Abstract: The invention comprises copper chemical-mechanical polishing processes using fixed abrasive polishing pads, and copper layer chemical-mechanical polishing solutions specifically adapted for chemical-mechanical polishing with fixed abrasive pads. In one implementation, processes are described for pH's of 7.0 or greater. In one implementation, processes are described for pH's of 7.0 or less. In one implementation, a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad comprises a copper oxidizing component present at from about 1% to 15% by volume, a copper corrosion inhibitor present at from about 0.01% to 2% by weight, and a pH of less than or equal to 7.0. In one implementation, a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad comprises a copper oxidizing component present at from about 0.

Abstract: According to the invention, an aqueous polishing composition comprises, abrasive particles and water of basic pH to remove a barrier layer by CMP using a polishing pad, the aqueous polishing composition further comprising, solely polar molecules each having multiple, polar bonding sites forming respective hydrogen bonds with silanol bonding groups on a hydrated silica dielectric layer of a semiconductor substrate, which form an hydrophilic protective film of the polar molecules that minimizes erosion.

Abstract: A pyrogenic process is used to prepare alkali-doped silica particles. Particles produced by this process exhibit homogeneous doping, reduced agglomeration, greater stability and higher removal rates. Aqueous dispersions containing alkali-doped pyrogenic silica with average particle size less than 100 nm are used for polishing surfaces (CMP).

Abstract: An SiO2/Al2O3 composite abrasive is disclosed, which has positive surface charges when dispersed in an alkaline water solution. This SiO2/Al2O3 composite abrasive includes an Al2O3 core and SiO2 coated thereon. The abrasive of the present invention is suitable for polishing metal, compact disks, optical lenses, and semiconductors etc in a high-pH environment. A method for producing the SiO2/Al2O3 composite abrasive is also disclosed in the present invention.

Abstract: Brush bristles include filaments of synthetic resin material containing two or more types of abrasive particles selected from among diamond powder, stainless-steel powder, titanium powder, silicon carbide powder and aluminum oxide powder or silicon carbide or alumina abrasive grains.

Abstract: The invention provides abrasive articles with optimally oriented abrasive particles and a method of making the same. The method involves contacting a substrate with the contact and mating surfaces of tools to provide an embossed substrate with perforated depressions, distributing abrasive particles within the depressions of the substrate, optimally orienting each abrasive particle in the depression containing the abrasive particle, creating a differential pressure between the top surface and the back surface of the embossed, perforated sheet wherein a lower pressure is applied to the back surface to hold the oriented abrasive particles within its depression while removing at least a major portion of abrasive particles not within the depressions from the top surface of the sheet and permanently bonding the abrasive particles in the depressions after they are optimally oriented to provide the abrasive product.

Abstract: The present invention provides a dispersion liquid of silica particles for polishing with a low content of Na ions and also with a content of ions other than Na ions in a prespecified range. This dispersion liquid is a dispersion liquid of silica particles in which the silica particles having the average particle diameter in the range from 5 to 300 nm is dispersed, and a content of Na ions in the silica particle is less than 100 ppm, while a contents of ions other than Na ions is in the range from 300 ppm to 2 weight %.

Abstract: An aqueous dispersion containing a cerium oxide-doped, pyrogenically produced silicon dioxide, wherein the cerium oxide is introduced through an aerosol of a cerium salt solution or suspension and the average particle size in the dispersion is less than 100 nm. The dispersion is produced by dispersing the cerium oxide-doped, pyrogenically produced silicon dioxide in aqueous solution by means of a high energy input. The aqueous dispersion can be used for chemical-mechanical polishing.

Abstract: An abrading composition and a process for abrading factory pre-finished surface coverings, wherein the abrading composition comprises an effective amount of wear-resistant particles, a rheology modifier, and a solvent. This invention further relates to a process to abrade wood floor surfaces and factory pre-finished wood floor surfaces, as well as a process for refinishing a factory pre-finished wood floor using the abrading composition.

Abstract: A non-asbestos friction material is made by molding and curing a composition which includes a fibrous base other than asbestos, a binder, an organic filler, an inorganic filler and an abrasive. The abrasive is composed of one or more inorganic substance selected from among inorganic substances having a Mohs hardness of at least 4.5 and inorganic substances having a Mohs hardness of less than 4.5 and containing at least 50 wt % of a component having a Mohs hardness of at least 4.5. The total amount of organic substances and the total amount of abrasive are in a volumetric ratio of from 1.5/1 to 3.5/1. The friction material thus constituted generates little squeal or other undesirable noise and has a good wear resistance.

Abstract: This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization (“CMP”) of semiconductor and other microelectronic substrates.

Abstract: A polishing liquid for metal containing a metal-oxidizing agent, an oxidized metal dissolving agent, a protective film forming agent, a water-soluble polymer and water, the polishing liquid being used for producing a wiring pattern having a metal-embedded wiring portion of 10 to 100 &mgr;m width and an insulating portion of 10 to 100 &mgr;m width in which pattern the wiring portion is arranged at a wiring density of 40 to 60%, the polishing liquid for metal being comprising in that, when a surface to be polished of a metal film embedded in the wiring portion and a surface to be polished of an insulating film formed at both side portions of the metal film is polished substantially flush, wherein (width of the metal-embedded wiring portion)/(magnitude of dishing (depth)) is no less than 103.

Abstract: Silica particles for polishing have a three-dimensional polycondensation structure with an average particle diameter in a range from 5 to 300 nm. The silica particles have residual alkoxy groups therein and a carbon content in a range from 0.5 to 5 weight % retained in the residual alkoxy groups.

Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination using wet grinding, and products thereof. The abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is theologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.

Abstract: Novel coated abrasives comprising abrasive agglomerate grains characterized by a high porosity and low ratio of solid volume to nominal volume provide exceptionally useful medium to low pressure grinding characteristics.

Abstract: Powders of particles comprising a ceramic core and a coating of ceria deposited thereon provide an economical and effective abrasive for glass polishing formulations.

Abstract: Abrasive articles abrasive articles (e.g., abrasive wheels) comprised of abrasive agglomerate particles dispersed within cellular polymeric material, and methods of making and using the abrasive articles.

Abstract: A composition of matter comprising particles of silica, where the silica particles have surfaces at which condensed phosphate is retained, and a production methodology therefor. Oral compositions containing this composition of matter are also presented, which are endowed with enhanced cleaning efficacy.

Abstract: The present invention provides a vitrified-bonded abrasive tool wherein the abrasive grit portion comprises a thermally sensitive abrasive grain, such as sintered sol gel microcrystalline alpha alumina abrasive grain or superabrasive grain, and wherein the vitrified bond may be matured by firing at a temperature of about 700 to 1,100 ° C. The invention preferably is carried out with sintered sol gel microcrystalline alpha alumina abrasive grain and a phosphorous oxide-containing, alkaliborosilicate vitrified bond composition. In one embodiment, during firing at about 700 to 1,100 ° C., the vitrified bond of the invention comprises at least two immiscible, amorphous phases.

Abstract: An aqueous polishing composition having abrasive particles of a metal oxide has a pH that undergoes pH drift, because ions are provided by dissolution of the metal oxide, and the pH drift is minimized by providing the aqueous polishing composition with an equilibrium concentration of the ions at said pH.

Abstract: The invention provides a chemical-mechanical polishing system, and a method of polishing using the system, comprising (a) an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) iodine, (c) an iodine vapor-trapping agent, and (d) a liquid carrier.

Abstract: Abrasive articles (e.g., abrasive wheels) comprised of abrasive particles and polymeric material such as a polymeric reaction product of components comprising saturated polyol, saturated polyisocyanate, and a free radical source, and methods of making and using the abrasive articles.

Abstract: Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planarizing surfaces, and preventing delamination and scratches.

Abstract: A coating composition for forming abrasion-resistant, high clarity coatings is described. It has been found that a macrocrystalline or single crystal mineral abrasive can be added at high levels, about 5 to about 80 percent by weight, to art-recognized film-forming resin compositions for producing coatings exhibiting exceptional abrasion resistance and clarity. Such a coating composition is useful for application to surfaces including wood, vinyl, tile, rubber modified cement, marble, metal, plastic, and laminated surfaces.

Abstract: A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.

Abstract: Coated abrasive articles comprise a backing and an abrasive layer, and optionally at least one of a backsize layer, tie layer, supersize layer, presize layer, or saturant.

Abstract: A method for repairing and lustering defects on a hydrophilic coat surface is reported. The method comprises the steps of applying a buffing composition on a hydrophilic coat surface; and buffing the hydrophilic coat surface to which the buffing composition has been applied. The buffing composition is an aqueous composition which comprises water and a water-soluble high-boiling-point liquid organic compound, and further comprises either a combination of abrasive particles and a dispersant, or lustering agent, or the both. The method allows for the removal of defects on a hydrophilic coat surface with good finish after repairing and without deteriorizing the antifouling function of the hydrophilic coat against urban fouling substances.

Abstract: A bimodal slurry system for a chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor of 3 than a mean particle diameter of the at least one type of second particles said first particles further being compressible.

Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.

Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.

Abstract: A method for producing organically bonded abrasive article includes combining an abrasive grain component and a phenol-based resin component. The combined components are molded and thermally cured in an atmosphere that comprises humidity, wherein the atmosphere contacts the molded components, thereby producing the organically bonded abrasive grain. The abrasive grain optionally can first be combined with an organosilicon compound, to form organosilicon-treated abrasive grain, and then with the phenol-based resin component. In one example, the phenol-based resin is thermally cured in the presence of steam. Abrasive articles produced by the method of the invention generally have improved properties under wet grinding conditions. In one example, an abrasive article produced by the method of the invention includes ammonia in an amount less than about 50 ppm. In another example, an abrasive grinding wheel produced by the method of the invention has a strength retention greater than about 57 percent.

Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.

Abstract: In the polishing particles each having a core-shell structure, the polishing rate can be controlled by adjusting the thickness and/or density of the shell portion. The polishing particles having the core-shell structure with the average diameter (D) in the range from 5 to 300 nm, and the shell portion of the polishing particles comprises silica with the thickness (ST) in the range from 1 to 50 nm, and the density of the shell portion is in the range from 1.6 to 2.2 g/cc, while the Na content of the shell portion is less than 10 ppm.

Abstract: A polishing composition comprising the following components (a) to (c): (a) colloidal silica; (b) at least one bicarbonate selected from the group consisting of ammonium bicarbonate, lithium bicarbonate, potassium bicarbonate, sodium bicarbonate and a mixture thereof; and (c) water; wherein the concentration of each of the elements included in Groups 2A, 3A, 4A, 5A, 6A, 7A, 8A, 1B and 2B, lanthanoid and actinoid, and the concentration of each element of aluminum, gallium, indium, thallium, tin, lead, bismuth, fluorine and chlorine, are at most 100 ppb in the polishing composition, respectively.

Abstract: A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.

Abstract: Abrasive particles and methods of making abrasive particles are disclosed. The abrasive particles may be incorporated into a variety of abrasive articles, including bonded abrasives, coated abrasives, nonwoven abrasives, and abrasive brushes.

Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

Abstract: Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in a substrate, at least partially curing the ceramic aggregate precursor particles, and heating the ceramic aggregate precursor particles to provide ceramic aggregate particles wherein solid particulates are bonded together by ceramic binder.

Abstract: A polishing composition comprising an abrasive having an average primary particle size of 200 nm or less, an oxidizing agent, an acid having a pK1 of 2 or less and/or a salt thereof, and water, wherein the acid value (Y) of the polishing composition is 20 mg KOH/g or less and 0.2 mg KOH/g or more; a process for reducing fine scratches of a substrate, comprising polishing a substrate to be polished with the above-mentioned polishing composition; and a method for manufacturing a substrate, comprising polishing a substrate to be polished with the above-mentioned polishing composition. The polishing composition can be suitably used for final polishing memory hard disk substrates and polishing semiconductor elements.

Abstract: The invention provides a polishing composition comprising (a) a silica abrasive, (b) methanol, and (c) a liquid carrier, wherein the polishing composition has a pH of about 1 to about 6, and the polishing composition is colloidally stable. The invention also provides a method for polishing a substrate comprising a silicon-based dielectric layer using the polishing composition. The invention further provides a method of stabilizing a silica abrasive in a polishing composition by contacting the abrasive with methanol.

Abstract: A two-part reagent method for polishing an inorganic silicate substrate is provided. The method comprises: providing a silicate substrate; providing a reagent comprising: a first part consisting essentially of an aqueous solution of at least one metal oxide abrasive selected from the group consisting of titania, zirconia, germania, and germania-doped silica; and a second part consisting essentially of an alkali aqueous solution of colloidal silica having a buffered pH value of at least about 10; polishing a surface of said substrate with the metal oxide abrasive aqueous solution to a surface roughness (Ra) ranging from about 6 Å to about 10 Å; and further polishing the surface with said alkali aqueous solution of colloidal silica to a roughness of less than or equal to about 5 Å.

Abstract: The invention provides a flexible abrasive product comprising a flexible sheet-like substrate comprising a multiplicity of separated resilient bodies connected to each other in a generally planar array in a pattern which provides open spaces between adjacent connected bodies, each body having a first surface and an opposite second surface; and abrasive particles to cause at least the first surface to be an abrasive surface. A method of making the abrasive is provided by providing the substrate and providing abrasive particles to at least the first surface to provide an abrasive surface.

Abstract: The invention provides a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety contains at least one oxygen atom, and (d) a polishing pad and/or an abrasive, wherein the total ion concentration of the system is above the critical coagulation concentration. The invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a the aforementioned polishing system or a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety contains at least one oxygen atom, and (d) a polishing pad and/or an abrasive, and polishing at least a portion of the substrate therewith in about 6 hours or less after the polishing system is prepared.

Abstract: The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a catalyst. The catalyst comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The composition further comprises at least one oxidizing agent. The composition is believed to be effective by virtue of the interaction between the catalyst coated on the surface of the abrasive particles and the oxidizing agent, at the catalyst surface. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.

Abstract: A process for making a heat treated ground ceramic cutting tool and the resultant cutting tool. The process comprising the steps of: providing an uncoated ground ceramic cutting tool having at least a portion thereof ground; and heat treating the uncoated ground ceramic cutting tool so as to form the heat treated ground ceramic cutting tool.

Abstract: An oxidizing slurry for removal of low dielectric constant materials. The slurry is formed utilizing non-oxidizing particles with a separate oxidizing agent, oxidizing particles alone or reducible abrasive particles with a compatible oxidizing agent. The particles can be formed of a metal oxide, nitride, or carbide material, by itself or mixtures thereof, or can be coated on a core material such as silicon dioxide or can be coformed therewith. A preferred oxidizing slurry is multi-modal in particle size distribution. Although developed for utilization in CMP semiconductor processing the oxidizing slurry of the present invention also can be utilized for other high precision polishing processes.

Abstract: A polishing composition for polishing a semiconductor wafer includes comprises water, an abrasive that is preferably colloidal silica, water-soluble cellulose having a molecular weight of at least about 1,000,000 and an alkaline compound that is preferably ammonia. Tetra methyl ammonium hydroxide may also be added to the polishing composition.

Abstract: A grinding wheel according to the present invention includes cubic boron nitride (cBN) or other abrasive particles such as diamond secured to a substrate by an electroplated, electroless plated or brazed layer of nickel, chrome or nickel or chrome based alloy, a first antioxidation layer of, for example, vapor deposited titanium aluminum nitride (TiAlN) and a second hard lubricant layer of, for example, vapor deposited molybdenum disulfide (MOS2), diamond graphite, tungsten carbide carbon, carbon nitride or titanium carbon nitride. The hard lubricant layer acts as a release agent and lubricant which reduces clogging of the wheel by lowering adhesion and facilitating the release of ground material from the wheel thereby providing improved grinding performance.

Abstract: To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface, and which can provide a polished surface in which the amount of dub-off is considerably reduced as compared with that of a conventional level, a polishing composition containing water, a polishing material (particularly alumina), a polishing accelerator, and at least one of hydroxypropyl cellulose and hydroxyalkyl alkyl cellulose is provided.

Abstract: The present invention provides abrasive articles having projections attached to a major surface thereof, and methods of making such articles. The articles include (1) a reaction product of components that include (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom; and/or (2) a polymeric material preparable by combining at least (a) an epoxy-functional material, and (b) at least one of a cyclic anhydride or a diacid derived therefrom.