Abstract: Cutting elements for earth-boring tools include one or more recesses and/or one or more protrusions in a cutting face of a volume of superabrasive material. The superabrasive material may be disposed on a substrate. The cutting face may be non-planar. The recesses and/or protrusions may include one or more linear segments. The recesses and/or protrusions may comprise discrete features that are laterally isolated from one another. The recesses and/or protrusions may have a helical configuration. The volume of superabrasive material may comprise a plurality of thin layers, at least two of which may differ in at least one characteristic. Methods of forming cutting elements include the formation of such recesses and/or protrusions in and/or on a cutting face of a volume of superabrasive material. Earth-boring tools include such cutting elements, and methods of forming earth-boring tools include attaching such a cutting element to a tool body.

Abstract: According to one embodiment, a dresser includes a base metal plate, and a plurality of chip portions that are provided on the base metal plate. Each chip portion includes a Si substrate having a projection at an upper portion thereof and a diamond layer provided on the projection of the Si substrate.

Abstract: Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.

Abstract: Provided are abrasive articles in which the make layer, abrasive particle layer, and size layer are coated onto a backing according to a coating pattern characterized by a pattern of discrete islands, or features, having an areal density ranging from about 30 features to about 300 features per square centimeter and an average feature diameter ranging from about 0.1 millimeters to about 1.5 millimeters. Optionally, the provided abrasive particles have an average abrasive particle size ranging from about 20 micrometers to about 250 micrometers and the average make layer thickness ranging from 33 percent to 100 percent of the average abrasive particle size. This coating pattern provides that all three components are generally in registration with each other, while also providing a pervasive uncoated area extending across the backing, thereby providing improved cut and finish performance while displaying a resistance to curl in wet environments.

Abstract: A device used to smooth a material's surface with abrasion. More specifically, the device is in the form of a glove or mitten with an abrasive layer that is placed over, and secured on, a user's hand to protect the user's hand and to provide an agile and flexible range of motion while sanding a material's surface.

Abstract: A method of making a coated abrasive article includes the steps of: applying a make coat to a first major surface of a backing; applying shaped abrasive particles to the make coat to form a first abrasive layer consisting essentially of shaped abrasive particles; applying diluent particles to the make coat over the shaped abrasive particles to form a final abrasive layer; applying a size coat over the final abrasive layer; curing the make and size coats; and wherein the shaped abrasive particles comprise a vertex opposite a base and a width of the shaped abrasive particle tapers from the base to the vertex.

Abstract: Provided are a polishing pad which remedies the problem of scratches occurring when a conventional hard (dry) polishing pad is used, which is excellent in polishing rate and polishing uniformity, and which can be used for not only primary polishing but also finish polishing, and a manufacturing method therefor. The polishing pad is a polishing pad for polishing a semiconductor device, comprising a polishing layer having a polyurethane-polyurea resin foam containing substantially spherical cells, wherein the polyurethane-polyurea resin foam has a Young's modulus E in a range from 450 to 30000 kPa, and a density D in a range from 0.30 to 0.60 g/cm3.

Abstract: A media-bearing polisher and restorer removes surface and subsurface contaminants from a vehicle, household or other surface. The media-bearing polisher and restorer comprises an ovoid body with a planar bottom. The body comprises a resilient or rigid material and one or more flutes for receiving one or more user fingers. A permeable elastic medium is removably attached to the planar bottom of the body, which absorbs and extracts contaminants from the surface. A variety of media can be used with the media-bearing polisher and restorer.

Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

Abstract: A chemical mechanical polishing pad includes a polishing layer, a recess being formed in a polishing surface of the polishing layer, the polishing layer including a surface layer that forms at least an inner side of the recess, and a ratio (D1/D2) of an average opening ratio D1(%) to an average opening ratio D2(%) being 0.01 to 0.5, the average opening ratio D1 being an average opening ratio of the inner side of the recess when the polishing layer has been immersed in water at 23° C. for 1 hour, and the average opening ratio D2 being an average opening ratio of a cross section of the polishing layer that does not intersect the surface layer when the cross section has been immersed in water at 23° C. for 1 hour.

Abstract: An object of the invention is to provide a polishing pad which has a polishing layer with a phase-separated structure and can provide high polishing rate and high planarization property and with which scratching can be suppressed. The polishing pad comprises the polishing layer. The polishing layer comprises a product of curing reaction of a polyurethane-forming raw material composition containing: (A) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (a) containing an isocyanate component and a polyester-based polyol; (B) an isocyanate-terminated prepolymer obtained by reaction of a prepolymer-forming raw material composition (b) containing an isocyanate component and a polyether-based polyol; and a chain extender, wherein the product of curing reaction has a phase-separated structure.

Abstract: Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

Abstract: An abrasive article is provided. The article includes (a) a flexible backing having opposing first and second surfaces; (b) an abrasive layer comprising plurality of abrasive particles disposed on the first surface of the flexible backing; and (c) an adhesive layer comprising load bearing particles and an adhesive matrix, the adhesive layer disposed on the second surface of the polymer layer. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate.

Abstract: The purpose of the present invention is to provide a laminated polishing pad that can be flatly bonded to a polishing platen even if it is large in size. This laminated polishing pad, comprising a polishing layer and a support layer with an adhesive member interposed therebetween, wherein the polishing layer contains 0.5 to 5% by weight of a hydrophilic substance; the support layer is a layer obtained by integrally molding a cushion layer and a resin film having a thermal dimensional change rate of 1.3 to 12.6%; the laminated polishing pad has a concavely warped form in the polishing layer side; and the laminated polishing pad has an average warp amount of 3 to 50 mm at the peripheral edge of the pad.

Abstract: A chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.

Abstract: A multilayer chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 ?m/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.

Abstract: Presently described are methods of making an article via electrostatic deposition of particles, abrasive grains and articles, as well as a method of repairing a painted surface. The abrasive grain comprises a plurality of abrasive particles having a median primary particle size of less than 75 microns, and discrete hydrophobic nanoparticles.

Abstract: An abrasive article includes a backing having a major surface, an adhesion promoting layer overlying the major surface of the backing, and a make layer directly contacting the adhesion promoting layer. The adhesion promoting layer has a thickness of at least about 10 microns and is formed of a polar thermoplastic material, a cross-linkable polymer, or blends thereof.

Abstract: Provided are abrasive articles in which the make layer, abrasive particle layer, and size layer are coated onto a backing according to a coating pattern characterized by a plurality of discrete islands. The coating pattern has features in which all three components are generally in registration with each other, while providing a pervasive uncoated area extending across the backing. Advantageously, this configuration provides a coated abrasive that displays superior curl-resistance compared with previously disclosed abrasive articles. Moreover, this configuration resists loading, resists de-lamination, has enhanced flexibility, and decreases the quantity of raw materials required to achieve the same level of performance as conventional abrasive articles.

Abstract: Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.

Abstract: An abrasive device including at least one substrate, provided as a carrier element of a binder layer at least partially accommodating at least one abrasive grain, and having at least one fastening element, configured to detachably fasten the at least one substrate to an abrasive handling device.

Abstract: A method of forming one or more TSP compacts is provided. The method includes placing one or more TSP material layers in an enclosure and surrounding each TSP material layer with at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates. The method also includes exposing the enclosure to a high temperature high pressure process wherein the at least one of a pre-sintered tungsten carbide powder, pre-cemented tungsten carbide powder, tungsten carbide powder, or partially sintered tungsten carbide substrates bond to the TSP material layers forming a stack of TSP material layers including the TSP material layers one over the other with tungsten carbide bonded to each of the TSP material layers and encapsulating each of the TSP material layers.

Abstract: A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved with the even tracking zone.

Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.

Abstract: A method of making an abrasive article including the steps of treating a plurality of cavities in a contacting surface of a production tool by plasma deposition of a thin film thereby forming a plurality of plasma treated cavities. Filling the plurality of plasma treated cavities in the production tool with an abrasive slurry, and at least partially curing the abrasive slurry while residing in the plurality of cavities.

Abstract: The purpose of the present invention is to provide a long-lived laminated polishing pad wherein a polishing layer is resistant to detachment from a support layer even when high temperatures are produced by long periods of polishing. This laminated polishing pad is characterized that: a polishing layer and a support layer are laminated together with an adhesive member interposed therebetween; said adhesive member is either an adhesive layer containing a polyester-based hot-melt adhesive or double-sided tape that has one of such adhesive layers on each side of a substrate; and for each 100 weight parts of a polyester-resin base polymer, said polyester-based hot-melt adhesive contains 2 to 10 weight parts of an epoxy resin that has at least two glycidyl groups per molecule.

Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major surfaces, an adhesive make coat on the first major surface, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and a non-slip coating layer on the second major surface. Methods of making and using such sandpaper are also provided.

Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating polycrystalline diamond tables and PDCs in a manner that facilitates removal of metal-solvent catalyst used in the manufacture of polycrystalline diamond tables of such PDCs.

Abstract: A flexible abrasive finishing article including a backing of fabric or paper having first and second major surfaces with abrasive particles adhesively secured to said first major surface and a layer of cyanoacrylate based material substantially covering the second major surface. The method of making a flexible abrasive finishing material including the steps of applying a layer of cyanoacrylate based material to a surface of a backing material opposite the surface to which abrasive particles are adhesively secured and covering said cyanoacrylate material.

Abstract: A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.

Abstract: Provided is a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad. In one embodiment, the polishing pad comprises a polishing layer produced by applying to the subpad a hardenable fluid. In another embodiment, the subpad is coated with a barrier before coating with the hardenable fluid. In each embodiment, the depth of penetration of the polishing layer and/or barrier is substantially uniform. Also provided is a method of producing a seamless polishing pad comprising a seamless polishing layer having a substantially uniform depth of penetration into a porous subpad.

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.

Abstract: A chemical mechanical polishing pad includes a polishing layer that is formed of a composition that includes a polyurethane, the polishing layer having a specific gravity of 1.1 to 1.3 and a thermal conductivity of 0.2 W/m·K or more.

Abstract: A flexible antistatic abrasive with a combined support (10) consisting of a plastic film (13), on which binder resins (8) are applied, consisting of a “maker coat” (14), on which the abrasive (16) adheres, fixed by a “size coat” (15) and if necessary coated with a third binder (17), in which the plastic support film (13) is laminated with at least one reinforcement substratum or base support (12) and in which all the components of the combined support are treated with materials designed to provide the support with antistatic properties.

Abstract: An abrasive disc includes a backing layer on a first major surface, a water-impermeable abrasive layer on a second major surface, and a water-absorbable, compressible, resilient, porous foam layer sandwiched in between the backing layer and the abrasive layer. The disc further includes a plurality of perforations. The disc is used to abrade a surface. Fluid is absorbed into the abrasive disc. The fluid is then released to the surface by compressing the abrasive disc against the surface in an abrading motion. The fluid is allowed to mix with and absorb surface swarf; and compression on the abrasive disc is released, reabsorbing the fluid and trapping swarf inside the disc.

Abstract: Flexible abrasive sheet articles having precision thickness flat-topped raised island structures that are coated with a monolayer of equal sized abrasive agglomerate are described. Methods of producing high quality equal-sized spherical shaped composite abrasive agglomerate beads containing small diamond abrasive particles are described. Beads are produced by level-filling fine mesh screens or perforated sheets with a water based metal oxide slurry containing abrasive particles and then using a fluid jet to eject the abrasive slurry lumps from the individual screen cells into a dehydrating environment. Surface tension forces form the ejected liquid lumps into spheres that are solidified and then heated in a furnace to form ceramic beads. These porous ceramic abrasive beads can be bonded directly onto the flat planar surface of a flexible backing material or they can be bonded onto raised island surfaces to form rectangular or disk abrasive sheet articles.

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.

Abstract: An abrasive pad assembly, for use with a surfacing machine, includes a circular pad member and a diamond abrasive member. The circular pad member includes an exterior surface and the diamond abrasive member is affixed to the exterior surface of the circular pad member. The diamond abrasive member includes an insert and a diamond abrasive material. The insert has a first surface affixed to the exterior surface of the circular pad member. The diamond abrasive material is a polycrystalline diamond substance that is affixed to the second surface of the insert. The polycrystalline diamond material is spaced apart from the exterior surface of the circular pad member.

Abstract: A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G?, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 ?m/min.

Abstract: There are provided an abrasive tape capable of suppressing contamination of a magnetic disk due to shattered abrasive particles and smoothing the surface of the magnetic disk; a method for producing an abrasive tape; and a varnishing process. An abrasive tape 1 produced according to the method for producing an abrasive tape of the invention is used in a process for varnishing a magnetic disk and produced according to a process for preparing a slurry by kneading and dispersing abrasive particles 5 and a binding agent 6; a process for forming a coating film by applying the slurry on a support 2; a process for forming an abrasive particle layer 3 by hardening the coating film; and a process for forming a coating layer 4 on the surface of the abrasive particle layer 3.

Abstract: A sponge product for cleaning a work surface includes an open-cell melamine foam body layer having a front wall, rear wall, first sidewall or second sidewall that is inclined and at an acute angle relative to the upper surface of the body layer. An abrasive layer is adjacent the upper surface of the melamine foam body layer forming a unitary product. The abrasive layer has at least one of the front wall, rear wall, first sidewall or second sidewall forming an obtuse angle with the lower surface of the abrasive layer, and the abrasive layer upper surface and at least one front wall, rear wall, first sidewall or second sidewall forms a working edge having an acute angle, and the working edge remains flat against the work surface when a force is applied to the sponge product.

Abstract: A coated abrasive article (1) comprises a backing (3) having an abrasive coating (5) on one side, an attachment layer (7) on the other side of the backing, and a line of weakness (9) that does not penetrate the front face of the abrasive coating (5). The line of weakness, which may be formed using a laser beam, comprises a through-cut (11) in the attachment layer (7) and perforations (13) in the backing (3), and permits one part of the abrasive article (1) to be separated from another part. Alternatively, the abrasive article can be used in its original form.

Abstract: An abrasive article is provided. The article includes (a) a flexible backing having opposing first and second surfaces; (b) an abrasive layer comprising plurality of abrasive particles disposed on the first surface of the flexible backing; and (c) an adhesive layer comprising load bearing particles and an adhesive matrix, the adhesive layer disposed on the second surface of the polymer layer. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate.

Abstract: A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed.

Abstract: A coated abrasive product includes green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles, a nanoparticle binder, a sulfosuccinate, and a crosslinking, wherein the abrasive aggregates are dispersed within a polymer resin coating comprising a mixture of copolyester resin. The coated abrasive product is capable of finishing coated surfaces and repairing defects in coated surfaces, including surfaces coated with automotive primers, paints, clear coats, and combinations thereof.

Abstract: An optical-grade surfacing tool includes: a rigid holder (60); an elastically compressible interface (12) secured to the rigid holder (60); and a flexible pad (13) that can be applied against a surface to be machined (71) and secured to the interface (12) opposite the rigid holder (60). The pad (13) is carried by an elastically extensible membrane (14) including: a central plate (15); and a plurality of straps (18) each radially protruding from the periphery of the plate (15) and each having a distal portion engaged with a fastening element (38), each strap (18) rotating about the side surface (28) of the interface (12) and extending up to the fastening element, each strap (18) being taut.

Abstract: A method for manufacturing a polishing pad that has high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form water-impermeable film; and cutting the polishing

Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

Abstract: A universal abrasive sheet is provided for a sanding or polishing machine and includes segments defined by weakened regions that allow portions of the universal abrasive sheet to be removed in order to adapt the abrasive sheet to alternative platent configurations. Each of the different configurations of the universal abrasive sheet can be provided with an individualized tip portion which can be separated from a body portion and either repositioned or replaced in order to change the working point of the tip portion when it becomes worn out.