Abstract: A large-size synthetic quartz glass substrate is produced by measuring a flatness and parallelism of front and back surfaces of a synthetic quartz glass substrate stock having a diagonal length of at least 1,000 mm, and partially removing raised portions and thick portions of the substrate stock on the basis of the measured data of flatness and parallelism. The removing step includes abrasive working by a first working tool having a diameter of 15-50% of the diagonal length, and abrasive working by a second working tool having a smaller diameter.

Abstract: A polishing machine for lenses with at least one first polishing spindle having a polishing axis (K) and a tool holder disposed on the first polishing spindle for a first polishing disc designed as a tool, further comprising at least one first workpiece spindle having a rotary axis (C) and a workpiece holder disposed on the first workpiece spindle for a lens, wherein the workpiece holder and the tool holder are disposed so as to be movable in translation in the direction of a telescoping axis (Z) disposed parallel to the polishing axis (K) and in the direction of a translation axis (X) disposed at right angles to the rotary axis (C).

Abstract: The invention relates to a hard finish machine (1) for hard finishing of a workpiece (2), comprising at least two different hard finish tools (3, 4) which are arranged on a tool spindle (5), wherein the tool spindle (5) is arranged movable in the direction (Y) of its axis (6) on a tool carrier (7), wherein the tool carrier (7) is translational movable relatively to a machine bed (8) and wherein the hard finish machine furthermore comprises cooling lubricant supplying means (9) for the supply of cooling lubricant to the machining region between the workpiece (2) and the hard finish tool (2, 3).

Abstract: A carbon electrode grinding apparatus for shaping a front end of an arc discharge carbon electrode is provided with front end grinding blades configured to grind a front end surface of the carbon electrode, lateral surface grinding blades configured to grind a surface from the front end surface to a base end of the carbon electrode, and rotation means configured to rotate and drive the front end grinding blades and the lateral surface grinding blades around a rotation axis line coincident with an axis line of the carbon electrode.

Abstract: In a swivel device, a swivel head provided with a plurality of tool spindles thereon is mounted on a support base to be turnable about a swivel shaft being upright on the support base. An annular space portion is formed between the support base and the swivel head in coaxial relation with the swivel shaft. The tool spindles each mounting a grinding wheel are arranged on the swivel head to extends in a horizontal plane which crosses the annular space portion at about a mid position in the vertical direction of the annular space portion. A direct drive motor is built in the annular space portion so that a driving center of the direct drive motor is at almost the same height as the horizontal plane including the axes of the grinding wheels. Thus, the swivel device can lower the positions of the rotational axes of the grinding wheels and is rigid against inclination caused by grinding resistance acting on the grinding wheels.

Abstract: A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

Abstract: A device (1) for machining an ophthalmic lens includes a support for the ophthalmic lens and for driving it in rotation about a blocking axis (A1), a machining module (35) that can be swiveled relative to the support and driving the lens in rotation and that is suitable for pivoting about a swivel axis that is not parallel to the blocking axis of the lens, and at least one drill tool mounted to rotate on the machining module about a first axis of rotation. The machining device includes at least one other machining tool mounted to rotate on the machining module about another axis of rotation that is distinct from the first axis of rotation and that is stationary relative to the first axis of rotation.

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.

Abstract: A process and an apparatus for optimising tyres after vulcanization, in order to improve the dynamic behavior of the tyre itself. The process includes first of all the stages of measuring the curve of the radial force of the tyre, calculating the first harmonic of this radial force and identifying on the tyre a point corresponding to the maximum of the first harmonic. Subsequently, material is removed from the tread over an arc subtending a principal angle positioned either side of the maximum point of the first harmonic. The removal stage is performed by removing discrete circumferential portions of the arc with differentiated depths of removal, increasing from opposite ends of this arc toward the maximum point of the first harmonic.

Abstract: Described herein is technology for, among other things, a multi-purpose sanding or filing apparatus. The apparatus includes a motor, a plurality of drive mechanisms in mechanical communication with the motor, and a plurality of drums, where each of the drums has an axis passing therethrough, the drums are coupled with respective drive mechanisms, and the drive mechanisms are operable to rotate the drums about their respective axes.

Abstract: Crankshaft rod bearings are pre-ground and finish-ground in a first grinding station and the crankshaft main bearings are then pre-ground and finish-ground in a second grinding station. The crankshaft is first mounted centered between the two points of the rotary drive. The chuck has two support members which can be moved in the radial direction and which are then positioned against the main bearing in a self-equalizing manner. In the engaged position, the support members are locked tightly to the chuck by locking pins. A pivoting clamping member is then clamped with the operating end thereof against the main bearing.

Abstract: Provided is a V-groove processing apparatus for cutting and V-groove processing. The V-groove processing apparatus includes a processing unit for processing V-grooves in an engineered stone raw plate fixed on a table while being transferred by a transfer unit. Here, the processing unit includes a circular saw blade disposed at a front of a cutting panel to cut the engineered stone raw plate, one or more cutters disposed on a front of a cutter housing to form a V-groove inside a cut surface, a first rise and fall unit transferring the circular saw blade to a cutting location during the cutting of the engineered stone raw plate and restoring the circular saw blade to an original place after the cutting of the engineered stone raw plate, and a second rise and fall unit transferring the circular saw blade and the cutters to a V-groove forming location during the formation of the V-groove and restoring the circular saw blade and the cutters to original places after the formation of the V-groove.

Abstract: The invention relates to a tool for machining hard materials such as metal-matrix or organic-matrix composite materials, comprising a cylindrical sonotrode (22) connected, along the axis (A) of said cylinder, to an assembly vibrating at a predetermined ultrasonic frequency and rotated about said axis, and at least one nozzle (3), on the surface to be machined and at the terminal end (24) of the sonotrode, for ejecting a liquid in which abrasive particles are suspended, said particles being vibrated at said ultrasonic frequency by the sonotrode so as to form a drilling head along the axis (A) of the cylinder, characterized in that the circumference (23) of the sonotrode is covered with particles of a so-called superhard material in order to form a milling head capable of moving in a plane that is substantially perpendicular to said vibratory axis (A).

Abstract: In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of double-disk face grinding. The bar-shaped workpiece is clamped on the longitudinal sides in the first clamping position thereof, and the bar-shaped workpiece is transported between two clamping jaws, which clamp the workpiece in the second clamping position thereof on the faces. The first clamping position is then released, and the bar-shaped workpiece is rotated by the clamping jaws. A CNC-controlled peripheral grinding step is performed based on CX interpolation principles. This rough grinds and finishes the longitudinal sides of the bar-shaped workpiece. Transport from the first to the second clamping position is effected by a clamping station, which concomitantly forms the holder for the face grinding operation.

Abstract: The invention relates to a device for fine machining workpieces, preferably for honing and/or fineboring cylinder bores in crankcases of internal combustion engines, wherein inside a module (1) one or two horizontally displaceable machining units (10, 11, 12, 13) each are provided on two longitudinal sides (2, 3) that are opposite each other for honing and/or fineboring. Each machining unit (10, 11, 12, 13) comprises a spindle (100), a drive for creating the oscillating stroke movement of the spindle (100) and for displacing the machining unit into the working position, a tool holder (8) with a rigid axis, and a feed device (60, 61, 62, 63, 64) for the radial feeding of the machining tools, and between the longitudinal sides equipped with the machining units (10, 11, 12, 13) a service chamber (7) that can be accessed from an end side, wherein at least one tool magazine (30, 31) is associated with the machining units (10, 11, 12, 13) at the rear end side (4) of the module (1).

Abstract: A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42a, 42b, 42c, 42d) for cleaning the polishing object after polishing and a transport unit (44) for transporting the polishing object; a transport mechanism (50) for transporting the polishing object between the loading section (14), the polishing lines (20, 30) and the cleaning line (40); and a control section for controlling the polishing lines (20, 30), the cleaning line (40) and the transport mechanism (50).

Abstract: The disclosure relates to a method and apparatus for the extraoral production of a tooth replacement part, whereby the method comprises providing a base body (300); rotary grinding of the base body; and grinding of the base body. Further, a milling step is possible. The presented method significantly reduces the production times, because it minimizes the time required for milling.

Abstract: Milling strategies for machining dental ceramic materials are provided that reduce milling time while maintaining strength, accuracy and marginal integrity.

Abstract: A grinding machine includes a holding table adapted to hold a workpiece, a grinding unit operative to grind the workpiece held on the holding piece, and a grinding unit transfer mechanism operative to shift the grinding unit in a direction coming close to or moving away from the workpiece. The grinding unit includes a porous pad having fine pores opposed to the workpiece, a gel-like slurry storing portion provided on the porous pad so as to store a gel-like slurry therein, and a water supply unit to supply water between the porous pad and the workpiece. The porous pad contains relatively larger superabrasives at least at an outer circumferential portion. The fine pores of the porous pad have a diameter greater than that of relatively small superabrasives contained in the gel-like slurry.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: A grinding worm for the continuous generation grinding of a work piece is provided with mutually overlapping rough grinding and finish grinding zones arranged along the worm's axis, the finished grinding zone being provided with a three-dimensionally modified flank geometry having a width related design.

Abstract: A cylindrical grinding and polishing device includes a main body defining a cavity, a polishing device, a cylindrical grinding device, a support device. The polishing device is received in the cavity, and includes a number of polishing wheels positioned along a first direction. The cylindrical grinding device is received in the cavity, and includes a grinding wheel positioned at an end of the cavity along a second direction substantially perpendicular to the first direction. The support device is received in the cavity, and includes a support plate for supporting a work-piece. The support device carries the work-piece to contact the polishing wheels or the grinding wheel.

Abstract: A grinding method for a wafer having a mark indicating the crystal orientation. The grinding method includes a first grinding step for grinding the upper surface of the wafer by rotating a chuck table holding the wafer thereon, rotating a grinding ring, positioning the grinding ring so that the grinding ring is passed through the center of the wafer, and feeding the grinding ring in a direction perpendicular to the chuck table; a wafer positioning step for positioning the upper surface of an outer circumferential portion of the wafer directly below the locus of rotation of the grinding ring; and a second grinding step for grinding the upper surface of the wafer by first stopping the rotation of the chuck table so that the mark indicating the crystal orientation of the wafer held on the chuck table is pointed in a predetermined direction, next feeding the grinding ring in the direction perpendicular to the chuck table, and next relatively moving the chuck table and the grinding ring in parallel.

Abstract: A cutting apparatus for cutting corner pieces formed of stone or other materials for use as building faces or for cutting flat pieces is disclosed herein. The cutting apparatus includes a frame with a first and a second conveyor operatively attached to the frame. The first and the second conveyors are configured to carry a workpiece from a first end of the frame to the second end of the frame. The first conveyor is disposed at an angle of about 45 degrees to a ground surface supporting the cutting apparatus. The second conveyor is disposed at an angle of about 45 degrees to the ground surface supporting the cutting apparatus, wherein the second conveyor is positioned perpendicularly to the first conveyor so as to form a V-shaped channel therewith.

Abstract: An electric sharpener includes a body having a reception area for receiving a driving device, and a sharpening area in which a gear set is located which is connected with the driving device. A shaft is located in the sharpening area and connected to the gear set. A rough sharpening set connected to the shaft and has a first spring unit. A fine sharpening set is connected to the shaft and has a second spring unit. The first and second spring sets have different spring forces applied to the rough sharpening set and the fine sharpening set.

Abstract: A polishing device includes an outer barrel, an inner barrel, polishing members, and an actuator. The outer barrel defines a chamber and includes inner surfaces substantially parallel to a central axis of the outer barrel. Each of the inner surfaces defines a holding groove for holding a workpiece. The inner barrel is received in the chamber and includes a side surface substantially parallel to the central axis. The side surface defines installation grooves. Each polishing member includes an elastic piece, a polishing motor connected to a bottom of a corresponding installation groove by the elastic piece and received in the corresponding installation groove, and a polishing plate connected to the polishing motor and capable of being driven to rotate by the polishing motor. The actuator is configured for driving the outer barrel to spin and move back and forth along the central axis.

Abstract: An operating method improves the running behavior of gearwheels negatively noticed upon gearwheel testing and is performed by a burnishing device. The gearwheels that were rejected from the production process may be optimized rapidly and in a targeted way so that they may be returned back into the production process. The tooth flanks of a gearwheel to be machined are, in a first method step, mechanically freed of particles adhering to the surfaces of the tooth flanks or slight protrusions protruding therefrom using a first gearwheel machining tool having a machining wheel coated with an abrasive agent. Subsequently, in a second method step in a second gearwheel machining tool known as a burnishing machine, the gearwheel is chucked between gearwheel-shaped rolling tools, the so-called burnishing wheels, and rolled without material abrasion.

Abstract: A method of surface grinding a Zr-rich bulk amorphous alloy article includes providing a substrate; providing a first surface grinder for rough surface grinding; and providing a second surface grinder for finish surface grinding. During the rough surface grinding, the rotating speed is in the range from 20 r/min to 30 r/min, the grinding time period is from 3 minutes to 12 minutes, and the grinding pressure is from 1 kg/cm2 to 2 kg/cm2, and a first pump circularly conveys a first lubricant to a first rotating abrasive wheel. During the finish surface grinding, the rotating speed is in the range from 30 r/min to 40 r/min, the grinding time period is from 5 minutes to 7 minutes, and the grinding pressure is from 1 kg/cm2 to 2 kg/cm2, and a second pump circularly conveys a second lubricant to a second rotating abrasive wheel.

Abstract: A post-process sizing control device is provided with origin compensation means for controlling a size measuring device to measure an actual size of a workpiece portion and for compensating the origin of a wheel head by a position compensation amount which corresponds to a difference between the actual size and a theoretical size derived from calculation and size measuring interval setting means for setting the number of workpieces which should be ground during the next size measuring interval which begins after the preceding origin compensation operation and ends with the next origin compensation operation. The size measuring interval setting means sets the number of workpieces which should be ground during the next size measuring interval, based on an average position compensation amount derived by dividing a position compensation amount for the last workpiece ground during the present size measuring interval by the number of workpieces ground during the present size measuring interval.

Abstract: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.

Abstract: A device includes pivoting elements enabling the drilling axis (A6) of the drilling tool (35) to be pivoted (PIV) about the axis of orientation, and elements for adjusting the angular position of the drilling tool (35) about the axis of orientation. It also includes first mobility members enabling relative mobility of the drilling tool (35) in relation to the lens to be drilled (L), or vice-versa, according to a first degree of mobility (ESC) which is distinct from the pivoting of the drilling axis of the drilling tool (35) about the axis of orientation. The elements for adjustment are configured so as to control the pivoting of the drilling axis (A6) of the drilling tool (35) about the axis of orientation, in favor of the first degree of relative mobility of the drilling tool (35) in relation to the lens (L) that is to be drilled.

Abstract: Milling strategies for machining dental ceramic materials are provided that reduce milling time while maintaining strength, accuracy and marginal integrity.

Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.

Abstract: Wafer processing apparatuses and methods for polishing and cleaning semiconductor wafers with high productivity, small footprint, easy maintenance and low defectivity are provided. The apparatuses comprise a polishing apparatus and a cleaning apparatus. The polishing apparatus comprises at least one polishing module. Each module comprises at least one polishing surface, at least one polishing head, at least one wafer transfer station and a transport mechanism to transfer the at least one polishing head between the at least one polishing surface and the at least one wafer transfer station. The polishing module may comprise a shield member and fluid injection devices to protect the at least one polishing surface from foreign particles. The cleaning apparatus can comprise two or more dry chambers for high productivity. The wafer processing apparatuses can comprise two cleaning apparatuses for high productivity.

Abstract: In the present invention, an insulating material is applied onto a substrate in a coating treatment unit to form a coating insulating film. The substrate is heated in the heating processing unit, whereby the coating insulating film is hardened partway. A brush is then pressed against the front surface of the coating insulating film in a planarization unit and moved along the front surface of the coating insulating film, thereby planarizing the coating insulating film. The substrate is then heated to completely harden the coating insulating film. According to the present invention, the coating film can be planarized without using the CMP technology.

Abstract: An apparatus for thermal mechanical machining of composite materials includes a head, a drive, and a shaft. The head has an abrasive face. The drive is coupled to the apparatus to move the head to produce abrasion of the composite material by the abrasive face. The shaft includes a passageway that communicates a heated gas to an interface between the abrasive face and the composite material. The gas removes particles that result from the abrasion of the composite material by the abrasive face. The gas can be heated sufficiently to carbonize or vaporize organic constituents of the composite material.

Abstract: A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wafer is mounted, the circumferential plate having a fitting hole where the center plate is fitted and a gear part formed along the outer periphery thereof, the center of the mounting hole being eccentric from the center of the center plate, the center of the fitting hole being eccentric from the center of the circumferential plate; and a sun gear and an internal gear engaged with the gear part to transmit a rotational force to the plurality of carriers, wherein a fitting direction of a center plate into a fitting hole is adjustable for at least two carriers among the plurality of carriers.

Abstract: A sharpener for creating cross-grind knife edges includes a nominally flat annular abrasive sharpening member which could be a ring or a disk and is rotated about its center and held against a moving knife edge facet to simultaneously and sequentially abrade the knife edge at multiple locations on the abrasive member. The disk may be slidably mounted on a shaft in opposition to a spring restraining force. The disk is nominally disposed in a vertical orientation. The sharpener may include multiple stages including a manual stage having a pair of off axis conical shaped rotatable abrasive coated disks which have abrading lines on opposing facets which are not parallel but cross and intersect in a crossing pattern at the blade edge.

Abstract: Provided is a polishing tool capable of forming a high-quality surface of a workpiece for a short period of time. A polishing tool includes: a rotation shaft arranged parallel to a sending direction of moving the polishing tool relative to a workpiece; and at least two polishing bodies. The polishing body includes a foamed resin such as a foamed polyurethane resin, and has an outer peripheral surface having a porosity higher than that of the polishing body. The polishing body includes a non-foamed resin such as a non-foamed polyurethane resin being a material more rigid than that for the polishing body. When polishing-processing, the polishing body performs polishing removal on a surface of the workpiece, and the polishing body smoothes a waviness formed on the surface through the polishing removal.

Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.

Abstract: A grinding assembly (3) is described, for a grinding head (1) for a grinding machine of glass slabs (2), comprising: a first (5) (and possibly a second (7)) grinding wheel adapted to tangentially work on the glass edge (2) and whose rotation axis A is parallel to the glass edge (2) to be ground; and a handling system for the grinding wheel (5) for adjusting the removal of glass (2) in an oscillating way or in parallel with the plane of the slab (2) to be ground. A grinding head (1) equipped with the above grinding assembly (3) is further described.

Abstract: A cutting apparatus for cutting corner pieces formed of stone or other materials for use as building faces or for cutting flat pieces is disclosed herein. The cutting apparatus includes a frame with a first and a second conveyor operatively attached to the frame. The first and the second conveyors are configured to carry a workpiece from a first end of the frame to the second end of the frame. The first conveyor is disposed at an angle of about 45 degrees to a ground surface supporting the cutting apparatus. The second conveyor is disposed at an angle of about 45 degrees to the ground surface supporting the cutting apparatus, wherein the second conveyor is positioned perpendicularly to the first conveyor so as to form a V-shaped channel therewith.

Abstract: A motorized knife sharpener includes means of for sharpening heavy, medium, and fine blades at angles appropriate to the cutting edges of such blades.

Abstract: A double-side grinding apparatus is designed to be capable of minimizing thermal expansion of hydrostatic pad members and reducing nanotopography in performing wafer grinding. The double-side grinding apparatus is a double-side grinding apparatus for wafers that can simultaneously grind either surface of a wafer to be ground by pressing a grindstone against either surface of the wafer to be ground while hydrostatically supporting either surface of the wafer to be ground in a noncontact manner. Each hydrostatic supporting unit is formed with a hydrostatic pad member facing the wafer to be ground, and a base member placed on the back surface of the hydrostatic pad member. The hydrostatic pad member is made of a ceramic member, and the base member is made of a metal member.

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: A process and an apparatus for optimising tyres after vulcanization, in order to improve the dynamic behavior of the tyre itself. The process includes first of all the stages of measuring the curve of the radial force of the tyre, calculating the first harmonic of this radial force and identifying on the tyre a point corresponding to the maximum of the first harmonic. Subsequently, material is removed from the tread over an arc subtending a principal angle positioned either side of the maximum point of the first harmonic. The removal stage is performed by removing discrete circumferential portions of the arc with differentiated depths of removal, increasing from opposite ends of this arc toward the maximum point of the first harmonic.

Abstract: A wood planing machine includes a base adapted to permit a workpiece to be moved thereon in a front-to-rear direction, a plurality guide posts fixed on the base, a mounting seat sleeved movably on the guide posts, a motor disposed on the mounting seat, and a cutting unit disposed on the mounting seat. The cutting unit includes a rough-plane cutter, a fine-plane cutter disposed behind the rough-plane cutter, a first transmission unit interconnecting the motor and the rough-plane cutter to allow the rough-plane cutter to be driven by the motor, and a second transmission unit interconnecting the rough-plane cutter and the fine-plane cutter to allow rotation of the rough-plane cutter to be transferred to the fine-plane cutter.

Abstract: A mechanical polishing apparatus includes a polishing pad, at least one carrier head positioned over and off center relative to the polishing pad and configured for holding at least one substrate against the polishing pad within a first annular region of the polishing pad when the polishing pad is rotating. At least one conditioning head is positionable over and off center relative the polishing pad at a plurality of first positions and configured for applying a contacting surface of at least one conditioning pad against the polishing pad when the polishing pad is rotating, where the conditioning pad is applied to a second annular region of the polishing pad and moves between the plurality of first positions. In the apparatus, the diameter of the conditioning pad?a difference between a radius of the polishing pad and a width of the first annular region.

Abstract: A dust collection device for a sanding machine includes a casing located at the lower end of the upright sanding belt and the casing includes a bottom hole which communicates with the open top of the dust collection part. The dust collection part communicates with an exterior collection area defined within an outer cover. A fan unit an a separation plate are located within the outer cover, so that dust during operation of the sanding belt can be collected into the exterior collection area and brought out via an escape pipe connected to the outer cover. A sanding wheel is located beside the separation plate and a housing is mounted to the sanding wheel. The housing includes a restriction plate so as to guide dust during operation of the sanding wheel into the escape pipe. The sanding belt, the fan unit and the sanding wheel share a common axle.

Abstract: A paper feeding apparatus includes a rack that stores sheets in a vertically placed state, a first conveying roller that conveys a sheet extracted from the rack in a first direction in an erected state, a scraper that scrapes a surface of the sheet conveyed in the erected state by the first conveying roller, and a second conveying roller that conveys the sheet, the surface of which is scraped by the scraper, in a second direction different from the first direction.