Abstract: A method and structure for forming an enhanced metal capping layer includes forming a portion of a multi-level metal interconnect network over a substrate. In some embodiments, the portion of the multi-level metal interconnect network includes a plurality of metal regions. In some cases, a dielectric region is disposed between each of the plurality of metal regions. By way of example, a metal capping layer may be deposited over each of the plurality of metal regions. Thereafter, in some embodiments, a self-assembled monolayer (SAM) may be deposited, where the SAM forms selectively on the metal capping layer, while the dielectric region is substantially free of the SAM. In various examples, after selectively forming the SAM on the metal capping layer, a thermal process may be performed, where the SAM prevents diffusion of the metal capping layer during the thermal process.

Abstract: A silica-based particle dispersion including a silica-based particle group and a high polishing rate and high surface precision is achieved to a silica-based substrate or a NiP-plated substrate to be polished or the like. A silica-based particle dispersion containing a group including irregularly-shaped and non-irregularly-shaped silica-based particles, wherein the irregularly-shaped silica-based particles each have a plurality of small holes thereinside and a covering silica layer which covers the core, and the silica-based particle group satisfies [1]-[3]. [1] Having an average particle size (D1) of 100-600 nm, and a particle size (D2) of 30-300 nm in terms of specific surface area. [2] An irregular-shape degree D (D=D1/D3) represented by the average particle size (D1) and a projected area-equivalent particle size (D3) being in the range of 1.1-5.0. [3] When waveform separation is performed on a volume-reference particle size distribution, a multi-peak distribution in which three or more peaks are detected.

Abstract: A polishing apparatus includes a chuck table, a rotation mechanism that rotates the chuck table around a predetermined rotation axis, a polishing unit that has a spindle and in which a polishing pad for polishing the wafer sucked and held by the holding surface is mounted on a lower end part of the spindle, a slurry supply unit, and a cleaning unit that cleans the holding surface. The cleaning unit has a cleaning abrasive stone for removing the slurry that adheres to the holding surface through getting contact with the holding surface and a positioning unit that positions the cleaning abrasive stone to a cleaning position at which the cleaning abrasive stone gets contact with the holding surface and an evacuation position at which the cleaning abrasive stone is separate from the holding surface. Hardness of the cleaning abrasive stone is lower than the hardness of the holding surface.

Abstract: The present invention relates to a polishing composition including water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and an NMR specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the BET specific surface area falling within the above-described range, and additionally having the NMR specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.

Abstract: A surface modified abrasive particle may include a core abrasive particle and a coating functionally connected to a surface of the core abrasive particle. The core abrasive particle may have a median particle size of at least about 0.06 microns. The coating may include a compound selected from the group consisting of dopamine, tyrosine, dihydroxyphenylalanine, norepinephrine, epinephrine, normetanephrine, 3,4-dihydroxyphenylacetic acid, tannic acid, pyrogallic acid or combinations thereof.

Abstract: A bonded abrasive wheel comprises magnetizable abrasive particles retained in an organic binder. The bonded abrasive wheel has a central portion adjacent to a central hub, an outer circumference and a rotational axis extending through the central hub. The magnetizable abrasive particles adjacent to the central hub are aligned at an average angle of less than 35 degrees with respect to the rotational axis, and the magnetizable abrasive particles adjacent to the outer circumference of the bonded abrasive wheel are aligned at an average angle that is from 35 and 90 degrees, inclusive, with respect to the rotational axis. Methods of making a bonded abrasive wheel are also disclosed.

Abstract: The invention provides a method for making agglomerate particles, said method comprising: (a) forming by mixing at high speed a slurry of mineral agglomerate components in a polymerizable liquid resin carrier; (b) mixing said slurry with a non-miscible fluid to form discrete dispersed droplets; (c) exposing the discrete dispersed droplets to UVA radiation; (c) solidifying said droplets to form a multitude of solid particles; (d) isolating said solid particles and then firing said particles. The resulting size of the fired particles of the invention are estimated to be in the range from approximately 20 ?m to approximately 500 ?m.

Abstract: A method of making magnetizable abrasive particles includes: moistening the outer surfaces of ceramic particles with waterglass to provide moistened ceramic particles. Magnetizable particles are contacted with the moistened ceramic particles to provide powder-coated ceramic particles. The powder-coated ceramic particles are heated to at least a temperature sufficient to bond the magnetizable particles of the powder-coated ceramic particles to the respective ceramic particles thereby providing the magnetizable abrasive particles. On a respective basis, each magnetizable abrasive particle comprises a respective ceramic particle having a magnetizable particles bonded thereto.

Abstract: A ceramic porous body comprising: skeleton portions including an aggregate and at least one binding material; and pore portions formed between the skeleton portions, the pore portions being capable of allowing a fluid to flow therethrough. In the ceramic porous body, the pore portions have a pore volume ratio of pores having a pore diameter of from 1 to 10 ?m, of 45% or more, and a ratio of a contact area between the aggregate and the binding material to a surface area of the binding material of from 20 to 60%.

Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table in which a metal-solvent catalyst is alloyed with at least one alloying element to improve thermal stability and/or wear resistance of the PCD table. In an embodiment, a PDC includes a substrate and a PCD table bonded to the substrate. The PCD table includes diamond grains defining interstitial regions. The PCD table includes an alloy comprising at least one Group VIII metal and at least one metallic alloying element such as phosphorous.

Abstract: In a method for producing open-pore, ceramic-bonded grinding tools, a pore former mixture consisting of at least two polymers having different firing curves, the maxima of which differ by at least 20° C., is used. The polymers are preferably thermoplastics that can be decomposed exclusively into CO2 and water during combustion. The resulting grinding tool has a multimodal pore size distribution.

Abstract: A slurry that polishes surfaces or substrates which includes cobalt. The slurry further comprises an anionic and/or cationic surfactant, each of which has a phosphate group, a long chain alkyl group, or both. The slurry also includes a corrosion inhibitor, abrasives, removal rate enhancers, solvents, pH adjustors, and chelating agents. The pH of the slurry is preferably 8 or higher.

Abstract: A shaped abrasive particle including a body comprising a first major surface, a second major surface, and a side surface extending between the first major surface and the second major surface, the body comprising a sharpness-shape-strength factor (3SF) within a range between about 0.7 and about 1.7 and a Shape Index within a range between at least about 0.01 and not greater than about 0.49.

Abstract: Methods for, and structures formed by, wet process assisted approaches implemented in a replacement gate process are provided. Generally, in some examples, a wet etch process for removing a capping layer can form a first monolayer on the underlying layer as an adhesion layer and a second monolayer on, e.g., an interfacial dielectric layer between a gate spacer and a fin as an etch protection mechanism. Generally, in some examples, a wet process can form a monolayer on a metal layer, like a barrier layer of a work function tuning layer, as a hardmask for patterning of the metal layer.

Abstract: Disclosed are ceramic bodies comprised of composite cordierite aluminum magnesium titanate ceramic compositions and methods for the manufacture of same.

Abstract: The present invention relates to a composition comprising a non-oxide silicon containing component, a water soluble phosphate component, a metal oxide ceramic component, a polysaccharide component and water to 100% w/w. This composition can be transformed into a cement that holds individual honey comb filter segments of a honey comb filter together.

Abstract: A method of forming a mixture including a ceramic material into a sheet, sectioning at least a portion of the sheet using a mechanical object and forming at least one shaped abrasive particle from the sheet, such that the at least one shaped abrasive particle can have a two-dimensional shape as viewed in a plane defined by a length and a width of the shaped abrasive particle selected from the group consisting of polygons, ellipsoids, numerals, Greek alphabet characters, Latin alphabet characters, Russian alphabet characters, complex shapes having a combination of polygonal shapes, and a combination thereof.

Abstract: 96 parts by mass of a ?-alumina powder, 4 parts by mass of a an AlF3 powder, and 0.17 parts by mass of an ?-alumina powder as a seed crystal were mixed by a pot mill. The purities of each raw material were evaluated, and it was found that the mass ratio of each impurity element other than Al, O, F, H, C, and S was 10 ppm or less. In a high-purity alumina-made sagger having a purity of 99.9 percent by mass, 300 g of the obtained mixed powder was received, and after a high-purity alumina-made lid having a purity of 99.9 percent by mass was placed on the sagger, a heat treatment was perforated at 900° C. for 3 hours in an electric furnace in an air flow atmosphere, so that an alumina powder was obtained. The value of AlF3 mass/container volume was 0.016 g/cm3.

Abstract: Soil improving compositions and methods of using the compositions for improving soil properties are described.

Abstract: Producing a silica particle by inhibiting the generation of incompletely reacted materials such as oligomers which have not been grown to the silica particles having the intended particle size. A dispersion liquid of a silica particle is produced by simultaneously adding, to a liquid substantially consisting of an organic solvent, a liquid containing silane alkoxide and a liquid containing an alkali catalyst and water to cause hydrolysis and polycondensations to produce a silica particle. The variation rate of the mole ratio of the alkali catalyst to silane alkoxide in the reaction system for a period from the start to the end of the reaction relative to the initial mole ratio is 0.90 to 1.10; and the variation rate of the mole ratio of water to silane alkoxide for a period from the start to the end of the reaction relative to the initial mole ratio is 0.90 to 1.10.

Abstract: The purpose of the present invention is to provide a polishing composition which can polish an object to be polished containing oxygen atoms and silicon atoms at high polishing speed, and can reduce generation of scratches on a surface of the object to be polished. A polishing composition used for polishing an object to be polished containing oxygen atoms and silicon atoms, the polishing composition including: abrasive grains A having an average primary particle size of 3 nm or more and 8 nm or less; abrasive grains B having an average primary particle size of more than 8 nm; and a dispersing medium, wherein a content of the abrasive grains B in the polishing composition is larger than a content of the abrasive grains A in the polishing composition, average silanol group density of the abrasive grains A and the abrasive grains B is 2.0 nm?2 or less, and an aspect ratio of the abrasive grains B is more than 1.3 and 2.0 or less.

Abstract: A bonded abrasive article suitable for processing hard materials such as sapphire. In an embodiment, an abrasive article includes a bonded abrasive body including a bond material comprising a metal, abrasive particles contained within the bond material having an average particle size of not greater than about 20 ?m, and a pore size standard deviation of not greater than about 16 ?m. An abrasive article can also include a bonded abrasive body having a bond material comprising metal, abrasive particles contained within the bond material having an average particle size of not greater than about 20 ?m, and an average pore size of not greater than about 110 ?m.

Abstract: A polishing composition comprising a colloidal dispersion of spherical silica particles and associated silica particles as abrasive is provided. When used in the step of polishing synthetic quartz glass substrates, the polishing composition ensures a higher polishing rate than conventional colloidal silica and is effective for preventing any microscopic defects on the substrate surface, thus providing the substrate with a high smoothness. The polishing composition can be used as the ceria replacement polishing composition for polishing a lapped surface.

Abstract: A silicone oil-treated silica particle according to the present invention includes a silica particle body and silicone oil. The silica particle body has a BET specific surface area of 70 m2/g to 120 m2/g. The silica particle body has been surface-treated with the silicone oil. The amount of free silicone oil liberated from the surface of the silica particle body in the silicone oil accounts for 2.0 mass % to 5.0 mass % with respect to the silica particle body. A surface-treated styrene acrylic resin particle, in which 2 parts by mass of the silicone oil-treated silica particle has been added to 100 parts by mass of a styrene acrylic resin particle having a particle size median of 5 ?m to 8 ?m, has a degree of agglomeration of 18% or less.

Abstract: After a titanium nitride film is formed to cover an interlayer insulating film, a first nickel film is formed on a front surface of a silicon carbide base exposed in a contact hole, so as to extend on the titanium nitride film. Next, the silicon carbide base and the first nickel film are reacted by rapid thermal annealing at a temperature of 800 to 1100 degrees C. to form a nickel silicide film that forms an ohmic contact. Grains of the titanium nitride film are enlarged by the rapid thermal annealing, making a grain size of the titanium nitride film 20 nm to 50 nm. Thus, interstices of the grains of the titanium nitride film become smaller than before the rapid thermal annealing or are eliminated, enabling the intrusion of nickel from the first nickel film into the interstices of the columnar grains of the titanium nitride film to be suppressed.

Abstract: The silica sol of the invention contains silica particles having a mean primary particle size of 20 to 100 nm and which has a silica particle size/mean primary particle size ratio, determined through dynamic light scattering, of 3.0 or less, wherein the silica particles are surface-treated with an organic silane compound and have an ?-ray emission rate of 0.005 counts/cm2·hr or less and a moisture absorption coefficient, determined after allowing the silica particles to stand for 48 hours at 23° C. and a relative humidity of 50 RH %, of 0.5 mass % or lower.

Abstract: The CMP polishing solution of the invention comprises (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a positive zeta potential in the CMP polishing solution, (C) a metal oxide solubilizer and (D) an oxidizing agent. The polishing method of the invention comprises a first polishing step in which the conductive substance layer of a substrate comprising an interlayer insulating filth having an elevated section and a trench at the surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, is polished to expose the barrier layer located on the elevated section of the interlayer insulating film, and a second polishing step in which the barrier layer exposed in the first polishing step is polished using the CMP polishing solution to expose the elevated section of the interlayer insulating film.

Abstract: An abrasive article including a body including a bond material having an inorganic material including a ceramic, abrasive agglomerates including silicon carbide contained within the bond material, and a permeability of at least 60.

Abstract: A shaped abrasive particle including a body having a first major surface, a second major surface, and a side surface extending between the first major surface and the second major surface, wherein the body includes a sharpness-shape-strength factor (3SF) within a range between about 0.7 and about 1.7 and a Shape Index within a range between at least about 0.51 and not greater than about 0.99.

Abstract: A method includes: providing a mold having a plurality of mold cavities, wherein each mold cavity is bounded by a plurality of faces joined along common edges; filling at least some of the mold cavities with a sol-gel composition that includes a release agent dispersed therein; at least partially drying the sol-gel composition thereby forming shaped ceramic precursor particles; calcining at least a portion of the shaped ceramic precursor particles to provide calcined shaped ceramic precursor particles; and sintering at least a portion of the calcined shaped ceramic precursor particles to provide ceramic shaped abrasive particles. A sol-gel composition, shaped ceramic precursor particles, and ceramic shaped abrasive particles associated with practice of the method are also disclosed.

Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises odd-shaped abrasive grains and an oxidizing agent having a standard electrode of 0.3 V or more, and preferably further contains a salt, such as an ammonium salt. The pH of the polishing composition is 1 or more and 6 or less, or 8 or more and 14 or less. The average degree of association of the abrasive grains, obtained by dividing the value of the average secondary particle diameter of the abrasive grains by the value of the average primary particle diameter of the abrasive grains, is preferably 1.6 or more.

Abstract: A colloidal sol and a method of making colloidal sol that is capable of controlling the resulting particle size and more specifically, using a potassium hydroxide process to obtain a colloidal sol having a single peak of average particle sizes.

Abstract: An abrasive particulate material which is made of alumina crystals and a primary additive composition impregnated within the abrasive particulate material, the primary additive composition including a combination of Mg and Ca, wherein Mg and Ca are present in an additive ratio [Mg:Ca] within a range between about 1:1 and about 10:1, and a Ca amount is at least about 0.2 wt % Ca for the total weight of the abrasive particulate material.

Abstract: A polishing composition includes a water-soluble polymer having a weight average molecular weight of 1000000 or less and a molecular weight distribution represented by weight average molecular weight (Mw)/number average molecular weight (Mn) that is less than 5.0. The polishing composition is mainly used in an application for polishing a substrate, preferably in an application for performing final polishing on a substrate.

Abstract: Technologies for a process used to reduce the height of a raised profile of a device. One or more raised profiles on one or more layers of a device are removed using a combined chemical-mechanical polishing/etching process. In some implementations, a protective layer is applied to a top layer of a device grown on a substrate. A combined chemical-mechanical polishing/etching process may commence whereby one or more raised profiles of the protective layer are removed through a planarization process, exposing at least a portion of a raised profile of a layer below the protective layer. Material may be removed using an etchant to reduce the height of the raised profile.

Abstract: A manufacturing apparatus, of a grinding stone which is manufactured by attaching abrasive grains respectively having polyhedral shapes in which mutually opposed surfaces are parallel to each other to a base member, is provided with: an abrasive grains classifying apparatus adapted to classify the abrasive grains based on sizes of the abrasive grains defined by face-to-face distances between the mutually opposed surfaces; and an attaching apparatus adapted to attach the abrasive grains classified by the abrasive grains classifying apparatus to the base member.

Abstract: A coated grain is provided with a fused base grain at least partially covered with a coating that includes silica. The base grain includes more than 40% of alumina as a percentage by weight based on the weight of the base grain.

Abstract: A polishing composition contains colloidal silica. The colloidal silica satisfies the expression A×D×E×F?350,000 where “A” denotes the average aspect ratio (dimensionless) of the colloidal silica, “D” denotes the average particle diameter (units: nm) of the colloidal silica, “E” denotes the standard deviation of the particle size (units: nm) of the colloidal silica, and “F” denotes the volume fraction (units: %) of particles having a diameter of 1 to 300 nm in the colloidal silica. The volume fraction of particles having a diameter of 1 to 300 nm in the colloidal silica is 90% or greater.

Abstract: A high temperature bonded abrasive includes alumina abrasive grits, and a vitreous bond matrix in which the alumina abrasive grits are distributed, the vitreous bond matrix having a cure temperature not less than 1000° C. The alumina abrasive grits include polycrystalline alpha alumina having a fine crystalline microstructure characterized by an alpha alumina average domain size not greater than 500 nm, and the alumina abrasive grits further include a pinning agent that is a dispersed phase in the polycrystalline alpha alumina.

Abstract: To provide a method for producing an alkali silicate aqueous solution containing a reduced amount of foreign substance of plate-like fine particles and a method for producing a silica sol containing a reduced amount of foreign substance of plate-like fine particles. A method for producing an alkali silicate aqueous solution fulfilling the following condition: the existing amount of plate-like fine particles having a length of one side of 0.2 to 4.0 ?m and a thickness of 1 to 100 nm is determined to be 0 to 30%. The method for producing an alkali silicate aqueous solution includes the steps of adjusting a silica concentration of an alkali silicate aqueous solution to 0.5 to 10.0% by mass and filtering the alkali silicate aqueous solution through a filter having a removal rate of particles with a primary particle size of 1.0 ?m of 50% or more.

Abstract: A polishing agent for polishing a non-oxide single-crystal substrate such as a silicon carbide single-crystal substrate with a high polishing rate to obtain a smooth surface is provided. This polishing agent comprises an oxidant having redox potential of 0.5 V or more and containing a transition metal, silicon oxide particles, cerium oxide particles and a dispersion medium, in which a mass ratio of the silicon oxide particles to the cerium oxide particles is from 0.2 to 20.

Abstract: A polishing slurry for a chemical mechanical planarization process includes polishing particles and polyhedral nanoscale particles having a smaller size than the polishing particles and including a bond of silicon (Si) and oxygen (O).

Abstract: A polishing composition contains colloidal silica particles having protrusions on the surfaces thereof. The average of values respectively obtained by dividing the height of a protrusion on the surface of each particle belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles by the width of a base portion of the same protrusion is no less than 0.245. Preferably, the part of the colloidal silica particles that has larger particle diameter than the volume average particle diameter of the colloidal silica particles has an average aspect ratio of no less than 1.15. Preferably, the protrusions on the surfaces of particles belonging to the part of the colloidal silica particles that has larger particle diameters than the volume average particle diameter of the colloidal silica particles have an average height of no less than 3.5 nm.

Abstract: Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate and a preformed polycrystalline diamond table including an interfacial surface bonded to the substrate and an opposing working surface. The preformed polycrystalline diamond table includes a proximal region extending from the interfacial surface to an intermediate location within the preformed polycrystalline diamond table that includes a metallic infiltrant infiltrated from the substrate, and a distal region extending from the working surface to the intermediate location that is substantially free of the metallic infiltrant. A boundary exists between the proximal and distal regions that has a nonplanar irregular profile characteristic of the metallic infiltrant having been infiltrated into the preformed polycrystalline diamond table.

Abstract: An abrasive composition for polishing substrates including a plurality of abrasive particles having a poly-dispersed particle size distribution with median particle size, by volume, being about 20 nanometers to about 100 nanometers; a span value, by volume, being greater than or equal to about 15 nanometers, wherein the fraction of particles greater than about 100 nanometers is less than or equal to about 20% by volume of the abrasive particles.

Abstract: An abrasive article includes a shaped abrasive particle including a body having a first height (h1) at a first end of the body defining a corner between an upper surface, a first side surface, and a second side surface, and a second height (h2) at a second end of the body opposite the first end defining an edge between the upper surface and a third side surface, wherein the average difference in height between the first height and the second height is at least about 50 microns. The body also includes a bottom surface defining a bottom area (Ab) and a cross-sectional midpoint area (Am) defining an area of a plane perpendicular to the bottom area and extending through a midpoint of the particle, the body has an area ratio of bottom area to midpoint area (Ab/Am) of not greater than about 6.

Abstract: The abrasive material contains Fe, Si, Ca, Al, Mg and Mn and has an amorphous continuous phase, wherein the total amount of Fe, Si and Ca is 50.0% or more by mass in terms of the total content of FeO, SiO2 and CaO, Fe is contained in an amount of 6.0% to 35.0% by mass inclusive in terms of FeO content, Si is contained in an amount of 15.0% to 35.0% by mass inclusive in terms of SiO2, and Ca is contained in an amount of 10.0% to 35.0% by mass inclusive in terms of CaO content, wherein all of the amounts are those relative to the entire amount of the abrasive material.

Abstract: An abrasive element comprises a body of crystalline abrasive material. The body has an array of cutting elements formed of crystalline abrasive material which projects from a surface of the body. The shape, size and form of the projections is controlled in the production process. The body may be a natural or synthetic crystal. The body may be a film formed by deposition. The body may be diamond or cubic boron nitride. The body may be monocrystalline or polycrystalline. The projections may be aligned along a crystallographic plane or planes.

Abstract: A plastic soft composition is formed of soft base material constantly provided with plasticity, porous fine particles for polishing contained in the base material, and the like, and a polishing process and a coating process are performed to a painted surface and the like using the plastic soft composition. The fine particles for polishing are impregnated with a coating agent (a surface protective agent) added with an activator which is emulsified by contact with water, and the coating agent is held in concave portions formed in the fine particles. Both polishing work and coating work are achieved by sliding the plastic soft composition on a painted surface by a palm pressure of a user.

Abstract: A method of forming an abrasive article includes providing a green body having abrasive particles including microcrystalline alumina, and heating the green body via microwave radiation to form a bonded abrasive body including the abrasive particles and a bond material comprising a vitreous phase.