Abstract: A dispenser and method for attaching abrasive sheets to a backup pad. The dispenser conveniently centers on the backup pad an abrasive sheet that is larger than the backup pad. In a preferred embodiment, the dispenser comprises: a holder configured to receive circular abrasive sheets, the holder including a bottom, a top, front portion and a rear portion, wherein the rear portion extends farther from the bottom than the front portion, and wherein the bottom of the holder defines at least a 180 degree arc of a first circle having a first radius; a slider guide extending along the rear of the holder; and a spacer mounted in the guide, wherein the spacer is movable along the guide from a first position within the front portion of the holder to a second position beyond the front portion of the holder, the spacer defining an arc of no more than 180 degrees of a second circle having a second radius smaller than the first radius.

Abstract: A cleaner and polish article comprises a substrate capable of absorbing and retaining a fluid and having two opposed surfaces wherein at least one surface is abrasive, and a nonabrasive aqueous cleaner and polish formulation absorbed, in the substrate. The cleaner and polish formulation comprises an aqueous cleaning emulsion containing water, a surfactant and an organic solvent, a polishing agent, and a carrier, whereby cleansing and polishing action is achieved by the formulation, and abrasive cleansing action and polishing action is achieved by the cleaner and polish formulation as well as by the abrasive surface of the substrate. The substrate is further capable of absorbing the dissolved or softened soil residue to assist in the cleansing action. The substrate can comprise a cloth-like towel. A plurality of such towels is provided in a continuous roll placed in a selectively sealable, essentially airtight container.

Abstract: A sanding glove for treating an area of an object. The sanding glove includes a glove portion, a sanding portion releasably secured to the glove portion and a device for releasably securing the sanding portion to the glove portion. The user is able to treat a surface of an object by rubbing the sanding portion against the object. The device for releasably securing includes a plurality of recesses extending through the palm area of the glove portion and a plurality of protrusions extending from a first side of the sanding portion, the plurality of protrusions being received by respective recesses securing the sanding portion to the glove portion. Alternatively, the device for releasably securing may include a hook and loop fastener on both the glove portion and sanding portion which engage with one another. The glove portion is fabricated from a flexible material for protecting and bending with the user's hand.

Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.

Abstract: A polishing tool uses a fixed abrasive polisher which can perform polishing of an object with good surface accuracy for a long period of time. A mixture of abrasive grains, having an average particle diameter of 0.01 to 2.0 &mgr;m, and comprising at least one of cerium oxide, manganese oxide, titanium oxide, zirconia, silica, and iron oxide, and polyimide resin particles or phenolic resin particles having an average particle diameter of 0.1 to 20 &mgr;m is heated at a temperature of 120 to 250° C. under a pressure of 9,800 to 49,000 kPa (100 to 500 kg/cm2) to mold the mixture into a desired shape. This can provide a polisher 4 having abrasive grains dispersed in a thermosetting resin, and having abrasive grains of 20 to 60% by volume, a binder of 30 to 50% by volume, pores of not more than 40% by volume, and a Rockwell hardness of not less than 30 in terms of the H scale. This polisher is attached to a surface plate by an epoxy adhesive to produce a polishing tool.

Abstract: A sanding disc particularly useful for smoothing drywall. The sanding disc includes a circular abrasive disc having an abrasive surface, and a circular foam disc smaller in diameter than the abrasive disc which is co-axially adhered to the surface of the abrasive disc opposite its abrasive surface. The abrasive disc has a circular central portion along which the surface defined by the abrasive is generally planar, and has an annular peripheral portion extending from its central portion to its peripheral surface along which its surface defined by the abrasive is generally cylindrically convex to position the peripheral surface of the abrasive disc in a plane passing through the foam disc.

Abstract: A polishing member for use in polishing of an end face of an optical fiber connector ferrule comprises a substrate and a polishing layer, which is overlaid on the substrate and which comprises a binder and fine polishing particles dispersed in the binder. Agglomerated fine silica particles having a mean particle size falling within the range of 0.1 &mgr;m to 4 &mgr;m are utilized as the fine polishing particles contained in the polishing layer, and a thickness of the substrate falls within the range of 25 &mgr;m to 150 &mgr;m. The polishing with the polishing member is performed while a polishing liquid, which is constituted of water or a silica slurry, is being supplied onto a surface of the polishing layer. The polishing liquid is free from a base or an acid. The polishing layer has a dry thickness falling within the range of 5 &mgr;m to 15 &mgr;m.

Abstract: An apparatus (46) for reconditioning a protective surface (30) of an optically-read digital recording disc (20) includes a turntable (48) configured to receive the disc (20) and a first motor (52) for rotating the turntable (48) and the disc (20). The apparatus further includes a buffing element (122) and a second motor (54) for rotating the buffing element (122). A timing element (56) synchronizes the first and second motors (52, 54) to substantially simultaneously cease rotation of the turntable (48) and the buffing element (122) following removal of an amount of material from the disc (20). The buffing element (122) includes a foam pad (124) having a discoid portion (126) and an annular portion (128) encircling a perimeter (132) of the discoid portion (126). The annular portion (128) is more resistant to compression than the discoid portion (126). A buffing pad (82) is in fixed relation with the foam pad (124).

Abstract: A sanding pad with a circular cross section for a manually operable grinding device has one 'surface with means (2) for connection to the grinding device. An opposite surface (6) forms a contacting surface (5) for guiding an abrasive. The contacting surface (5) is provided with radially extending grooves (1), which are constructed open towards the contacting surface (5), in order to increase the abrading performance of the sanding pad (2).

Abstract: A flexible, open-pored cleaning body having at least one scouring surface (2) provided in at least one subregion with continuously formed, raised projecting ridges (3), wherein the ridges (3) have regions C,D of different heights in the direction of their extension.

Abstract: A resilient flexible sanding sponge including a foam backing layer having a layer of abrasive particles distributed along one of its major surfaces that are adhered together and to the backing layer by a layer of flexible adhesive material. That backing layer has about the same flexibility and conformability as the backing layers on prior art sanding sponges, while having a significantly higher tear strength than prior art sanding sponges. That high tear strength backing layer can either be (1) a layer of felted urethane foam; or (2) a layer of foam that encompasses a reinforcing material.

Abstract: A polisher for polishing a repair surface to a predetermined shape and a ground paper for polishers are provided. The polisher of the present invention includes a substrate portion (30) for holding an abrasive on a surface opposite to a repair surface, a holding plate (2) provided in parallel to the substrate portion with a predetermined space therebetween, and elastic members (3) interposed between the substrate portion (30) and the holding plate (2). The substrate portion (30) has a first face plate portion (4) fixed to the holding plate (2) with a predetermined space therebetween and second face plate portions (5) which are connected to respective end portions of the first place portion (4) and are rotatable about connection lines as axes, connecting them and the first face plate portion (4). The second face plate portions (5) are rotatably provided in a predetermined range from a position where they become flush with the first face plate portion (4) in a direction that they approach the holding plate (2).

Abstract: Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Abstract: A polishing member for use in the chemical mechanical planarization of a semiconductor wafer has a first surface for contacting the semiconductor wafer, a second surface opposite the first surface oriented away from the wafer. A plurality of grooves formed in the second surface. The plurality of grooves enable the polishing member to conform to the surface of the wafer and provide uniform polishing of the wafer. In one embodiment the polishing member comprises a linear belt having at least two portions mated at a joint. The plurality of grooves reduce the stress on the joints by increasing the flexibility of the belt thereby reducing the risk of delamination of the belt and joints.

Abstract: A coated abrasive backing consisting of an endless, seamless, loop is provided. The backing loop includes about 40-99% by weight of an organic polymeric binder, based upon the weight of the backing; and an effective amount of a fibrous reinforcing material engulfed within the organic polymeric binder material. The endless, seamless backing loop includes a length with parallel side edges, and at least one layer of fibrous reinforcing material engulfed within the organic polymeric binder material such that there are regions of organic binder material free of fibrous reinforcing material on opposite surfaces of the layer of fibrous reinforcing material. The fibrous reinforcing material can be in the form of individual fibrous strands, a fibrous mat structure, or a combination of the these. A method for preparing the endless, seamless backing loop for a coated abrasive belt is also provided.

Abstract: A coated abrasive backing consisting of an endless, seamless, loop is provided. The backing loop includes about 40-99% by weight of an organic polymeric binder, based upon the weight of the backing; and an effective amount of a fibrous reinforcing material engulfed within the organic polymeric binder material. The endless, seamless backing loop includes a length with parallel side edges, and at least one layer of fibrous reinforcing material engulfed within the organic polymeric binder material such that there are regions of organic binder material free of fibrous reinforcing material on opposite surfaces of the layer of fibrous reinforcing material. The fibrous reinforcing material can be in the form of individual fibrous strands, a fibrous mat structure, or a combination of the these. A method for preparing the endless, seamless backing loop for a coated abrasive belt is also provided.

Abstract: The invention provides individually made abrasive discs with the primary abrasive surface around the periphery of the disc where the bulk of the abrading action occurs when the disc is in use. The invention also provides a process by which these discs can be made using a unique grain feeding technique which is capable of depositing abrasive grain on a backing surface accurately and in annular patterns.

Abstract: A polishing pad and/or platen for use in a chemical mechanical polishing system is provided. The polishing pad and/or platen have slurry distribution/retaining grooves formed on a surface thereof. In one embodiment, the grooves are formed on the upper polishing surface of a pad for use in a rotary or linear polishing system. In another embodiment, an upper mounting surface of a platen is patterned with grooves. The grooves are adapted to direct the flow of slurry inwardly from a perimeter portion of the pad/platen. In operation, the grooves provide uniform distribution of slurry to areas on a polishing pad/platen.

Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m&mgr; are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.

Abstract: A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body.

Abstract: An abrasive fine inorganic powder is dispersed in silicone rubber to confer adequate wet strength and chemical resistance.

Abstract: The present invention relates to an aesthetically appealing nail file/buffer comprising a core with an abrasive surface on at least one side of the core and a durable, decorative pattern or design. Preferably, the tool has a core which includes a substantially rigid substrate and at least one layer of resilient material laminated to the substrate. Abrasive material is adhered to at least one side of the core, and glitter may be mixed with the abrasive material. The tool preferably includes materials, such as substantially transparent plastics or gels, possibly with colored pigment, which create a unique, attractive nail file. The tool typically includes a colored pattern, preferably by embedding dyes into the hiatused abrasive surface of the tool using sublimation. Alternatively, the tool may incorporate a patterned sheet under the abrasive material, the abrasive material being composed of substantially clear materials allowing the pattern to show therethrough.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or, finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other electronic devices.

Abstract: A finishing star or spinner abrasive tool is formed of inner and outer packs of square sheets of abrasive cloth or sandpaper with the inner packs angularly offset from the outer packs on the mandrel axis. Each sheet is formed with discontinuous radial slits extending beyond an unslit center section around a center fastener forming the mandrel drive hole. The slits provide surface flexibility while maintaining sheet integrity as it wears to circular form. An optional backing core is provided in the middle of the tool in the form of a cloth-sisal quilt acting as a cushion backing for the sheets, and which may retain coolant or compound during operation. The tool has longer working life with improved flexibility and working characteristics.

Abstract: An abrasive member made of a silica molding predominantly comprised of silica is described. The abrasive member has a bulk density of 0.2 to 1.5 g/cm3, a BET specific surface area of 10 to 400 m2/g, an average particle diameter of 0.001 to 0.5 &mgr;m, and a multiplicity of interconnecting minute pores which are open to the exterior. A solid soluble in a polishing liquid is made present within the minute pores of the silica molding. The abrasive member is fixed or fitted to a supporting auxiliary to be assembled into an abrasive disc. The abrasive disc is used for polishing a material to be polished, by rubbing the material to be polished therewith while at least one of the abrasive disc and the material to be polished is moved and while a polishing liquid is applied to the abrasive disc.

Abstract: An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.

Abstract: This invention pertains to an abrasive article comprising precisely shaped particles. The abrasive article may be a coated abrasive article, a bonded abrasive or a nonwoven abrasive article. The precisely shaped particles may further comprise abrasive grits, fillers, grinding aids and lubricants.

Abstract: A polishing pad having a soft layer with a porous structure impregnated with a relatively hard material that locally deforms irreversibly under polishing pressure to a substantially flat polishing pad surface.

Abstract: A molded abrasive product which is made mainly of a zirconia component and which has a bulk density of from 0.5 to 5.2 g/cm3, a BET specific surface area of from 0.1 to 100 m2/g and an average particle size of from 0.005 to 50 &mgr;m.

Abstract: An abrasive article is provided comprising a rigid backing having a first major surface and a second major surface; a plurality of ceramic abrasive composites each comprising a plurality of abrasive particles distributed throughout a porous ceramic matrix; and at least one metal coating which affixes the ceramic abrasive composites to at least one major surface of the backing.

Abstract: A polishing pad comprising: a base from which extends multiple posts having top surfaces that collectively provide a polishing surface on the polishing pad, and each of the top surfaces being recessed with an opening to provide a second cutting edge on the post, and the opening providing a reservoir for polishing fluid.

Abstract: An apparatus and method for removing a polishing pad from a platen during a CMP process is disclosed. The invention facilitates the removal of a polishing pad from a platen by providing a polishing pad having at least one protuberance portion extending from the main portion of the pad such that the polishing pad may be removed manually or with the assistance of a device by engaging the protuberance portion.

Abstract: The invention provides a polishing sheet comprising a support and an abrasive layer formed thereon with an adhesive layer interposed therebetween, characterized in that the adhesive layer is formed by a cured layer of a thermosetting and/or photo-curable curable adhesive composition based on at least one resin selected from the group consisting of (A) an ethylene-vinyl acetate copolymer, (B) a copolymer of ethylene, vinyl acetate, and an acrylate and/or methacrylate monomer, (C) a copolymer of ethylene, vinyl acetate, and maleic acid and/or maleic anhydride, (D) a copolymer of ethylene, an acrylate and/or methacrylate monomer, and maleic acid and/or maleic anhydride, and (E) an ionomer resin in the form of an ethylene-methacrylic acid copolymer whose molecules are bonded by a metal ion.

Abstract: A method and an apparatus for releasably attaching a polishing pad to a support surface under the polishing pad. In one embodiment of the invention, a polishing pad has a first surface for planarizing a substrate assembly, a second surface contacting the support surface, and an interlocking element. The support surface has a retaining member configured to engage the interlocking element on the polishing pad. The interlocking element and retaining member can be any one of several configurations, including: tongue and groove, protuberance and depression, reciprocal elongated ridges, or teeth.

Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.

Abstract: The invention provides individually made abrasive discs with the primary abrasive surface around the periphery of the disc where the bulk of the abrading action occurs when the disc is in use. The invention also provides a process by which these discs can be made using a unique grain feeding technique which is capable of depositing abrasive grain on a backing surface accurately and in annular patterns.

Abstract: In the method for the manufacture of dental tools for the treatment of surfaces, a rubber core serving as a carrier layer is first applied by injection molding onto the spindle of the tool, and the abrasive layer comprising the abrasive grains is subsequently applied to the carrier layer. In another method for the manufacture of dental tools for different treatments of surfaces, more particularly for coarse grinding, finishing, and polishing, rubber-elastic masses of different degrees of hardness are used for the abrasive parts of the tools according to the intended treatment, and abrasive grains of the same size are embedded in the rubber-elastic mass of these parts.

Abstract: An abrasive shaped article composed of at least 90% by weight, based on the weight of the abrasive shaped article, of silica and having a bulk density of 0.2 g/cm3 to 1.5 g/cm3, a BET specific surface area of 10 m2/g to 400 m2/g and an average particle diameter of 0.001 &mgr;m to 0.5 &mgr;m. An abrasive disc having fitted thereto at least one of the abrasive shaped article is advantageously used for polishing a material such as substrate. Preferably at least two kinds of abrasive shaped articles are fitted to the supporting auxiliary, at least one kind of which has a bulk density of 0.7 g/cm3 to 1.5 g/cm3 and at least one kind of which has a bulk density of at least 0.2 g/cm3 but smaller than 0.7 g/cm3.

Abstract: An abrasive article is formed from a lofty nonwoven abrasive pad and one or more abrasive sheets. In one embodiment, each sheet has an abrasive layer on its front side and a plurality of engagement stems on its back side. Enough of the engagement stems engage fibers on the surface of the nonwoven pad to affix the two components together for workpiece surface treatment. In another embodiment, the nonwoven pad has a slit therein, and each abrasive sheet has a portion thereof inserted into its respective slit to anchor the sheet to the pad. In this embodiment, each sheet has an abrasive layer on its front side but may have no stems on its back side. In either embodiment, the sheets are readily replaceable on the nonwoven pad, thus creating a very simple and versatile arrangement for varying the abrasive characteristics presented to the workpiece.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: An abrasive article is formed having a barrier coating coextensive with and interposed between a backing and an abrasive coating. The hardened barrier coating essentially eliminates penetration of the abrasive coating into the backing, especially volatile materials. The barrier coating comprising as starting materials a water-borne resin that upon hardening forms a crystalline or semi-crystalline polymer, a major polyfunctional crosslinking agent, and at least one minor polyfunctional crosslinking agent. The minor polyfunctional crosslinking agent enhances the attachment of the abrasive coating to the barrier coating.

Abstract: A polishing pad is provided for chemical-mechanical polishing a dielectric layer in a multilevel semiconductor device. Embodiments include providing a polishing pad comprising a plurality of raised elements thereon and mechanically polishing a highly porous dielectric layer to form a planarized interlevel dielectric layer.

Abstract: A seamless, composite belt that is designed to maintain a substantially flat surface in the span between two rollers. The belts typically have one or more polymer layers, including the polishing layer, and one or more supporting woven or non-woven layers. The belts have the necessary balance between down-cupping and up-cupping forces achieved by: 1) varying the relative thickness of the different polymer and supporting layers in the belt, 2) varying the relative hardness or rigidity of the different layers in the belt, 3) varying the temperatures at which the different layers are formed, 4) varying the compositions of supporting layers, and 5) prestressing one or more of the composite layers. The belts are particularly useful in chemical mechanical polishing of semiconductor wafers.

Abstract: Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern elements distributed over the first surface of the backing member, and a hard cover layer over the pattern elements. The pattern elements define a plurality of contour surfaces projecting away from the first surface of the backing member. The cover layer at least substantially conforms to the contour surfaces of the pattern elements to form a plurality of hard nodules projecting away from the first surface of the backing member. The hard nodules define abrasive elements to contact and abrade material from a microelectronic-device substrate assembly. As such, the cover layer defines at least a portion of a planarizing surface of the polishing pad.

Abstract: The present invention discloses a new surface geometry of a polycrystalline diamond (PCD) cutter whereby large chips are prevented from forming in front of the cutter. The surface geometry includes recess(es) and/or raised region(s) that can act as chip breakers and also increase turbulence in the flow across the face of the cutter and thus increase the Heat transfer coefficient and reduce drag. PCD surface's geometric configuration is formed in the high temperature/high heat (HT/HP) process and is therefore integral with the cutter. This invention thus provides a polycrystalline cutter with improved cutting capability by preventing chip build up and enhanced heat transfer resulting in a cooler cutting edge temperature.

Abstract: A polishing cloth according to the present invention includes: a polishing cloth substrate; a pressure-sensitive adhesive layer laminated on one face of the polishing cloth substrate; and a release sheet attached to the pressure-sensitive adhesive layer in a releasable manner. The pressure-sensitive adhesive layer includes an adhesive composition containing a polymer, the polymer having a first-order melt transition in a temperature range narrower than 15° C. Thus, the present invention provides a polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine such that the polishing cloth can be peeled off the base by simply cooling the base plate and the adhesive layer of the polishing cloth.

Abstract: Midspan access to selected optical fibers which are encapsulated in an optical ribbon or tube is achieved by placing the desired span of the encapsulated fibers to be accessed between opposing abrasive layers and controllably urging at least one of the abrasive layers in the direction of the opposing abrasive layer to cause both abrasive layers to contact the encapsulant which covers the fibers. The amount of force applied to the at least one abrasive layer is limited by the structure of a resilient element which is coupled to the abrasive surface. Stress concentrators are created in the encapsulant and the encapsulant is removed from the span portion by relative movement of the encapsulated fibers and the abrasive layers. A minimum separation distance between the opposing abrasive layers can be defined, according to the thickness of the specific encapsulated fiber medium undergoing fiber separation, to avoid contact between the abrasive surfaces and the fibers within the medium.

Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m.mu. are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.

Abstract: The present invention relates to an aesthetically appealing nail file/buffer comprising a core with an abrasive surface on at least one side of the core and a durable, decorative pattern or design. Preferably, the tool has a core which includes a substantially rigid substrate and at least one layer of resilient material laminated to the substrate. Abrasive material is adhered to at least one side of the core. The tool preferably includes materials, such as substantially transparent plastics or gels, possibly with colored pigment, which create a unique, attractive nail file. The tool typically includes a colored pattern, preferably by embedding dyes into the hiatused abrasive surface of the tool using sublimation. Alternatively, the tool may incorporate a patterned sheet under the abrasive material, the abrasive material being composed of substantially clear materials allowing the pattern to show therethrough.