Abstract: A grinding machine includes an abrasive element rotatably mounted on a support frame and coupled to a drive, a blower casing including a surrounding wall which confines a blower chamber and which extends beyond and which is spaced apart radially from a rim of the abrasive element to define a surrounding intake passage therebetween, a dust discharge port disposed downstream of the intake passage, communicated with the blower chamber and, and offset from an axis of the abrasive element, and an impeller disposed in the blower chamber and coaxial with the abrasive element such that dust generated as a result of a grinding operation of the abrasive element is entrained in an air stream drawn into the blower chamber through the surrounding intake passage and subsequently out of the discharge port by virtue of rotation of the impeller.

Abstract: A clutch device for a rollers' swinging mechanism of a belt sander, which includes a roller set, a swinging gear set, is composed of a control bar, a linking member and a clutch member. The roller set is driven by the swinging gear set to carry out an axial movement. The control bar is set with an eccentric wheel at its lower side, and the eccentric wheel is connected with the linking member, which is pivotally connected with the clutch member at its other end. When the eccentric wheel is driven to turn around, the linking member moves successively the clutch member to work for controlling the swinging gear set to provide two operating models optional for the belt sander.

Abstract: An improved roller shaft for a food peeling machine that allows for an improved method of changing abrasive sections that are on the shaft, the improved shaft having a first and second end with removable retaining elements and the method involving the use of a hydrostatic cylinder to place a new abrasive section on the roller shaft thus causing the most worn section to slide off the shaft.

Abstract: Methods and apparatus for end effectors for performing surface lapping using a robotic system are provided. In one embodiment, a lapping system includes a robotic arm and a pneumatic end effector unit. The pneumatic end effector unit includes a first base attached to the robotic arm, a second base, a lapping pad attachable to the second base, and a pneumatic piston system coupled between the first and second bases. An abrasive pad is attached to the lapping pad with a layer of pitch. The pneumatic piston system includes a piston chamber, a piston being slideably received within the piston chamber, and a component for controlling air pressure within the piston chamber. A slurry system introduces a slurry compound into one of the second base or the lapping pad.

Abstract: A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

Abstract: Apparatus for removing a burr from an aperture in a workpiece, using a rotating deburring tool having a flexible or partly flexible shaft, an abrasive mechanism that rotates on the shaft and a collar that protects the workpiece from abrasion when the abrasive mechanism is being positioned for deburring. Optionally, the shaft and abrasive mechanism move laterally as they rotate. Optionally, a shaft holder includes a protective surrounding sleeve to catch or deflect any fragment of the shaft holder that might fly off. Optionally, the shaft and the workpiece rotate independently of each other. Two or more different abrasive mechanisms can be simultaneously attached to the shaft. The cross-sectional shape of the abrasive mechanism may be curvilinear and/or polygonal, depending upon shape of the workpiece surface. Optionally, a shaft restrictor receives the shaft and limits lateral motion of the rotating shaft.

Abstract: A process for treating surfaces of rare earth metal-based permanent magnets, comprising removing an oxide layer formed on a surface of each of the permanent magnets using a blasting apparatus. The apparatus comprises a tubular barrel formed of a mesh net for accommodation of work pieces and supported circumferentially outside a center axis of a support member rotatable about the center axis, and an injection nozzle disposed to inject a blast material against the work pieces from the outside of the tubular barrel, wherein at least one of the tubular barrel and the support member is detachably mounted. The process further comprises removing the tubular barrel or the support member from the blasting apparatus and attaching the tubular barrel or the support member to a vapor deposited film forming apparatus, where a metal film is formed on the surface of each of the permanent magnets by a vapor deposition process.

Abstract: An abrasive cutting blade is provided to achieve high-quality surface finishes at high feed rates. The blade is fabricated by electroplating fine abrasive onto a steel cathode disc to form a first layer, followed by electroplating a second layer of coarser abrasive onto the first layer. A third layer of fine abrasive is then electroplated onto the second layer. The resulting composite is then removed from the cathode disc to form a multi-grit, multi-layer, hub-less blade.

Abstract: A combination tool for machining a bore has a tool shaft transmitting a rotational movement and an oscillating movement in an axial direction of a bore to be machined with the tool. A horning tool is arranged on the tool shaft, and a deburring tool is arranged on the tool shaft at an axial spacing to the honing tool in a direction of a longitudinal axis of the tool shaft. The honing tool is configured to move for each honing stroke between a lower position and an upper position wherein a spacing between a lower edge of the honing tool and a lower edge of the deburring tool in the direction of the longitudinal axis of the tool is greater than a spacing of the lower edge of the honing tool to a workpiece surface when the honing tool is in the lower position.

Abstract: A wafer carrier gap washer includes at least one wafer carrier head and at least one nozzle installed on a wafer load/unload mechanism. The wafer carrier head has a flexible membrane and a retaining ring for holding a wafer beneath the wafer carrier head during a CMP process. The nozzle sprays fluid toward a gap between the flexible membrane and the retaining ring so as to wash the gap and remove slurry residues produced in the CMP process.

Abstract: Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.

Abstract: A buffing head (34) includes a rotary element (36) for retaining an optical disc (20) and causing the disc (20) to rotate at a first speed. A buffing element (38) contacts a work surface (30) of the optical disc (20), and rotation of the disc (20) enables corresponding movement of the buffing element (38). A restrictor (40), in communication with the buffing element (38), restricts movement of the buffing element (38) so that the buffing element (38) moves at a second speed to recondition the work surface (30), the second speed being slower than the first speed. The buffing head (34) further includes a well (86) surrounding the buffing element (38) and containing a fluid (88). Movement of the buffing element (38) causes the buffing element (38) to be immersed into the fluid (88) and to be returned into contact with the work surface (30).

Abstract: A wafer processing machine comprising a turntable, a plurality of chuck tables mounted on the turntable, a grinding means for grinding a wafer held on the chuck table, and a multipurpose polishing means for polishing the ground surface of a wafer held on a chuck table, wherein the multipurpose polishing means comprises a mounter for detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means for supporting the spindle unit in such a manner that the spindle unit can move in a direction perpendicular to the holding surfaces of the chuck tables and in a direction parallel to the holding surfaces of the chuck tables, a first polishing-feed means for moving the spindle unit in a direction perpendicular to the holding surfaces of the chuck tables, and a second polishing-feed means for moving the spindle unit in a direction parallel to the holding surfaces of the chuck tables.

Abstract: A device for the precision working of planar surfaces, in particular for the plane finishing, has a tool (13), which has an outer and an inner operating surface (36, 44). These are designed like cup wheels, which fit into one another, and are rotatable together, however, can be axially fed independent of one another. This is done with respect to the outer operating surface (36) by means of the spindle drive of a honing machine, which is preferably designed as a linear motor, whereas the inner operating surface (44) is fed through the feed drive (28) of the honing machine, which feed drive extends inside of the spindle and of the tool.

Abstract: A cutter foe making optical lenses has a main member with a connector base and a grinding assembly at an opposite ends thereof. The grinding assembly has two fixed devices having a cutting portion at a distal end thereof respectively and two movable devices having a grinding portion at a distal end thereof respectively. The grinding portions are finer than the cutting portions. An elastic member has opposite ends resting on the main member and the movable device to urge the movable device for movement along an axial orientation of the main member. A key is provided between the movable device and the main member to restrict the movable device from movement, whereby the grinding portion of the movable device is higher than the cutting portions of the fixed devices by the elastic member urging the movable device outward and the key fixing the movable device thereat.

Abstract: A device is disclosed for the surface machining of, among other things, plastic spectacle lenses, which has a work spindle, by means of which the spectacle lens can be driven with a controlled angle of rotation about an axis of work rotation, and a tool spindle, by means of which a tool can be driven to rotate about an axis of tool rotation, work and tool spindle being movable relative to one another with their positions controlled in two axes running at right angles. For rotational machining of the surface of the spectacle lens to be machined, the tool can also be swiveled by means of the tool spindle with a controlled angle of rotation about the axis of tool rotation, so that a rotational cutting edge provided on the tool can be brought into a defined rotational machining engagement with the surface of the spectacle lens to be machined as a function of the angle of rotation of the spectacle lens.

Abstract: The present invention provides a multi-step aqueous composition useful for polishing a tantalum barrier material and copper from a semiconductor wafer, comprising by weight percent 0.1 to 30 oxidizer, 0.01 to 3 inorganic salt or acid, 0.01 to 4 inhibitor, 0.1 to 30 abrasive, 0 to 15 complexing agent and balance water, wherein the aqueous composition has a pH between 1.5 to 6.

Abstract: A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.

Abstract: In a cylindrical grinding machine, a lateral surrounding cover is mounted on a bed and surrounds and covers lateral surfaces of a machining area in which a work support drive device, a grinding wheel and a bearing unit therefor are arranged and a slide area in which a base portion of a wheel head and a slide mechanism for the wheel head are arranged. A top open/close cover is further provided on the top portion of the lateral surrounding cover and is movable between a first position to open the upsides of the machining area and the slide area and a second position to cover the upsides of the machining area and the slide area. Thus, only by moving the top open/close cover to the first position, it becomes possible for an operator to look over the whole part of the machining area and the slide area. Since plural components of the grinding machine can be checked simultaneously with the top open/close cover opened, the time taken for maintenance or service work on the grinding machine can be shortened.

Abstract: A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

Abstract: A method for machining a component. The method includes providing a machining apparatus configured to induce vibrations such that a vibration direction of the machining apparatus is substantially aligned with respect to a machining direction of the component, and vibrating the machining apparatus in the vibration direction to machine the component in the machining direction.

Abstract: A combined tool for both drilling a hole through a vehicle wheel and deburring the edge of the hole and a method for using the combined tool.

Abstract: A device for processing welding electrodes includes a driving motor, a shaft, a housing and a first grinding wheel rotatably mounted on the shaft. The first grinding wheel is driven by the driving motor through the shaft. The lateral openings formed in the housing and are adapted to guide the welding electrode for grinding into a defined position relative to the first grinding wheel. A second grinding wheel is provided which is also driven by the shaft.

Abstract: A polishing and cleaning compound device is provided which polishes and cleans a work piece in series, wherein cleaning is started while the polishing is being terminated. Thus, the polishing and cleaning compound device includes a polishing device unit having a pair of cylindrical polishing tools which vertically grip and hold a work piece transported from a container in which a plurality of thin disc-shaped work pieces are installed, the cylindrical polishing tools being rotated so as to pull the work piece up and polish the work piece as the work piece is rotated by rollers for rotation; and a cleaning device unit which is a circular shaped transporting mechanism and in which a plurality of holding devices hold the work pieces polished in the polishing device unit and move to a specific position in turn to clean the work piece. The polishing process is carried out by supplying abrasive and a cleaning process is carried out by supplying washing water.

Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.

Abstract: A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.

Abstract: A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly comprised of a central pad mount on a central shaft. That central pad mount beneficially retains a center polishing pad. Also included is a ring polishing assembly comprised of a ring pad mount with a central aperture on a ring shaft with a central aperture. The ring pad mount beneficially retains a ring polishing pad having a central aperture. The central polishing assembly and the ring polishing assembly beneficially rotate and move axially independently of one another. The apparatus includes the CMP polishing tool and a rotating polishing table. The method includes rotating a semiconductor wafer on the rotating polishing table. Then, selectively and independently moving a solid center polishing pad having an axis of rotation and/or an axially aligned ring-shaped polishing pad into contact with the surface of the semiconductor wafer.

Abstract: In a vertical type of double disc surface grinding machine, an object of this invention is to enable simple adjustment of a parallelism between a grinding surface of a lower grinding wheel and a work end face clamped by a clamping jig of a rotary table, even when a grinding wheel spindle axis is disordered. The vertical type of double disc surface grinding machine is equipped with a pair of grinding wheels 2 & 3 opposing each other in vertical direction and fixed to a pair of vertical grinding wheels 4 & 5 and a rotary table 15 holding a work W and supplying it to a grinding position A1 located between the grinding wheels 2 & 3, and provided on the rotary table 15 with a work clamping jig 17 including a rotary shaft 63 which clamps the work W at a specified position and makes it spin itself.

Abstract: A method and apparatus for electrically biasing a substrate in an electrochemical processing system is generally provided. In one embodiment, an apparatus for electrochemical processing includes a polishing pad and a conductive element disposed therein. The polishing pad has an upper surface adapted to support a substrate thereon during processing. The conductive element disposed in the polishing pad is movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.

Abstract: A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90°.

Abstract: The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing (710) a wafer having initial thickness variations between two wafer surfaces. The wafer is subjected to grinding (720), polishing (730) and cleaning (740) processes. The wafer is thereafter transferred (750) to a wafer processing chamber to undergo device formation processes (760-780). The wafer processing steps may be undertaken in a series of process modules of sufficiently small size to permit their use in a circuit device fabrication facility. The in-fab processing of wafers reduces the number of process steps, cost and time typically associated with wafer processing prior to device formation thereon.

Abstract: Apparatus for removing a burr from an aperture in a workpiece, using a rotating deburring tool having a flexible or partly flexible shaft, an abrasive mechanism that rotates on the shaft and a collar that protects the workpiece from abrasion when the abrasive mechanism is being positioned for deburring. Optionally, the shaft and abrasive mechanism move laterally as they rotate. Optionally, a shaft holder includes a protective surrounding sleeve to catch or deflect any fragment of the shaft holder that might fly off. Optionally, the shaft and the workpiece rotate independently of each other. Two or more different abrasive mechanisms can be simultaneously attached to the shaft. The cross-sectional shape of the abrasive mechanism may be curvilinear and/or polygonal, depending upon shape of the workpiece surface. Optionally, a shaft restrictor receives the shaft and limits lateral motion of the rotating shaft.

Abstract: The invention concerns a machine for the chip-forming machining and the measurement of gears and screw-type workpieces. Arranged on a swivel head (6) swivellable about an axis (A) at right angles to the rotary axis of the workpiece (4) are functional units (8a, 8b, 8c, 8d) with machining and measuring tools (10, 12, 14, 15, 17) which are displaceable radially and parallel relative to the swivel axis (A), which said tools can be brought consecutively into engagement with the workpiece (4), thus making possible the application of different tools (10, 12, 14, 15, 17) and machining techniques in the same work set-up without colliding. The work spindle (1) is driven by electric motor either directly or via a gear unit.

Abstract: A machine for deburring and fine machining of the tooth flanks of toothed workpieces with a gear-shaped fine machining tool, preferably, a shaving wheel, which is in rolling engagement with a workpiece, comprising a tool spindle, a motor for driving the tool spindle, a workpiece spindle with a clamping device for the workpiece, a motor for driving the workpiece spindle, a sensor correlated with the workpiece spindle for determining the angular position of the teeth of the workpiece relative to the axis of the workpiece and an electronic gear coupling the drive motors of the tool spindle and of the workpiece spindle which, as a function of the signal of the sensor, rotates the fine machining tool and the workpiece such relative to one another that tooth and gap are aligned.

Abstract: In an apparatus, after completion of a CMP (i.e., chemical mechanical polishing) operation of a semiconductor wafer, the thus polished wafer is temporarily stored in a water tank before it is subjected to a post-CMP cleaning operation. During its storage period in the water tank, the wafer is prevented from being chemically attacked by an oxidizing agent contained in an abrasive used in the CMP operation. The apparatus includes: the water tank for storing the wafer therein; a pure water supply pipe for supplying pure water to the water tank; an anticorrosion agent supply pipe for supplying an anticorrosion agent to the pure water; a drain pipe connected with a lower portion of the water tank to discharge the water from the water tank; a return pipe for returning the discharged water to an upper portion of the water tank through a pump and a filter, the return pipe branching-off from the drain pipe; and, valves mounted on these pipes.

Abstract: A polishing system controls the durations over which different layers on a substrate are sequentially polished. The polishing system polishes an upper layer using an endpoint detection technique and polishes a lower layer using a closed loop control technique. Once the lower layer is detected during the course of polishing the upper layer, the polishing system automatically enters the recipe for polishing the lower layer under a closed loop control mode.

Abstract: A semiconductor device production method and a semiconductor device production apparatus are provided. The semiconductor device production method includes the steps of: sticking a wafer to a stretch tape stretchable by a physical process; dicing the wafer into individual semiconductor chips; stretching the stretch tape by performing the physical process on the stretch tape after the dicing: and grinding the rear surface of the wafer stuck to the stretch tape after the tape stretching.

Abstract: A grinder in a tire uniformity machine having a frame including a first side frame member and a second side frame member, the frame receiving a tire having a central axis for testing, the grinder including a carriage pivotally attached to the first side frame member and a locking assembly adjacent the carriage and the second side frame member selectively coupling the carriage to the second side frame member when the carriage is in the operating position; a grinding head supported on one end of the carriage, the grinding head having at least one grinding stone and at least one motor coupled to the grinding stone capable of causing rotation thereof.

Abstract: A grinding machine is designed as a multi-station grinding machine, which has two complete grinding stations. The grinding stations have grinding heads, which can be moved by means of appropriate positioning devices, for example compound table arrangements, and/or pivot tables, in relation to the saw blade. Positioning devices and arresting devices for the workpiece are furthermore parts of the grinding stations. The workpiece support is used for positioning the saw blades to the extent that their center axis is to be fixed in the grinding. The rotation of the saw blades around this center axis M, and the clamping in place of the saw blade in the respective rotated position for performing the grinding operation is the task of the respective units in the grinding stations.

Abstract: A polishing apparatus comprises: a housing defining a chamber wherein articles to be polished are subject to polishing and cleaning operations; partition walls for dividing the chamber of the housing into a plurality of sections; and, an air exhaust device. The exhaust device comprises: air exhaust conduits which are fluidly connected to the sections in the housing to exhaust air from the sections; valves for closing and opening the air exhaust conduits, respectively; and, a controller for independently controlling the valves to regulate air flows exhausted through the conduits. The conduits have inlet openings located in a vicinity of spaces where any air pollutant is generated in the sections in the housing.

Abstract: The polishing machine for stone materials comprises: a conveyor belt for the slabs or strips to be polished, a beam made to oscillate on at least two transverse, fixed frames above the said conveyor, at least one oscillating mechanism, a number of polishing heads, aligned on the said beam and oscillating with it, a device for detecting the shape and/or dimensions of the slabs or strips, positioned upstream of the working area, a process and control calculator for the polishing machine, and has, positioned parallel to the said first beam a second beam, also equipped with a number of polishing heads aligned transversely with the polishing heads of the said first beam, and made to oscillate synchronously with it, by means of adjustable coupling devices, that enable the distance between the rows of polishing heads on the said first beam and second beam to be varied.

Abstract: A machining strain removal apparatus for removing machining strain present on a treated surface of a workpiece, for example, a ground back of a semiconductor wafer by polishing the treated surface or ground back with a polishing tool with a high efficiency in a high quality. The apparatus includes a chuck for holding the workpiece while exposing the treated surface, and a polishing component for polishing the treated surface of the workpiece held on the chuck. The polishing component includes a polishing tool, and presses the polishing tool being rotated against the treated surface of the workpiece, thereby polishing the treated surface.

Abstract: A rotary woodworking machine includes a longitudinally extending transmitting shaft having two ends respectively coupled to two rotary woodworking members. A speed ratio varying device is disposed to couple the transmitting shaft to an output shaft of a motor, and includes two pitch-variable first and second pulleys mounted on the transmitting shaft and the output shaft, a belt trained on the pulleys, and a control unit operable to move a movable disc of the first pulley toward or away from a fixed disc of the first pulley so as to vary the radial distances between the belt and each of the shafts, thereby varying the speed ratio of the transmitting shaft to the output shaft.

Abstract: When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.

Abstract: An apparatus for pointing twist drill bits includes a processing unit which has a rotary index plate on which are mounted a plurality, e.g., five, of drill bit holders which are circumferentially spaced apart at equal, e.g., 72-degree intervals, and a loading unit which has located adjacent to the index plate a rotary pedestal on which are mounted an equal number of transfer arms. Located around the periphery of the processing unit and loading unit are a plurality of processing stations and loading unit operation stations, respectively.

Abstract: A device for processing welding electrodes includes a driving motor, a shaft, a housing and a first grinding wheel rotatably mounted on the shaft. The first grinding wheel is driven by the driving motor through the shaft. The lateral openings formed in the housing and are adapted to guide the welding electrode for grinding into a defined position relative to the first grinding wheel. A second grinding wheel is provided which is also driven by the shaft.

Abstract: A substrate processing apparatus according to the present invention has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: An object of the invention is to provide a polishing and cleaning compound device in which it is possible to polish and clean a work piece in series and cleaning is started while the polishing is terminated. Thus, the polishing and cleaning compound device is constituted of: a polishing device unit in which a pair of cylindrical polishing tools vertically grip and hold a work piece transported from a container in which a plurality of thin disc-shaped work pieces are installed, the cylindrical polishing tools are rotated so as to pull the work piece up and polish the work piece as the work piece is rotated by rollers for rotation; and a cleaning device unit which is a circular shaped transporting mechanism and in which a plurality of hold means hold the work pieces polished in the polishing device unit and move to a specific position in turn to clean the work piece.

Abstract: A rotary sanding machine includes a driven wheel coupled to a transmission shaft which is driven by a motor so as to actuate an emery coated belt for sanding. A barrier wall is disposed to hold back dust flying during sanding action to permit the dust to fall into a dust passageway in a dust collecting member. An impeller is mounted in a blower casing, and is coupled to an impeller driving shaft which is rotated with the transmission shaft by means of an endless drive transmission member such that the dust falling in the dust passageway can be drawn into the blower casing for discharge through a discharge port.

Abstract: A grinding machine includes a work table disposed on top of a base, a housing rotatably secured to the base with a shaft and having a roller disposed on one end, a casing has one end secured to the housing and has another roller, a sander belt is engaged over the rollers. The sander belt is adjustable relative to the base and the work table when the housing is rotated and adjusted relative to the base about the shaft. A plate is secured to the base and has a curved slot, the casing has a fastener adjustably engaged in the curved slot of the plate.