Abstract: A flapped grinding disk having a disk- or plate-shaped support including an outer periphery, and a plurality of spaced-apart, discrete groups of grinding flaps forming a plurality of apertures, wherein the flaps overlap each other on the support in the manner of shingles, are secured in an adhesive bed, and define an outer circumference, wherein the radial dimension of the aperture from the outer periphery of the support to the outer circumference is substantially commensurate with the radial dimension of the groups of grinding flaps from the outer periphery of the support to the outer circumference.

Abstract: A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.

Abstract: A grinding and cutting head adapted to be mounted with a rotating disk of a grinding and cutting machine. The head includes a plate having a first surface which mounts at least one carrier. The carrier includes a vertical slot along one side which extends upwardly from the first surface of the plate. A generally rectangular shaped diamond cutting element is secured in the slot with first and second edges thereof exposed outwardly of the carrier. The structure provides that the one of the first and second edges are exposed in the direction of rotation of the disk.

Abstract: A method for cutting a chamfer on an edge of a concrete slab, comprising the steps of: providing a generally circular, rotatable concrete saw blade that is coupled to a right-angle grinder motor with a blade-mounting hub having no blade attachment hardware projecting below a lower major surface of the blade; making an initial planar cut at a desired angle beginning a distance from the edge, thereby creating an initial cantilevered ledge above the initial cut; if the initial cantilevered ledge is not severed from the slab by a cutting action of the blade before the hub is proximate an edge of the initial cantilevered ledge, then fracturing and removing the initial cantilevered ledge from the slab; and making at least one subsequent planar cut continuous with the initial cut and any necessary fracturings and removals of subsequent cantilevered ledges until the chamfer is complete.

Abstract: A grinding wheel including a ring-shaped wheel, a first fixing cap, a second fixing cap and a buffer member. The ring-shaped wheel has a fixing section and a working section formed along outer circumference of the fixing section. The first and second fixing caps are respectively mounted on two sides of the fixing section. The buffer member is positioned between the first and second fixing caps for reducing shock produced in operation. The circumference of the buffer member is formed with multiple movable vanes. When the grinding wheel is rotated at high speed, the centrifugal force will deform the movable vanes of the buffer member to lean on the ring-shaped wheel for supporting the working section thereof.

Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

Abstract: The present invention is for a grinding device, such as a surface grinding disc or an annular grinding wheel, constructed from a plurality of abrasive segments arranged in an array thereon, wherein the plurality of abrasive segments are embedded in a matrix composition, and wherein the device is abapted to perform a “dry machining” operation. The abrasive segments may be resin bonded or vitrified and may include diamond or other superhard or superabrasive particles, such as, for example, cubic boron nitride (“cBN”), dispersed therein. Both the abrasive segments and the matrix composition include a dry lubricant, such as hexagonal boron nitride, molybdenum disulfide or graphite, dispersed therein. The abrasive segments further include a melt phase metal composition, such as bronze or other copper alloys, to aid in heat dissipation.

Abstract: In relation to a blade cutting stone or concrete, a blade, preventing wearing of a core while preventing the core from wobbling, cuttable at a stable speed is provided. In a blade formed by providing slots on the outer peripheral edge of a circular core and fixing a superabrasive layer to a portion of the outer peripheral surface of the core located between the slots, the superabrasive layer consists of a first superabrasive layer having an extension formed by partially extending the superabrasive layer toward the inner periphery of the core and a second superabrasive layer.

Abstract: An abrasive tool insert is formed from a substrate having an inner face that has a center. The inner face slopes outwardly and downwardly from the center. An annular face slopes downwardly and outwardly from the inner face. An abrasive layer, having a center and a periphery forming a cutting edge, is integrally formed on the substrate.

Abstract: A grinding disc structure including an integrally formed main disc adapted to a dust-sucking cover body of a grinder. The main disc has multiple through holes nearly in parallel to an axis of the main disc. The main disc is further formed with multiple internal passages which are horizontally formed in the main disc corresponding to the through holes and nearly perpendicular to the axis of the main disc. The passages are tangential to the through holes. Two ends of each passage respectively communicate with the through hole and outer side around the main disc. The main disc has a complete bottom face to which a grinding layer can be fully adhered.

Abstract: An abrasive sandpaper system having a backing plate (16) with a canted outer periphery (28) and an off-centered aperture (26) for interlocking with lugs (18) of a power driver (12). The sandpaper (30) has a canted outer periphery (38) for riding over raised edges (45) of an uneven wood deck. The backing plate may have a pocket (50) with a side wall (60) to receive the substrate layer (58) of sandpaper (54).

Abstract: A belt sander comprising a first roller (34) a second roller (38) and a casing (28), characterised in that the casing (28) is located between the first roller (34) and the second roller (38).

Abstract: A polishing pad conditioner comprises a base and a pad conditioning face on the base. The conditioning face comprises central and peripheral regions. Abrasive spokes having a substantially constant width of abrasive particles, extend from the central to the peripheral region. The spokes are symmetric and radially spaced apart from one another, and may have a variety of shapes. The conditioning face can also have a cutout inlet channel to receive polishing slurry when the conditioning face is rubbed against a polishing pad, a conduit to receive the polishing slurry from the cutout inlet channel, and an outlet on the peripheral edge of the base to discharge the received polishing slurry.

Abstract: A CMP pad conditioner including: (a) a disk-shaped substrate having a working surface which is provided by one of its axially opposite end surfaces and which is to be brought into contact with the CMP pad; and (b) abrasive grains which are fixed to the working surface. The substrate includes a radially inner portion and a radially outer portion which is located radially outwardly of the radially inner portion. The working surface in the radially outer portion is inclined with respect to the working surface in the radially inner portion, such that a thickness of the radially outer portion as measured in an axial direction of the substrate is reduced as viewed in a direction away from an axis of the substrate toward a periphery of the substrate. A ratio of an outside diameter of the radially inner portion to an outside diameter of the substrate is 60–85%.

Abstract: The invention relates to grinding/polishing sheet, which comprises 2 or more annular grinding/polishing zones (1-5) separated by intermediate annular distancing zones (6). One or more of the grinding polishing zones (1-5) comprises one or more non-continuous areas, that are part of an annular structure forming channels (8) in radial direction. The grinding/polishing sheet can be placed on a rotatable grinding/polishing disc for manual, automatic or semiautomatic preparations of materialographic samples. The invention also relates to a method for preparations of materialographic samples.

Abstract: The flapped grinding disk comprises a disk- or plate-shaped support and grinding flaps which overlap each other on the support in the manner of shingles and which are secured in an adhesive bed. Apertures are cut away on the periphery of the flapped grinding disk, the apertures have approximately the form of a part of an annulus with a front edge and an edge at the rear in the direction of rotation of the grinding disk and at least the edge of the apertures that is at the rear in the direction of rotation of the grinding disk runs approximately radially. The grinding flap adjoining the rear edge of the aperture can form a ramp. The front edge of the apertures can also run approximately radially. The radial depth of the apertures can be equal to the radial extent of the grinding flaps, so that no remnants of grinding flaps remain at the inner edge of the apertures.

Abstract: An apparatus for cutting a chamfer on an upper edge of a concrete slab includes a hub designed for installation on the threaded output spindle of an angle grinder, and a specially-modified diamond-grit-edged rotary blade which mounts on the hub. For a preferred embodiment of the hub, an attachment collar is unitary and concentric with both a blade mounting flange having countersunk attachment screw holes and a blade centering shoulder on the flange. The attachment collar has at least one pair of flattened parallel sides for receiving a wrench used to tighten the hub on the output spindle. The blade, which is equipped with both countersunk attachment holes and a central positioning aperture sized to fit closely over the blade centering shoulder, is attachable with countersinking screws to the mounting flange so that the head of each screw is flush with the surface of the blade.

Abstract: A method of forming a chemical-mechanical polishing pad having at least one optically transmissive region comprising (i) providing a polishing pad comprising an aperture, (ii) inserting an optically transmissive window into the aperture of the polishing pad, and (iii) bonding the optically transmissive window to the polishing pad by ultrasonic welding.

Abstract: An improved method of manufacturing automotive accessory drive belts or other workpieces of pliant material which have a grooved operative face, a tool having an abrasive ramp configuration for performing said improved method and a method of manufacturing said tool with the abrasive ramp configuration.

Abstract: An abrasive tool insert is formed from a substrate having an inner face that has a center, and annular face which annular face has a periphery. The inner face slopes outwardly and downwardly from the center at an angle ranging from between about 5° and 30° from the horizontal. The annular face surrounds by the inner face and terminates at the periphery. The annular face slopes downwardly and outwardly from the inner face at an angle of between about 20° and 75° from the horizontal. A continuous abrasive layer, having a center and a periphery forming a cutting edge, is integrally formed on the substrate and defines an interface therebetween.

Abstract: A metal-bonded grinding tool including a base and abrasive grains bonded to the base by means of a metal bond matrix containing a Cu alloy as a main component. A content of at least one of an alloy phase, a mixed phase, and an intermetallic compound of Zr and Ti in the metal bond matrix is in a range of 3.8 to 19.2 wt %.

Abstract: A grinding unit assembly, a plurality of which is placed around a cylinder (12) of a grinding machine. Each assembly comprises a grindstone unit (1) and a metal fixture (16). The grindstone holder (3) has on one side face a positioning cutout (7), and a thinly cut grindstone (2) attached to one end of the grindstone holder (3). The metal fixture (16) has a metal body (17) having a protrusion (18) adapted to fit in the cutout (7) and a locking bolt (21).

Abstract: A grinding wheel comprises an annular base and a grinding stone means mounted on the under surface of the base. A coolant pool which is open inward in a radial direction is formed in the inner surface of the base.

Abstract: A method and apparatus is provided that comprises an improved substrate polishing pad conditioning plate. In one embodiment, the conditioning plate contains multiple channels interposed between the abrasive surfaces so as to manage slurry and debris to resist clogging the abrasive surface of the conditioning plate so as to enable conditioning of the polishing pad.

Abstract: In a depressed-center abrasive wheel assembly a reinforcement layer of polygonal shape is located between a front face of the abrasive wheel and a front flange. The reinforcement layer is dimensioned to entirely cover the depressed center portion of the wheel. An example of polygonal reinforcement layer has a hexagonal shape and is made of fiberglass cloth. A polygonal shape reinforcement layer can also be employed between the front flange and the front face in an abrasive flat wheel assembly that employs a wheel without internal reinforcement.

Abstract: A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a support material. At least a portion of the discrete elements are spaced apart from each other on the support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the support material, and the discrete elements can be directly affixed to the support material or affixed to the support material with an adhesive.

Abstract: A grinding wheel having a tool portion formed by firmly fixing diamond grains to an end face of a cup-shaped core by brazing. A circumferentially continuous groove is formed in a substantially central portion of the end face of the core. The abrasive grains are firmly fixed to an end face portion excluding regions near an outer rim and near an inner rim of the end face and near the boundaries with the groove under the condition that, with respect to all the abrasive grains, skirts of a brazing material layer for holding the abrasive grains have a length one or more times an average grain size of the abrasive grains. The provision of the groove in the end face of the core can enhance the capability of ejecting chips that occur during machining; besides, chips can be captured in the groove to preclude the occurrence of scratches resulting from the chips.

Abstract: A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly comprised of a central pad mount on a central shaft. That central pad mount beneficially retains a center polishing pad. Also included is a ring polishing assembly comprised of a ring pad mount with a central aperture on a ring shaft with a central aperture. The ring pad mount beneficially retains a ring polishing pad having a central aperture. The central polishing assembly and the ring polishing assembly beneficially rotate and move axially independently of one another. The apparatus includes the CMP polishing tool and a rotating polishing table. The method includes rotating a semiconductor wafer on the rotating polishing table. Then, selectively and independently moving a solid center polishing pad having an axis of rotation and/or an axially aligned ring-shaped polishing pad into contact with the surface of the semiconductor wafer.

Abstract: The invention is based on an insertable tool having a rotationally drivable, disk-shaped hub (10, 12), on which a grinding means (14) forming a cutoff disk, grinding disk, roughing disk, or abrasive disk is secured in the radially outer region. It is proposed that the grinding means (14) and the hub (10, 12) are joined via joining means (26) in the manner of a positive connection at least in the direction of rotation.

Abstract: A diamond blade having rim type cutting tip for use in apparatus such as cutting saw machine having a structure which rim type cutting tip is able to produce cutting chips with relative large size during cutting operation so that those chips are easily discharged outside with reducing the friction with cutting tip of blade, thereby to increase cutting ability and to prevent the chips dispersing in the air and giving rise to the bad effects to user's health and the contamination of environment. The diamond blade according to the present invention comprises a wheel body connected with a shaft of electric motor, and rim type cutting tip for cutting or grinding crushable materials disposed on the circumference of the wheel body and composed of at least two diamond layers longitudinally disposed parallel with the rotation direction of the blade in which diamond particles are included, and non-diamond portion disposed between the diamond layers in which diamond particles are not included.

Abstract: Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered. Solution mechanism: The whetstone particle layer (13), which consists of multiple whetstone particle layer units (12), . . . , is configured on the surface (11a) of the whetstone substrate (11) while the respective whetstone particle layer units (12) are being mutually linked via the bridge unit (9). The non-whetstone particle unit (22) is configured between whetstone particle layer units (12) and (12). Whetstone particle layer unit (12) is obtained by configuring the superwhetstone particles (14) densely in the central unit (12a) and by configuring them sparsely in the peripheral unit (12b). The metal coupling phase (17), to which the superwhetstone particles (14) are fixed, is formed by the first and second metal plate phases (15) and (16), respectively. The thickness of the first metal plate phase (15) decreases from the central unit (12a) toward the peripheral unit (12b) in the shape of a mountain.

Abstract: A tool is provided which includes a chuck provided with abrasive elements in the form of pellets fixed thereto. Abrasive filler is arranged between the abrasive elements. The density and abrasive grit of the abrasive filler are in ranges of from 20 to 80% and from 1 to 50% with respect to the density and abrasive grit of the abrasive elements. A composition is provided which consists of epoxy resin, diamond-containing abrasive, a hardener, a filler and polyhydride siloxane. The polyhydride siloxane is used in order to form pores when reacting with the hardener during the production of the tool.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.

Abstract: In a hand power tool for surface machining, with a vibrating plate, which is suspended on a housing by vibrating elements, and with an electromotively driven eccentric drive, which is contained in the housing and sets the vibrating plate into an orbital oscillating motion, in order to produce a housing that is rather flat and short, which can be manually controlled in the same way as a grasping block, the coupling point is situated between the eccentric drive and the vibrating plate, close to the front edge of the vibrating plate, while the elastic vibrating elements engage the vibrating plate close to the opposite edge of the vibrating plate.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: Apparatus for cutting a chamfer on an upper edge of a concrete slab includes a hub designed for installation on the threaded output spindle of an angle grinder, and a specially-modified diamond-grit-edged rotary blade which mounts on the hub. For a preferred embodiment of the hub, an attachment collar is unitary and concentric with both a blade mounting flange having countersunk blade-attachment screw holes and a blade centering shoulder on the flange. The attachment collar has at least one pair of flattened parallel sides for receiving a wrench used to tighten the hub on the output spindle. The blade which is equipped with both countersunk attachment holes and a central positioning aperture sized to fit closely over the blade centering shoulder, is attachable with countersinking screws to the mounting flange so that the head of each screw is flush with the surface of the blade.

Abstract: A grindstone 1 has a pedestal 2 and an abrasive-grain layer 9 provided on the pedestal 2. The abrasive-grain layer 9 is a plating film which contains abrasive grains. An intermediate layer 7 which has physical properties different from those of the abrasive-grain layer 9 is provided between the abrasive-grain layer and the pedestal. The intermediate layer 7 is a plating film which contains abrasive grains, and the plating film of this intermediate layer 7 has a color tone different from the color tone of the plating film of the abrasive-grain layer 9. As being so made up, in the grindstone having an abrasive-grain layer formed of a plating film as a binder, the grindstone lifetime can be judged with ease.

Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.

Abstract: A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of an uniformed height on at least one of its sides, and a cutting portion having a diamond layer of an uniformed thickness formed substantially on a whole surface of the side of the substrate having the geometrical protrusions. The geometrical protrusions have a flat upper surface or the upper surface may comprise a plurality of smaller geometrical protrusions formed by recessed grooves. The substrate is made from ceramic or cemented carbide materials and has a shape of a disk, a plate having multiple corner, a cup, a segment, or a doughnut with flattened upper and lower surfaces. The conditioner may further comprise a body portion being fixedly attached to the substrate at a side opposite to the side having formed with geometrical protrusions for linking the cutting portion to conditioning equipment.

Abstract: A grinding wheel has a flat, circular carrier surface (1) on which a plurality of elongated grinding members (2) are arranged running least partially radially. A discharge opening (3) is disposed ahead of each of the grinding members (2) in the circumferential direction (U). Furthermore, the carrier surface (1) has a basically truncated conical central depression (4) facing away from the grinding members (2). The discharge openings (3) abut the L-shaped grinding members (2) in a direction of rotation (D) and extend approximately over the entire length of the grinding members (2).

Abstract: A vitrified bond tool including: (a) a support body; (b) a vitrified bond layer which is formed on a working surface of the support body; and (c) a plurality of abrasive grains which are held by the vitrified bond layer so as to be fixed relative to the working surface of the support body and which are spaced apart from each other with spacing between the adjacent ones of the abrasive grains. This vitrified bond tool is advantageously manufactured according to a method including the steps of (i) forming a pattern layer which includes a vitrified bond, in a predetermined pattern on the working surface of the support body; (ii) sprinkling the abrasive grains over the pattern layer before the pattern layer is dried; and (iii) firing the pattern layer and the abrasive grains which are bonded to the pattern layer and are arranged in the predetermined pattern on the working surface of the support body.

Abstract: A power tool comprising a body (20), a motor and a roller (38), characterized in that the motor acts as the roller (38).

Abstract: A resinoid grindstone including a main body having an abrasive structure in which abrasive agglomerates are held together by a resin bond. Each of the abrasive agglomerates includes abrasive grains which are held together by an inorganic bond. The resin bond includes a filler such that a ratio of a strength of the abrasive agglomerates to a strength of the resin bond is not higher than 1.5. A ratio of a total weight of the abrasive agglomerates included in the abrasive structure, to a weight of the abrasive structure is not lower than 10% and is not higher than 40%.

Abstract: The invention relates to an improved grinding wheel for grinding eye glass edges. The grinding wheel comprises a base member and an abrasive coating of diamond and metal. The base member 3 consists substantially of plastic material and an annular member 2 of metallic material is provided between the base member 3 and the coating 1. The metallic material of the annular member 2 has a strength withstanding the forces occuring in sintering the coating to the annular member.

Abstract: A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a support material. At least a portion of the discrete elements are spaced apart from each other on the support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the support material, and the discrete elements can be directly affixed to the support material or affixed to the support material with an adhesive.

Abstract: A sanding disc particularly useful for smoothing drywall. The sanding disc includes a circular abrasive disc having an abrasive surface, and a circular foam disc smaller in diameter than the abrasive disc which is co-axially adhered to the surface of the abrasive disc opposite its abrasive surface. The abrasive disc has a circular central portion along which the surface defined by the abrasive is generally planar, and has an annular peripheral portion extending from its central portion to its peripheral surface along which its surface defined by the abrasive is generally cylindrically convex to position the peripheral surface of the abrasive disc in a plane passing through the foam disc.

Abstract: In a depressed-center abrasive wheel assembly a reinforcement layer of polygonal shape is located between a front face of the abrasive wheel and a front flange. The reinforcement layer is dimensioned to entirely cover the depressed center portion of the wheel. An example of polygonal reinforcement layer has a hexagonal shape and is made of fiberglass cloth. A polygonal shape reinforcement layer can also be employed between the front flange and the front face in an abrasive flat wheel assembly that employs a wheel without internal reinforcement.

Abstract: Of the type designed to be attached to the propeller-shaped bases or heads of a concrete grinder, to enhance the grinding effect of said propeller-shaped bases after the latter are used without disks, it is shaped like a cross, with four equal arms which are equiangularly distributed, in the shape of an isosceles trapezoid, each of which has a curved-convex end (1), forming part of the imaginary circumferential outline corresponding to the theoretical disk, and curved-concave side edges (2-2′), which are joined to each other without a break in continuity between adjoining arms and which define a deep concave indentation (3), whose path is circumferential and whose radius appreciably coincides with the theoretical radius of the disk, so that a pair of disks may be used in a concrete grinder with two heads, working on the same plane without touching each other, by means of offsetting them angularly from each other by 45°.

Abstract: Polishing pads are provided having a polishing surface formed from a material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.