Abstract: A tool head for a machine tool comprising a plurality of tool spindles with each tool spindle being rotatable about a respective tool axis. The plurality of tool spindles comprises at least a first tool spindle rotatable about a first tool axis, a second tool spindle rotatable about a second tool axis and a third tool spindle being rotatable about a third tool axis with the first, second and third tool axes being parallel to one another. The first, second and third tool spindles are arranged on the tool head whereby one of the first, second and third tool spindles faces a first direction and the other two of the first, second and third tool spindles face a second direction with the first and second directions being 180 degrees apart. The tool spindles are preferably grinding spindles on a machine for grinding bevel gear cutting tools.

Abstract: In accordance with an embodiment, a film thickness monitoring method includes polishing an opaque film on a transparent film on a substrate, irradiating the substrate with light concurrently with the polishing of the substrate, obtaining a first signal by detecting reflected light from the substrate, acquiring first data from the first signal, and calculating a polishing amount of the opaque film using the first data. The polishing is performed by relative rotation of the substrate and a polishing table to which a polishing pad is attached. The first data is obtained by grouping the first signals obtained from positions each remote from a central position of the substrate by a same distance, and by performing data processing.

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for accurately measuring the amount of material removed during a polishing process. Accurate measurement of such a polishing process can be especially helpful in measuring material removal on curved surfaces and edges where material removal rates tend to be less predictable.

Abstract: A spindle for a machine tool comprising a outer spindle portion and an inner spindle portion with each of the outer spindle portion and the inner spindle portion being rotatable relative to one another about the same axis. The outer spindle portion and the inner spindle portion each include a plurality of magnets that are arranged in an opposing manner with respect to one another whereby rotation of one portion of the spindle will induce rotation in the other portion of the spindle due to the attraction force between the magnets.

Abstract: In a measuring method in which a sizing device is activated only for a prescribed measurement time (t1) to carry out measurement in a main process that is repeated with a period of a prescribed process time (t0), there are stored an activation drift that is a drift of a measured value after activation of the sizing device and a deactivation drift that is a fluctuation in drifts among different elapsed times, each of the drift being measured when the sizing device is activated after a predetermined time has elapsed since the sizing device is deactivated. A measurement drift section is determined.

Abstract: A personal computer has correction coefficients (?) for tooth-profile error correction and correction coefficients (?) for meshing position correction which are set for each number of times a shaving cutter is sharpened, and for each cutter feature of the shaving cutter. Target tooth-profile data (Do), tooth-profile error data (?D) which is the difference between the target tooth-profile data (Do) and measured tooth-profile data (Dm), and the correction coefficient (?) and the correction coefficient (?) captured in correspondence with the number of times sharpening is performed, and the cutter features are applied to an equation Dcc=Do+?·?D+? to find aimed tooth-profile data (Dcc). Shaving-cutter tooth-profile data (ds) is found from the aimed tooth-profile data (Dcc). Thus, the shaving cutter can be sharpened appropriately even when the outer diameter and tooth thickness of the shaving cutter are reduced by sharpening the shaving cutter.

Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.

Abstract: A milling and grinding device, for machining a workpiece, includes a rack, a positioning tool, a spindle, a tool magazine, a milling cutter, a grinding wheel, and a controller. The rack defines a receiving chamber, and includes a workstation at a bottom of receiving chamber. The positioning tool is mounted on the workstation to position the workpiece. The milling cutter and the grinding wheel are received in the tool magazine. The milling cutter is capable of milling the workpiece to form a hole. The grinding wheel is capable of grinding the hole of the workpiece. The controller is mounted on the rack, and capable of controlling the spindle to receive the milling cutter or the grinding wheel from the tool magazine, to mill or grind the workpiece. The tool setting gauge is mounted on the workstation, and capable of sharpening the grinding wheel in a different grinding precision.

Abstract: The present invention includes a base, a work table, upright posts, several carriages and a grinding head. Wherein, the upright posts include for example a first upright post and a second upright post which are installed in parallel to each other on the base, and the carriages include a first carriage, a second carriage and several of third carriages; the base is connected to the first carriage and the work table is connected to the first carriage; the second carriage is positioned between the first upright post and the second upright post, the grinding head is installed on the second carriage and the third carriages are symmetrically installed on the outer sides of the first upright post and the second upright post, and each of the third carriages has a slider. The grinding machines of this invention can be used to significantly improve the operating stability and machining precision.

Abstract: A core grinding wheel that has a grinding layer on an outer periphery of a core is used. An ultrasonic wave is output from an ultrasonic sensor to the grinding layer via grinding fluid. An ultrasonic measuring device control unit calculates a thickness of the grinding layer on the basis of a sonic velocity in the grinding layer and an arrival time difference between a reflected wave from a surface of the grinding layer and a reflected wave from a surface of the outer periphery of the core. A grinding process and a truing process are controlled on the basis of an outside diameter of the grinding wheel, which is calculated on the basis of the measured thickness of the grinding layer and an outside diameter of the core.

Abstract: In a continuous grinding machine for grinding the surface of flat workpieces (20) with at least one grinding station and a transport device (10) for moving the workpieces (20) relative to the grinding station, the grinding station having at least one grinding assembly (22) with a grinding belt (26) and a pressure device (34) for pressing the grinding belt (26) against the workpiece surface, and with a control device (38) for controlling the pressure device (34) depending on the workpiece contour, the transport device (10) is reversible with respect to its feed direction and the control device (38) has means (36) for detecting the workpiece contour depending on the feed direction.

Abstract: A glass-plate working machine 1 is arranged such that while a cutting head 9 for forming a cut line on a glass plate 5 and a grinding head 10 for grinding a peripheral edge of the glass plate 5 bend-broken along the cut line are being moved simultaneously in parallel under numerical control, the cutting head 9 and the grinding head 10 respectively having angle control motors 46 and 49 are synchronously subjected to angular control about axes 39 perpendicular to the surface of the glass plate 5, and the cutting head 9 and the grinding head 10 are moved such that the orientation of a cutter wheel 52 is adjusted to a processing line, and the press contacting direction of a grinding wheel 64 of the grinding head 10 is kept in a normal direction with respect to a processing line of an edge of the glass plate 5.

Abstract: An eyeglass lens processing apparatus configured to form, on a peripheral edge of a lens, a bevel or a groove for fitting the lens to a frame of an eyeglass, includes: a data calculating unit for calculating data of the bevel or the groove to be formed on the peripheral edge of the lens based on frame shape data of the frame or demonstration lens shape data which is shape data of a demonstration lens having the bevel or the groove fitted to the shape of the frame; and a correction unit for approximating a front-side foot width, which is a width between a position of the bevel or the groove to be formed on the lens and a position of a front edge of the lens, to a target value by correcting the data of the bevel or the groove calculated by the data calculating unit.

Abstract: An eyeglass lens processing apparatus includes: a lens rotation unit configured to rotate a lens chuck shaft; a processing tool rotational shaft to which a processing tool is attached; a shaft-to-shaft distance change unit that includes a carriage which holds the lens chuck shaft or the processing tool rotational shaft and is movable in a direction where a shaft-to-shaft distance between the lens chuck shaft and the processing tool rotational shaft changes by driving a motor, a movement member that is moved in the shaft-to-shaft distance direction, a connection member that connects the movement member and the carriage, and a deformation detecting sensor configured to detect a deformation of the connection member; and a controller configured to control the driving of the motor based on a detection result of the deformation detecting sensor.

Abstract: A method of surfacing a surface of a spectacle lens, includes a step of determining a fixed rotation speed (Vrot) of the lens based on geometric characteristics of the surface, wherein the step of determining the rotation speed (Vrot) includes the following steps: generating (102), based on the geometric characteristics of the surface (12), a file of geometric altitude values of the surface, the file being centered on a zero geometric altitude value at a predetermined reference point; determining (103) a value representative of the greatest difference (MaxHk) in geometric altitude values on the surface; deducing (107) the rotation speed (Vrot) from the value of the greatest difference (MaxHk) in geometric altitude values on the surface and from a geometric value of the cylinder at a predetermined far-vision control point.

Abstract: A substrate carrying mechanism includes: a base; a substrate holding member placed on the base and capable of holding a substrate and of being advanced and retracted relative to the base; four or more detecting units respectively for detecting different parts of the edge of a substrate held by the substrate holding member when the substrate holding member holding a substrate is retracted; and a controller that determines whether or not a notch formed in the edge of the substrate has been detected by one of the detecting units, on the basis of measurements measured by the four or more detecting units and corrects an error in a transfer position where the substrate is to be transferred to the succeeding processing unit on the basis of measurements measured by the detecting units excluding the one detecting unit that has detected the notch of the substrate.

Abstract: Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.

Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.

Abstract: A method accurately monitors the progress of polishing and accurately detects the polishing end point. The method includes directing light to the substrate during polishing of the substrate, receiving reflected light from the substrate, measuring an intensity of the reflected light at each wavelength, and producing a spectrum indicating a relationship between intensity and wavelength from measured values of the intensity. The method also includes calculating an amount of change in the spectrum per predetermined time, integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum, and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum.

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: A method and system for providing transducer(s) including a disk structure and having an air-bearing surface (ABS) are described. The disk structure resides a distance from the ABS and has a disk dimension substantially perpendicular to the ABS. Lapping control and disk windage ELGs are provided. The lapping control ELG has first and second edges first and second distances from the ABS. The disk windage ELG has edges different distances from the ABS. A difference between these edges corresponds to the disk dimension. A windage resistance of the disk windage ELG is measured and a disk windage determined. The disk windage corresponds to a difference between designed and actual disk dimensions perpendicular to the ABS. A lapping ELG target resistance is determined based on the disk windage. The transducer is lapped. Lapping is terminated based on a resistance of the lapping control ELG and the lapping ELG target resistance.

Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.

Abstract: Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe.

Abstract: The rotary platens used here for high speed lapping are light in weight and low in mass inertia to allow fast acceleration and deceleration of the platens. The use of cast aluminum materials that are adhesively bonded together provides very rigid platens that have precision-flat surfaces that are dimensionally stable over long periods of time. Use of hardened spherical bead coatings on the surfaces of the platens provides wear-resistant coatings that are easy to apply and to maintain. The platens are constructed using ribs that provide very substantial stiffness and yet are light in weight which allows relatively small motors to be used to drive the platens. Platens are also constructed where the platen mass center is offset a very small distance from the center of rotation of the spherical-action bearings that support the platens to prevent dynamic distortion of the platen abrasive surface due to platen out-of-balance forces.

Abstract: An apparatus for grinding hand knives, in particular for meat processing, with at least one grinding tool is proposed, by means of which a knife ground finish, in particular during the reconditioning of hand knives after use, is made possible in a repeatable manner with reproducible grinding quality. This is achieved according to the invention in that a knife magazine (6, 7) for accommodating at least one hand knife is provided, in that a driven manipulating device (3, 4, 5) having at least one knife gripper (5) is provided, in that at least one sensor unit (22) for at least partly recording the knife contour is provided, and in that an electronic evaluating and control unit for evaluating the sensor data and for activating the manipulating device (3, 4, 5) is provided.

Abstract: A CNC system for effecting a finishing treatment of a surface, including: a mechanical assembly having a mechanical arm, adapted to move within at least two controllable axes of motion; a shoe arrangement, adapted to connect to an end of the arm and having at least one flexible surface finishing pad; and a drive mechanism adapted to drive the arm; a controller; a communication arrangement adapted to deliver communication signals between the controller and the mechanical assembly; and a positioning system providing the controller with positioning information with respect to the mechanical assembly, the system configured whereby the arm is responsive to the controller, the mechanical assembly adapted to urge the working surface against a workpiece surface, whereby a pressure is delivered thereto, the mechanical assembly including a controllable spring arrangement disposed and adapted to contribute to an overall mechanical compliance, normal to the working surface, of the mechanical assembly, the spring arrangem

Abstract: During grinding of mutually parallel edges of glass plates every edge of the glass plate is ground using a grinding tool or two grinding tools disposed one behind the other and cooling agent is directed from a side of the glass plate toward the grinding tool and supplied using a supply line divided via a redirection and separating segment into a plurality of fine streams of cooling agent, and a position of the grinding tool can be adjusted such that at least the position of the grinding tools relative to the assigned edge of the glass plate, which is passing through, is calibrated and the corners of the glass plate are ground to form a chamfer.

Abstract: A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.

Abstract: A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion path is modified based on the specified variable contact force profile. The surface of the work piece is finished using one or more surface finishing tools along the modified three-dimensional motion path. The surface of the work piece includes at least a flat region and a curved region.

Abstract: A method of shaping an ophthalmic lens to have a desired outline with a machining device including a blocking support for the ophthalmic lens and at least one first machining tool, the method includes: obtaining an inner cutting limit for the first machining tool; defining an initial blocking position for the ophthalmic lens and its desired outline; calculating whether at least a portion of the desired outline presents a non-zero intersection with the inner cutting limit; defining as the final blocking position either the unchanged initial blocking position if the calculated intersection is zero, or else a blocking position that is modified relative to the initial blocking position so that the desired outline as repositioned using the modified blocking position does not present an intersection with the inner cutting limit associated with the first tool; and blocking and shaping the ophthalmic lens with the desired outline.

Abstract: Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time.

Abstract: Teaching (contacting) operation is performed, and from the contact position (SX), the workpiece (2) is ground by a given “test grinding amount (A).” Subsequently, the diameter of the workpiece is measured. Based on the result of the measurement, the residual amount to be ground (residual grinding amount) to obtain the finished dimensions is calculated, and grinding by the “residual grinding amount (R)” is performed.

Abstract: A method of controlling a polishing system includes polishing a substrate at a first polishing station, transporting the substrate to an in-line optical metrology system positioned between the first polishing station and a second polishing station, at the in-line optical metrology system measuring a spectrum reflected from the substrate, and generating a characterizing value from the spectrum, determining that the substrate needs rework based on the characterizing value, returning the substrate to the first polishing station and performing rework of the substrate at the first polishing station; and transporting the substrate to the second polishing station and polishing the substrate at the second polishing station.

Abstract: A method of machining a profile pattern in a ceramic coating of a turbine shroud is provided and includes applying the ceramic coating substantially uniformly onto the turbine shroud, positioning a machining tool proximate the ceramic coating, and removing material from the ceramic coating by activating the machining tool to machine the ceramic coating and by moving the machining tool across the ceramic coating in a movement pattern that generally corresponds to the profile pattern.

Abstract: A substrate holding apparatus holds a substrate and presses the substrate against a polishing pad. The substrate holding apparatus includes a top ring configured to hold the substrate and press the substrate against the polishing pad, a vertical movement mechanism configured to vertically move the top ring, a torque detector configured to detect a torque of the vertical movement mechanism when the top ring is being lowered or being lifted by the vertical movement mechanism, and a controller in which a torque of the vertical movement mechanism when the top ring is brought into contact with a surface of the polishing pad at the time of a pad search is preset as a torque limit value. The controller calculates a torque correction amount from the torque detected by the torque detector and a preset reference value, and corrects the torque limit value by using the torque correction amount.

Abstract: A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.

Abstract: A system and method for evaluating characteristics of an S-cam are provided. The inventive method includes the step of obtaining angle values and displacement values indicative of an angle of rotation of the S-cam and displacement of a cam follower caused by rotation of a lobe of the S-cam. The method further includes the step of determining a profile for the lobe of the S-cam responsive to the angle values and the displacement values. The method further includes the steps of computing a deviation of the profile from a desired profile for the lobe of the S-cam and determining a rate of change in the deviation of the profile. In addition, the system and method may evaluate characteristics such as the concentricity of the S-cam and power transfer characteristics of the S-cam.

Abstract: With the center position CP of a support shaft 6 supporting a grinding wheel 4 being a reference, a provisional grinding start position S0? for a first workpiece 2 is calculated, based on a diameter ID of the first workpiece 2 before grinding, a diameter WD of the grinding wheel, a grinding completion position S4 on the first workpiece after the grinding, and an actual grinding start position S0 of the grinding wheel before grinding in second and subsequent grinding. S0 is determined by performing the grinding by moving the grinding wheel from S0? and by moving the grinding wheel away from the first workpiece by a distance corresponding to S4 near the grinding completion position S4. S0? is set by a calculation, S0?=ID?WD?S4?S?, considering an allowance S? between S0 and S0?.

Abstract: A method of chemical mechanical polishing a substrate includes polishing a layer on the substrate at a polishing station, monitoring the layer during polishing at the polishing station with an in-situ monitoring system, the in-situ monitoring system monitoring an elongated region and generating a measured signal, computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate, modifying the measured signal based on the angle to generate a modified signal, and at least one of detecting a polishing endpoint or modifying a polishing parameter based on the modified signal.

Abstract: A tire measurement system includes a computer with various memory/media elements for storing raw and transformed tire measurement data (e.g., a data set of measured radial or lateral run-out values) as well as software in the form of computer-executable instructions, which are executed by a processor to filter selected run-out values within the obtained data set that spike above adjacent measurements, identify selected ones of the filtered run-out values that lie on a convex hull surrounding the entire set of values, and perform interpolation of the identified selected ones of the run-out values that lie on the convex hull to obtain a final data set of filtered run-out measurements. Similar steps can be performed on an inverted data set to better detect sidewall deformation features such as sidewall depressions.

Abstract: An automatic grinding machine for end mills for wood, programmable with optical reading of geometric features and for computerized sharpening, has a compact structure, which includes a computerized control panel actuating various assemblies adapted for automated sharpening. A first optical reading assembly has an arm for automatic movement from an inactive position to a position suited for detecting the geometric features of the end mill. A second assembly for holding the end mill is configured to move on command forward and backward and/or simultaneously rotate the mill about its own axis. A third assembly for supporting a cup grinding wheel is mounted on the vertical frame, which rests on a rotatable circular and horizontal base. The grinding wheel can move above and below, longitudinally along the mill and/or in front of it, on the right and left side to sharpen end mills for wood with a left-handed or right-handed helix.

Abstract: The described embodiments relate generally to lapping, polishing or sanding operations of three dimensional objects having curved surfaces. More specifically, methods and apparatuses are described for providing a smooth and consistent looking surface along curved or spline shaped features. In some embodiments, a robot arm is used in conjunction with a computer numerical control (CNC) machine. Methods involve varying the location of a tool center point with respect to a finishing tool depending on the location of the finishing tool with respect to the tool control path.

Abstract: A system for controlling a manufacturing process of a substrate, the system may include an illumination module that is arranged to illuminate multiple regions of a substrate with electromagnetic radiation; a detection module that is arranged to detect electromagnetic signals resulting from the illumination of the multiple regions; and a processor that is arranged to: determine dimensions of multiple vias that are deposited within a substrate of the substrate to provide first via measurement results; determine substrate thickness at multiple locations to provide first substrate thickness results; and provide information related to at least one out of (a) the first substrate thickness results and (b) the first via measurement results to at least one out of (i) a thinning device arranged to thin the substrate and (ii) a manufacturing device that differs from the thinning device and is arranged to participate in a manufacturing of the substrate.

Abstract: A consumable component of a liquid jet cutting system is provided. The consumable component includes a body defining a conduit for a liquid jet and a signal device located on or within the body for transmitting a signal associated with the consumable component to a reader.

Abstract: A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.

Abstract: A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.

Abstract: A low friction flat-lapping abrading apparatus and method for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with flat-surfaced workpieces that are attached to three rotary spindles. The rigid equal-height flat-surfaced rotatable fixed-position workpiece spindles are mounted on a flat abrading machine base. They are positioned to form a triangle to provide stable support of the floating platen. All three spindle-tops are co-planar aligned to provide a precision-flat reference plane for mounting of the workpieces. The lapping operation has very high abrading speeds and very low abrading forces. The lightweight but strong lapping machine employs a pivot-balance structure where the weight of the drive motor is used to balance the weight of the abrading platen. Use of low-friction air bearings provides the capability for precision control of the abrading forces. The lapping machine is robust and well suited for a harsh abrading environment.

Abstract: A method and system for providing a perpendicular magnetic recording (PMR) head are disclosed. A PMR pole having a bottom and a top wider than the bottom is provided. The PMR pole may be formed by depositing a PMR pole layer, then removing part of the PMR pole layer, leaving the PMR pole. The PMR pole may also be provided by forming a trench having the desired profile in a photoresist layer, depositing the PMR pole layer, then removing the photoresist layer, leaving the PMR pole in the location of the trench. A side gap is deposited over the PMR pole. A side shield is provided on the side gap. A planarization that removes part of the side shield on the PMR pole is performed. A top gap is provided on the PMR pole, substantially covering the entire PMR pole. A top shield is provided on the top gap.

Abstract: A method of monitoring progress of polishing of a substrate having at least two regions including a first region and a second region with different structures is provided. The method includes: applying light to plural measurement points on the substrate during polishing of the substrate; receiving reflected light from each measurement point; measuring intensity of the reflected light; producing a spectrum of the reflected light from the intensity; classifying the spectrum as spectrum of the reflected light from the first region or as spectrum of the reflected light from the second region based on a shape of the spectrum or the intensity of the reflected light; and monitoring progress of polishing of the substrate based on a temporal change in the spectrum of the reflected light from the first region.