Abstract: The invention provides a plurality of polymeric particles embedded with silicate that include gas-filled polymeric microelements. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell having an outer surface and a diameter of 5 ?m to 200 ?m with silicate particles embedded in the polymer. The silicate particles have an average particle size of 0.01 to 3 ?m. The silicate-containing regions are spaced to coat less than 50 percent of the outer surface of the polymeric microelements; and less than 0.1 weight percent total of the polymeric microelements is associated with i) silicate particles having a particle size of greater than 5 ?m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric micro elements agglomerated with silicate particles to an average cluster size of greater than 120 ?m.

Abstract: An outer blade cutting wheel comprising an annular thin disc base of cemented carbide and a blade section of metal or alloy-bonded abrasive grains on the outer periphery of the base is provided. The abrasive grains are diamond and/or cBN grains having an average grain size of 45-310 ?m and a TI of at least 150. The blade section includes overlays having a thickness tolerance (T3max?T3min) of 0.001 mm to 0.1×T2 mm. The blade section has a roundness (ODmax/2?ODmin/2) of 0.001 mm to 0.01×ODmax mm.

Abstract: The present invention relates to a polishing slurry including: a colloidal silica having an average particle size of 40 nm or more; water; and a ? potential adjusting component, in which the ? potential adjusting component includes at least one water-soluble organic polymer selected from a water-soluble polyether polyamine and a water-soluble polyalkylene polyamine and at least one acid selected from hydrochloric acid, sulfuric acid, nitric acid, nitrous acid and amidosulfuric acid, and the ? potential adjusting component contains the acid at a ratio of from 0.6 to 1.4 to the water-soluble organic polymer in terms of molar ratio, and the polishing slurry has a pH of 8 or more.

Abstract: An abrasive article can include an abrasive aggregate with the abrasive aggregate having a plurality of silicon carbide particles bonded together by a binder material. The binder material can include a vitreous phase material, a crystalline phase material, or both. In an embodiment, the crystalline phase material can include an aluminosilicate material. In a particular embodiment, abrasive aggregates can be formed from a mixture including silicon carbide particles, a binder material, and a liquid carrier. The mixture can be formed into a number of green granules that are vibrated and heated on a platen. In an illustrative embodiment, the green granules can then be heated to form abrasive aggregates.

Abstract: An abrasive composition for polishing substrates including a plurality of abrasive particles having a poly-dispersed particle size distribution with median particle size, by volume, being about 20 nanometers to about 100 nanometers; a span value, by volume, being greater than or equal to about 15 nanometers, wherein the fraction of particles greater than about 100 nanometers is less than or equal to about 20% by volume of the abrasive particles.

Abstract: An abrasive product is disclosed. The abrasive product includes a binder support substrate, a binder, an abrasive material affixed to the support substrate by the binder, and an antiloading composition on the surface of the abrasive product. The antiloading composition is a lauryl sulfate. The lauryl sulfate is the only organic antiloading compound included in the antiloading composition.

Abstract: A sheet of sandpaper includes a backing layer having opposed first and second major sides, an adhesive make coat on the second major side, abrasive particles at least partially embedded in the make coat, thereby defining an abrasive surface, and an exposed fibrous non-slip layer on the first major side. Methods of making and using such sandpaper are also provided.

Abstract: Abrasive articles containing solid abrasive particles (A) selected from the group consisting of inorganic particles, organic particles and inorganic-organic hybrid particles (a1) having an average primary particle size of from 1 to 500 nm as determined by laser light diffraction and having electron donor groups (a2) chemically bonded to their surface are provided. The said solid abrasive particles (A) are distributed throughout or on top of or throughout and on top of a solid matrix (B). A method for manufacturing abrasive articles and a method for processing substrates useful for fabricating electrical and optical devices are provided. The said methods make use of the said abrasive articles.

Abstract: A cerium salt wherein, when 20 g of the cerium salt is dissolved in a mixed liquid of 12.5 g of 6N nitric acid and 12.5 g of a 30% hydrogen peroxide aqueous solution, a concentration of an insoluble component present in the solution is 5 ppm or less by mass ratio to the cerium salt before dissolution and cerium oxide produced by processing the cerium salt at high temperatures. Scratch on a surface to be polished can be reduced when a cerium based polishing slurry containing the cerium oxide particles is used, since an amount of impurities in cerium oxide particles and cerium salt particles, raw material thereof, is reduced for high purification.

Abstract: An abrasive article can include a bonded abrasive body having abrasive particles comprising microcrystalline alumina (MCA) contained within a bond material. In an embodiment, the bonded abrasive body has a porosity of at least about 42 vol % of the total volume of the bonded abrasive body. Additionally, in an embodiment, the bonded abrasive body is capable of grinding a workpiece comprising metal at a speed of at least about 60 m/s at a material removal rate of at least about 0.4 in3/min/in (258 mm3/min/mm).

Abstract: Suspensions of cerium oxide particles in which the particles (secondary particles) have an average size not exceeding 200 nm, such secondary particles being comprised of primary particles having an average size not exceeding 100 nm with a standard deviation having a value not exceeding 30% of the value of this average size, are prepared from a solution of a cerium-III salt, including cerium IV or hydrogen peroxide, which is contacted with a base in the presence of nitrate ions and in an inert atmosphere; the medium thus obtained is subjected to a thermal processing in an inert atmosphere, then acidified and scrubbed and the powder is obtained by drying and calcining of the suspension, which suspension and powder are useful for polishing applications.

Abstract: The present invention relates to a polishing composition used in a step of polishing until a barrier layer adjacent to a copper layer is exposed, in a pattern formation of polishing the copper layer provided on an insulating layer through the barrier layer thereby alternately forming a copper embedded wiring and the insulating layer, the polishing composition including: an alicyclic resin acid; a colloidal silica in which a content thereof in the polishing composition is from 0.1 to 1.5% by mass, an average primary particle size thereof is from 10 to 40 nm, an average secondary particle size thereof is from 30 to 80 nm, and (the average secondary particle size×the content) is in a range of from 10 to 40; and tetramethylammonium ion.

Abstract: A method of sharpening blades of a hair cutting device includes providing a sharpening composition in substantially crystalline form, activating a hair cutting device, submerging a working end of the hair cutting device at least partially into the sharpening composition, and viewing the sharpening composition. Sharpening is complete when the sharpening composition is substantially transformed to powder form.

Abstract: The disclosure is directed to a radiation curable composition including abrasive grains and a binder composition. The binder composition includes about 10 wt % to about 90 wt % cationically polymerizable compound, not greater than about 40 wt % radically polymerizable compound, and about 5 wt % to about 80 wt % particulate filler based on the weight of the binder composition. The particulate filler includes dispersed submicron particulates.

Abstract: Presently described are methods of making an article via electrostatic deposition of particles, abrasive grains and articles, as well as a method of repairing a painted surface. The abrasive grain comprises a plurality of abrasive particles having a median primary particle size of less than 75 microns, and discrete hydrophobic nanoparticles.

Abstract: An abrasive article includes a bonded abrasive body having abrasive particles comprising microcrystalline alumina (MCA) contained within a bond material. In an embodiment, the bonded abrasive body has a strength ratio (MOR/MOE) of at least about 0.80.

Abstract: The invention relates to a chemical-mechanical polishing composition comprising silica, one or more organic carboxylic acids or salts thereof, one or more polysaccharides, one or more bases, optionally one or more surfactants and/or polymers, optionally one or more reducing agents, optionally one or more biocides, and water, wherein the polishing composition has an alkaline pH. The polishing composition exhibits a high removal rate and low particle defects and low haze. The invention further relates to a method of chemically-mechanically polishing a substrate using the polishing composition described herein.

Abstract: Presently described are methods of inhibiting water vapor adsorption of a powder and methods of storing a powder at increased humidity level. The methods comprise providing adding discrete hydrophobic nanoparticles to a plurality of particles.

Abstract: A coated abrasive product includes a particulate material containing green, unfired abrasive aggregates having a generally spheroidal or toroidal shape, the aggregates formed from a composition comprising abrasive grit particles, a nanoparticle binder, a dual function material, and a cross-linking agent. These green unfired abrasive aggregates can also be used in free abrasive products and bonded abrasive products.

Abstract: The invention relates to a fused grit having the following chemical analysis, in wt %: ZrO2+HfO2: 38.0-46.0%; Al2O3: the remainder up to 100%; SiO2: 0.20-0.60%; Y2O3: 0.45 to 0.70%; TiO2: 1.00 to 2.00%; other oxides: <1.00%, the ratio of Y2O3/SiO2 being 0.80 to 2.00, and the tetragonal phase being 60 to 90% of the weight of the zirconia, the remainder being in monoclinic form.

Abstract: A method of manufacturing polycrystalline abrasive elements consisting of micron, sub-micron or nano-sized ultrahard abrasives dispersed in micron, sub-micron or nano-sized matrix materials. A plurality of ultrahard abrasive particles having vitreophilic surfaces are coated with a matrix precursor material in a refined colloidal process and then treated to render them suitable for sintering. The matrix precursor material can be converted to an oxide, nitride, carbide, oxynitride, oxycarbide, or carbonitride, or an elemental form thereof. The coated ultrahard abrasive particles are consolidated and sintered at a pressure and temperature at which they are crystallographically or thermodynamically stable.

Abstract: A vitrified superabrasive product includes a superabrasive component and a vitrified bond component in which the superabrasive component is dispersed, wherein the vitrified bond component defines pores occupying greater than about 50% of the total volume of the vitrified superabrasive product. The vitrified superabrasive product can be in the form of a grinding tool, such as a grinding wheel. A superabrasive mixture includes a glass powder, a superabrasive grit, a binder and a silicon carbide. The mixture can be in the form of a green body, which is fired under an atmosphere and pressure, and at a temperature sufficient to form a porous vitrified superabrasive product.

Abstract: An abrasive element consisting substantially of a glass material that is at least partially devitrified.

Abstract: An abrasive article includes a shaped abrasive particle including a body having a first height (h1) at a first end of the body defining a corner between an upper surface, a first side surface, and a second side surface, and a second height (h2) at a second end of the body opposite the first end defining an edge between the upper surface and a third side surface, wherein the average difference in height between the first height and the second height is at least about 50 microns. The body also includes a bottom surface defining a bottom area (Ab) and a cross-sectional midpoint area (Am) defining an area of a plane perpendicular to the bottom area and extending through a midpoint of the particle, the body has an area ratio of bottom area to midpoint area (Ab/Am) of not greater than about 6.

Abstract: A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.

Abstract: A method of chemical mechanical polishing a surface of a substrate including the step of: contacting the substrate and a composition including a plurality of colloidal silica particles having less than 200 ppb of each trace metal impurity, excluding potassium and sodium, have less than 2 ppm residual alcohol and wherein the cumulative concentration of the trace metal, excluding potassium and sodium, is in the range from about 0.5 to about 5 ppm; and a medium for suspending the particles; wherein the composition is an ultrapure colloidal silica dispersion; and wherein the contacting is carried out at a temperature and for a period of time sufficient to planarize the substrate.

Abstract: A composition including an abrasive, a suspension agent, a surfactant, and a lubricant, is provided for removing scratches, hazing, discoloration, and other defects from plastic surfaces. The composition is applied to a surface and used to polish the surface. The defects within the surface are removed without the removal of significant amounts of the material. Accordingly, the present invention removes defects from surfaces without creating optical distortion.

Abstract: An abrasive composition including vitreous binding material; abrasive material; and a dimensional stabilizing additive (DSA), present in an amount that is from about 1 to about 40 volume percent of the abrasive composition, wherein the dimensionally stabilizing additive is inert to the binding material, and has a Mohs hardness of between 4 and 9, and wherein the abrasive composition does not include hollow sphere fillers. Also included is a method of making an abrasive articles, articles formed thereby; and articles formed from the abrasive compositions.

Abstract: A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1×Y1?0 and the relationship X2×Y2>0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide.

Abstract: The present invention provides a sol of spinous inorganic oxide particles not containing coarse particles, in which particles having extremely homogeneous particles are dispersed in a solvent. An acidic silicic acid is added to a dispersion liquid of core particles to grow core particles, and then again the acidic silicic acid is added at the addition rate 1.2 to 1.8 higher than that in the previous step to prepare a sol of spinous inorganic oxide particles. Then the sol is subjected to centrifugation to remove coarse particles having the diameter of 800 nm or more, thus spinous inorganic oxide particles having peculiar form such as a spinous one being obtained.

Abstract: A system for forming a labyrinth seal on a turbine blade has a fixture with a plurality of nozzles for distributing a coolant, a first jaw set for clamping and holding a root portion of the turbine blade in a first orientation, which first jaw set is attached to the fixture and has two members for mating with said root portion of said turbine blade, each of the jaw set members respectively have ridges; and a plurality of grinding wheels for forming the labyrinth seal.

Abstract: The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.

Abstract: A polishing composition for a silicon wafer includes a macromolecular compound, an abrasive, and an aqueous medium. The macromolecular compound includes a constitutional unit (a1) represented by the following general formula (1), a constitutional unit (a2) represented by the following general formula (2), and a constitutional unit (a3) represented by the following general formula (3). The total of the constitutional unit (a3) is 0.001 to 1.5 mol % of all the constitutional units of the macromolecular compound.

Abstract: An abrasive article includes an organic bond material, an abrasive material dispersed in the organic bond material, mineral wool microfibers uniformly dispersed in the organic bond material, the mineral wool microfibers being individual filaments, one or more reinforcement and/or chopped strand fibers dispersed in the organic bond material and one or more active fillers including, for example, a manganese compound. The abrasive article can be used in the abrasive processing of a workpiece.

Abstract: The present invention relates to an abrasive product and to a method of manufacturing same. Such an abrasive product comprises a structured abrasive coating provided on an upper side (6) comprised by the abrasive product. Herein, abrasive grains (8) and glue (7) are molded on a backing such that the upper side of the abrasive product is provided with a three-dimensional product-specific pattern. This pattern is created by said abrasive grains and glue, which constitute an individual composite grain (9). In generating the pattern, a special computer program is utilized in a computer program product for placing said composite grains randomly over the upper side of the abrasive product. The invention also relates to a casting mould with which the thus obtained pattern may be transferred onto the upper side of the abrasive product. The invention further comprises an arrangement for manufacturing said casting mould.

Abstract: A chemical-mechanical planarization composition containing surface-modified abrasive particles such as silica where at least a portion of the surface of the particles has bound thereto a surface-modifying aluminum-containing stabilizer and fluoride that is used to polish semiconductor substrates. The use of a CMP slurry containing surface-modifying aluminum-containing stabilizer and fluoride bound to a silica abrasive provides high metal polishing rates relative to the removal rate of a dielectric.

Abstract: A heterocoagulate comprises first particles, having a particle size of at most 999 nm, on a second particle, having a particle size of at least 3 microns. The first particles comprise cerium oxide, and second particle comprises at least one member selected from the group consisting of silicon oxides, aluminum oxides and zirconium oxides.

Abstract: The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing a silicon nitride-containing substrate while suppressing polysilicon removal from the substrate. The composition comprises abrasive particles suspended in an acidic aqueous carrier containing a surfactant comprising an alkyne-diol, an alkyne diol ethoxylate, or a combination thereof. Methods of polishing a semiconductor substrate therewith are also disclosed.

Abstract: Aqueous dispersion comprising cerium oxide and silicon dioxide, obtainable by first mixing a cerium oxide starting dispersion and a silicon dioxide starting dispersion while stirring, and then dispersing at a shear rate of 10000 to 30000 s?1, wherein a) the cerium oxide starting dispersion—contains 0.5 to 30% by weight of cerium oxide particles as the solid phase, —a d5o of the particle size distribution of 10 to 100 nm—and has a pH of 1 to 7, and b) the silicon dioxide starting dispersion—contains 0.1 to 30% by weight of colloidal silicon dioxide particles as the solid phase, has a d5o of the particle size distribution of 3 to 50 nm and has a pH of 6 to 11.5, d) with the proviso that the d5o of the particle size distribution of the cerium oxide particles is greater than that of the silicon dioxide particles, the cerium oxide/silicon dioxide weight ratio is >1 and the amount of cerium oxide starting dispersion is such that the zeta potential of the dispersion is negative.

Abstract: Raspberry-type coated particles comprising a core selected from the group consisting of metal oxides of Si, Ti, Zr, Al, Zn and mixtures thereof with a core size of from 20 to 100 nm wherein the core is coated with CeCO2 particles having a particle size below 10 nm; process for preparing raspberry type coated particles comprising the steps of i) providing a mixture containing: a) core particles selected from the group of metal oxides of Si, Ti, Zr, Al, Zn and mixtures thereof, with a particle size of from 20 to 100 nm; b) a water soluble Ce-salt and c) water; ii) adding an organic or inorganic base to the mixture of step i) at temperatures of from 10 to 90° C. and iii) aging the mixture at temperatures of from 10 to 90° C.; and polishing agents containing the particles and their use for polishing surfaces.

Abstract: Abrasive particles which are shaped abrasive particles each with an opening is disclosed. The shaped abrasive particles are formed from alpha alumina and have a first face and a second face separated by a thickness t. The opening in each of the shaped abrasive particles can improve grinding performance by reducing the size of a resulting wear flat, can provide a reservoir for grinding aid, and can improve adhesion to a backing in a coated abrasive article.

Abstract: A surface-modified abrasive grain includes an abrasive grain as a substrate, and a film on the abrasive grain that includes a relatively hydrophilic silane component and a relatively hydrophobic silane component. The film can be a single film layer or multiple film layers, wherein a film layer most proximal to the abrasive grain has a predominately hydrophilic silane component, and a film layer more distal to the abrasive grain includes predominately a relatively hydrophobic silane component. Coated abrasive products and bonded abrasive products include the surface-modified abrasive grains.

Abstract: To polish polishing target surfaces of SiO2 insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3 and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

Abstract: A composition including an abrasive, a suspension agent, a surfactant, and a lubricant, is provided for removing scratches, hazing, discoloration, and other defects from plastic surfaces. The composition is applied to a surface and used to polish the surface. The defects within the surface are removed without the removal of significant amounts of the material. Accordingly, the present invention removes defects from surfaces without creating optical distortion.

Abstract: An apparatus and associated method for polishing a workpiece with a polishing slurry having ceria particulates and silica particulates.

Abstract: The present invention provides a system and method for recycling an abrasive chemical mechanical polishing (CMP) slurry after polishing substrates therewith. The method comprises circulating the recovered CMP slurry from a blending tank through an ultrafiltration unit and back into the, the ultrafiltration unit removing a predetermined amount of water from recovered slurry to form a slurry concentrate; optionally adjusting the pH of the concentrate to a predetermined target level; and optionally adding selected additive chemical components and/or water to the concentrate in amounts sufficient to form a reconstituted CMP slurry that is suitable for use in a CMP process.

Abstract: The present invention provides a sol of spinous silica-based particles in which silica-based particles having peculiar forms, spinous forms are dispersed in a solvent. The spinous silica-based particles have verrucous projections formed on surfaces of spherical silica-based particles. In the spinous particles, a value of the surface roughness (SA1/SA2, SA1 indicating a specific surface area measured by the BET method or the Sears method and SA2 indicating a specific surface area converted from an average particle diameter (D2) measured by the image analysis method) is in the range from 1.7 to 10. Furthermore the average diameter (D2) measured by the image analysis method is in the range from 7 to 150 nm.

Abstract: The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica particles having a ratio of long axis to short axis of 1.5 to 15. The polishing method for a semiconductor wafer uses the polishing composition. The polishing composition can provide a remarkably high polishing rate compared with a polishing composition using spherical colloidal silica, and can provide good mirror-polishing without causing scratches. In addition, small alkali metal content enables reduction of adverse effects on a semiconductor wafer, such as residual abrasives after polishing.

Abstract: A molten alumina/zirconia grain mixture having the following chemical composition, in wt %: ZrO2+HfO2: 35 to 45.5%; Al2O3: 43.7 to 65%; other oxides: <10%; SiO2: <0.8%, which simultaneously adheres to a granulometric condition and to a densimetric condition.

Abstract: A blast media for removal of thick coatings from heavy steel and lighter aluminum substrates where a profile is desired for new paint adhesion. The blast media is applied as a free flowing particulate in a stream of a pressurized fluid. The blast media comprises a main ingredient of a glass frit with smaller generally equal amounts by weight of angular copper slag, spherical synthetic iron oxide and aluminum oxide.