Abstract: A method for manufacturing a polishing pad prevents slurry leaks and provides a pad that can be used to provide high optical detection accuracy. The method for manufacturing a polishing pad includes forming a groove for injecting a light-transmitting region forming material on the back surface of a polishing layer; injecting the light-transmitting region forming material into the groove and curing the material to form a light-transmitting region; and buffing the front surface of the polishing layer to expose the light-transmitting region on the front surface.

Abstract: A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.

Abstract: The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surface 1a of a polishing pad 1 is subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 ?m or less. As a result, the flatness of the object polished by the polishing pad 1, such as a silicon wafer, is improved.

Abstract: A method of processing an article with a coated abrasive product, including a repeat of a single marking, comprises detecting at least two characteristics of the repeat of a single marking. The repeat is placed along the length of the abrasive product at a first major surface, wherein each of the detected characteristics conveys independent information regarding the abrasive product. The method further includes comparing the information to a database. A method of acquiring information of the coated abrasive product includes detection and comparing steps.

Abstract: Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.

Abstract: Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.

Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: A polishing pad, comprising a mounting surface and an opposing polishing surface with a polishing pattern having at least one aperture thereon, is formed with an adhesive layer adhered to the mounting surface with uniform adhesive strength therebetween. Embodiments include applying an adhesive layer to the mounting surface with uniform pressure prior to forming the polishing pattern on the polishing surface. Embodiments also include forming the polishing pattern having at least one aperture, forming a fitter having a surface pattern opposite to the polishing pattern and having a projection, positioning the fitter on the polishing pattern so that the projection fills the aperture in the polishing pattern forming a composite having substantially parallel opposing surfaces, applying pressure to bond the adhesive layer to the mounting surface with substantially uniform adhesive strength therebetween, and removing the fitter.

Abstract: A chemical mechanical polishing pad is described. A chemical mechanical polishing pad has an outer layer that includes a polishing surface, a first thinned region defined by a recess on a bottom surface of the pad, a first thick region surrounding the first thinned region, a second thinned region surrounding the first thick region, and a second thick region surrounding the second thinned region. The first thick region is not vertically extendable. The second thinned region defines one or more flexure mechanisms configured to make the first thinned region and the first thick region movable relative to the second thick region in a direction parallel or substantially parallel to the polishing surface.

Abstract: A two piece eraser assembly , including an eraser disk and an eraser hub for mounting and holding the eraser disk. The eraser hub includes upper and lower surfaces a flange at the peripheral edge of the hub and a stub shaft on the lower surface positioned axially with a throughbore. The eraser hub includes a plurality of spaced apertures for engaging with and detachably locking eraser disk extensions on the backside. The upper surface of the eraser disk includes a central recess and an aperture in the recess. The eraser disk includes a plurality of abrading teeth running radially from the central recess. The lower surface of the eraser disk further comprises a plurality of mounting elevations keyed for engaging with the spaced apertures or slots in the eraser hub for securely locking the eraser disk to the eraser hub.

Abstract: Provided are abrasive articles having a plurality of elongated channels extending across its working surface and intersecting with each other. These channels provide hinge points that enhance flexibility of the article along two or more directions. Optionally, the abrasive article includes a flexible attachment layer, along with apertures that penetrate through the attachment layer located at the intersection points of the channels. The enhanced flexibility allows the abrasive article to easily access recessed areas of the workpiece and facilitates applying even pressure across convex and concave surfaces. The channels assist in segregating dust particles from the abrading operation, and the optional apertures can be advantageously connected to a vacuum source for evacuation of the dust particles from the channels.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: Bonded abrasive articles and in particular organic bonded depressed center wheels with one or more reinforcements have reduced stiffness in comparison to conventional counterparts. Techniques for producing and using such wheels are described. In one example, a method for reducing the stiffness of an organically bonded abrasive wheel includes applying to a raised hub region of a reinforced depressed center wheel a force effective to irreversibly decrease the stiffness of said wheel.

Abstract: A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 ?m The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.

Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.

Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a light stable polymeric endpoint detection window, comprising: a polyurethane reaction product of an aromatic polyamine containing amine moieties and an isocyanate terminated prepolymer polyol containing unreacted —NCO moieties; and, a light stabilizer component comprising at least one of a UV absorber and a hindered amine light stabilizer; wherein the aromatic polyamine and the isocyanate terminated prepolymer polyol are provided at an amine moiety to unreacted —NCO moiety stoichiometric ratio of <95%; wherein the light stable polymeric endpoint detection window exhibits a time dependent strain of ?0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60° C. at 100 minutes and an optical double pass transmission of ?15% at a wavelength of 380 nm for a window thickness of 1.

Abstract: A method of producing equal-sized spherical shaped beads of a wide range of materials is described. These beads are produced by forming the parent bead material into a liquid solution and by filling equal volume cells in a sheet with the liquid solution. The sheet cells establish the volumes of each of the cell mixture volumes which are then ejected from the cells by an impinging fluid. Surface tension forces acting on the ejected equal sized solution entities form them into spherical beads. The ejected beads are then subjected to a solidification environment which solidifies the spherical beads. The beads can be solid or porous or hollow and can also have bead coatings of multiple material layers.

Abstract: The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 ?m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 ?m.

Abstract: Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

Abstract: The present invention relates to a CMP polishing pad and to a method for manufacturing same. The CMP polishing pad is manufactured by means of a method in which a light-absorbing material is dispersed in or on the surface of the pad, and a laser beam is absorbed by the light-absorbing material to form holes, wherein the diameter of the holes is determined by the wavelength of the laser beam. The CMP polishing pad of the present invention has holes formed therein by absorbing laser light with light-absorbing material dispersed on the surface of or in the CMP polishing pad, and laser beams of various wavelengths can be effectively absorbed in accordance with the type of light-absorbing material, such that holes having a desired diameter can be formed in the CMP polishing pad, thereby enabling the low-cost manufacture of a CMP polishing pad with excellent polishing characteristics.

Abstract: The present invention relates to a CMP polishing pad and to a method for manufacturing same, characterized in that a light-absorbing material for forming pores is dispersed in the pad. Pores formed in the CMP polishing pad of the present invention are formed by means of the breakdown of the light-absorbing material which absorbs a laser beam irradiated on the polishing pad, enabling the pore size to be controlled by controlling the amount of the light-absorbing material, the intensity of the laser beam, etc., and enabling pore distribution to be freely controlled through the computer numerical control (CNC) technique. Accordingly, a CMP polishing pad can be provided that exhibits the highest polishing effectiveness in accordance with the material to be polished or the type of slurry.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. A porous polishing layer includes a dual porosity structure within a polyurethane matrix. The dual porosity structure has a primary set of pores having pore walls with a thickness of 15 to 55 ?m and a storage modulus of 10 to 60 MPa measured at 25° C. In addition, pore walls contain a secondary set of pores having an average pore size of 5 to 30 ?m. The porous polishing layer is either fixed to a polymeric film or sheet substrate or formed into a woven or non-woven structure to form the polishing pad.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: A polishing system and associated methods are described for polishing a magnetic disk used in a disk drive system. The polishing system includes a polishing film that is used to polish the magnetic disk. The polishing system also includes an actuator operable to move the polishing film across a surface of the magnetic disk to polish the magnetic disk. The polishing system also includes a pad having at least one protrusion extending from a surface of the pad. The protrusion is configured to contact the polishing film and press the polishing film against the magnetic disk. The protrusion is operable to compress to about the surface of the pad when in contact with the polishing film. Once polishing is complete, the pad retracts from the polishing film and the protrusion extends from the pad, reducing the adhesion force between the pad and the polishing film.

Abstract: Processing pads for mechanical and/or chemical-mechanical planarization or polishing of substrates in the fabrication of microelectronic devices, methods for making the pads, and methods, apparatus, and systems that utilize and incorporate the processing pads are provided. The processing pads include grooves or other openings in the abrading surface containing a solid or partially solid fill material that can be selectively removed as desired to maintain the fill at an about constant or set distance from the abrading surface of the pad and an about constant depth of the pad openings for multiple processing and conditioning applications over the life of the pad.

Abstract: Polishing pads for use in chemical mechanical planarization (CMP) or polishing elements/surfaces of such pads are made from a combination of immiscible polymers, for example polyurethane and polyolefin. The polymers are selected on the basis of interfacial interaction, melt index and ratios of melt indices between the polymer phases—a matrix phase and a dispersed phase. By selecting the polymer system such that the two polymers are immiscible in one another and preferentially form separate domains, the dispersed phase can be removed when conditioning or polishing processes expose it. The melt index of individual polymers and the ratio of melt indices determines dispersability of a smaller phase into the matrix, hence the phase size.

Abstract: A grinding tool for natural stone floors, artificial stone floors and industrial floors allows a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors to be restored by using diamond tools that are flexibly attached. The diamond tools are fixed on a mat so that each individual diamond tool can adapt individually to the grooves and unevennesses of an animated natural stone and stone floor. The grinding pattern of a surface machined with said grinding tool corresponds to a newly produced natural stone or artificial stone floor.

Abstract: A surface abrading method of an electrophotographic photoreceptor is disclosed, comprising abrading the surface of a photosensitive layer with an abrading member entrained about a backup roll with feeding the abrading member and rotating the photoreceptor, while moving the abrading member parallel to a rotating shaft of the photoreceptor with bringing the abrading member into contact with the photosensitive layer surface, wherein the abrading member comprises a solid body on a backing material, the solid body contains abrasive grains and is provided on the backing material brought into contact with the photosensitive layer surface, and the top face of the solid body exhibits a surface roughness (Ry) of from 4.0 to 8.0 ?m.

Abstract: The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. A porous polishing layer includes a dual porosity structure within a polyurethane matrix. The dual porosity structure has a primary set of pores having pore walls with a thickness of 15 to 55 ?m and a storage modulus of 10 to 60 MPa measured at 25° C. In addition, pore walls contain a secondary set of pores having an average pore size of 5 to 30 ?m. The porous polishing layer is either fixed to a polymeric film or sheet substrate or formed into a woven or non-woven structure to form the polishing pad.

Abstract: Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a light stable polymeric endpoint detection window, comprising: a polyurethane reaction product of an aromatic polyamine containing amine moieties and an isocyanate terminated prepolymer polyol containing unreacted —NCO moieties; and, a light stabilizer component comprising at least one of a UV absorber and a hindered amine light stabilizer; wherein the aromatic polyamine and the isocyanate terminated prepolymer polyol are provided at an amine moiety to unreacted —NCO moiety stoichiometric ratio of <95%; wherein the light stable polymeric endpoint detection window exhibits a time dependent strain of ?0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60° C. at 100 minutes and an optical double pass transmission of ?15% at a wavelength of 380 nm for a window thickness of 1.

Abstract: This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a determined thickness on the polishing pad, wherein a peak of one modified pattern and a valley of another modified pattern neighboring thereto are sequentially located on the same line. The polishing pad may uniformly disperse slurry over the whole area during a polishing process to provide improved polishing uniformity, and appropriately control residence time of the slurry to increase polishing rate.

Abstract: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

Abstract: A chemical mechanical polishing pad used for chemical mechanical polishing comprises a polishing surface, a non-polishing surface that is provided opposite to the polishing surface, a side surface that connects an outer edge of the polishing surface and an outer edge of the non-polishing surface, and a plurality of grooves formed in the polishing surface. The side surface has a slope surface that is connected to the polishing surface, and a depth of the grooves is equal to or smaller than a height of the slope surface.

Abstract: The polishing pad includes a polishing surface, on which is formed with a plurality of first grooves and a plurality of second grooves, wherein the characteristic of the polishing pad is in that: the first grooves are connected to the second grooves, the width of first grooves are larger than that of the second grooves, the depth of first grooves are larger than that of the second grooves, the density of first grooves are larger than that of the second grooves, and the first grooves and the second grooves are uniformly distributed over the polishing surface respectively. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove.

Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.

Abstract: A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on the polishing pad is set. The oscillatory movement distance enables any particular point on the workpiece to cross the same number of grooves, when a direction between the particular point and the center of the workpiece is perpendicular to a tangential direction of the grooves. The workpiece is then polished with the oscillatory movement distance, so as to achieve a better polishing uniformity for the surface of the workpiece.

Abstract: Chemical mechanical polishing pads having a polishing layer with a polishing surface adapted for polishing a substrate are provided, wherein the polishing layer has a unique integral identification feature; wherein the unique integral identification feature is non-polish active, wherein the unique integral identification feature comprises at least two visually distinct characteristics, wherein at least one of the at least two visually distinct indicia is a non-color based indicia, wherein one of the at least two visually distinct indicia is a color based indicia, and wherein the at least two visually distinct characteristics are selected to uniquely identify the chemical mechanical polishing pad as a type of chemical mechanical polishing pad selected from a plurality of types of chemical mechanical polishing pads; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provided is a method of making such polishing layers and for using them to polish a substrate.

Abstract: A method for manufacturing an optical projection reticle employs a damascene process. First feature recesses are etched into a projection reticle mask plate which is transmissive or transparent. Then feature recesses are tilled with a radiation transmissivity modifying material comprising a partially transmissive material and/or a radiation absorber for absorbing actinic radiation. Sacrificial materials may be added to the recess temporarily prior to filling the recess to provide gaps juxtaposed with the material filling the recess. Thereafter, the sacrificial materials are removed. Then the projection mask is planarized leaving feature recesses filled with transmissivity modifying material, and any gaps desired. The projection mask is planarized while retained in a fixture holding it in place during polishing with a polishing tool and a slurry.

Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.

Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.

Abstract: The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first embodiment, a first region and a second adjacent region have a first and second non-zero void volume, respectively, wherein the first void volume is less than the second void volume. In a second embodiment, a first non-porous region is adjacent to a second adjacent porous region, wherein the second region has an average pore size of about 50 ?m or less. In a third embodiment, at least two of an optically transmissive region, a first porous region, and an optional second porous region, are adjacent. The invention further provides methods of polishing a substrate comprising the use of the polishing pads and a method of producing the polishing pads.

Abstract: A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.

Abstract: A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.

Abstract: The invention provides a polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium with a polishing pad. The polishing pad comprises a center, an inner region surrounding the center, a transition region connecting grooves from the inner region to an outer region surrounding the inner region. The outer region has multiple grooves with a high-rate path. The transition region is adjacent the outer region and within a radius from the center defined as follows: r TR = 0.7 ? r * ? ? to ? ? 1.3 ? r * where r * = R C ? ( R R C ) 2 - cos ? ( 2 ? ? c ? ? 0 ) - sin ? ( 2 ? ? c ? ? 0 ) ? ( R / R C cos ? ? ? c ? ? 0 ) 2 - 1 ; with the inner region originating continuous grooves that extend uninterrupted to the outer region.

Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.