly mounted to a conditioning arm of the CMP apparatus for receiving a ball bearing and a cylinder rotator. A cylinder shaft is mounted inside a cylinder chamber defined by the cylinder rotator and is further equipped with a piston mounted at near a top end of the shaft which has an elastomeric gasket mounted on an outer rim for sealingly engaging a sidewall in the cylinder chamber. A disk holder is mounted to a bottom end of the cylinder shaft by a universal connector/universal mount such that the disk holder, with a conditioning disk mounted thereon, can be operated to follow a contour of the polishing disk by tilting to an angle of at least ±30° from a horizontal plane.

Abstract: The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride(PcBN). The abrasive particles are brazed to a substrate which may be then coated with an additional anti-corrosive layer. The anti-corrosive layer is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate, the abrasive particles extend for a uniform distance away from the substrate, allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions.

Abstract: A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof, determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser against the polishing cloth while the turntable and the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.

Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.

Abstract: The invention applies to a process and rotary point crush truer device to dress grinding wheels with profiled working surfaces with a rotary truer where the grinding wheel and rotary truer to whose surfaces are applied a material of greater hardness than the grinding wheel to be dressed, allowing the grinding wheel and rotary truer to run with the same circumferential speed and, at the same time, the grinding wheel and the rotary point crush truer device to press together under high pressure. It is the task of the invention to create a possibility of a simple means to avoid the abrasion in the above mentioned process of crush dressing with different surface speeds between the grinding wheel and the rotary truer, and thus to achieve long tool life of the dressing tool.

Abstract: A method and apparatus for conditioning a fixed abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member formed from glass, at least one collimated hole structure located within the conditioning member, wherein the collimated hole structure forms a channel, and wherein each channel is arranged in a generally parallel orientation with respect to any other channel. The method includes providing at least one conditioning member formed with at least one capillary tube array, wherein the capillary tube array forms multiple channels within the conditioning member, pressing the conditioning member against the fixed abrasive polishing pad, and moving the fixed abrasive polishing pad. In one embodiment, the method further comprises rotating the conditioning member to simulate the polishing of at least one semiconductor wafer.

Abstract: Conditioning systems and methods for conditioning polishing pads used in mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies. In one aspect of the invention, a conditioning system includes a conditioning element or conditioning member having a conditioning face configured to engage a polishing pad. The conditioning face preferably includes a bonding medium covering at least a portion of the conditioning face and a plurality of conditioning particles attached to the bonding medium. The conditioning system also includes a corrosion-inhibiting unit that can be coupled to the conditioning element or a liquid on the polishing pad. The corrosion-inhibiting unit retards corrosion of the bonding medium in the presence of chemicals on the polishing pad that would otherwise corrode the bonding medium.

Abstract: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads.

Abstract: An apparatus for end-rounding bristles in a brush having different heights. The apparatus includes pins disposed in pre-determined locations such that they will contact selected bristles in a brush abutting the apparatus when the pins travel a two-dimensional path. The height of the pins is adjusted according to the heights of the selected bristles.

Abstract: A method and apparatus for mechanical and/or chemical-mechanical planarization of microelectronic substrates. In one embodiment, a conditioning device for removing waste matter from a microelectronic planarizing medium has a support assembly with a support member and a conditioning head attached to the support member. The support member may be a pivoting arm or gantry assembly that carries the condition head over the planarizing medium. The conditioning head may have a non-contact conditioning element that transmits a form of non-contact energy to waste matter on the planarizing medium. The non-contact conditioning element, for example, may be an emitter that transmits a selected waveform capable of penetrating the planarizing medium and the waste matter on the planarizing medium. In operation, the selected non-contact energy may impart energy to the waste matter that weakens or breaks bonds in the waste matter and/or bonds between the planarizing medium and the waste matter.

Abstract: A polishing apparatus has a turntable with a polishing surface, a top ring for pressing a workpiece against the polishing surface under a given pressure to polish the workpiece, and a dresser for dressing the polishing surface. The polishing surface has an outer circumferential edge portion cut off or the dresser has a predetermined outside diameter, such that the polishing surface has an outer circumferential edge positioned in alignment with or radially inwardly of an outer circumferential edge of the dresser in the radial direction of the turntable when the polishing surface is dressed by the dresser.

Abstract: A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.

Abstract: A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utilize brazed diamond technology in association with a coating of a titanium nitride containing composition or a thin film diamond deposition in order to reduce the fracturing and loss of cutting elements bonded to the conditioning ring.

Abstract: An apparatus and method for conditioning a polishing pad in a polishing system. One embodiment of the apparatus generally includes a movable support member, a conditioner device coupled to the support member, and a first actuator coupled to the support member and adapted to move the conditioner device along a first path. Another embodiment of the apparatus generally includes a platen, a polishing pad supported on the platen, and a conditioner device coupled to a support member and positioned adjacent a region of the polishing pad outside of a substrate polishing area. One embodiment of the method includes raising a conditioner device adjacent to the polishing pad, providing relational movement between the conditioner device and the polishing pad, and lowering the conditioner device away from the polishing pad.

Abstract: A conditioning tool including a rotary conditioning pad; a lower shaft attached to the conditioning pad; an upper shaft having an upper end and a lower end, the lower end attached to the lower shaft via a flexible coupling; and a motor attached to the upper end of the upper shaft and adapted to rotate the shaft. The tool further includes a mechanism for measuring an angle of the conditioning pad relative to a reference plane. The conditioning tool may further include a conditioning arm, various control mechanisms, and a controller for receiving feedback from the angle measuring mechanism and the various control mechanisms and for controlling the various control mechanisms in response to the feedback. A chemical-mechanical polishing apparatus and a conditioning method for providing a uniform polishing surface of a chemical-mechanical polishing pad are also disclosed.

Abstract: The invention concerns a polishing machine comprising at least a base unit (10) in the form of a parallelepiped cell (12), with a first loading and unloading surface (14), a second opposite parallel surface (16) for access to the working zone located in an intermediate section (24), and third and fourth surfaces (18, 20). The loading pallet board (48) and unloading pallet board (56) are respectively borne by a loading arm (50) and an unloading arm (58) operating independently of each other, said pallet boards being both accessible on the first surface (14) side. The mechanism (28, 30) is located in the lower section beneath the cell (12) intermediate section (24), while the automaton is arranged in the top section, the mechanism and the automaton being accessible on the second surface (16) side.

Abstract: An apparatus and method for conditioning the polishing pad of CMP system by employing a multi-zone conditioner, or dresser. The conditioner comprises a plurality of rollers or disks, which can be well tuned to make down-pressure and rolling speed of the rollers or disks to the extent as desirable. The conditioner further comprises driving means for rotating the polishing rollers or disks. It can make a better uniformity of the pad conditioning and improve the profile of the polished wafers. The apparatus and method for conditioning the polishing pad can be especially used to compensate the uniformity of the incoming films, or the pre-CMP films.

Abstract: A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced.

Abstract: A system and method for polishing semiconductor wafers includes a rotatable polishing pad movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer. A pad dressing assembly positioned coplanar, and adjacent, to the wafer provides in-situ pad conditioning to a portion of the polishing pad not in contact with the wafer. The method includes the step of radially moving the polishing pad with respect to the wafer.

Abstract: An apparatus for providing a flat to stepped convex facing for grinding wheels used for the finished machining of parts, the apparatus including dressing wheels located only at the outer diameter of the Cubic-Boron-Nitride wheels to be dressed.

Abstract: An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the polishing tool. In order to solve the above-mentioned problem, the present invention provide a rotary machining apparatus comprising a polishing tool for polishing a sample; a rotary disk for holding the polishing tool; a tool for configuring a surface of the polishing tool; and a position adjusting mechanism for adjusting a gap between the tool and the polishing tool, which comprises a rotating mechanism for rotating the tool; and a sensor for sensing a change in the rotation of the rotating mechanism, a height at starting to configure the polishing tool using the tool being determined based on the change in the rotation obtained by the sensor.

Abstract: The present invention is directed to a method and apparatus for cleaning and enhancing CMP polishing pads. According to an example embodiment of the present invention, a fluid source supplies cleaning elements to a CMP pad conditioner arrangement at pressure of about 20 PSI. A dispensing arrangement is coupled to the fluid source and is adapted to disperse the cleaning elements and to dispense the elements onto a CMP pad. The high-pressure cleaning of the CMP pad improves the ability to clean the pad over existing methods, reduces processing defects, increases the pad life, and improves the uniformity of the polish rate.

Abstract: A cold-gas-blow-cooling type machining apparatus in which a cold gas blow is provided to cool a machining tool and a workpiece while the workpiece is machined by the machining tool. The machining apparatus includes: a rectifying device which rectifies the machining tool; a workpiece-temperature detecting device which detects a temperature of the workpiece; and a rectifying-device control device which controls an operation of the rectifying device on the basis of the temperature of the workpiece which is detected by the workpiece-temperature detecting device.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: This invention describes methods of polishing with pads useful in the manufacture of semiconductor devices or the like. These pads have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance. These pads provide exceptional performance when used for polishing in conjunction with a slurry in which the abrasive particles are stabilized by use of an amino alcohol. They are also useful when used with slurries comprising an organic polymer.

Abstract: A polishing pad conditioner used in the removal of slurry and semiconductor thin film build-up in the polishing pad in a chemical and mechanical polishing (CMP) process used to planarize a semiconductor wafer surface. The conditioner is pressed against the polishing pad, often while de-ionized water is applied, to remove the material build-up. The conditioner of the present invention has a convex lower surface covered by diamond crystals that are bonded to the underside of the nickel alloy conditioner. Typically, the difference between the center and the edge of the conditioning surface will range from a minimum of about 0.2 mm (very slightly convex) to a maximum of the entire thickness of the conditioning surface (more convex). The convex shape reduces the friction between the pad and conditioner and allows the slurry to reach the center of the conditioner. This more uniformly conditions the pad surface which yields more uniformly polished wafers and also increases pad life.

Abstract: The useful lifetime of a fixed abrasive article is extended and wafer-to-wafer uniformity enhanced by preconditioning a fixed abrasive element and/or periodic conditioning after initial wafer polishing. Embodiments include preconditioning by forced removal of an upper binder-rich portion of the fixed abrasive elements to expose abrasive particles having a similar concentration as the bulk concentration at about one half the height of the elements. Embodiments further include periodic conditioning after initial wafer polishing by forced removal of an upper portion of the fixed abrasive elements.

Abstract: A dressing apparatus dresses the polishing surface of a turntable while controlling the orientation of a dresser body with electromagnetic forces, thereby allowing an increase in the degree of flatness of the polishing surface of the turntable. A polishing apparatus having the dressing apparatus is also provided. The dressing apparatus includes a dresser body which dresses the polishing surface by contacting it. A pressing device presses the dresser body against the polishing surface of the turntable. An orientation controller controls the orientation of the dresser body by utilizing electromagnetic forces.

Abstract: A cover for a pad conditioning assembly for use in a chemical mechanical polishing apparatus and a pad conditioning assembly incorporating such cover are disclosed. The cover may be formed of a body portion with at least two boss sections and at least two locking tabs mounted in the boss sections. The cover provides a quick mount/dismount to a support plate of a pad conditioning assembly by engaging and disengaging the blocking tabs. The cover further provides the advantage that when a substantially transparent material is used in fabricating the cover, any malfunction or breakage of the components under the cover can be readily observed. The cover is further provided with an extended skirt section such that all the major components of the pad conditioning assembly can be shielded a slurry solution and cleaning fluids.

Abstract: A polishing media magazine for improved polishing. The polishing media magazine may include a conditioning element for rapid, uniform conditioning and cleaning of the polishing media. The polishing media magazine may include polishing media having sections of raised elevation to contain the fluid and may include a polishing support platen having features adapted to urge the edges of the polishing media upwards. The polishing media may be roll fed from a supply roll across a support platen and onto a take-up roll.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be actively rotated or reciprocated at variable rates, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Abstract: A device for chemical-mechanical polishing. The device can be applied to a chemical polishing table spinning in a fixed direction and a polishing pad above of it. A chemical-mechanical polishing device according to the present invention is at least comprised of a main body of conditioner with a plurality of mounting pads, wherein each mounting pad is mounted with the diamond granules and located on the lower surface of conditioner, distributed on the rim of main body of each mounting pad. It can contact with polishing pads when cleaning the polishing pads and a number of cavities are across the upper and lower surfaces of each main body of conditioner and distributed between each mounting pads as well. When using the conditioners to clean out the polishing pads, the de-ionized water will flow through the cavities to wash off the acid or basic slurry to eliminate the destruction made by the solders around the diamond granules to extend the durability of the conditioner.

Abstract: Onto the surface of a dressing tool for removing the clogging of an abrasive cloth, diamond grains of plural groups each having a different average particle diameter are subjected to be mixed and then fixed. In this state, the upper end of small diamond grains 4 is projected over nickel plating 2. Thereby foreign substances aggregated in the concave of the abrasive cloth are effectively removed and at the same time wearing the surface of the nickel plating 2 is prevented. Achieved are the stabilization of a polishing speed in polishing and the inhibition of dropping out diamond grains and wearing nickel plating in dressing.

Abstract: In a first step, the grinding worm profile is dressed according to the requirements of the workpiece that is to be machined. In a second step, the thereby shaped grinding worm, which has been slightly deformed by the effects of the centrifugal force, is measured at operating speed. In a third step, the measured values are converted into control data for a correcting, redressing process of the grinding worm flanks. Finally in a fourth step, the grinding worm flanks are redressed in such a manner that form errors, which are caused by various influences during grinding, are used as correction factors in the machining of the worm profile. The measuring of the grinding worm flanks may be performed directly without contact by means of a distance sensor or indirectly, whereby a sample toothed wheel is ground and this wheel is then measured by means of a tooth-flank measuring machine.

Abstract: According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet is configured and arranged for receiving treatment elements. A distribution surface is coupled to the inlet and is configured and arranged to disperse the treatment elements. A multitude of outlets are coupled to the distribution surface and are configured and arranged to dispense the treatment elements onto a CMP pad. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.

Abstract: An apparatus for dressing a wafer polishing pad, including a disk-shaped dresser, an arm, and a control unit. The disk-shaped dresser is configured to be pressed against the polishing pad which rotates in a circumferential direction. The dresser is configured to rotate in a same direction as the polishing pad rotates due to frictional force generated between the dresser and the polishing pad. The arm is configured to support the dresser rotatably and to press the dresser against the polishing pad. The control unit is configured to control the arm to position the dresser such that a peripheral edge portion of the dresser is positioned outside a peripheral edge portion of the polishing pad by a predetermined distance.

Abstract: Methods and apparatuses are provided that may remove the build up of polishing by products from the polishing pad without the reduction in throughput associated with conventional ex-situ conditioning. The conditioning method comprises holding a wafer against a polishing pad with a 0 psi force, and applying a conditioning fluid to the polishing pad while holding the wafer against the polishing pad with a 0 psi force. Thereafter the conditioning fluid may be rinsed from the polishing pad or may remain on the polishing pad while polishing is commenced. The polishing apparatus has a controller programmed to perform the conditioning method.

Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.

Abstract: A dresser 44 of a wafer polishing apparatus according to this invention includes a grinding wheel head 444 that is idly supported in such a manner as to be capable of moving up and down relative to a dresser main body 441, and an air bag 449 interposed between the dresser main body and the grinding wheel head. The air pressure inside the air bag can be regulated so that the force pushing the grinding wheel head to the polishing cloth can be regulated. A washing tank 46 for washing the grinding wheel head of the dresser is disposed adjacent to the platen 41, and a brush table 463 having a brush 462 implanted thereto is detachably provided to the bottom part of the washing tank 46.

Abstract: The present invention provides a dresser for a chemical and mechanical polishing cloth wherein a bonding material for retaining diamond grit is not dissolved and contamination of chemical slurry caused by dissolving of metal or peeling-off of diamond grit is prevented from occurring. A sintered product constituting the dressing face 2a is obtained by mixing a bonding material 4 consisting of silicon and/or silicon alloy with diamond grit 3, and forming and sintering the mixture. A carbide film 5 generated by sintering silicon in the bonding material into diamond is formed on the surface of the diamond grit 3. Thereby, the diamond grit is firmly bonded with the bonding material, and the bonding material is not dissolved. As a result, the contamination of the chemical slurry or the peeling-off of the diamond grit is prevented.

Abstract: In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In another aspect, pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad.

Abstract: A movable frame assembly to move a device for dressing a grinding wheel for the sharpening an ice skate blade. The device uses a housing surrounding a grinding wheel and movable frame with a swing arm. A dressing tool is mounted in the dresser swing arm and the dresser swing arm is rotatable between a storage position and an operating position. The movable frame assembly slides along rails to allow positioning of the dressing tool into the grinding wheel. Horizontally and vertically disposed bearings are positioned beside and under a rail with resiliently biased bearings are held against the top of the rail. The bearings help the rails of the movable frame move smoothly. The rails are spaced apart by yokes on the arm or a bar across the top of the dresser to prevent binding as the movable frame is slid for dressing the wheel. Adjustment of the rails is also provided for by adjustment slots at the back of the rails.

Abstract: In a first step for the purpose of precentering, the dressing too; (27), without axial movement, is brought into contact with the circumference of the rotating grinding worm (11), and those rotary-angle positions of the grinding worm (11) at which the overrunning of the thread gap (36) starts of ends are determined by means of an acoustic-sensor signal and the shaft-angle encoder (18) of the grinding spindle (16). In a second step for the purpose of precision centering, the dressing tool (27) fed into the thread gap (36) is brought into contact with the left-hand and right-hand tooth flanks (38, 39) by axial displacement. In this case, the axial infeed is stopped by means of the acoustic-sensor signal, and the exact grinding-worm thread center is calculated from the contact positions of the dressing tool (27) achieved.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: An apparatus and method of conditioning a CMP polishing pad to ensure consistent polishing throughout the polishing process. In particular, the apparatus consists of a translatable wedge-shaped conditioning plate, having a three point adjustable contact to ensure proper alignment with the polishing pad; a high pressure conditioning spray nozzle to clean the polishing pad and conditioning assembly throughout polishing; and a slurry dispensing nozzle to enhance planarization of the wafer. Further, the frequency of oscillation may be varied by the operator to prevent grooves from forming in the polishing pad.

Abstract: Disclosed is a method of effectively dressing a grinding wheel of high grain concentration having a high wheel number usable for an ultrahigh precision processing. When a grinding wheel (10) is trued (i.e., formed into a predetermined shape) by using a truing tool (11), the grinding wheel (10) is dressed by feeding a coolant W in which abrasive grains (12) for dressing are dispersed into a space between the truing tool (11) and a surface (13) of the grinding wheel (10). Therefore, it is possible to easily true and dress the ultra-fine grinding wheel usable for ultra-high precision processing, without being affected by the manufacturing limit of the dressing tool, being different from the dressing method using a dressing tool.

Abstract: A preconditioning mechanism for preconditioning a polishing pad is described. The preconditioning mechanism includes an arm capable of being disposed over the polishing pad and a head section located on a distal end of the arm and rotatable about a central axis. Furthermore, the head section includes at least two heads oriented about the central axis and have surfaces for either conditioning or preconditioning the polishing pad, whereby rotation of the head section about the central axis by defined amounts presents at least two heads to the polishing pad so that different of the two heads can engage the polishing pad for conditioning or preconditioning depending upon how far rotation has proceeded.