Abstract: There is provided a groove machining method by means of water jet which machines grooves by means of a water jet device including injection nozzles for injecting a water jet on a face to be machined of a member to be machined, including a step of disposing protection members which are more resistive against an injection power of the water jet than the member to be machined so as to cover a portion which is a part of the face to be machined, and on which grooves are not to be formed in order to form ends of the machined grooves in a travel direction of the injection nozzles inside an outline of the face to be machined, and a step of moving the nozzles across the protection members and the face to be machined while injecting the water jet at a predetermined injection power from the injection nozzles.

Abstract: A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.

Abstract: A method and apparatus for finishing the surface of rubber or synthetic covered rollers (10) is disclosed. As seen in FIG. 3, a rotating hub (16) having a circumferential abrasion band (47) and an adjacent set of rasp blades (20) arranged end-to-end and extending circumferentially about the hub is used to progressively and sequentially removebands of surface material by cutting and then abrading as the hub and roller are rotated and one is moved axially relative to the other.

Abstract: A water electrolysis apparatus includes a plurality of unit cells. A membrane electrode assembly of the unit cell includes an anode side power feeding element and a cathode side power feeding element stacked on an anode catalyst layer and a cathode catalyst layer on both surfaces of a solid polymer electrolyte membrane. A surface of the anode side power feeding element is subjected to a grinding process, and then, subjected to an etching process to form a smooth surface.

Abstract: A method for manufacturing a glass substrate for an information recording medium having a high level of cleanness and superior smoothness. The manufacturing method includes washing a disk-shaped glass plate with an acid washing liquid, removing at least part of a surface layer, which is formed on the surface of the glass plate, by performing grinding with diamond abrasion grains, and washing the surface with a neutral or alkaline washing liquid.

Abstract: A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance.

Abstract: A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the edge of the silicon wafer.

Abstract: A method of making a beverage container from salt including cutting the salt into a block. A center portion of the block is removed to form a hollow interior portion for receiving a liquid. The block is polished to create smooth sides and rounded edges for the container. A wax coating may be applied to an exterior portion of the block. Further, an indicia may be attached to the wax coating.

Abstract: A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.

Abstract: The present invention provides a method for correcting a semi-conductive belt, the semi-conductive belt including a resin and a conductive substance, the method having grinding a geometrically defective part of the semi-conductive belt to flatten the geometrically defective part.

Abstract: A treatment device for improving the cutting properties of the blade of a non-electric shaving razor. The device has a treatment surface for interacting with the cutting edge of the razor blade, as the blade is put into sliding contact with the treatment surface. The treatment surface has a plurality of resilient honing projections that are compressed as the blade is moved in sliding contact with the surface.

Abstract: A stent has surface sculpturing, preferably on its outer surface only, having, for example, microspheres, having the function of increasing the actual geometric surface area of the stent, of creating undercuts and roughness to encourage the application of coatings of active or activatable agents, as well as of improving the attachment of the stent to the blood vessel wall.

Abstract: Provided are a steel plate for a refrigerator door and a method for manufacturing the steel plate. The steel plate includes a stainless steel plate provided on and forming an exterior of a refrigerator door with a vertical length of 1250 mm or more. The stainless steel plate surface is processed to form a finished texture oriented in a horizontal direction with respect to the refrigerator door. The method includes cutting a section from a rolled stainless steel plate base material corresponding in length to a length of a refrigerator door, rotating the cut section by a 90° angle, and surface processing through grinding a surface of the cut section in a direction perpendicular to a rolled direction thereof.

Abstract: A system for preparing a surface for painting, staining, or other treatment is provided. This system includes a surface preparation material and an optional dispenser for dispensing the surface preparation material. The surface preparation material includes a single-layer or multi-layer substrate material or fabric; a sanding portion formed on the substrate, wherein the sanding portion further includes at least one abrasive substance deposited thereon or embedded therein; and a wiping portion formed on the substrate separate from the sanding portion, wherein the wiping portion further includes cleaning means for removing debris created by the sanding portion from the surface to be painted, stained, or otherwise treated. The cleaning means may be one or more dry textured regions or areas formed on the substrate or it may be one or more sticky or tacky regions or areas formed on the substrate.

Abstract: A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50).

Abstract: A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal board, an abrasive-pressing tool which is placed on the metal board and has a hard surface, and a ultrasonic oscillation-generating tool attached to either or both of the abrasive-pressing tool and the metal board; rotating the metal board while supplying an abrasive slurry onto the surface of the metal board and while supplying electric power to the ultrasonic oscillation-generating tool to generate and apply ultrasonic oscillation to either or both of the abrasive-pressing tool and the metal board, whereby introducing the supplied abrasive slurry between the metal board and the abrasive-pressing tool and partly embedding some abrasive grains onto the metal board; and removing unfixed abrasive grains from the metal board.

Abstract: A lens deblocking system (1) used for removing a lens (51) from an edging block (22). The system (1) includes opposed movable arms (4, 5) that are constrained to travel longitudinally within an aperture (3) so as to grip a lens (51) that is adhesively secured to an edging block by a pad (52). The edging block (22) is held within a clamp (11) that resides on a collet closer (63) which may be rotated by activating an air cylinder (82). A cam push block (91) is linked to file cylinder (82) as well as a cam arm (98) that is attached to a spindle (96) extending from the collet closer (63). In response to the movement of the push block (91) a rotational motion is imparted to the damp (11) via the cam arm (98). The rotation of the clamp (11) occurs while the tens (51) is still constrained against rotational movement between the movable arms (4, 5) thereby physically breaking the bond between the pad (52) arid the clamp (11) and permitting subsequent manual removal of the pad (52) from the lens (51).

Abstract: A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.

Abstract: A method for fabricating a semiconductor device includes: supporting a semiconductor substrate formed with a polishing target film by a polishing head; and polishing the polishing target film while restricting movement in a radial direction of the semiconductor substrate by a retainer formed on the polishing head with a tilted surface formed on an inner peripheral section of the retainer, wherein when the polishing target film is polished, an outer peripheral surface of the semiconductor substrate comes into contact with the tilted surface formed on the inner peripheral section of the retainer.

Abstract: A method of polishing the double sides of a plurality of works simultaneously by rotating a plurality of carriers between upper and lower rotating surface plates, comprising the steps of forming the works (400) integrally with the carriers (500) on the outside of a polishing device main body (110), feeding the works (400) onto a rotating surface plate (111) on the underside of the polishing device main body (110) with the works formed integrally with the carriers (500), injecting liquid such as water from the upper side rotating surface plate when the upper side rotating surface plate is raised after the double sides are polished, holding the plurality of works (400) on the lower side rotating surface plate (111) after the double sides are polished, enabling the works (400) to be discharged automatically from the lower side rotating surface plate (111), providing a brush storage part (180) and a dresser storage part (190) near the polishing device main body (110), and frequently treating a polishing cloth ins

Abstract: An apparatus for the repair and resurfacing of compact discs using a motorized, abrasive surface.

Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

Abstract: A semiconductor wafer is produced by a method comprising a slicing step of cutting out a thin disc-shaped semiconductor wafer from a crystalline ingot; and a fixed grain bonded abrasive grinding step of sandwiching the semiconductor wafer between a pair of upper and lower plates each having a pad of fixed grain bonded abrasive to simultaneously grind both surfaces of the semiconductor wafer.

Abstract: A method for producing a mechanical part comprising sizing a sintered metal unit with application of a lubricating oil composition containing (A) a lubricating base oil having a kinematic viscosity of 0.5 to 150 mm2/s at 40° C., and compounded therein (B) as an extreme-pressure and rust preventing agent, a high basic Ca sulfonate in an amount of 5 to 80% by mass, (C) as a rust preventing agent, a neutral Ba sulfonate and/or a fatty acid ester of a polyhydric alcohol in an amount of 0.5 to 30% by mass, (D) as a metal deactivator, a benzotriazole compound and/or thiadiazole compound in an amount of 0.005 to 10% by mass, and (E) an anti-oxidizing agent in an amount of 0.05 to 10% by mass, each based on a total amount of the composition.

Abstract: An eyeglass lens processing apparatus includes a lens holding unit for holding an eyeglass lens, a roughing tool, a finishing tool, a drilling tool, a processing water supply unit for applying processing water to a processed part of the lens held by the lens holding unit, and a controller for controlling driving operations of each of the processing tools and the processing water supply unit in order to execute roughing for the lens by the roughing tool without application of the processing water, drilling for the lens by the drilling tool without the application of the processing water after the roughing and finishing for the lens by the finishing tool with the application of the processing water after the drilling.

Abstract: A method of reconditioning a medical device may include removing a portion of the medical device, and attaching to the medical device a replacement piece formed from nickel carbide and sized, shaped, and positioned to replace the portion removed.

Abstract: A cut section checking/aligning unit simultaneously checks cut sections of unit liquid crystal display panels that are separated from within first and second base substrates and aligns the unit liquid crystal display panels to a reference position. A grinding unit grinds edges of the unit liquid crystal display panels. The cut section checking/aligning unit and the grinding unit are integrated within a grinding device.

Abstract: A holding mode is selectively switched, in accordance with the content of processing of a substrate, among three holding modes: (a) a first holding mode in which while first support pins F1 through F12 abut on the back surface of a substrate W and support the substrate W, the substrate W is held because of nitrogen gas which is supplied to the front surface of the substrate W; (b) a second holding mode in which while second support pins S1 through S12 abut on the edge surface of the substrate W as the substrate W moves along the horizontal direction, thereby restricting horizontal movement of the substrate W, and abut on the back surface of the substrate W, thereby supporting the substrate W, the substrate W is held because of nitrogen gas which is supplied to the back surface of the substrate W; and (c) a third holding mode in which while the first and the second support pins F1 through F12 and support pins S1 through S12 abut on the back surface of the substrate W, the substrate W is held because of nitroge

Abstract: The present invention provides a method for trimming molds of automotive metal sheets, which comprise a top mold and a bottom mold. The top mold has a concave mold surface, and the bottom mold has a corresponding convex mold surface. The method comprises: 1. Use the top mold as the base mold, and smear dye on the top mold; 2. Close the bottom mold to the top mold; and 3. Polish the mold surface of the bottom mold. Thereby, the processing method according to the prior art is broken through, and an ergonomic trimming operation is hence provided. Accordingly, the trimming process is simplified, and the labor hours are reduced. Beside, the accuracy of trimmed molds is improved and the subsequent mold-clamping process can be omitted. Thereby, the exterior quality of the metal sheets can be enhanced while reducing substantial labor hours, and economic benefits for manufacturing molds of metal sheets for an automotive body can be achieved.

Abstract: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.

Abstract: A method for manufacturing magnetic recording tape includes applying a front coat including a magnetic component to a substrate to provide a coated substrate. The coated substrate defines a first face and an opposing, second face, the first face extending between a first corner and an opposing, second corner, and the second face extending between a third corner and an opposing, fourth corner. An abrasive surface is moved against the first corner of the coated substrate to abrasively remove a volume of material from the first corner. In particular, the abrasive surface is angularly offset at a substantially non-orthogonal angle from the first face of the coated substrate.

Abstract: A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding ring is passed through the center of the wafer, and feeding the grinding ring in a direction perpendicular to the chuck table; a wafer positioning step for positioning the upper surface of an outer circumferential portion of the wafer directly below the locus of rotation of the grinding ring; and a second grinding step for grinding the upper surface of the wafer by first stopping the rotation of the chuck table so that the mark indicating the crystal orientation of the wafer held on the chuck table is pointed in a predetermined direction, next feeding the grinding ring in the direction perpendicular to the chuck table, and next relatively moving the chuck table and the grinding ring in parallel.

Abstract: A rotary cutting tool has a cutting insert clamped from behind by a backing clamp against a frontal abutment defined in the body of the rotary cutter head. The clamp backs the cutting insert against the cutting pressure during operation and provides for the use of a same rotary cutter with different profiles of cutting inserts. Plugs of predetermined weight can be inserted in pre-formed holes in the cutting insert to permit recalibration of the insert after a sharpening operation.

Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

Abstract: An apparatus for manufacturing a liquid crystal display (LCD) device includes a table receiving an LCD panel thereon, a first grinding part grinding a surface of the LCD panel to a first surface roughness, a second grinding part grinding the surface of the LCD panel grinded to the first surface roughness to a second surface roughness, wherein the second surface roughness is smoother than the first surface roughness, and a polishing part polishing the surface of the LCD panel which is grinded to the second surface roughness.

Abstract: A grinding machine has a machine bed, a first spool and a second spool mounted on the machine bed. The spools are capable of storing stock to be ground and are rotatable in a coordinated manner. A grinding wheel is mounted on the machine bed. The first spool is capable of continuously unwrapping the stock, the second spool is capable of continuously wrapping the stock and the grinding wheel is adapted to grind the stock during its travel between the first spool and the second spool. The grinding machine can be used to continuously grinding a slender stock. The stock is continuously unwrapped from the first spool and continuously wrapped on the second spool. The stock is ground during its travel from first spool to the second spool.

Abstract: The invention provides an adhesive sheet for grinding a back surface of a semiconductor wafer, which is to be adhered to a circuit forming surface of the semiconductor wafer when the back surface of the semiconductor wafer is ground, in which the adhesive sheet contains an adhesive layer, an intermediate layer and a substrate in this order from the circuit forming surface side, the intermediate layer has a JIS-A hardness of more than 55 to less than 80, and the intermediate layer has a thickness of 300 to 600 ?m. Furthermore, the invention also provides a method for grinding a back surface of a semiconductor wafer, including adhering the above-mentioned adhesive sheet to a circuit forming surface of the semiconductor wafer, followed by grinding the back surface of the semiconductor wafer.

Abstract: The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.

Abstract: A method of manufacturing an optical component comprising a substrate and a mounting frame with plural contact portions disposed at predetermined distances from each other is provided. The method comprises providing a measuring frame separate from the mounting frame for mounting the substrate, which measuring frame comprises a number of contact portions equal to a number of the contact portions of the mounting frame, wherein respective distances between the contact portions of the measuring frame are substantially equal to the corresponding distances between those of the mounting frame, measuring a shape of the optical surface of the substrate, while the substrate is mounted on the measuring frame, and mounting the substrate on the mounting frame such that the contact portions of the mounting frame are attached to the substrate at regions which are substantially the same as contact regions at which the substrate was attached to the measuring frame.

Abstract: A lancet made of lancet wire having a ground tip. The lancet has a first ground face and a further ground face, which are located at a defined angle relative to one another, the length of the lancet being at most 16 mm. Also disclosed is a method for producing lancets for taking blood for medical-analytical purposes, which have at least one ground face that is generated in a grinding procedure. A lancet wire is positioned using a positioning device in a defined grinding position relative to a grinding element of a grinding device, and the following method steps are performed in this sequence: drawing off the lancet wire from a roll and transporting it into the positioning device; fixing or securing the lancet wire in the positioning device; grinding the free end of the lancet wire using the grinding device to generate at least one ground face; and cutting off the free end of the lancet wire in a cutting position to form a lancet having a defined length.

Abstract: A method for processing a flexographic printing plate on which patterned flexographic material that is uncured or partially cured has been provided, the method comprising mechanically shaping the upper surface of the flexographic material and fully curing the shaped material.

Abstract: A method of determining a position of a coolant nozzle relative to a rotating grinding wheel removing material from a work-piece and an apparatus for practicing the method are disclosed. The method includes the step of disposing a coolant nozzle having a base and a distal end for adjustable movement relative to the grinding wheel and the work-piece. The distal end of the coolant nozzle can be moved in a first plane normal to an axis of the grinding wheel along a first arcuate path centered on a pivot axis at the base. The distal end can also be moved by moving the pivot axis in the first plane along an orbit centered on the grinding wheel axis. The method also includes the step of selecting a position of the distal end along the first arcuate path. The method also includes the step of projecting a second arcuate path in the first plane centered on the grinding wheel axis and having a radius extending to the position of the distal end along the first arcuate path.

Abstract: A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.

Abstract: A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump region (25) where said bumps are formed in the wafer; forming a resin layer (29) by applying resin around the bump region-conforming member up to a thickness equal to or greater than that of the bump region-conforming member; grinding the bump region-conforming member along with the resin layer to a predetermined thickness; removing the bump region-conforming member from the table to form a concave part (45) in the resin layer; applying a film (11) on the front surface of the wafer; and disposing the wafer in the concave part of the resin layer and holding the wafer on the table so that a back surface (22) of said wafer faces upward. After that, the back surface of the wafer can also be ground.

Abstract: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.

Abstract: The substrate processing apparatus relating to the present invention comprises a polishing section where wafers are sequentially arranged, and that has multiple polishing platens for polishing a metal film on the wafer surface in stages. The wafers are simultaneously conveyed between the polishing platens by a rotating head mechanism. Further, the wafers polished by the polishing platen for the final stage polishing are sequentially conveyed to a cleaning section and are cleaned. The wafers from the polishing section to the cleaning section are conveyed by a load-unload unit, a post-polishing wafer reversal unit and wet robots. Then, the operation of each part is controlled by an apparatus controller to start the cleaning processing of the polished wafers by the polishing platen for the final stage polishing within a predetermined time period from the completion of polishing by the polishing platen for the final stage polishing.

Abstract: A process of forming a deflection mirror in a light waveguide with a use of a dicing blade having a cutting end with a flat top cutting face and at least one slanted side cutting face. The process includes a cutting step of cutting a surface of the light waveguide to a depth not greater than a width of the flat top cutting face, thereby forming a groove in the surface of the light waveguide. The groove has a slanted surface which is formed by the slanted cutting face to define the deflection mirror in the waveguide.

Abstract: A wafer grinding machine and a wafer grinding method are disclosed. A barrier (60) is arranged around a holding unit (29) to hold at least a wafer (40) with a film (11) attached on the front surface (41) thereof and with the back surface (42) thereof directed upward. The upper surface (61) of the barrier unit is ground to the position between the back surface of the wafer held by the holding unit and the boundary between the wafer and the film. Then, the wafer is ground while being held with the back surface thereof up by the holding unit. As a result, the film is prevented from coming off from the wafer at the time of grinding the back surface of the wafer. Further, when the wafer is ground, a fluid may be supplied into the gap between the barrier unit and the outer peripheral portion of the wafer held by the holding unit.

Abstract: There is provided a method for manufacturing cell structures having a plurality of cells divided by porous partition walls and extending from one end face to the other end face to function as fluid passages. Dry mass of each of a plurality of honeycomb-shaped cell structure precursors is measured, and at least one end face of each of the cell structure precursors is subjected to machining according to the dry mass measured to obtain a plurality of cell structures having a uniform dry mass. The method can suppress excessive use of a catalyst component to reduce production costs and uniformalize the amount of a catalyst component carried on the structures.

Abstract: A wafer polishing method is provided. First, a wafer, having a first surface, a second surface, and a plurality of opening portions depressed on the first surface, is provided. A plastic adhesive is filled in the opening portions and cured later. A polishing step is performed to thin the thickness of the wafer. Therefore, the yield of the wafer in the polishing process can be improved by the protection of the plastic adhesive.