Abstract: The present invention relates to the use of an aqueous polymer dispersion comprising dispersed particles of at least one polymer A1 having a glass transition temperature, Tg, of from ?20° C. to +35° C. and obtainable through free-radical emulsion polymerization in the presence of a polymer A2 synthesized from from 50 to 99.5% by weight of at least one ethylenically unsaturated monocarboxylic and/or dicarboxylic acid whose carboxylic groups can form an anhydride group, or mixtures thereof, from 0.5 to 50% by weight of at least one ethylenically unsaturated compound selected from the esters of ethylenically unsaturated monocarboxylic acids and the monoesters and diesters of ethylenically unsaturated dicarboxylic acids with an amine containing at least one hydroxyl group, and up to 20% by weight of at least one further monomer as binder for producing abrasive material.

Abstract: An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated mold and cured. The molded product is then removed from the mold and double side faced or ground to form a single thin polishing pad comprising a single layer of homogeneous material.

Abstract: A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located between the working and the attaching layer and having a peripheral region which is thinner and also a central region which is thicker than the peripheral region and therefore has an increased elasticity so that during polishing an elasticity of a central portion of the working layer is increased.

Abstract: A recycled polishing pad conditioner comprises a base plate and a reversed abrasive disc that is flipped over from its original configuration. The reversed disc comprises an exposed abrasive face having an unused abrasive face comprising abrasive particles. A bond face of the disc is affixed to the base plate, the bond face comprising a used abrasive face that was previously used to condition polishing pads. Also described is a pad conditioner having an abrasive face comprising exposed portions of abrasive particles, with at least about 60% of the abrasive particles having a crystalline structure with substantially the same crystal symmetry.

Abstract: A chemical mechanical polishing (CMP) pad includes a unitary body having a first side and a second side, the first side having a plurality of holes formed therein, and the second side having a plurality of grooves formed therein. Each of the plurality of holes in the first side is aligned with one of the plurality of grooves in the second side.

Abstract: A multi-layer flexible non-skid cushioning tape having a top layer of plastic material having a frictional surface thereon, an elastomeric cushioning layer comprising a neoprene/EPDM/SBR blend, and an adhesion layer of a plastic sheet with a pressure sensitive adhesive thereon. The layers are laminated together for application to a platform. The cushioning tape provides a vibration-absorbing, non-skid surface with an improved coefficient of friction-resisting slippage.

Abstract: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.

Abstract: Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a surface roughness Ra<3 microns. Another conditioned polishing pad is porous and has a surface height probability distribution with a pad surface height Ratio R?60%, or alternatively has an asymmetric surface height probability distribution characterized by an asymmetry factor A10?0.50. Methods of pad conditioning and planarizing a wafer using the polishing pads are also disclosed.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.

Abstract: An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing using a polishing pad having a multi-layered structure of a polishing layer and a supporting layer, and a polishing process using thereof. The polishing pad of the present invention is characterized in that it is comprising a supporting layer which is a non-porous elastic body and a polishing layer which is laminated on one surface of the supporting layer, and a polishing process using thereof. Shore D hardness of the polishing layer is preferably 35 or more, and hardness of the supporting layer is preferably lower than that of the polishing layer.

Abstract: The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shaped engaging elements that are one part of a two-part mechanical engagement system. An abrasive product is provided by coating at least the raised areas of the backing with an abrasive coating.

Abstract: A high quality polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafer, etc. which is not affected by the change of polishing conditions during polishing and can attain excellent removal rate, capacity of step height reduction and uniformity is described, wherein a polyurethane-based foam 12 having fine and uniform cells 20 suitable for polishing of semiconductor material, etc. obtained by reaction-injection molding a gas-dissolved raw material prepared by dissolving an inert gas in a mixture of a polyurethane or polyurea as a main raw material and various subsidiary raw materials under pressure is used.

Abstract: Planarizing machines and methods for selectively using abrasive slurries on fixed-abrasive planarizing pads in mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies. In one embodiment of a method in accordance with the invention, a microelectronic substrate is planarized by positioning a fixed-abrasive planarizing pad on a table of a planarizing machine, covering at least a portion of a planarizing surface on the pad with a first abrasive planarizing solution during a first stage of a planarizing cycle, and then adjusting a concentration of the abrasive particles on the planarizing surface at a second stage of the planarizing cycle after the first stage. The concentration of the second abrasive particles can be adjusted during the second stage of the planarizing cycle by coating the planarizing surface with a non-abrasive second planarizing solution without abrasive particles during the second stage.

Abstract: Abrasive body (1) capable of being used in surface processing devices that has an active face (2a) provided with appropriate means of abrasion (3) intended to perform finishing operations on the surface of an object when the said body is set in motion. The abrasive body has a predetermined number of substantially passing cuts (6) defined by the respective flaps (7, 8) lying side by side. When the abrasive body is set in motion on an object to be processed, flaps (7, 8) deform in such a manner as to create appropriate opening that will permit the abraded dust particles to be removed solely and exclusively from that part of the abrasive body actually in contact with the object (FIG. 2).

Abstract: A chemical mechanical polishing to polish a substrate having a layer to be polished thereon is described. A pre-polishing process is performed using a softer polishing pad to remove partially raised parts of the layer to be polished before conducting a polishing process using a harder polishing pad. Since the first polishing pad is flexible, porous and with low density, the first polishing pad can be deformed to increase contact areas between the first polishing pad and the raised part of the layer to be polished, and the abrasives are embedded easily in holes of the surface of the first polishing pad. Ultimately, the layer to be polished can be polished directly during the pre-polishing process. Therefore, the processing time is reduced, the consumption of the slurry is decreased and the process cost can be cut down substantially.

Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

Abstract: A surface treating article including a surface treating member and a fastener including a fiducial. The present invention also provides a preferred method of making a surface treating article that includes to a method of sensing the location of a fasteners on a surface treating web and thereafter cutting the surface treating web around the fastener to provide a surface treating article.

Abstract: An abrasive molding consisting essentially of inorganic particles having an average particle diameter in the range of 0.005 &mgr;m to 0.3 &mgr;m, and having a relative density in the range of 45% to 90%, provided that pores having a diameter of at least 0.5 &mgr;m are excluded from the molding. The abrasive molding is used for polishing a material to be polished by using a polishing liquid, preferably water or an aqueous solution of an alkali metal hydroxide, which does not contain a loose abrasive grain.

Abstract: Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mold or carrier and curing the froth to form a fixed abrasive material having an open cell structure containing between about 5 and 85 wt % abrasive particles and a dry density of about 350 kg/m3 to 1200 kg/m3.

Abstract: Coated abrasive articles comprise a backing and an abrasive layer, wherein at the abrasive layer comprises a reaction product of components comprising polyfunctional acrylate, alicyclic polyepoxide, and aromatic polyepoxide having an average epoxy functionality of at least 2.5.

Abstract: An abrasive film for polishing a workpiece, including: (a) a substrate; (b) a binder; (c) a multiplicity of abrasive grains which are fixed to a surface of the substrate by the binder; and (d) a water-soluble inorganic compound or a water-soluble organic acid alkali metal salt which is added to the binder. The water-soluble inorganic compound preferably consists of a weak-alkali metal salt or a weak-acid metal salt. The water-soluble organic acid alkali metal salt preferably consists of an anionic surface-active agent or a carboxylic acid alkali metal salt.

Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing, pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad also exhibits a stable morphology that can be reproduced easily and consistently. The pad surface has macro-texture that includes perforations as well as surface groove designs The surface groove designs have specific relationships between groove depth and overall pad thickness and groove.area and land area.

Abstract: An abrasive body which includes an abrasive layer bonded to a substrate along an interface and at least one strip-like projection extending from the interface into the substrate. The projection has a profile which includes a substantially flat central portion and connecting surfaces to either side of the central section. The surface is sloped from the central section to the interface.

Abstract: An abrasive article backup plate assembly and grinder system having an abrasive article backup plate assembly is disclosed. The abrasive article backup plate assembly includes an abrasive article having an abrasive surface that includes a viewing window within the abrasive surface. A support member is provided including a first major surface which supports the abrasive article. At least a portion of the support member is made of materials sufficiently clear to collectively see through the support member and the viewing window. A method of abrading a surface using a grinder system including the abrasive article backup plate assembly is also disclosed.

Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.

Abstract: A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of the frame assembly, a cleaning fluid is sprayed onto the web in order to clean the web between planarization cycles.

Abstract: The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.

Abstract: A tearable abrasive article is provided which includes a backing comprising a polymer film having a scrim partially embedded therein and an abrasive coating comprising a plurality of abrasive articles and a binder bonded to at least one side of the backing.

Abstract: Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one embodiment, a planarizing pad for mechanical or chemical-mechanical planarization includes a base section and a plurality of embedded sections. The base section has a planarizing surface, and the base section is composed of a first material. The embedded sections are arranged in a desired pattern of voids, and each embedded section has a top surface below the planarizing surface to define a plurality of voids in the base section. The embedded sections are composed of a second material that is selectively removable from the first material. A planarizing pad in accordance with an embodiment of the invention can be made by constructing the embedded sections in the base section and then removing a portion of the embedded sections from the base section. By removing only a portion of the embedded sections, this procedure creates the plurality of voids in the base section and leaves the remaining portions of the embedded sections.

Abstract: A nonabsorbent, abrasive scrubbing pad, especially for domestic use in the kitchen or bathroom, comprising a nonwoven web of fibers in which the fibers have coated thereon a mixture of antimicrobial compounds. The antimicrobial compounds are dispersed in a coating material that is applied to the fibers and then cured to anchor the antimicrobial compounds in the coating and prevent their being leached. The coating preferably also has dispersed therein abrasive particles to provide an abrasive scrubbing pad. More broadly, any substrate can be provided with an antimicrobial coating by mixing into a curable, film-forming composition an antimicrobial compound, coating the substrate with the mixture, and curing the mixture on the substrate.

Abstract: New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements and finishing surfaces can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Abstract: A system and method for cleaning probe pins on a probe card used in testing a semiconductor device during fabrication thereof. A ceramic cleaning wafer is utilized to clean the probe pins without having to remove the probe card from a production line. The same apparatus used to test production wafers also handles the cleaning wafer during a probe cleaning cycle. During operation of the cleaning cycle, the cleaning wafer is placed in a manual load tray, which inserts the cleaning wafer into a prober machine. The cleaning wafer is transported by a robotic trolley to a prealign stage area where the cleaning wafer is aligned and centered. The cleaning wafer is then placed on a support device. The support device and cleaning wafer are positioned under a pneumatic sensor and profiled to determine wafer planarity. The support device and cleaning wafer are then positioned underneath the probe pins on the probe card to be cleaned.

Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.

Abstract: Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path.

Abstract: A surface treating article including a surface treating member and a fastener including a fiducial. The present invention also provides a preferred method of making a surface treating article that includes to a method of sensing the location of a fasteners on a surface treating web and thereafter cutting the surface treating web around the fastener to provide a surface treating article.

Abstract: The present invention relates to a support (4-7) for temporary fixation of a self-sticking abrasive and/or polishing sheet (2) comprising an adhesive layer (3), said support (4-7) comprising a surface for receiving the sheet (2), where the surface of the support (4-7) is so adapted that the resulting adhesive force between the sheet (2) and the support (4-7) is varied over the surface of the support (4-7).

Abstract: A coated abrasive having an abrasive surface comprising a plurality of individual abrasive structures can be modified to convey information by changing the appearance, for example by changing the size, shape or spacing of the structures to create patterns conveying the information.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: A seamless polishing apparatus for utilization in chemical mechanical polishing is disclosed. The seamless polishing apparatus includes a base belt that has a reinforcement layer and a cushioning layer. The seamless polishing apparatus also includes a polishing pad that is attached to the base belt as a result of a direct casting of a polymeric precursor on a top surface of the cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.

Abstract: An apparatus (46) for reconditioning a protective surface (30) of an optically-read digital recording disc (20) includes a turntable (48) configured to receive a center hole (24) of the disc (20) and a first motor (52), coupled to the turntable (48), for rotating the turntable (48) and the disc (20) at a first rotational speed. The apparatus further includes a buffing element (50) for removing an amount of material from the protective surface (30) as the turntable rotates the disc (20) and a second motor (54), coupled to the buffing element (50) for rotating the buffing element (50) at a second rotational speed. A timing element (56) synchronizes the first and second motors (52, 54) to substantially simultaneously cease rotation of the turntable (48) and the buffing element (50) following removal of an amount of material from the disc (20).

Abstract: An arrangement for planarizing a surface of a semiconductor wafer. The arrangement includes a planarizing member having a planarizing surface configured to be (i) positioned in contact with and (ii) moved relative to the surface of the semiconductor wafer so as to remove material from the surface of the semiconductor wafer such that the surface of the semiconductor wafer is planarized. The arrangement also includes an adherence promoting ligand chemically bonded to the planarizing surface of the planarizing member. The arrangement further includes an abrasion particle chemically bonded to the adherence promoting ligand such that the abrasion particle is attached to the planarizing surface of the planarizing member. The arrangement also includes a conditioning bar having a conditioning portion positioned in contact with a wafer track defined on the planarizing member. The conditioning portion is configured so that the conditioning portion extends completely across the wafer track.

Abstract: Dishing in chemical mechanical polishing (CMP) is reduced by introducing a material that balances electrochemical forces. In a first embodiment of the invention, a polishing pad having copper material in grooves on the polishing pad surface is used in the polishing process to reduce dishing. In a second embodiment of the invention, the polishing pad has perforations with copper fillings. In a third embodiment of the invention, a copper retaining ring on the polishing head introduces copper material to the CMP process to reduce dishing. In a fourth embodiment of the invention, a conditioning plate of copper is used in the polishing apparatus. In a fifth embodiment of the invention, additional copper features are placed on the substrate to be polished. The polishing of the additional features introduces copper steadily through the polishing process. In a sixth embodiment of the invention, copper compounds are added to the polish slurry.

Abstract: A polishing pad for polishing glass and the like has a working layer with a plurality of polishing grains, an attaching layer with which the polishing pad is attachable to a polishing head of a power tool, and a connection layer which connects the working layer, with the attaching layer, and the connection layer is composed of vulcanizable material, which is vulcanized at certain temperature and under certain pressure and thereby connects the working layer with the attaching layer.

Abstract: An abrasive body which includes an abrasive layer bonded to a substrate along an interface and at least one projection extending from the interface into the substrate. The a projection has an essentially elliptical or circular form in plan and a profile which includes a substantially flat central portion and connecting surfaces joining the central portion to the interface and which slope towards the interface.

Abstract: A composite polishing pad for use in a linear chemical-mechanical polishing apparatus is provided. The pad comprises a hard polishing pad having a polishing surface and an attachment surface opposite the polishing surface, the attachment surface comprising a border comprising an adhesive, the border surrounding a cavity, the cavity being sized and shaped to receive a soft polishing pad. The soft polishing pad is disposed completely in the cavity and completely fills the cavity, and the soft polishing pad has a first side adhered in the cavity of the hard polishing pad, and a second side comprising an adhesive, whereby the attachment surface of the hard polishing pad and the second side of the soft polishing pad are substantially in a common plane. Other composite polishing pads are also provided, as are methods for making composite pads and methods for preventing composite pads from splitting apart into their component pads.

Abstract: A hardened skin care instrument having a file tooth portion formed by an electroplating process is disclosed. The instrument including a handle part with a recessed portion formed thereon, and a head part comprises an abrasive piece attached to the head part. The abrasive piece includes a plurality of release grooves that are produced by corroding a selected portion of a copper film laid on one surface of a base made of synthetic resin, and a plurality of file tooth portions that are formed by adhering abrasive powder to the remaining portion of the copper film by an electroplating. The release grooves and file tooth portions are arranged to cross over each other.

Abstract: A method for making high density foam semiconductor polishing pads and belts with controlled, reproducible microcellular structure by mechanical frothing. The method involves agitating a liquid polymer resin at a controlled temperature and pressure in order to produce a stable froth. Next, the resin froth is metered under pressure to a mix head where it is typically combined with a desired amount of curative before being injected or poured into a mold.