Abstract: An abrasive cutter formed of at least one diamond particle, preferably at least one mono-diamond crystal and metallic binder material distinguished by the fact that the diamond particle (D) has a size of about 50 &mgr;m to about 500 &mgr;m and each diamond particle (D) is enclosed by a coating (H) produced in a fluidized bed with the coating having a wall thickness of about 10 &mgr;m to about 200 &mgr;m. The volume of the coating (H) constitutes at least 30% of the volume of the diamond particles (D) in the fully consolidated state following individual sintering of the coated diamond particles (D, H). The abrasive cutters can be applied directly onto an abrasive tool. Further they can be processed to form composite cutters or cutting segments. In the method of forming the abrasive cutter, the diamond particle (D) is brought into a fluidized bed reactor and enclosed in a metallic coating (H).

Abstract: A drill bit is provided with a cylindrical body portion fabricated from a plastic material. The body portion is fastened in concentric, end to end relation to a cylindrical cutter fabricated from a metallic material and having an array of cutting elements disposed thereon. The body portion and cutter are preferably tubular, wherein the cutting elements are disposed in an annular array, to facilitate core or crown drilling operations. The wall thickness of the tubular body portion may be increased relative that of the cutter to compensate for wear during drilling. The tubular body portions also may fabricated from a composite polymer including wear resistant particles, whiskers, fibers and the like disposed on inner and outer surfaces of the polymer body, or dispersed throughout the body.

Abstract: A method and apparatus for machining flat or planarizing a fire deck of a bimetallic engine block includes providing a grinding wheel by disposing a series of abrasive inserts at spaced locations along a circumference of a circular head, so that during rotation of the head, the inserts form a notional annular grinding ring. The head is preferably a conventional milling head and the inserts are sized and shaped to fit within receptacles adapted to receive conventional milling inserts. In an alternate embodiment, a second series of abrasive inserts may be disposed radially inward of the first series of inserts to form an inner notional annular grinding ring disposed concentrically with the outer ring. Inner and outer inserts preferably comprise a single layer of diamond abrasive brazed onto a metallic substrate.

Abstract: A grinding body for on-line roll grinding has a grindstone of a cup shape. The grindstone is on a surface portion, and near a peripheral edge, of a circular support base plate, so that a peripheral edge portion of the circular support base plate has on a surface side thereof a two-layer structure. This two-layered structure includes a flat ring-shaped portion jutting toward an inner periphery so as to define a groove opening inward. The grindstone is mounted on the flat ring-shaped portion; and a damping material is filled and mounted into the groove. This grinding body can effectively prevent the formation of a spiral mark and a pitching surface mark, improve the grinding power and grinding accuracy, and prolong the life of the grindstone.

Abstract: Grinding wheels are fabricated with outwardly extending circular peripheral rims having a continuous rim surface to which separate abrasive pieces, preferably of a super abrasive such as CBN, are secured by suitable adhesive. The superabrasive pieces are preferably circular and of a diameter corresponding to the width of the rim and are secured to the rim surface so as to either be adjacent and touch one another or to be spaced one from the other around the circle of the rim surface so that a predetermined amount but not all of the rim surface is covered with abrasive pieces. That rim surface coverage optimize grinding efficiency while providing space for fluid flow for purposes of cooling and carrying away particles from the grinding process.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: Corrugated abrasive discs such as grinding wheels are treated by applying a water-resistant coating to the interiors of the corrugations before the corrugations are plugged. Discs having water-sensitive matrices such as magnesium oxychloride cement are thus protected against water or water vapor seepage from aqueous-based plug fill material.

Abstract: The invention relates to a grinding wheel for machining metal circular-saw blades at relatively high rotational speeds, which have machining areas which contain in particular hard materials, such as for example diamond or cubic boron nitride. The grinding wheels according to the invention are intended in particular to improve the centring at relatively high rotational speeds, and consequently to prevent true running problems as far as possible. The base body of the grinding wheel is of contoured design, at least on one side, in the radially outer area of a tool-mounting bore, and at least one centring element can be designed to engage in a formfitting manner in the correspondingly designed contours, so that the grinding wheel and a centring element on a tool spindle of a grinding machine are held together in a force-fitting manner.

Abstract: A probe polish burnishing assembly has a stem having a substantially spherical surface. This spherical surface makes intimate contact with the concave surfaces commonly present at the tips of set screws used to align the assembly, decreasing the likelihood of slippage and chipping of the stem. Alignment of the assembly is thus made more precise, and the useful life of the assembly is improved. Furthermore, the likelihood of damage to the probe during burnishing is lessened.

Abstract: Components of chemical, mechanical, polishing apparatus with components resistant to chemical attack by chemical slurries used in the polishing of semiconductor wafers. Among the components that are improved to enhance resistance to chemical attack are the polishing platen, pad conditioning end effectors, various subassemblies, housings for instrumentation, carrier rinse station surfaces, and other components that come into contact with a slurry. The coating compositions are preferably tightly adherent to the underlying substrate, and may be applied by a wide range of techniques. Especially useful are coatings such as tungsten carbide, tungsten nitride, amorphous diamond like carbon, and other such inert wear resistant coatings.

Abstract: Provided are an outer-diameter blade, an inner-diameter blade and cutting machines using both blades for cutting hard material, and a core drill and a core-drill processing machine for forming a hole into hard material, whereby the mechanical processing with reduction in the cutting and/or contact resistance to the tools is realized, so that in the case of the outer-diamond blade, it is prevented from occurring that a to-be-cut object is warped and put into contact to the blade to cause chipping; in the case of the inner-diameter blade, it is prevented from occurring that the blade is bowed and/or a cutting surface is curved; and in the case of the core drill, not only are grinding powder of a workpiece and loosed-off abrasive grains effectively removed to prevent those from being loaded between the drill and the workpiece, but neither of cracking and chipping occur when the drill passes through the workpiece.

Abstract: A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered bond including a metal component and an active metal component exhibits superior stiffness. The metal component can be selected from among many sinterable metal compositions. The active metal is a metal capable of reacting to form a bond with the abrasive grains at sintering conditions and is present in an amount effective to integrate the grains and sintered bond into a grain-reinforced composite. A diamond abrasive, copper/tin/titanium sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.

Abstract: An abrasive tool includes an electroformed layer having superabrasive grains electroplated on an outer surface of the electroformed layer, and a plurality of dimples arranged on the outer surface of the electroformed layer using a mold with projections made of gel adhesive. The concentration of the abrasive gains is regulated by changing the number of the dimples (i.e., changing a dimple-area-rate). The gel adhesive preferably has a viscosity of 500,000 cP or smaller. The dimple-area-rate is preferably from 7 to 70%.

Abstract: A tool including abrasive segments, which can be superabrasive segment, mounted to a mounting plate and a method for making the same. The abrasive segments include hard particles and are formed by sintering layers of hard particles with layers of bond material to form a laminated sheet. The abrasive segments are then cut from the laminated sheet and mounted to a planar face of the mounting plate to form a portion of a working region of the tool. Each segment has a grinding surface which can be formed perpendicular to the layers of bond material and layers of hard particles so that the concentration of hard particles at the grinding surface is relatively high. This allows the portion of working surface made up of the abrasive segments to relatively small. The segments can also be mounted to the substrate disc such that the grinding surface of each segment is at an angle to the planar face.

Abstract: In a method of tuning a high frequency printed resonance circuit having a conductive layer that is printed on a dielectric substrate and that serves as an inductance of the resonance circuit, the conductive layer is ground to mechanically remove a portion thereof from the dielectric substrate via a grinding pin that is rotated about a rotary axis perpendicular to a major printed surface of the dielectric substrate, thereby correcting the inductance of the resonance circuit in order to tune the same.

Abstract: A polishing cloth according to the present invention includes: a polishing cloth substrate; a pressure-sensitive adhesive layer laminated on one face of the polishing cloth substrate; and a release sheet attached to the pressure-sensitive adhesive layer in a releasable manner. The pressure-sensitive adhesive layer includes an adhesive composition containing a polymer, the polymer having a first-order melt transition in a temperature range narrower than 15° C. Thus, the present invention provides a polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine such that the polishing cloth can be peeled off the base by simply cooling the base plate and the adhesive layer of the polishing cloth.

Abstract: The present invention provides a composite bond wheel that has both excellent wear resistance and self-edging properties. The composite bond wheel of the invention includes: a grain layer including abrasive grains and a bonding phase; wherein the bonding phase includes a metal bonding phase and a resin bonding phase, wherein said metal bonding phase includes a metal having the abrasive grains and outside-opening pores dispersed therein, and wherein at least a portion of the outside-opening pores are filled with a resin of the resin bonding phase.

Abstract: The invention describes an abrasive system comprising a fiber-backed abrasive disc and a backup pad in which the backup pad has spaced portions removed from the circumference such that the disc overlaps in the area of the removed portions. This has the effect of inhibiting catching of the disc on obstructions and enabling easy swarf removal during operation.

Abstract: A grinding tool of the present invention is configured by having grinding surface that comes into direct contact with the surface of the object to be ground. Multiple small protuberances which include diamonds and other abrasive materials are formed on the grinding surface. Surface area of the small protuberances and the distance between the small protuberances are set such that the grinding resistance was maintained at an approximate constant value after a substantially constant grinding resistance value was reached.

Abstract: An abrasive article includes a plurality of abrasive particles securely affixed to a substrate with a corrosion resistant matrix material. The matrix material includes a sintered corrosion resistant powder and a brazing alloy. The brazing alloy includes an element which reacts with and forms a chemical bond with the abrasive particles, thereby securely holding the abrasive particles in place. A method of forming the abrasive article includes arranging the abrasive particles in the matrix material, and applying sufficient heat and pressure to the mixture of abrasive particles and matrix material to cause the corrosion resistant powder to sinter, the brazing alloy to flow around, react with, and form chemical bonds with the abrasive particles, and allow the brazing alloy to flow through the interstices of the sintered corrosion resistant powder and form an inter-metallic compound therewith.

Abstract: An grinding body includes an annular carrier element. Grinding blades are arranged on both sides of the carrier element in a fan-like manner, the blades being overlapped in opposite directions on opposite sides of the carrier element. One side of the body is covered by a shield which forms part of a retainer for securing the body to a grinder.

Abstract: A system and method for attaching an abrasive article to a backing pad is provided. The system includes a backing pad including loop-textile material applied to an attachment surface thereof and an abrasive article, which is removably attached thereto. The abrasive article has at least first and second surfaces including a plurality of abrasive particles adhered thereto. The first surface of the abrasive article includes abrasive particles having a size and density selected to provide a desired surface finish of a workpiece surface being abraded with the abrasive article. The second surface includes a plurality of abrasive particles having a size and density selected to releasably engage textile loops extending from the loop textile material applied to the backing pad attachment surface. Various embodiments, including double-sided sandpaper sheets and sanding screens, which adhere to the textile loops extending from the loop textile material applied to the backing pad attachment surface are disclosed.

Abstract: Abrasive discs with spaced portions removed from the circumference in the form of rounded and elongated V-shapes provide, when in use, complete vision of a workpiece being abraded with reduced tendency to snag on obstructions.

Abstract: An abrasive wheel having an annular support disk and an abrasive ring fixed thereto comprises reinforcement layers on the front sides of the abrasive ring, a layer of an abrasive agent being disposed between the reinforcement layers. The reinforcement layers and the outer portion of the support disk overlap each other radially, at least one reinforcement layer, in this area, being connected with an annular flange of radial extension by means of an adhesive layer.

Abstract: A grinding wheel is disclosed with a disk-like, cylindrical shape, whose perimeter is equipped with a grinding abrasive and has at least one spiral groove. The groove extends essentially around the perimeter at an acute bevel angle of inclination less than 45.degree. to a radius line normal to the axis of wheel rotation. Preferably the bevel angle is designed as an acute angle and is sized so that the groove extends over at least one full circumference of the grinding wheel. The face of the ribs may be tapered and the corners chamfered. Multiple parallel or non-parallel grooves may be employed. Improved cutting, service life and surface characteristics of the processed workpiece are obtained.

Abstract: The present invention relates to a grinding cup and a wear part for grinding of cutting inserts of a rock drill bit. The grinding cup is provided to be rotatably mounted in a grinding machine. The grinding cup is provided to perform grinding of cutting inserts of a rock drill bit. The grinding cup comprises a shank, a flush channel, and a wear part having a recess. The grinding cup has a center axis and is provided with vibration dampening means. The wear part is resilient in the grinding cup in at least the axial direction relative to the shank and the vibration dampening means forms contact surfaces with cooperating parts. The contact surfaces have substantially the same radial extension.

Abstract: A polishing disc support comprising a body (1) in the form of a disc, the disc having two sides one of which has a center, a centering hole (4) being provided in said center and a drive hole (5) being provided in an eccentric position in this same side, wherein a coating (6) of a material which is softer than that of the body (1) is applied to the other side (3).

Abstract: A supported polycrystalline compact (PC) cutter made under high temperature, high pressure (HT/HP) processing conditions having non-planar interfaces between the PC layer and a cemented carbide support layer. The carbide PC interface geometry is such that one or more protrusions extend from the support layer into the PC layer. The protrusions have a low cobalt metal binder content of about 3-9% by weight. The low cobalt metal binder content in the protrusions results in enhanced performance and improved resistance to cracking during installation and/or to brazing breakage.

Abstract: A plurality of polishing pads and methods for mechanical and/or chemical-mechanical planarization of substrate assemblies with the polishing pads in the fabrication of microelectronic devices. In one embodiment, a polishing pad has a suspension medium with an exposed surface configured to face toward a substrate holder of a planarizing machine, and a plurality of reaction control elements in the suspension medium. The reaction control elements are bonded to the suspension medium in a fixed distribution across at least a portion of the exposed surface of the suspension medium to define at least a portion of a planarizing surface of the polishing pad. The reaction control elements are preferably soluble in the planarizing fluid to impart a chemical to the planarizing fluid that interacts with the substrate assembly for controlling removal of material from the substrate assembly.

Abstract: Disclosed is a polishing method including the step of: polishing a surface of a member to be polished by rotating and sliding an abrasive wheel holding fixed abrasive grains on the surface of the wheel while supplying free abrasive grains to the surface of the member to be polished; wherein the abrasive wheel is formed by binding the fixed abrasive grains with a soft binder and a pore forming agent. This polishing method is effective to obtain a high flatness of a polished surface and improve surface characteristics of the polished surface, and also to obtain a high continuous-workability by stably keeping a polishing ability for a long period of time.

Abstract: Segmented cutting tools such core drill bits and diamond saw blades can be made more efficient by hardening a portion of the sides of each of the segments.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: A system and method for cleaning probe pins on a probe card used in testing a semiconductor device during fabrication thereof. A ceramic cleaning wafer is utilized to clean the probe pins without having to remove the probe card from a production line. The same apparatus used to test production wafers also handles the cleaning wafer during a probe cleaning cycle. During operation of the cleaning cycle, the cleaning wafer is placed in a manual load tray, which inserts the cleaning wafer into a prober machine. The cleaning wafer is transported by a robotic trolley to a prealign stage area where the cleaning wafer is aligned and centered. The cleaning wafer is then placed on a support device. The support device and cleaning wafer are positioned under a pneumatic sensor and profiled to determine wafer planarity. The support device and cleaning wafer are then positioned underneath the probe pins on the probe card to be cleaned.

Abstract: This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.

Abstract: An abrasive material contains abrasive particles in the range of 50 to 80% by weight in an olefinic thermalplastic resin system which is based on ethylene copolymer. The material may be incorporated on a substrate structure to be used as a stropping or honing material or may be shaped by an injection molding process or may be injection molded over a rigid insert or molded over a rigid wheel or disk inserted in the mold. The material may be used for polishing and finishing of crystalline materials, ceramics, silicon and semi-conductor wafers.

Abstract: With an abrasive dresser for a polishing disc of a chemical-mechanical polisher for abrading a flat rotatable polishing disc of a chemical-mechanical polisher which supplies a chemical polishing agent to the surface of the polishing disc to polish the surface of an article on top of the polishing disc, a sectional shape of an abrasive surface being a peripheral portion of a flat disc shaped base member which protrudes upwards over a predetermined width with an abrasive grit distributed substantially uniformly over and affixed to the surface thereof, is formed as a convex circular arc curved surface. In this way, the portion of contact with the polishing disc of the chemical-mechanical polisher becomes surface contact, thereby enabling a reduction in wear during use and an increase in life, together with an increase in the efficiency of abrading the polishing disc.

Abstract: In a method of processing a sealing surface of a casting to eliminate casting defects on or in the vicinity of the sealing surface, each of abrasive grains constituting a grindstone has a flat face formed on its distal end. The sealing surface of the casting is ground by the grindstone while the flat face of each abrasive grain is held parallel to the sealing surface of the casting. Consequently, a plastic flow layer is formed on the sealing surface of the casting. Blowholes present within a predetermined range of depth of the casting from the sealing surface are collapsed as the result of formation of the plastic flow layer.

Abstract: A unitary composite abrasive disc for one-pass grinding and finishing of a workpiece comprising a flexible epoxy rim bonded to a rigid core.

Abstract: The invention is directed to an extended wear stone polishing disk for use with an automatic polishing head. The disk consists of a first plastic plate of prescribed flexibility having a pair of mounting studs secures therewith to extend above its upper face. The mounting studs form a quick release securing members which locks with the mounting plate and secures it with the first plate. A second plastic plate and a resilient foam pad secured there between. A plurality of diamond faced grinding and polishing segments are secured with the lower face of the second plate in a prescribed pattern to form a polishing face. In use, the resilient foam pad evenly distributes resistance to pressure applied against the second plate during polishing while allowing the polishing face to distort in conformance with the contour of the surface being polished.

Abstract: A lapping assembly is described wherein a lapping process is performed to provide a flat headbox apron floor. The lapping assembly includes an eight-legged fly-style plate and a spring loaded floating driver. The lapping assembly and operation consists of attaching a spring loaded floating driver to a machine spindle of a milling machine. A lapping fly wheel is attached to the spring loaded floating driver. A coated abrasive strip with desired grit size to achieve the desired finished results is clamped in place on the lapping fly wheel. The machine spindle is rotated, thereby rotating the spring loaded floating driver and the lapping fly wheel, and the grinding and lapping of the apron floor can begin.

Abstract: A pot-shaped grinding wheel having a circular grinding region provided with a plurality of segment-like grinding members (5), a circular seat region (4) coaxial with an axially spaced from the grinding region (2), a transition region (3) extending between an inner contour of the grinding region (2) and an outer contour of the seat region (4) and tapering toward the outer contour of the seat region (4), and at least one bore (6) extending parallel to an axis of the grinding wheel and arranged in the grinding region (2) and at least one bore (7) likewise extending parallel to the grinding wheel axis and arranged in the transition region (3).

Abstract: A wheel hub is provided for use in combination with conventional depressed center grinding wheels. The hub includes a generally cylindrical aperture bushing. A disc shaped flange extends radially from a medial portion of the bushing and terminates at a peripheral lip. The bushing is adapted to extend through a central bore of the wheel so that the lip engages the backing face of the wheel proximate an outermost circumference of the depressed center. A grinding face end of the bushing is flangeable radially outward to engage the front grinding face of the wheel and mechanically capture the wheel between the grinding face end and the flange. The flange, lip and backing face form a cavity into which epoxy resin is placed to chemically bond the hub to the wheel. The combination of mechanical fastening and chemical bonding adequately secures the hub to the wheel, nominally without requiring the flange to extend over the stub.

Abstract: An abrasive tool and a method for its manufacture is provided in which the structural body of the tool, including both the central core and the outer, abrasive-containing portion, is fabricated of a homogeneous material, with abrasive particles dispersed throughout the consumable abrasive-containing portion to grindingly remove workpiece material during rotation of the structural body. A porous lattice of diamond grains encased in a cladding material is first formed by sintering as a continuous annulus or as arcuate segments. The skeletal lattice is then placed in a mold and a homogeneous material in liquid state is introduced into the mold to simultaneously form the central core and to flow into at least a portion of the porous lattice of clad diamond grains to provide an integrally molded, unity tool when the core material solidifies.

Abstract: An electrodeposited diamond wheel including a circular substrate having an attaching aperture formed at the center and a plurality of cooling apertures each formed at a predetermined distance from the attaching aperture in the outer circumferential direction and each at a predetermined pitch. Diamond abrasive particles are electrodeposited on the outer circumference of the circular substrate. Ridges and grooves are formed as corrugations on both surfaces of the circular disc, and diamond abrasive particles are electrodeposited on the outer circumference of the corrugations to form a cutting edge, the cutting edge being formed into a corrugated shape conforming to the substrate. The diamond wheel is suitable for cutting of a composite material of a heat-softening material and a reinforcing material.

Abstract: Grinding tool including a basic body symmetric with respect to rotation and a grinding layer deposited on the periphery of said grinding tool. The grinding layer being composed of the grinding grains, bonding agent and occasionally filler and/or wear-changing additives. The outer radius of the annular grinding layer or the extension in feeding direction perpendicular to the axis of the basic body is different, with the physical properties and/or the volume contents of the components of the layer are different in axial direction such that an adaptation to the different grinding load continuously in axial direction is achieved.

Abstract: A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.

Abstract: A grinding machine for grinding a wafer includes a pressure sensing grinding wheel having a disk portion, an annular portion depending from the disk portion that includes a plurality of cavities, a grinding tooth disposed in each cavity, and a pressure sensor disposed in each cavity between the tooth and the disk portion. The pressure sensor provides a signal indicative of the pressure applied by the grinding wheel against the wafer to a controller. Based on the signal received, the controller provides control signals to the drive motor and to a feed rate mechanism to maintain optimum grinding action. A method for grinding a wafer includes the steps of receiving a pressure signal from the grinding wheel and changing the feed rate in response to the pressure signal. The controller can also receive, and use for control purposes, additional inputs indicative of the current draw of a drive motor and of the rotational speed of a spindle shaft attached to the grinding wheel.

Abstract: A grinding wheel with tips which can be uniformly abraded regardless of the position of the tips is disclosed. In the wheel, the inside and outside tips may be formed by bonding diamond dust of the same concentration with resinoid or metal bonds of lower and higher abrasion resistances, respectively. Alternatively, the inside and outside tips may be formed using the same resinoid or metal bond. In this case, the outside tips are laden with diamond dust, while the inside tips are laden with no diamond dust or cheap abrasive. As a further alternative, the concentration of the diamond dust of the tips may be stepwisely reduced from the outside toward the inside. In addition, the top surface of each tip may be inclined downward from the outside toward the inside to compensate for the eccentric abrasion of the tips due to the circumferential speed difference between the inside and outside tips.

Abstract: The present invention defines an optical polishing lap comprising a thermoplastic polymer resin of uniform density, porosity, and texture throughout including the surface of the lap. The optical lap is of unitary construction formed having a solid main body with a generally domed-shaped upper head portion of substantially monolithic form providing an upper curved surface. The optical lap includes a lower flat surface having an attachment means defining an integral base portion extending downward opposite the lower flat surface offset from the main body. The integral base portion defines webbing having a continuous peripheral rail extending around the edge.

Abstract: A sanding disk for use with power tools. The disk has four arms that form a cross-shaped structure about a central disk. Alternatively, four arms can be attached to a set of braces to form a cross-shaped structure with no central hub. The device is designed to fit in a standard drill chuck, much like a standard disk sander. To make the device sufficiently light weight, the face of the sander has a number of holes drilled in the face of the device. In addition, the arms are made of relatively thin stock. Support braces are attached to the back of the arms to ensure that the arms do not warp or bend during the sanding operation. Four rectangular sanding pads are attached to the face of the device. These sheets do the actual sanding. These sheets are commercially available. The device is bolted onto a standard sanding disk plate. The disk plate is then inserted in a standard drill.