Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.

Abstract: A coated abrasive includes a substrate, where the substrate has a first edge and a first plurality of flaps defining a first edge. The flaps can be manufactured with different shapes and spacing between the flaps to improve the conformability of the coated abrasive.

Abstract: A flexible hand-held abrasive article includes a conformable backup pad having opposed major surfaces, a backing layer affixed to one surface of the backup pad, the backing layer containing a plurality of biaxially oriented openings, and abrasive particles arranged on the backing layer, thereby defining an abrasive surface. A method of making such an abrasive article is also disclosed. The abrasive article may also comprise a backing layer containing a plurality of biaxially oriented slits with abrasive particles arranged at least one surface of the backing layer.

Abstract: Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive article in the presence of the conditioning particles to modify the surface of the workpiece and to condition the fixed abrasive. The fixed abrasive article comprises a substrate having a first surface and a region of abrasive composites distributed on the first surface of the substrate. The abrasive composites include a composite binder and abrasive particles, which may be in abrasive agglomerates together with a matrix material. The abrasive particles are harder than the workpiece. The conditioning particles are sufficient to condition one or more of the composite binder, matrix material, and abrasive agglomerates. The hardness of the conditioning particles is less than the hardness of the workpiece and they do not substantially polish the workpiece.

Abstract: Polishing tools and associated methods are disclosed. In one aspect, a tool for polishing a work piece is provided. Such a tool may include a solid substrate with a greater than 10 wt % graphite having a high degree of graphitization. The solid substrate may have a working surface which has asperities having a tip-to-tip RA value of less than or equal to about 10 ?m, and the working surface may have a surface roughness RA value of less than or equal to about 50 ?m. A method for making such a tool and a method for polishing a work piece are also presented.

Abstract: An abrasive sheet material comprising a first sheet having a first major suface and a second major surface and second sheets having first major surfaces and second major surfaces wherein the second major surfaces of the second sheets are affixed to the first major surface of the first sheet and spaces exist between the second sheets wherein said spaces form pathways that interweave between the second sheets wherein the pathways communicate with each other and form a network of pathways. At least one aperture extends from at least the first major surface of the first sheet to the second major surface of the first sheet and communicates with at least one of the pathways. Abrasive particles are coated onto at least the first major surface of the second sheets forming an abrasive first major surface.

Abstract: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. Such a method may include securing the plurality of superabrasive particles in the solidified organic material layer such that the organic material layer wicks up the protruding portions of the superabrasive particles. In addition to the wicking of the organic material layer around the superabrasive particles, various additional parameters may be utilized to improve retention. For example, in another aspect the plurality of superabrasive particles may be secured in an arrangement that minimizes mechanical stress impinging on protruding portions of any individual superabrasive particle when used to abrade a work piece.

Abstract: An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, a third filter media with channels, a fourth filter media, and an optional attachment layer. The openings of the porous abrasive layer cooperate with the channels to allow the flow of particles from the abrasive surface to the filter media.

Abstract: A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least 100 MPa. The impact modifier includes a low modulus component having a modulus of at least one order of magnitude less than the high modulus component that increases the impact resistance of the polishing pad.

Abstract: Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed.

Abstract: A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface of a substrate and define channels therebetween. The conductive processing pad may have lower features made of a conductive composite that extend into the sub-pad from the conductive carrier. The conductive processing pad is adhered to a sub-pad bound to an opposing conductive layer and the opposing conductive layer bound to a platen assembly.

Abstract: The present invention relates to an abrasive backing and abrasive cloth and more particularly, to an abrasive backing including an upper weave layer and a lower weave layer which are comprised with warps and wefts, and a binding yarn which connects the upper weave layer and the lower weave layer, wherein the abrasive backing is woven by using the wefts of the upper weave layer having a different thickness from those of the lower weave layer. when the weft of the upper weave layer and that of the lower weave layer have a different thickness, the upper weave layer and the lower weave layer may have uneven surface having different details and coat abrasive materials having different grain sizes.

Abstract: An abrasive element has a first surface region which coincides with an enveloping surface of the element, and a second surface region which does not. When the element is pressed against a planar surface, part of the second surface region, which is provided with abrasive material, comes into contact with the surface. Also disclosed are a system comprising at least two part-elements which can be connect to form an abrasive element, and methods for making and using the abrasive element.

Abstract: A structured abrasive article comprises a backing, a structured abrasive layer affixed to the backing, the structured abrasive layer comprising: a plurality of raised abrasive regions, each raised abrasive region consisting essentially of a close-packed plurality of pyramidal abrasive composites; and a network consisting essentially of close-packed truncated pyramidal abrasive composites, wherein the network continuously abuts and separates the raised abrasive regions from one another. The height of the pyramidal abrasive composites is greater than the height of the truncated pyramidal abrasive composites. Methods of making and using the same are also disclosed.

Abstract: A top layer comprises a flexible support and a plurality of hard elements anchored in a binder over the flexible support, and a method of forming the same is provided. In one embodiment, certain ones of the hard elements have a contact surface adapted to contact the conductive surface, with the binder being disposed below the contact surface of each of the certain ones of the hard elements. In another embodiment, the top layer comprises a flexible support, a plurality of hard elements are anchored in a binder over the flexible support such that certain ones of the hard elements have a top surface and the binder is disposed below the top surface of each of the certain ones of the hard elements, and a hard material coating is disposed over the plurality of hard elements and the binder, thereby creating a contact surface of the hard material coating at locations corresponding to the top surface of the certain ones of the hard elements.

Abstract: An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, a third filter media with channels, a fourth filter media, and an optional attachment layer. The openings of the porous abrasive layer cooperate with the channels to allow the flow of particles from the abrasive surface to the filter media.

Abstract: This invention relates to reinforcement of various items by the use of a fibre substrate such as filament tape. The reinforced items may be used for strengthening abrasive paper, packaging and cabling.

Abstract: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method for making a low-melting point superabrasive tool having a plurality of superabrasive particles is provided. Such a method may include coating each of the plurality of superabrasive particles with a reactive element that chemically bonds to each of the plurality of superabrasive particles and bonding together the plurality of superabrasive particles with a molten braze that wets the reactive element at a temperature of less than about 700° C. In some aspects, the method may further include arranging the plurality of superabrasive particles on a leveling surface and bonding the plurality of superabrasive particles together with the molten braze such that, upon formation of the superabrasive tool, the plurality of superabrasive particles have been leveled by the leveling surface to an RA value of less than about 40 ?m.

Abstract: A chemical mechanical polishing pad which has a storage elastic modulus E?(30° C.) at 30° C. of 120 MPa or less and an (E?(30° C.)/E?(60° C.)) ratio of the storage elastic modulus E?(30° C.) at 30° C. to the storage elastic modulus E?(60° C.) at 60° C. of 2.5 or more when the storage elastic moduli of a polishing substrate at 30° C. and 60° C. are measured under the following conditions: initial load: 100 g maximum bias: 0.01 % frequency: 0.2 Hz. A chemical mechanical polishing process makes use of the above chemical mechanical polishing pad. The chemical mechanical polishing pad can suppress the production of a scratch on the polished surface in the chemical mechanical polishing step and can provide a high-quality polished surface, and the chemical mechanical polishing process provides a high-quality polished surface by using the chemical mechanical polishing pad.

Abstract: A coated abrasive article has a backing treatment preparable by at least partially polymerizing an isotropic backing treatment precursor comprising polyepoxide, polyfunctional urethane (meth)acrylate, non-urethane polyfunctional (meth)acrylate, acidic free-radically polymerizable monomer, dicyandiamide, photoinitiator. Methods of making and using the same.

Abstract: A curable composition comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional urethane(meth)acrylate, dicyandiamide and photoinitiator. The curable composition is useful for preparing treated backings and coated abrasive articles.

Abstract: An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.

Abstract: A direct-coated sponge abrasive material bearing a releasable securing means comprising one part of a two part hook and loop attachment system is provided.

Abstract: The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a plurality of temporary shaped structures comprised of said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; and curing the softened particulate curable binder material to convert said temporary shaped structures into permanent shaped structures and cure the at least partially cured primer coating on the first surface of the backing. The invention also provides an abrasive product made by the method.

Abstract: A resilient hand-held abrasive article includes a flexible conformable backing layer having opposed first and second major surfaces, a flexible reinforcing layer affixed to at least one of the backing layer first and second major surfaces, and abrasive particles arranged on the reinforcing layer, thereby defining an abrasive surface. The backing layer comprises a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern that provides open spaces between adjacent connected bodies.

Abstract: A conditioner including abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.

Abstract: A method and system are disclosed. The system may include a device for sharpening a convex edge on the blade of a knife. The device may include a resilient material and a plurality of abrasive sheets of varying grit values. Each abrasive sheet may be removably attachable to a top of the resilient material. The method may include placing the blade against the abrasive surface at a small angle with a first side of an edge to be sharpened of the blade contacting the abrasive surface and a spine of the blade elevated above the abrasive surface, applying a downward force on the blade causing the edge to be sharpened to compress the resilient abrasive surface, and moving the first side of the edge to be sharpened along the abrasive surface in the direction of the spine.

Abstract: The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydroxybutyric acid, hydroxyvaleric acid, caprolactone, p-dioxanone, trimethylene carbonate, butylene succinate, butylene adipate, monosaccharides, dicarboxylic acid anhydrides, enantiomers thereof, and combinations thereof. The invention is further directed to methods of its use.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a polymer netting with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The polymer netting cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: CMP pad dressers and their methods of manufacture are disclosed. One aspect of the present invention provides a CMP pad dresser having improved superabrasive grit retention in a resin layer. The CMP pad includes a resin layer, superabrasive grit held in the resin layer such that an exposed portion of each superabrasive grit protrudes from the resin layer, and a metal coating layer disposed between each superabrasive grit and the resin layer, where the exposed portions are substantially free of the metal coating layer. The metal coating layer acts to increase the retention of the superabrasive grit in the resin layer as compared to superabrasive grit absent the metal coating layer.

Abstract: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and an apertured attachment interface with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The apertured attachment interface cooperates with the screen abrasive to allow the flow of particles through the abrasive article.

Abstract: Polishing tools and associated methods are disclosed. In one aspect, a method of polishing a work piece is provided. Such a method may include providing a polishing tool having asperities on a working surface, where the asperities have a tip-to-tip RA value of less than or equal to about 10 ?m, and the working surface has a surface roughness RA value of less than or equal to about 50 ?m. The method may further include contacting the tips of the asperities against an interface surface of the work piece and moving the tips of the asperities in a direction substantially parallel to the interface surface of the work piece such that the interface surface is polished.

Abstract: The present invention is directed to an abrasive article and methods of making the abrasive article. An abrasive coating on the abrasive article comprises at least 20% by weight of a superabrasive particle. The abrasive coating is derived from an abrasive slurry. The abrasive slurry may comprise and a dispersant having an AV wherein AV=1000*[(Amine Value)/(Mw)]. The dispersant comprises a polymer having a molecular weight (Mw) of greater than 500 g/mol and an AV of greater than 4.5, a polymer having a molecular weight (Mw) of greater than 10,000 g/mol and an AV of greater than 1.0, or a polymer having a molecular weight (Mw) of greater than 100,000 g/mol and an AV of greater than 0.

Abstract: A resilient flexible abrasive article includes a continuous backing layer including a support layer coated with foam, the continuous backing layer having opposed major surfaces, at least one of the major surfaces including a three dimensional surface topography including raised and recessed regions, and wherein the raised and recess regions are at least partially coated with abrasive particles, thereby defining an abrasive surface.

Abstract: An apparatus for making a surface treating article, and in one embodment for making a plurality of surface treating articles. The apparatus includes an attaching means for attaching a fastener to a surface treating web and a cutting means for cutting the web around the fastener to provide a surface treating article. In one embodiment, a sensor, such as a machine vision system, senses a position of the fastener on the web, with this sensed position being used to direct operation of the cutting means.

Abstract: Provided is a fixed abrasive article for polishing a workpiece having a hardness comprising (a) a substrate having a first surface and a second surface, (b) a region of abrasive composites distributed on the first surface of the substrate, and (c) a region of conditioning amalgams distributed on the first surface of the substrate. The abrasive composites include a composite binder and abrasive particles of a first hardness, which first hardness is higher than the hardness of the workpiece. The amalgams include an erodible binder and conditioning particles sufficient to condition the composite binder and having a second hardness, which second hardness is less than the hardness of the workpiece and greater than the hardness of the composite binder. Also provided are other abrasive articles, and methods of making them.

Abstract: Coated abrasive articles have a tie layer that is preparable by at least partially polymerizing an isotropic polymerizable composition comprising a polyfunctional aziridine, an acidic free-radically polymerizable monomer, and an oligomer having at least two pendant free-radically polymerizable groups, wherein homopolymerization of the oligomer results in a polymer having a glass transition temperature of less than 50 degrees Celsius.

Abstract: Coated abrasive articles have a composite tie layer. The composite tie layer is preparable by disposing a first polymerizable composition comprising a polyfunctional aziridine on a backing, and disposing a second polymerizable composition comprising at least one acidic free-radically polymerizable monomer and at least one oligomer having at least two pendant free-radically polymerizable groups on the first polymerizable composition, at least partially polymerizing the first and second polymerizable compositions, wherein homopolymerization of the oligomer results in a polymer having a glass transition temperature of less than 50 degrees Celsius.

Abstract: An abrasive tool comprising of a base portion (2), having a foam layer (3) affixed to the abrasive tool base portion, and a plastic film layer (4) affixed, bonded or glued to the foam layer. This tool is adapted to receive an abrasive material layer (5) or sand paper or other abrasive material having a pressure sensitive adhesive applied to one side of the abrasive material, to allow said abrasive material to be stuck and affixed to the abrasive tool. The abrasive tool may be hand operated, or operated by electric power, air power, or other motive power.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: It is provided a polishing pad of novel construction capable of controlling actively and efficiently a slurry flow during polishing a surface of a semiconductor substrate, such as a wafer, thus making it possible to precisely and stably performing a desired polishing process. Onto a surface of a pad substrate 12 of synthetic resin material, formed is a groove 16 extending approximately circumferentially. An inner circumferential wall surface 20 and an outer circumferential wall surface 22 are made parallel to each other and slant with respect to a center axis 18 of the pad substrate 12.

Abstract: An attachable abrasive article comprises an abrasive member having an attachment device affixed thereto. The attachment device comprises a fastener having a flange thereon. Thermoplastic material is disposed between the flange and the abrasive article. The disclosure also concerns methods of making and using attachable abrasive articles.

Abstract: A coated abrasive having an abrasive surface comprising a plurality of individual abrasive structures can be modified to convey information by changing the appearance, for example by changing the size, shape or spacing of the structures to create patterns conveying the information.

Abstract: A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.

Abstract: A polishing device capable of polishing a repaired surface in a specified shape, comprising a polishing panel body holding a polishing material on a surface opposed to the repaired surface and polishing the repaired surface in the specified shape with the polishing material and a holding part installed on the polishing panel body and held when the polishing panel body is operated, wherein the holding part is installed on the polishing panel body rotatably about an axis set on the polishing panel body, whereby a controllability can be improved, the labor of a worker can be reduced, and the disturbance of smoothness on the repaired surface and the premature wear of sand paper can be suppressed.

Abstract: A vitrified bond tool including: (a) a support body; (b) a vitrified bond layer which is formed on a working surface of the support body; and (c) a plurality of abrasive grains which are held by the vitrified bond layer so as to be fixed relative to the working surface of the support body and which are spaced apart from each other with spacing between the adjacent ones of the abrasive grains. This vitrified bond tool is advantageously manufactured according to a method including the steps of (i) forming a pattern layer which includes a vitrified bond, in a predetermined pattern on the working surface of the support body; (ii) sprinkling the abrasive grains over the pattern layer before the pattern layer is dried; and (iii) firing the pattern layer and the abrasive grains which are bonded to the pattern layer and are arranged in the predetermined pattern on the working surface of the support body.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: The present invention comprises a customized polishing pad for use in a wafer polishing machine. The polishing pad of the present invention includes a polishing surface integral with the polishing pad. The polishing surface is adapted to frictionally contact a wafer in the polishing machine, thereby polishing the wafer. The polishing surface of the polishing pad includes at least two areas, where each area is adapted to frictionally contact the wafer and achieve a polishing effect specific for that area. A customized polishing effect is achieved by the polishing pad of the present invention when the wafer is selectively moved frictionally against the at least two areas by the wafer polishing machine.

Abstract: A set of profiled sanding pads for doing bodywork on vehicles and the like where specific areas require sanding attachments that conform to the unique contours encountered. The set of profiled sanding pads includes a plurality of elongate members, each having a distinctive configuration with a padded sanding side, and a side mountable to an existing sander.

Abstract: The scouring pad comprises a wad (10) of looped scouring wire. The wad is constituted by substantially concentric windings of the wire (12) such that it presents substantially the form of a toroidal ring. The pad has means for holding the windings together, said means comprising at least one binding strap (20) going around a section of the ring and disposed substantially on a meridian of the torus formed by the ring.