Abstract: A method for cleaning plated polished disks used in hard drive media is provided. The method includes positioning plated polished disks in a first batch scrubber having multiple first brushes, wherein each of the plated polished disks is positioned between two of the first brushes, and scrubbing the plated polished disks with the first brushes. The method further includes positioning the plated polished disks scrubbed in the first batch scrubber in a second batch scrubber having multiple second brushes, wherein each of the plated polished disks is positioned between two of the second brushes, and scrubbing the plated polished disks with the second brushes.

Abstract: A wet electrolytic capacitor that includes a porous anode body containing a dielectric layer, an electrolyte, and a cathode containing a metal substrate on which is disposed a conductive coating is provided. Prior to application of the conductive coating, the metal substrate is blasted with abrasive particles to enhance the ability of the substrate to adhere to the coating. The micro-roughened metal substrate can be treated after blasting so that substantially all of the abrasive particles are removed. This is accomplished by contacting the metal substrate with an extraction solution to remove the particles, and also by selectively controlling the nature of the abrasive particles so that they are dispersible (e.g., soluble) in the solution.

Abstract: The invention seeks to provide a wood sanding bit that can be used for the sanding of routered work piece edges. Specifically, the invention seeks to provide a wood sanding bit for use with a rotary tool, the bit comprising a sanding body having an outwardly and radially disposed sanding surface, the sanding surface provided with an abrasive material, wherein the sanding surface has a profile corresponding to a standard contoured router bit profile.

Abstract: The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.

Abstract: The present invention refers to a procedure for obtaining a carbon electrode from acid cell wastes with extremely high electrocatalytic activity that can be used as cathode or anode for various applications such as electrochemistry, electroplating, electrolytic refining, etc. One of its most interesting applications is in the field of sensor electrodes.

Abstract: A method of machining a fibrous sheet for a composite structure is described. The sheet comprises a resin matrix having a glass transition temperature, wherein the method comprises cooling the sheet substantially to maintain the temperature of the matrix below its glass transition temperature during machining.

Abstract: A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the surface by abrasion, measuring the abraded surface with a profile determination device, optionally measuring the amount of material abraded from the surface and the gloss of the abraded surface, polishing a portion of the abraded surface with a polishing device at a controlled load for a pre-determined time and measuring the roughness and/or gloss of the polished surface followed by comparison thereof to the corresponding measurements of the unpolished, conditioned portion of the specimen surface. Polishing materials and devices may also be tested using the apparatus and method for polishing a standardized material.

Abstract: The present invention relates to a method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes a step for washing a disk-shaped glass plate with an acid washing liquid, a step for removing at least part of a surface layer, which is formed on the surface of the glass plate, by performing grinding with diamond abrasion grains, and a step for washing the surface with a neutral or alkaline washing liquid.

Abstract: A glass treatment apparatus, in one example, can include a fluid dispensing device configured to dispense a substantially laminar flow of a fluid film. In another example, a shroud substantially circumscribes an outer peripheral surface of a working wheel. The shroud includes a slot configured to receive an edge portion of a glass sheet. Methods of treating glass, in one example, include the step of dispensing a substantially laminar flow of a fluid film along a fluid plane to subsequently land on a first side of a glass sheet. In further examples, a fluid is passed over an inner surface of a shroud to carry away machined particles from a glass sheet. In still further examples, an outer peripheral surface of a working wheel is impacted with a fluid stream to clean the working wheel from glass particles generated when machining an edge of the glass sheet.

Abstract: A wafer processing method for reducing the thickness of a wafer to a predetermined thickness, the wafer having a chamfered portion along the outer circumference thereof. The wafer processing method includes a stacked wafer forming step of attaching a support substrate to the front side of the wafer to thereby form a stacked wafer, and a chamfered portion removing step of positioning a cutting blade having a rotation axis parallel to the stacking direction of the stacked wafer formed by the stacked wafer forming step so that the outer circumference of the cutting blade faces the chamfered portion of the wafer, and then making the cutting blade cut into the wafer from the outer circumference toward the center thereof to thereby partially remove the chamfered portion in the range corresponding to the predetermined thickness from the front side of the wafer.

Abstract: An apparatus includes: a cleaver configured to automatically cleave a bare fiber extending from an end face of a terminus or connector of a fiber optic cable, the cleaver including a bending element configured to bend the bare fiber and a defect-formation device configured to create a surface defect in surface of the bare fiber under tension when the bare fiber is bent by the bending element; and an abrader configured to automatically finish the end face of the terminus or connector after the bare fiber is cleaved.

Abstract: Method of shaping an ophthalmic eyeglass lens presenting two main optical working faces and including firstly a substrate made of a first material and presenting two main faces corresponding to the two main faces of the lens, and secondly at least one coating film made of a material distinct from that of the substrate, the coating film being previously secured on at least one of the main faces of the substrate, includes: cutting the lens by machining with a first tool over at least the thickness of the previously secured coating film, to define internally a working central portion of the coating film that presents a reduced outline; trimming the edge face of the substrate along the desired outline by machining with a second distinct tool, without machining the working central portion; and finishing the edge face of the substrate without machining the working central portion.

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for accurately measuring the amount of material removed during a polishing process. Accurate measurement of such a polishing process can be especially helpful in measuring material removal on curved surfaces and edges where material removal rates tend to be less predictable.

Abstract: Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.

Abstract: A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

Abstract: A substrate capable of achieving a lowered probability of defects produced in a step of forming an epitaxial film or a semiconductor element, a semiconductor device including the substrate, and a method of manufacturing a semiconductor device are provided. A substrate is a substrate having a front surface and a back surface, in which at least a part of the front surface is composed of single crystal silicon carbide, the substrate having an average value of surface roughness Ra at the front surface not greater than 0.5 nm, a standard deviation ? of that surface roughness Ra not greater than 0.2 nm, an average value of surface roughness Ra at the back surface not smaller than 0.3 nm and not greater than 10 nm, standard deviation ? of that surface roughness Ra not greater than 3 nm, and a diameter D of the front surface not smaller than 110 mm.

Abstract: A chemical mechanical polishing pad includes a polishing layer formed using a composition that includes a thermoplastic polyurethane, the polishing layer having a specific gravity of 1.15 to 1.30, and a durometer D hardness of 50 to 80.

Abstract: A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of <150 ?m, especially <100 ?m, preferably <75 ?m, even more preferably <50 ?m, especially preferably <30 ?m, surface treatment of the flat side with means for reducing an especially structural intrinsic stress of the product wafer.

Abstract: A method for producing a composite mirror. It comprises the steps of providing a glass blank with low coefficient of expansion, machining a convex shape (4) in the glass blank, laying a front skin (6) impregnated with resin over the convex shape (4) of the glass blank (2), machining in a rear supporting structure (8) a concave shape matching the convex shape machined in the glass blank (2), gluing the concave shape (10) of the supporting structure (8) onto the convex shape of the glass blank (2), machining a convex shape in the supporting structure, laying a rear skin (14) impregnated with resin on a mould, gluing the rear skin (14) onto the convex shape of the supporting structure (8), turning over the assembly so that the blank (2) lies in the upper portion of the assembly, machining and polishing a mirror in the glass blank (2).

Abstract: The invention relates to a method of premature wear of a fabric garment made of a colored denim canvas, wherein the aforementioned garment is placed into a rotating machine including a drum, characterized by the fact that the aforementioned method comprises a step during which the garment is rotated in the drum without being wetted or dampened, ozone gas being injected simultaneously into the interior of the aforementioned drum so as to bleach the aforementioned garment and give it a wear effect.

Abstract: Plastic restoration kits and methods for restoring the light transmission and optical clarity properties of plastic surfaces, such as plastic aircraft windows, automobile plastic headlight covers, plastic sunglass lenses, and plastic corrective optical lenses. The kits and methods restore plastic surfaces that have been damaged by hazing, scratching and/or UV-induced oxidation. The kits and methods employ at least one polishing composition configured to improve clarity by removing scratches. A UV protective material is incorporated into at least one of the polishing compositions so that the UV protective material becomes worked into the plastic surface during polishing, and a protective coating that forms a hard protective coating over the plastic surface impregnated with the UV protective material is finally applied. The plastic surface may be heated after polishing and prior to application of the protective coating material.

Abstract: A wet sanding adjuvant is comprised of a composition comprising: (1) an alkali metal or ammonium salt of an alkoxylated alkyl sulfate; (2) an alkali metal or ammonium salt of an alphaolefin sulfonate; (3) a cellulose derivative selected from the group consisting of hydroxyalkyl cellulose, a carboxyalkyl cellulose and combinations thereof. The adjuvant is used in a method of removing a coating from a surface comprising the steps of: (1) contacting a coated surface with a composition according to the invention to form a wet surface on the coating; (2) abrading the wet surface with an abrasive; (3) removing the composition from the surface.

Abstract: A method of grinding the tip of a blade which forms part of a rotor for a gas turbine engine is provided. The method includes mounting a plurality of blades in a disc to provide a blade assembly; mounting the blade assembly in a grinding apparatus; aligning the plurality of blades in a predetermined position using compressed fluid; and, grinding the blade tips.

Abstract: Optical polishing pitch formulations include synthetic polymers or other synthetic resins. As alternatives to traditional optical pitches, these materials offer improved stability in use, storage, and processing. In addition, these pitch compositions may be masterbatched and manufactured with precision to ensure superior reproducibility and quality control in polishing performance.

Abstract: The invention provides a metalworking fluid which contains (A) a base oil including 2-ethylhexanol palmitate or 2-ethylhexanol stearate, and (B) an anionic surfactant that is a salt of a branched aliphatic carboxylic acid having 8 to 18 carbon atoms with a branched alkanolamine having 3 to 12 carbon atoms. The metalworking fluid of the invention is excellent in the cutting performance, anti-foaming properties, stability of stock solution, emulsion stability and resistance to hydrolysis, and shows low kinematic viscosity at low temperatures.

Abstract: A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.

Abstract: A wafer grinding machine and a wafer grinding method are disclosed. A barrier (60) is arranged around a holding unit (29) to hold at least a wafer (40) with a film (11) attached on the front surface (41) thereof and with the back surface (42) thereof directed upward. The upper surface (61) of the barrier unit is ground to the position between the back surface of the wafer held by the holding unit and the boundary between the wafer and the film. Then, the wafer is ground while being held with the back surface thereof up by the holding unit. As a result, the film is prevented from coming off from the wafer at the time of grinding the back surface of the wafer. Further, when the wafer is ground, a fluid may be supplied into the gap between the barrier unit and the outer peripheral portion of the wafer held by the holding unit.

Abstract: A lens deblocking system (1) used for removing a lens (51) from an edging block (22). The system (1) includes opposed movable arms (4, 5) that are constrained to travel longitudinally within an aperture (3) so as to grip a lens (51) that is adhesively secured to an edging block by a pad (52). The edging block (22) is held within a clamp (11) that resides on a collet closer (63) which may be rotated by activating an air cylinder (82). A cam push block (91) is linked to file cylinder (82) as well as a cam arm (98) that is attached to a spindle (96) extending from the collet closer (63). In response to the movement of the push block (91) a rotational motion is imparted to the clamp (11) via the cam arm (98). The rotation of the clamp (11) occurs while the lens (51) is still constrained against rotational movement between the movable arms (4, 5) thereby physically breaking the bond between the pad (52) and the clamp (11) and permitting subsequent manual removal of the pad (52) from the lens (51).

Abstract: A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream.

Abstract: The invention includes methods of manufacturing shafts to be used in medical devices. In particular, methods are disclosed to improve straightness and profile of wire used to form guidewires. The wire is preferably twist-straightened with a desired twist orientation, followed by grinding a desired profile on an apparatus having a spin configuration that is aligned in the same direction as the twist orientation.

Abstract: An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member. A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.

Abstract: A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding ring is passed through the center of the wafer, and feeding the grinding ring in a direction perpendicular to the chuck table; a wafer positioning step for positioning the upper surface of an outer circumferential portion of the wafer directly below the locus of rotation of the grinding ring; and a second grinding step for grinding the upper surface of the wafer by first stopping the rotation of the chuck table so that the mark indicating the crystal orientation of the wafer held on the chuck table is pointed in a predetermined direction, next feeding the grinding ring in the direction perpendicular to the chuck table, and next relatively moving the chuck table and the grinding ring in parallel.

Abstract: A method of forming a slider includes forming a leading edge blend on a leading edge of the slider. After the leading edge blend is formed, the method further includes forming at least one step feature conformal to the leading edge blend. A slider having an air bearing surface includes a leading edge blend and at least one step feature conformal to the leading edge blend.

Abstract: In one embodiment, a first substrate including first and second array regions are prepared. The first and second array regions respectively include first and second active areas. A peripheral seal material having an air intake opening is arranged outside the first and second array regions. A second substrate is arranged on the surface of the first substrate in which the first and second seal materials and peripheral seal material are formed in a vacuum chamber under vacuum state. Atmosphere is introduced into the vacuum chamber and a space between the first and second seal materials from the air intake opening. Then, a pressure is applied to the first and second substrates by pressure difference between the atmospheric pressure of circumference which surrounds the first substrate and second substrate, and the atmospheric pressure of the space between the first substrate and second substrate.

Abstract: A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system there is a model having a representation of a desired shape of the workpiece. A scanning system generates a representation of a current shape of the workpiece while in-process during the polishing operation. A comparator compares the current shape of the workpiece to the desired shape of the workpiece. An illumination system highlights the workpiece with visible light during the polishing operation. The highlighting of the workpiece with visible light is a function of the comparison between the current shape and the desired shape. The illumination system highlights a portion of the workpiece that needs additional polishing to conform to the desired shape.

Abstract: Pinion gears for planetary gear transmissions are hobbed, heat treated, and then ground to get better control of the leads/profiles on all the gear teeth. Then a light shot peening is applied to the tooth flanks to achieve the desired compressive residual stresses on the tooth surface. By applying the process in the controlled manner specified, the surface is not over-cold worked. Next, a chemically assisted isotropic surface treatment is applied over the pinion gears to improve the surface finish on the gear teeth. For low speed applications the surface finish improves the lambda ratio, allowing for a good oil film thickness on the surface of the gear teeth.

Abstract: Certain disclosed embodiments concern making sports equipment, such as golf club heads, using polishing marks to facilitate removing material from as-cast work pieces to produce a final thickness within a desired specification, such as 0.6 millimeter or less ±0.05 millimeter. At least one polish mark, more typically plural polish marks, is formed into an outer surface of an as-cast article to a depth selected to provide a final product thickness subsequent to polishing that is ±0.05 millimeter of a final desired thickness. The golf club head or component is then polished at least once to remove club head material substantially corresponding to the depth of the at least one polish mark. The method may further comprise joining the club head to a shaft.

Abstract: A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump region (25) where said bumps are formed in the wafer; forming a resin layer (29) by applying resin around the bump region-conforming member up to a thickness equal to or greater than that of the bump region-conforming member; grinding the bump region-conforming member along with the resin layer to a predetermined thickness; removing the bump region-conforming member from the table to form a concave part (45) in the resin layer; applying a film (11) on the front surface of the wafer; and disposing the wafer in the concave part of the resin layer and holding the wafer on the table so that a back surface (22) of said wafer faces upward. After that, the back surface of the wafer can also be ground.

Abstract: For complex CMP processes requiring the removal of different dielectric materials, possibly in the presence of a polysilicon material, a slurry material may be adapted at the point of use by selecting an appropriate pH value and avoiding agglomeration of the abrasive particles. The in situ preparation of the slurry material may also enable a highly dynamic adaptation of the removal conditions, for instance when exposing the polysilicon material of gate electrode structures in replacement gate approaches.

Abstract: A method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes washing a disk-shaped glass plate with an acid washing liquid, removing at least part of a surface layer, which is formed on the surface of the glass plate, by performing grinding with diamond abrasion grains, and washing the surface with a neutral or alkaline washing liquid.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.

Abstract: A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin film in contact with a suction surface of a chuck table in a grinding apparatus, and the exposed back-side surface of the wafer is ground. Unevenness in thickness of the resin film is suppressed, whereby the thickness of the wafer subjected to back grinding is made to be uniform.

Abstract: A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising a protective film forming step for forming a protective film by coating the front surface of the wafer with a liquid resin; a flattening step for scraping the front surface of the protective film formed on the front surface of the wafer to flatten the protective film; and a rear surface grinding step for placing the protective film side of the wafer on the holding surface of a chuck table for holding a wafer and grinding the rear surface of the wafer by a grinding means to a predetermined thickness.

Abstract: This invention provides an oil composition for cutting and grinding by minimum quantity lubrication system, characterized by comprising an ester oil with a kinematic viscosity of 0.5-20 mm2/s at 100° C., and an ester-based polymer with a kinematic viscosity exceeding 20 mm2/s at 100° C. and an average molecular weight of 5,000-10,000,000. The oil composition for cutting and grinding by minimum quantity lubrication system according to the invention can achieve an excellent balance between misting property and inhibition of floating mist and ensure that an adequate amount reaches the working section, for cutting and grinding by minimum quantity lubrication system.

Abstract: A process for edging an optical lens for conforming the optical lens to the size and shape of a lens frame into which the optical lens is to be accommodated, said process comprising: a) providing an optical lens having a convex surface, the convex surface being provided with an anti-smudge topcoat rendering the optical lens inappropriate for edging; b) fixing a mounting element on the convex surface of the optical lens, preferably on its center, by means of an adhesive pad adhering both to the mounting element and the convex surface of the optical lens to form a mounting element/optical lens assembly; c) placing the mounting element/optical lens assembly in a grinding machine so that the optical lens is firmly maintained; and d) edging the optical lens to the intended size and shape, wherein, prior to step (b) of fixing the mounting element, the anti-smudge topcoat on the convex surface of the optical lens is pre-treated with a solvent selected from the group consisting of alkanols and dialkylketones under a

Abstract: Optical polishing pitch formulations include synthetic polymers or other synthetic resins. As alternatives to traditional optical pitches, these materials offer improved stability in use, storage, and processing. In addition, these pitch compositions may be masterbatched and manufactured with precision to ensure superior reproducibility and quality control in polishing performance.

Abstract: A blank and method for the production of dental shaped bodies in machining equipment having at least two tools located in the machining chamber of the machining equipment, including a corpus of tooth restoration material, from which the shaped body can be carved by means of at least one of at least two tools by material removal. The blank exhibits at least two gages, each of which is in the form of a recess, the geometry of which is such that the tool selected for the cutting operation can be recognized by means of at least one of the gages by reference to its outer contour, the at least two gages being disposed on the blank in such a way that they can be simultaneously engaged by the at least tools when the blank is clamped in the machining equipment for carving purposes.