Abstract: A gear shaper machine system drives and maneuvers a hone tool to generate teeth geometry in a manner the teeth were machined prior to a hardening process. After heat treatment, the hone tool is indexed to the teeth geometry spacing of the workpiece so as to divide the stock removal evenly between the drive and coast sides. The hone tool may be driven with rotational and reciprocating synchronous teeth generating motion in which the hone tool reciprocates along the length of the teeth parallel to the centerline of the workpiece while the workpiece and hone tool rotate with synchronous motion.

Abstract: A method of processing a wafer having a device area in which a plurality of devise are formed and a peripheral excess area surrounding the device area on the front surface, comprising an annular groove forming step for forming an annular groove having a predetermined depth and a predetermined width at the boundary between the device area and the peripheral excess area in the rear surface of the wafer by positioning a cutting blade at the boundary; and a reinforcement forming step for grinding an area corresponding to the device area on the rear surface of the wafer in which the annular groove has been formed, to reduce the thickness of the device area to a predetermined thickness and allowing an area corresponding to the peripheral excess area on the rear surface of the wafer to be left behind to form an annular reinforcement.

Abstract: A method for grinding a number of objects includes a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the grinding jig after completion of the grinding process, smoothly and precisely without damaging a number of the objects to be ground and without altering the arrangement pattern of the objects to be ground from the start through the end of the series of steps.

Abstract: In a scrubber adapted to clean a semiconductor wafer, the torque of a brush rotation motor is monitored while a scrubber brush is in contact with the wafer and is being rotated by the motor. The position of the brush relative to the wafer may be adjusted based on the monitored torque to regulate the pressure applied to the wafer by the brush. Open loop positioning or closed loop control may be employed.

Abstract: An operating method improves the running behavior of gearwheels negatively noticed upon gearwheel testing and is performed by a burnishing device. The gearwheels that were rejected from the production process may be optimized rapidly and in a targeted way so that they may be returned back into the production process. The tooth flanks of a gearwheel to be machined are, in a first method step, mechanically freed of particles adhering to the surfaces of the tooth flanks or slight protrusions protruding therefrom using a first gearwheel machining tool having a machining wheel coated with an abrasive agent. Subsequently, in a second method step in a second gearwheel machining tool known as a burnishing machine, the gearwheel is chucked between gearwheel-shaped rolling tools, the so-called burnishing wheels, and rolled without material abrasion.

Abstract: A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.

Abstract: A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.

Abstract: The present invention relates to a method for grinding of cam profiles on a camshaft (1), having an inner shaft (5) and an outer shaft (4) arranged coaxially one inside the other and mounted to rotate with respect to one another. The camshaft (1) additionally has first and second cams (2, 3) that can rotate with respect to one another over a limited circumferential angle about the camshaft axis (6), the first cams (2) of which are fixedly connected to the inner shaft (5) and the second cams (3) of which are fixedly connected to the outer shaft (4). It is essential to this invention that during and/or after the grinding operation a fluid is forced under pressure into the outer shaft (4), thereby preventing penetration of grinding dust into the interspace (8) between the first cams (2) and the outer shaft (4) or flushing out any grinding dust that has already penetrated.

Abstract: Difference between a lens edge circumference and an edged lens circumference is controlled to be always within a prescribed range so that a spectacle lens of a properly finished circumference size can always be supplied.

Abstract: An apparatus and method to test the abrasion resistance of materials. In one embodiment, the apparatus comprises a conduit network, a primary air stream generating device to generate a primary air stream in the conduit network, a secondary air stream generating device to produce a secondary air stream in the conduit network, and a particulate handling device to deposit particulate into the conduit network so that the particulate enters the secondary air stream. The conduit network merges the secondary air stream into the primary air stream to allow the particulate to enter the primary air stream, and allow the primary air stream to blow the particulate at a test sample positioned within the conduit network.

Abstract: It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.

Abstract: A wafer processing method including the step of removing a ringlike reinforcing portion formed along the outer circumference of a wafer on the back side thereof. The ringlike reinforcing portion is ground by a grinding stone in such a manner that the locus of the grinding stone rotating intersects the ringlike reinforcing portion as viewed in plan. The grinding of the ringlike reinforcing portion is ended when the ground surface of the ringlike reinforcing portion becomes higher by 20 to 1 ?m than the upper surface of a metal film deposited on the back side of a device area of the wafer. It is unnecessary to accurately align the grinding stone to the ringlike reinforcing portion on the upper side thereof, so that the position control can be easily performed.

Abstract: An information recording medium glass substrate manufactured by polishing the surface of a raw material glass plate. The polishing is divided into two steps, a step for performing a first polishing process to roughly polish the surface of the raw material glass plate to be smooth and a step for performing a second polishing process to finely polish the surface of the roughly polished raw material glass plate to be smoother. The second polishing process, using a polishing pad made of foam, is divided into two stages, pre-polishing with a polishing agent including abrasive grains of cerium oxide and post-polishing with a polishing agent including abrasive grains of silicon oxide. A rinsing process is performed between the pre-polishing and the post-polishing to rinse the raw material glass plate after the pre-polishing with a washing liquid to wash away the abrasive grains collected in the polishing pad in pre-polishing during the rinsing process.

Abstract: The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the upper floor face being made of a board having penetration holes or a mesh member, and the lower floor face supporting the upper floor face so as to be located above the lower floor face with a distance; and guiding dust made by the grinding apparatus to the water by use of the air stream.

Abstract: Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

Abstract: Refinishing an exterior automotive lens having a damaged exterior surface in situ using a continuous movement and oscillating motion, with first, a 320 grit sanding disc, next a 600 grit sanding disc and finally a 1500 grit sanding pad while flushing the surface with water to prevent melting of the surface. Buffing the surface with a polishing compound until a high gloss is achieved. Finally, coating the surface with a transparent ultraviolet hardenable coating material, and hardening it by exposure to an ultraviolet light source. This method is accomplished using an oscillating tool having a remotely located drive.

Abstract: A device for working of glass panes (1) has a support (5) for the glass panes (1) and a nozzle (2) from which a water jet emerges for cutting the glass panes (1). The nozzle (2) can be moved on a guide (8) parallel to the plane of the support (5). The tool (12) for working of the cut edges of the material plates (1) can likewise be moved on the guide (8) of the nozzle (2) and is preferably mounted on the same carriage (9) which can be moved on the guide (8), as the nozzle (2). This simplifies not only the technical structure of the device, but also shortens the working time, since the glass pane (1) need not be transported to another device for finishing. Moreover, essentially the same control program as for the water jet cutting can be used for finishing.

Abstract: A method of machining a workpiece includes applying a fluid between a fixed abrasive component and a workpiece, followed by translation of the fixed abrasive component and the workpiece relative to each other. The fluid contains an anti-clogging agent containing a phosphorus-containing organic chemistry.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A surface treating method for a golf club head includes applying polishing pretreatment on a golf club head and grinding at least one surface of the golf club head with a resilient grinding rod. The resilient grinding rod includes at least one resilient matrix and at least one kind of grinding particles. The resilient matrix is resin or rubber. The resilient matrix has a hardness within a range of Shore A 70 and Shore D 80. The resilient grinding rod includes a grinding end that possesses an inclined grinding face having inclination with an angle ? with respect to a longitudinal axis of the grinding rod.

Abstract: A method for water jet stripping and recontouring of a coated article of manufacture is provided. The method includes dimensionally scanning the coated article and establishing a three-dimensional model for the coated article. The method further includes establishing a set of reduced dimensional profiles for recontouring and then analyzing whether the reduced profiles are satisfactory for subsequent operation. A jet spraying program is established for removal of the coating and the surface base material to each predetermined reduced dimensional profile.

Abstract: The present invention relates to a sawing method for a wafer. The sawing method of the invention comprises: (a) providing a wafer, the wafer having an active surface and a back surface, the active surface having a plurality of sawing lines; (b) coating a protection layer on the active surface and the sawing lines; (c) taping a grinding tape on a surface of the protection layer; (d) grinding the back surface of the wafer to thin the wafer; (e) removing the grinding tape; and (f) sawing the wafer to form a plurality of dice. Whereby, the problems of die cracking, die scratching, die contamination and peeling of the surface of the sawing lines can be avoided.

Abstract: The method for making an optical lens according to the present invention is characterized in comprising: a optical lens preform fabrication step of fabricating a optical lens preform which comprises a first curved portion which serves as an optically functioning part and which is on one side, a flat surface portion which is formed on the opposite side to the first curved portion, and paired beveling surfaces which are formed on the both sides of the flat surface portion; a drawing step of drawing a optical lens preform 40 until the optical lens preform 40 has obtained a desired outer diameter; and an optical lens fabrication step of cutting thus drawn optical lens preform and accordingly fabricating an optical lens. With this making method, since there are paired beveling surfaces disposed, it is possible to suppress a drawing-induced distortion.

Abstract: Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a semiconductor wafer polishing apparatus of the present invention has a polishing unit polishing the circumferential edge side of a disc-formed wafer; and a gas blowing unit blowing a gas G against the surface of the wafer, so as to separate the space over the wafer by a curtain C of the gas G between a polishing field PF in which the wafer is polished by the polishing unit and a normal field NF except the polishing field PF.

Abstract: A method of processing a wafer having a device area in which a plurality of devise are formed and a peripheral excess area surrounding the device area on the front surface, comprising an annular groove forming step for forming an annular groove having a predetermined depth and a predetermined width at the boundary between the device area and the peripheral excess area in the rear surface of the wafer by positioning a cutting blade at the boundary; and a reinforcement forming step for grinding an area corresponding to the device area on the rear surface of the wafer in which the annular groove has been formed, to reduce the thickness of the device area to a predetermined thickness and allowing an area corresponding to the peripheral excess area on the rear surface of the wafer to be left behind to form an annular reinforcement.

Abstract: An adhesive tape which is to be arranged between a lens and at least one of a plurality of chucks in an edge-machining apparatus comprises an adhesive face for being in contact with the lens. A measurement of an adhesive strength of the adhesive face is 4 gf (0.0392 N) or more when a polyethylene terephthalate plate which has been subjected to a surface treatment with a fluorine-modified silicone parting agent is used as a test plate in an adhesive strength test method based on a 180°-peeling method as defined in JIS Z 0237 “adhesive tape/adhesive sheet test method”. A technique which can be used to edge the lens in which an antifouling layer is formed by using a fluorine-containing silane compound having an excellent antifouling effect is also provided.

Abstract: A method of abrading a surface of a workpiece with a structured abrasive article in the presence of a liquid comprising water and at least one of a sulfonate or sulfate anionic surfactant.

Abstract: A system for abrading and scoring glass. An abrading/scoring station includes a table for supporting a large sheet of glass on a generally flat support. A first tool support moves an abrading tool for abrading a coating material from the glass. A second tool support moves a scoring or cutting tool that scores a region of the glass. By coordinating a movement of the first and second tool supports with respect to a piece of glass, a controller causes the respective tools to first abrade and then score controlled paths on the piece of glass while avoiding contact between the first and second tool supports and their respective tools.

Abstract: Back grinding methods for fabricating an image sensor are disclosed. An example method of back grinding an image sensor comprises: forming a profile anti-deformation film on a micro lens of the image sensor; grinding a backside of a semiconductor substrate of the image sensor; and removing the profile anti-deformation film.

Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.

Abstract: A method for dry finishing of a floor surface consisting of concrete, stone, marble, terrazzo, densite or other hard materials is disclosed. The method comprises finishing of the floor surface using a cutting, grinding and/or polishing tool. In the method, a vapor or aerosol is applied to the floor surface and/or the tool in connection with said dry finishing. An apparatus and a set of parts for carrying out the method are also disclosed.

Abstract: Methods for grinding low-K interlayer dielectric (ILD) wafers are described herein. In various embodiments, the method may include cutting and severing a semiconductor wafer into a plurality of portions, the cutting and severing being performed in a manner that allows the portions to remain disposed with each other as if the semiconductor wafer had not been cut, applying a tape to a front side of the as if uncut semiconductor wafer, and grinding a backside of the taped as if uncut semiconductor wafer. In various other embodiments, the method may include attaching an adhesive to a backside of the semiconductor wafer prior to cutting the semiconductor wafer along the streets of the semiconductor wafer with the scribed lines to cut and sever the semiconductor wafer into a plurality of portions, with the portions remaining proximally disposed to each other and held in place by the adhesive as if the semiconductor device had not been cut.

Abstract: An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the polishing of a wafer by attracting or repelling the slurry to a portion or portions of the substrate.

Abstract: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

Abstract: Methods are provided for calibrating a tool using an eddy current probe and calibration wafers that each have a measurable predetermined property and a measurement of the measurable predetermined property of a first calibration wafer is different than a measurement of the measurable predetermined property of a second calibration wafer. The methods include determining a first set of impedance measurements of the calibration wafers while each is disposed in the tool and the tool has a tool parameter that is at a first condition, collecting a second set of impedance measurements of the calibration wafers while each is disposed in the tool and the tool parameter is at a second condition, establishing a reference point, based upon a first and a second data point from the first set of impedance measurements and a first and a second data point from the second set of impedance measurements.

Abstract: A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface roughness produced by the electroerosion.

Abstract: A method and apparatus are provided for post-CMP cleaning of a semiconductor work piece. The method comprises the steps of subjecting the work piece to a first cleaning composition having one of an acidic pH and a basic pH and subjecting the work piece to a second cleaning composition having an acidic pH, if the first cleaning composition has a basic pH and subjecting the work piece to a second cleaning composition having a basic pH, if the first cleaning composition has an acidic pH.

Abstract: A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical mechanical deposition station for filling copper material into a plurality of cavities formed in the surface of the wafer. The electroplating continues until a planar layer of copper with a predetermined thickness is formed on the surface of the wafer. In a following chemical mechanical polishing step the planar layer is removed until the copper remains in the cavities, insulated from one another by exposed regions of the dielectric layer.

Abstract: The present invention is aimed to provide a measurement system installable within a processing equipment and more specifically within the exit station of a polishing machine. The optical scheme of this system includes a spectrophotometric channel, an imaging channel and also means for holding the wafer under measurement.

Abstract: A method of restoring a discolored automobile headlight lens without removal of the lens from the automobile consistent with certain embodiments involves wet abrading an outer surface of the lens with successively finer grit wet sanding disks, using a low speed rotary or orbital tool having a flexible sanding holder holding the sanding disks, until a smooth surface is achieved exhibiting no discoloration, wherein the wet sanding disks comprise disks starting from approximately 220 to 400 grade down to approximately 2000 grade; polishing the outer surface of the lens with an aqueous paste abrasive polish containing aluminum oxide abrasive particles; cleaning any residue from the outer surface of the lens by wiping the lens with a lint free cloth; and spraying a film forming aqueous polymer dispersion containing an ultraviolet protectant to the outer surface of the lens, wherein the sealer comprises of acrylic urethane copolymers, Hindered Amine Light Stabilizers, benzotriazole UV light absorbers, 1-methyl-2-py

Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Abstract: A method for removing a metal oxide overlayer over a target polishing surface in conjunction with a chemical mechanical polishing (CMP) process to improve polishing uniformity including providing a substrate target polishing surface having a layer of an oxide of a metal overlying said metal to be chemically mechanically polished; removing the layer of an oxide of the metal using an oxide removal solution prior to performing a CMP process with an abrasive slurry; and, polishing the target polishing surface according to an a CMP process with an abrasive slurry including at least one of an oxidizer and a complexing agent.

Abstract: Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

Abstract: The surface of a gas turbine blade is machined with a material-removing tool and simultaneously, an anti-oxidation coating is deposited on the surface using eletrospark deposition.

Abstract: An apparatus for manufacturing a semiconductor device includes a first affixing mechanism, cutting mechanism, a second affixing mechanism and peeling mechanism. The first affixing mechanism affixes a first holding member to a rear surface of a semiconductor wafer which is opposite to an element forming surface thereof. The cutting mechanism cuts and discretely divides the semiconductor wafer. The second affixing mechanism affixes a second holding member to the element forming surface side of the semiconductor wafer while the first holding member is expanded to widen gaps of semiconductor elements of the discretely divided semiconductor wafer. The peeling mechanism peels the first holding member.

Abstract: A method of manufacturing an optical element having an optical surface extending close to a periphery of a substrate comprises: providing a substrate having a main surface extending beyond a periphery of the optical surface and also performing a polishing of the optical surface in regions of the main surface extending beyond the optical surface. Thereafter, material of the substrate carrying a portion of the surface extending beyond the optical surface is removed.

Abstract: A draining device for removing processing water attached to a lens includes: a first lens holding shaft to which a cup attached to a refractive surface of the lens as a processing jig can be fitted; and a rotating unit which rotates the first lens holding shaft to remove the water by centrifugal force.

Abstract: A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

Abstract: A separator plate useful in a wet-type multiplate clutch is provided on a friction surface thereof with elongated asperities extending with regularity in a predetermined direction. Peak portions of the elongated asperities, said peak portions being to project toward a counterpart member when the separator plate is assembled in the wet-type multiplate clutch, have been removed to form elongated plateaus. The separator plate can be manufactured by fixedly mounting a blank for the separator plate on a work support, forming elongated asperities with regularity in a predetermined direction on one of opposite surfaces of the blank by a grinding wheel, and then removing peak portions of the elongated asperities, said peak portions being to project toward a counterpart member when the separator plate is assembled in the wet-type multiplate clutch, to form elongated plateaus.

Abstract: A substrate processing apparatus equipped to employ electrical potential to assist in planarization and/or conditioning is provided.